CN103926800A - Circuit structure for micro displacement control of photo-etching projection objective - Google Patents
Circuit structure for micro displacement control of photo-etching projection objective Download PDFInfo
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- CN103926800A CN103926800A CN201410120352.0A CN201410120352A CN103926800A CN 103926800 A CN103926800 A CN 103926800A CN 201410120352 A CN201410120352 A CN 201410120352A CN 103926800 A CN103926800 A CN 103926800A
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Abstract
The invention provides a circuit structure for micro displacement control of a photo-etching projection objective, belongs to the field of control of photo-etching projection objectives and aims to solve the problems that in the prior art, the positioning precision is low and the cost is high. The circuit structure comprises an algorithm and time sequence generation circuit, a high-voltage drive and digital capacitance collection circuit and a capacitance A/D (Analog/Digital) conversion circuit, wherein the algorithm and time sequence generation circuit and the high-voltage drive and digital capacitance collection circuit are communicated through a user-defined protocol and are in physical connection through a P1 connector in the technique specification of a VME bus; the high-voltage drive and digital capacitance collection circuit and the capacitance A/D conversion circuit are communicate through a user-defined protocol and are in physical connection through a cable transmitting low-voltage differential digital signals; the circuit structure adopts an N-111.2A piezoelectric ceramic driver as an execution element and adopts a D-E30.500 capacitive sensor as a feedback element. According to the circuit structure, the requirements on measuring range and positioning precision of a mobile lens of the photo-etching projection objective are met and the cost is low.
Description
Technical field
The invention belongs to photoetching projection objective lens control field, be specifically related to the circuit structure of a kind of photoetching projection objective lens micrometric displacement control.
Background technology
In photoetching projection objective lens, deteriorated in order to compensate the picture element producing because of environmental change, need to be changing exposure batch, change in twice instantaneous field of view's exposure interval equal time in the exposure of silicon chip and single game, realize picture element compensation by the mode of mobile eyeglass, under normal circumstances, the range that eyeglass moves is tens microns, and positioning precision is 10-20 nanometer.Along with the line width of litho machine is more and more less, the range that eyeglass moves is also diminishing, the requirement of positioning precision is more and more higher, corresponding executive component and feedback element also change piezoelectric ceramic actuator and capacitive transducer into by servomotor and grating scale, in this case, that on photoetching projection objective lens controller, moves certainly grinds closed loop control algorithm and the communication link of itself and control box must be introduced in control loop, and can only operate piezoelectric ceramic actuator and capacitive transducer by control box, thereby having caused certainly grinding closed loop control algorithm cannot effectively control eyeglass, be difficult to ensure control accuracy and control time.In addition, the price of this type of control box product mostly is hundreds of thousands Euro, and cost is higher.
Summary of the invention
The object of the invention is to propose the circuit structure of a kind of photoetching projection objective lens micrometric displacement control, solve the low and high problem of cost of positioning precision that prior art exists, meet range and the positioning precision demand of mobile eyeglass in photoetching projection objective lens.
For achieving the above object, the circuit structure of a kind of photoetching projection objective lens micrometric displacement of the present invention control comprises algorithm and timing generator circuit, high drive and digital capacitance Acquisition Circuit and electric capacity analog to digital conversion circuit;
Between described algorithm and timing generator circuit and described high drive and digital capacitance Acquisition Circuit, use custom protocol to communicate by letter, and realize physical connection by the P1 connector in VME bussing technique specification, between described high drive and digital capacitance Acquisition Circuit and electric capacity analog to digital conversion circuit, use custom protocol to communicate by letter, and realize physical connection by low-voltage differential digital signal transmission line cable;
Described circuit structure adopts N-111.2A piezoelectric ceramic actuator as executive component, adopts D-E30.500 capacitive transducer as feedback element.
Described algorithm and timing generator circuit comprise OMAP-L138 main control chip, XC5VLX50T chip and high precision DA change-over circuit, between described OMAP-L138 main control chip and XC5VLX50T chip, connect by asynchronous bus, between described XC5VLX50T chip and high precision DA change-over circuit, connect by low pressure digital drive signals transmission link.
Described high drive and digital capacitance Acquisition Circuit comprise low-voltage digital capacity signal acquisition circuit and high drive amplifier, between high drive amplifier and high precision DA change-over circuit, drive signal transmission link to connect by low-voltage simulation, between low-voltage digital capacity signal acquisition circuit and XC5VLX50T chip, connect by low-voltage digital capacity signal transmission link, between high drive amplifier and N-111.2A piezoelectric ceramic actuator, connect by high pressure simulation signal transmission link.
Described electric capacity analog to digital conversion circuit comprises analog to digital conversion and protocol encapsulation circuit and artificial capacitor signal acquisition circuit; Between analog to digital conversion and protocol encapsulation circuit and low-voltage digital capacity signal acquisition circuit, be connected by low pressure digital differential signal transmission link, between analog to digital conversion and protocol encapsulation circuit and artificial capacitor signal acquisition circuit, be connected by low-voltage simulation capacitance signal transmission link, between artificial capacitor signal acquisition circuit and D-E30.500 capacitive transducer, connect by artificial capacitor signal transmission link.
In described OMAP-L138 main control chip, ARM926EJ-S examines existing external interface, and C674x examines existing Fuzzy PID, adopts Virtex-5 Series FPGA XC5VLX50T as timing sequencer and interface controller.
Beneficial effect of the present invention is: the circuit structure of a kind of photoetching projection objective lens micrometric displacement of the present invention control selects the N-111.2A of PI Corp. as executive component, its inside comprises four stack piezoelectric ceramic actuators, wherein two longitudinal extensions that are used as analog operation pattern regulate, two other transversal stretching that is used as other patterns regulates, in the time of real work, each N-111.2A needs 4 tunnel high drive amplifiers, under different mode of operations, need different timing sequencers to produce the work schedule that drives four stack piezoelectric ceramic actuators, the present invention adopts the fpga chip of Virtex-5 series as timing sequencer, the digital signal of output is through the analog voltage of be converted to-10V-10V of high precision DA chip, as the input signal of high drive amplifier, high drive amplifier employing ± 280V dual power supply, by be amplified to ± 250V of this signal to drive stack piezoelectric ceramic actuator.Select the D-E30.500 capacitive transducer of PI Corp. as feedback element, belong to the one of unipolar plate capacitive transducer, in order to ensure the signal transmission quality of pico farad magnitude capacitance signal, the present invention utilizes driving power technology that electric capacity acquisition function is positioned over apart from 2 meters of capacitive transducers with in interior space, and utilize analog to digital conversion circuit that artificial capacitor signal is converted to after digital capacitance signal, transfer to high drive and digital capacitance Acquisition Circuit by low-voltage differential digital signal transmission line cable.Adopt dual core processor OMAP-L138 as main control chip, it both can operate 3 road N-111.2A piezoelectric ceramic actuators by Virtex-5 Series FPGA chip, Ji12 road high-voltage driving circuit, can read again the digital capacitance signal of feedback, the ARM926EJ-S of OMAP-L138 main control chip inside examines existing external interface, mainly comprise network interface and FPGA operation-interface, C674x examines existing Fuzzy PID, to realize the closed-loop control to being less than three road N-111.2A/D-E30.500 control loops in single eyeglass.The present invention can meet range and the positioning precision demand of mobile eyeglass in photoetching projection objective lens, and cost is low.
Brief description of the drawings
Fig. 1 is the electrical block diagram of a kind of photoetching projection objective lens micrometric displacement of the present invention control;
Wherein: 1, OMAP-L138 main control chip, 2, asynchronous bus, 3, XC5VLX50T chip, 4, low pressure digital drive signals transmission link, 5, high precision DA change-over circuit, 6, low-voltage digital capacity signal transmission link, 7, algorithm and timing generator circuit, 8, low-voltage simulation drives signal transmission link, 9, high drive and digital capacitance Acquisition Circuit, 10, low-voltage digital capacity signal acquisition circuit, 11, high drive amplifier, 12, low pressure digital differential signal transmission link, 13, high pressure simulation signal transmission link, 14, electric capacity analog to digital conversion circuit, 15, analog to digital conversion and protocol encapsulation circuit, 16, low-voltage simulation capacitance signal transmission link, 17, artificial capacitor signal acquisition circuit, 18, artificial capacitor signal transmission link, 19, D-E30.500 capacitive transducer, 20, N-111.2A piezoelectric ceramic actuator.
Embodiment
Below in conjunction with accompanying drawing, embodiments of the present invention are described further.
Referring to accompanying drawing 1, the circuit structure of a kind of photoetching projection objective lens micrometric displacement of the present invention control comprises algorithm and timing generator circuit 7, high drive and digital capacitance Acquisition Circuit 9 and electric capacity analog to digital conversion circuit 14;
Between described algorithm and timing generator circuit 7 and described high drive and digital capacitance Acquisition Circuit 9, use custom protocol to communicate by letter, and realize physical connection by the P1 connector in VME bussing technique specification, between described high drive and digital capacitance Acquisition Circuit 9 and electric capacity analog to digital conversion circuit 14, use custom protocol to communicate by letter, and realize physical connection by low-voltage differential digital signal transmission line cable;
Described circuit structure adopts N-111.2A piezoelectric ceramic actuator 20 as executive component, adopts D-E30.500 capacitive transducer 19 as feedback element.
Described algorithm and timing generator circuit 7 comprise OMAP-L138 main control chip 1, XC5VLX50T chip 3 and high precision DA change-over circuit 5, between described OMAP-L138 main control chip 1 and XC5VLX50T chip 3, connect by asynchronous bus 2, between described XC5VLX50T chip 3 and high precision DA change-over circuit 5, connect by low pressure digital drive signals transmission link 4.
Described high drive and digital capacitance Acquisition Circuit 9 comprise low-voltage digital capacity signal acquisition circuit 10 and high drive amplifier 11, between high drive amplifier 11 and high precision DA change-over circuit 5, drive signal transmission link 8 to connect by low-voltage simulation, between low-voltage digital capacity signal acquisition circuit 10 and XC5VLX50T chip 3, connect by low-voltage digital capacity signal transmission link 6, between high drive amplifier 11 and N-111.2A piezoelectric ceramic actuator 20, connect by high pressure simulation signal transmission link 13.
Described electric capacity analog to digital conversion circuit 14 comprises analog to digital conversion and protocol encapsulation circuit 15 and artificial capacitor signal acquisition circuit 17; Between analog to digital conversion and protocol encapsulation circuit 15 and low-voltage digital capacity signal acquisition circuit 10, be connected by low pressure digital differential signal transmission link 12, between analog to digital conversion and protocol encapsulation circuit 15 and artificial capacitor signal acquisition circuit 17, be connected by low-voltage simulation capacitance signal transmission link 16, between artificial capacitor signal acquisition circuit 17 and D-E30.500 capacitive transducer 19, connect by artificial capacitor signal transmission link 18.
In described OMAP-L138 main control chip 1, ARM926EJ-S examines existing external interface, C674x examines existing Fuzzy PID, adopt Virtex-5 Series FPGA XC5VLX50T as timing sequencer and interface controller, to produce the control sequential that is applicable to N-111.2A piezoelectric actuator 20, and can utilize custom protocol to realize the collection of digital capacitance signal, between OMAP-L138 main control chip 1 and XC5VLX50T chip 3, realize data interaction by asynchronous bus 2 agreements.
Data stream in one-period of the present invention is specially:
Step 1: the OMAP-L138 main control chip 1 in algorithm and timing generator circuit 7 writes XC5VLX50T chip 3 by the displacement of N-111.2A piezoelectric ceramic actuator 20 by asynchronous bus 2;
Step 2: XC5VLX50T chip 3 is according to the displacement in step 1, produce the time sequential routine of N-111.2A piezoelectric ceramic actuator 20, and transfer to high precision DA change-over circuit 5 through low pressure digital drive signals transmission link 4, high precision DA change-over circuit 5 is the analog voltage of be converted to-10V-10V of the time sequential routine of N-111.2A piezoelectric ceramic actuator 20, and drives signal transmission link 8 to send into the high drive amplifier 11 of high drive and digital capacitance Acquisition Circuit 9 through low-voltage simulation;
Step 3: the supply voltage of high drive amplifier 11 is ± 280V, after be amplified to ± 250V of its low-voltage analog signal that drives signal transmission link 8 to input low-voltage simulation, realize the fine motion control to N-111.2A piezoelectric ceramic actuator 20 by high pressure simulation signal transmission link 13;
Step 4: the displacement of eyeglass is gathered by D-E30.500 capacitive transducer 19, the analog electrical capacitance collecting transfers in the artificial capacitor signal acquisition circuit 17 in electric capacity analog to digital conversion circuit 14 through artificial capacitor signal transmission link 18, artificial capacitor signal acquisition circuit 17 can be converted to voltage signal by analog electrical capacitance, and transferred to after analog to digital conversion and protocol encapsulation circuit 15 by low-voltage simulation capacitance signal transmission link 16, by analog to digital conversion and protocol encapsulation circuit 15, voltage signal is carried out to analog to digital conversion and protocol encapsulation, analog to digital conversion and protocol encapsulation circuit 15 by packaged digital voltage signal via low pressure digital differential signal transmission link 12, low-voltage digital capacity signal acquisition circuit 10 and low-voltage digital capacity signal transmission link 6 transfer to XC5VLX50T chip 3,
Step 5: XC5VLX50T chip 3 produces capacitance signal collection to OMAP-L138 main control chip 1 and completes interruption, OMAP-L138 main control chip 1 reads capacitive feedback signal by asynchronous bus 2, after calculating, fuzzy PID algorithm produces the displacement that N-111.2A piezoelectric ceramic actuator 20 is new, repeating step one, start next servo period, until meet lens orientation demand.
Claims (5)
1. a circuit structure for photoetching projection objective lens micrometric displacement control, is characterized in that, comprises algorithm and timing generator circuit (7), high drive and digital capacitance Acquisition Circuit (9) and electric capacity analog to digital conversion circuit (14);
Between described algorithm and timing generator circuit (7) and described high drive and digital capacitance Acquisition Circuit (9), use custom protocol to communicate by letter, and realize physical connection by the P1 connector in VME bussing technique specification, between described high drive and digital capacitance Acquisition Circuit (9) and electric capacity analog to digital conversion circuit (14), use custom protocol to communicate by letter, and realize physical connection by low-voltage differential digital signal transmission line cable;
Described circuit structure adopts N-111.2A piezoelectric ceramic actuator (20) as executive component, adopts D-E30.500 capacitive transducer (19) as feedback element.
2. the circuit structure of a kind of photoetching projection objective lens micrometric displacement according to claim 1 control, it is characterized in that, described algorithm and timing generator circuit (7) comprise OMAP-L138 main control chip (1), XC5VLX50T chip (3) and high precision DA change-over circuit (5), between described OMAP-L138 main control chip (1) and XC5VLX50T chip (3), connect by asynchronous bus (2), between described XC5VLX50T chip (3) and high precision DA change-over circuit (5), connect by low pressure digital drive signals transmission link (4).
3. the circuit structure of a kind of photoetching projection objective lens micrometric displacement according to claim 2 control, it is characterized in that described high drive and digital capacitance Acquisition Circuit (9) comprise low-voltage digital capacity signal acquisition circuit (10) and high drive amplifier (11), between high drive amplifier (11) and high precision DA change-over circuit (5), drive signal transmission link (8) to connect by low-voltage simulation, between low-voltage digital capacity signal acquisition circuit (10) and XC5VLX50T chip (3), connect by low-voltage digital capacity signal transmission link (6), between high drive amplifier (11) and N-111.2A piezoelectric ceramic actuator (20), connect by high pressure simulation signal transmission link (13).
4. the circuit structure of a kind of photoetching projection objective lens micrometric displacement according to claim 3 control, is characterized in that described electric capacity analog to digital conversion circuit (14) comprises analog to digital conversion and protocol encapsulation circuit (15) and artificial capacitor signal acquisition circuit (17); Between analog to digital conversion and protocol encapsulation circuit (15) and low-voltage digital capacity signal acquisition circuit (10), be connected by low pressure digital differential signal transmission link (12), between analog to digital conversion and protocol encapsulation circuit (15) and artificial capacitor signal acquisition circuit (17), be connected by low-voltage simulation capacitance signal transmission link (16), between artificial capacitor signal acquisition circuit (17) and D-E30.500 capacitive transducer (19), connect by artificial capacitor signal transmission link (18).
5. the circuit structure of a kind of photoetching projection objective lens micrometric displacement according to claim 1 and 2 control, it is characterized in that in described OMAP-L138 main control chip (1), ARM926EJ-S examines existing external interface, C674x examines existing Fuzzy PID, adopts Virtex-5 Series FPGA XC5VLX50T as timing sequencer and interface controller.
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| CN201410120352.0A CN103926800B (en) | 2014-03-27 | 2014-03-27 | The circuit structure that a kind of photoetching projection objective lens micrometric displacement controls |
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| CN201410120352.0A CN103926800B (en) | 2014-03-27 | 2014-03-27 | The circuit structure that a kind of photoetching projection objective lens micrometric displacement controls |
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Cited By (7)
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| CN104503302A (en) * | 2014-11-26 | 2015-04-08 | 天津三英精密仪器有限公司 | Precision motion control system and control method thereof |
| CN104516215A (en) * | 2014-12-25 | 2015-04-15 | 中国科学院长春光学精密机械与物理研究所 | Photolithographic projection objective control device |
| CN105159034A (en) * | 2015-09-21 | 2015-12-16 | 中国科学院长春光学精密机械与物理研究所 | Fault-tolerant control device of photoetching projection objective |
| CN108459471A (en) * | 2018-03-20 | 2018-08-28 | 中国科学院光电技术研究所 | Five-degree-of-freedom online adjustment control system for movable mirror based on DSP |
| CN109324483A (en) * | 2017-07-31 | 2019-02-12 | 台湾积体电路制造股份有限公司 | The method for manufacturing semiconductor structure |
| CN110263588A (en) * | 2019-07-23 | 2019-09-20 | 南方电网科学研究院有限责任公司 | Physical unclonable function circuit, integrated circuit and preparation method |
| CN110928177A (en) * | 2019-11-14 | 2020-03-27 | 上海咏昕信息科技有限公司 | Clock synchronization system and method |
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Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104503302A (en) * | 2014-11-26 | 2015-04-08 | 天津三英精密仪器有限公司 | Precision motion control system and control method thereof |
| CN104516215A (en) * | 2014-12-25 | 2015-04-15 | 中国科学院长春光学精密机械与物理研究所 | Photolithographic projection objective control device |
| CN105159034A (en) * | 2015-09-21 | 2015-12-16 | 中国科学院长春光学精密机械与物理研究所 | Fault-tolerant control device of photoetching projection objective |
| CN109324483A (en) * | 2017-07-31 | 2019-02-12 | 台湾积体电路制造股份有限公司 | The method for manufacturing semiconductor structure |
| CN108459471A (en) * | 2018-03-20 | 2018-08-28 | 中国科学院光电技术研究所 | Five-degree-of-freedom online adjustment control system for movable mirror based on DSP |
| CN108459471B (en) * | 2018-03-20 | 2020-04-10 | 中国科学院光电技术研究所 | Five-degree-of-freedom online adjustment control system for movable mirror based on DSP |
| CN110263588A (en) * | 2019-07-23 | 2019-09-20 | 南方电网科学研究院有限责任公司 | Physical unclonable function circuit, integrated circuit and preparation method |
| CN110928177A (en) * | 2019-11-14 | 2020-03-27 | 上海咏昕信息科技有限公司 | Clock synchronization system and method |
| CN110928177B (en) * | 2019-11-14 | 2021-12-10 | 上海咏昕信息科技有限公司 | Clock synchronization system and method |
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| CN103926800B (en) | 2015-11-25 |
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Effective date of registration: 20190829 Address after: Room 601-10, 6th floor, 52 Block 2, Jingyuan North Street, Beijing Economic and Technological Development Zone, 100176 Patentee after: Beijing Guowang Optical Technology Co., Ltd. Address before: 130033 southeast Lake Road, Jilin, Changchun, No. 3888 Patentee before: Changchun Inst. of Optics and Fine Mechanics and Physics, Chinese Academy of Sci |