CN103926800B - The circuit structure that a kind of photoetching projection objective lens micrometric displacement controls - Google Patents
The circuit structure that a kind of photoetching projection objective lens micrometric displacement controls Download PDFInfo
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- CN103926800B CN103926800B CN201410120352.0A CN201410120352A CN103926800B CN 103926800 B CN103926800 B CN 103926800B CN 201410120352 A CN201410120352 A CN 201410120352A CN 103926800 B CN103926800 B CN 103926800B
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Abstract
The circuit structure that photoetching projection objective lens micrometric displacement controls belongs to a photoetching projection objective lens control field, and object is the problem that positioning precision is low and cost is high solving prior art existence.The present invention includes algorithm and timing generator circuit, high drive and digital capacitance Acquisition Circuit and electric capacity analog to digital conversion circuit; Algorithm uses custom protocol to communicate with timing generator circuit with between described high drive with digital capacitance Acquisition Circuit, and realize physical connection by the P1 connector in VME bus specification, high drive uses custom protocol to communicate with between digital capacitance Acquisition Circuit and electric capacity analog to digital conversion circuit, and realizes physical connection by low-voltage differential digital signal transmission line cable; Described circuit structure adopts N-111.2A piezoelectric ceramic actuator as executive component, adopts D-E30.500 capacitive transducer as feedback element.The present invention can meet range and the positioning precision demand of mobile eyeglass in photoetching projection objective lens, and cost is low.
Description
Technical field
The invention belongs to photoetching projection objective lens control field, be specifically related to the circuit structure that a kind of photoetching projection objective lens micrometric displacement controls.
Background technology
In photoetching projection objective lens, in order to compensate the picture element deterioration produced because of environmental change, need change exposure batch, change silicon chip and single game exposure in twice instantaneous field of view's exposure interval equal time in, realize picture element by the mode of mobile eyeglass to compensate, under normal circumstances, the range of eyeglass movement is tens microns, and positioning precision is 10-20 nanometer.Along with the line width of litho machine is more and more less, the range of eyeglass movement is also diminishing, the requirement of positioning precision is then more and more higher, corresponding executive component and feedback element also change piezoelectric ceramic actuator and capacitive transducer into by servomotor and grating scale, in this case, what photoetching projection objective lens controller ran certainly grinds closed loop control algorithm and must introduce in control loop by the communication link of itself and control box, and piezoelectric ceramic actuator and capacitive transducer can only be operated by control box, thus result in and cannot effectively control eyeglass from grinding closed loop control algorithm, be difficult to ensure control accuracy and control time.In addition, the price of this type of control box product mostly is hundreds of thousands Euro, and cost is higher.
Summary of the invention
The object of the invention is to the circuit structure proposing the control of a kind of photoetching projection objective lens micrometric displacement, solve the problem that positioning precision is low and cost is high that prior art exists, meet range and the positioning precision demand of mobile eyeglass in photoetching projection objective lens.
For achieving the above object, the circuit structure that a kind of photoetching projection objective lens micrometric displacement of the present invention controls comprises algorithm and timing generator circuit, high drive and digital capacitance Acquisition Circuit and electric capacity analog to digital conversion circuit;
Described algorithm uses custom protocol to communicate with timing generator circuit with between described high drive with digital capacitance Acquisition Circuit, and realize physical connection by the P1 connector in VME bus specification, described high drive uses custom protocol to communicate with between digital capacitance Acquisition Circuit and electric capacity analog to digital conversion circuit, and realizes physical connection by low-voltage differential digital signal transmission line cable;
Described circuit structure adopts N-111.2A piezoelectric ceramic actuator as executive component, adopts D-E30.500 capacitive transducer as feedback element.
Described algorithm and timing generator circuit comprise OMAP-L138 main control chip, XC5VLX50T chip and high precision DA change-over circuit, connected by asynchronous bus between described OMAP-L138 main control chip and XC5VLX50T chip, connected by low pressure digital drive signals transmission link between described XC5VLX50T chip and high precision DA change-over circuit.
Described high drive and digital capacitance Acquisition Circuit comprise low-voltage digital capacity signal acquisition circuit and high voltage driver amplifier, connected by low-voltage simulation drive singal transmission link between high voltage driver amplifier and high precision DA change-over circuit, connected by low-voltage digital capacity signal transmission link between low-voltage digital capacity signal acquisition circuit and XC5VLX50T chip, connected by high voltage analog signal transmission link between high voltage driver amplifier and N-111.2A piezoelectric ceramic actuator.
Described electric capacity analog to digital conversion circuit comprises analog to digital conversion and protocol encapsulation circuit and artificial capacitor signal acquisition circuit; Analog to digital conversion is connected by low pressure digital difference signal transmission link with between protocol encapsulation circuit and low-voltage digital capacity signal acquisition circuit, analog to digital conversion is connected by low-voltage simulation capacitance signal transmission link with between protocol encapsulation circuit and artificial capacitor signal acquisition circuit, is connected between artificial capacitor signal acquisition circuit and D-E30.500 capacitive transducer by artificial capacitor signal transmission link.
In described OMAP-L138 main control chip, ARM926EJ-S examines existing external interface, and C674x examines existing Fuzzy PID, adopts Virtex-5 Series FPGA XC5VLX50T as timing sequencer and interface controller.
Beneficial effect of the present invention is: the circuit structure that a kind of photoetching projection objective lens micrometric displacement of the present invention controls selects the N-111.2A of PI Corp. as executive component, its inside comprises four stack piezoelectric ceramic actuators, wherein two longitudinal extensions being used as analog operation pattern regulate, two other transversal stretching being used as other patterns regulates, when real work, each N-111.2A needs 4 road high voltage driver amplifier, different timing sequencers is needed to produce the work schedule of driving four stack piezoelectric ceramic actuators under different mode of operations, the present invention adopts the fpga chip of Virtex-5 series as timing sequencer, the digital signal exported is converted to the analog voltage of-10V-10V through high precision DA chip, as the input signal of high voltage driver amplifier, high voltage driver amplifier employing ± 280V dual power supply, this signal is amplified to ± 250V to be to drive stack piezoelectric ceramic actuator.Select the D-E30.500 capacitive transducer of PI Corp. as feedback element, belong to the one of unipolar plate capacitive transducer, in order to ensure the signal transmission quality of picofarad range capacitance signal, in space within the present invention utilizes driving power technology electric capacity acquisition function to be positioned over distance capacitive transducer 2 meters, and after utilizing analog to digital conversion circuit that artificial capacitor signal is converted to digital capacitance signal, transfer to high drive and digital capacitance Acquisition Circuit by low-voltage differential digital signal transmission line cable.Adopt dual core processor OMAP-L138 as main control chip, it both can operate 3 road N-111.2A piezoelectric ceramic actuators by Virtex-5 Series FPGA chip, i.e. 12 road high-voltage driving circuits, the digital capacitance signal of feedback can be read again, the ARM926EJ-S of OMAP-L138 main control chip inside examines existing external interface, mainly comprise network interface and FPGA operation-interface, C674x examines existing Fuzzy PID, to realize the closed-loop control to being less than three road N-111.2A/D-E30.500 control loops in single eyeglass.The present invention can meet range and the positioning precision demand of mobile eyeglass in photoetching projection objective lens, and cost is low.
Accompanying drawing explanation
Fig. 1 is the electrical block diagram that a kind of photoetching projection objective lens micrometric displacement of the present invention controls;
Wherein: 1, OMAP-L138 main control chip, 2, asynchronous bus, 3, XC5VLX50T chip, 4, low pressure digital drive signals transmission link, 5, high precision DA change-over circuit, 6, low-voltage digital capacity signal transmission link, 7, algorithm and timing generator circuit, 8, low-voltage simulation drive singal transmission link, 9, high drive and digital capacitance Acquisition Circuit, 10, low-voltage digital capacity signal acquisition circuit, 11, high voltage driver amplifier, 12, low pressure digital difference signal transmission link, 13, high voltage analog signal transmission link, 14, electric capacity analog to digital conversion circuit, 15, analog to digital conversion and protocol encapsulation circuit, 16, low-voltage simulation capacitance signal transmission link, 17, artificial capacitor signal acquisition circuit, 18, artificial capacitor signal transmission link, 19, D-E30.500 capacitive transducer, 20, N-111.2A piezoelectric ceramic actuator.
Embodiment
Below in conjunction with accompanying drawing, embodiments of the present invention are described further.
See accompanying drawing 1, the circuit structure that a kind of photoetching projection objective lens micrometric displacement of the present invention controls comprises algorithm and timing generator circuit 7, high drive and digital capacitance Acquisition Circuit 9 and electric capacity analog to digital conversion circuit 14;
Described algorithm uses custom protocol to communicate with timing generator circuit 7 with between described high drive with digital capacitance Acquisition Circuit 9, and realize physical connection by the P1 connector in VME bus specification, described high drive uses custom protocol to communicate with between digital capacitance Acquisition Circuit 9 and electric capacity analog to digital conversion circuit 14, and realizes physical connection by low-voltage differential digital signal transmission line cable;
Described circuit structure adopts N-111.2A piezoelectric ceramic actuator 20 as executive component, adopts D-E30.500 capacitive transducer 19 as feedback element.
Described algorithm and timing generator circuit 7 comprise OMAP-L138 main control chip 1, XC5VLX50T chip 3 and high precision DA change-over circuit 5, connected by asynchronous bus 2 between described OMAP-L138 main control chip 1 and XC5VLX50T chip 3, connected by low pressure digital drive signals transmission link 4 between described XC5VLX50T chip 3 and high precision DA change-over circuit 5.
Described high drive and digital capacitance Acquisition Circuit 9 comprise low-voltage digital capacity signal acquisition circuit 10 and high voltage driver amplifier 11, connected by low-voltage simulation drive singal transmission link 8 between high voltage driver amplifier 11 and high precision DA change-over circuit 5, connected by low-voltage digital capacity signal transmission link 6 between low-voltage digital capacity signal acquisition circuit 10 and XC5VLX50T chip 3, connected by high voltage analog signal transmission link 13 between high voltage driver amplifier 11 and N-111.2A piezoelectric ceramic actuator 20.
Described electric capacity analog to digital conversion circuit 14 comprises analog to digital conversion and protocol encapsulation circuit 15 and artificial capacitor signal acquisition circuit 17; Analog to digital conversion is connected by low pressure digital difference signal transmission link 12 with between protocol encapsulation circuit 15 and low-voltage digital capacity signal acquisition circuit 10, analog to digital conversion is connected by low-voltage simulation capacitance signal transmission link 16 with between protocol encapsulation circuit 15 and artificial capacitor signal acquisition circuit 17, is connected between artificial capacitor signal acquisition circuit 17 and D-E30.500 capacitive transducer 19 by artificial capacitor signal transmission link 18.
In described OMAP-L138 main control chip 1, ARM926EJ-S examines existing external interface, C674x examines existing Fuzzy PID, adopt Virtex-5 Series FPGA XC5VLX50T as timing sequencer and interface controller, to produce the Control timing sequence being applicable to N-111.2A piezoelectric actuator 20, and custom protocol can be utilized to realize the collection of digital capacitance signal, by the data interaction of asynchronous bus 2 protocol realization between OMAP-L138 main control chip 1 and XC5VLX50T chip 3.
Data stream in one-period of the present invention is specially:
Step one: the displacement of N-111.2A piezoelectric ceramic actuator 20 is write XC5VLX50T chip 3 by asynchronous bus 2 by the OMAP-L138 main control chip 1 in algorithm and timing generator circuit 7;
Step 2: XC5VLX50T chip 3 is according to the displacement in step one, produce the time sequential routine of N-111.2A piezoelectric ceramic actuator 20, and transfer to high precision DA change-over circuit 5 through low pressure digital drive signals transmission link 4, the time sequential routine of N-111.2A piezoelectric ceramic actuator 20 is converted to the analog voltage of-10V-10V by high precision DA change-over circuit 5, and sends into the high voltage driver amplifier 11 of high drive and digital capacitance Acquisition Circuit 9 through low-voltage simulation drive singal transmission link 8;
Step 3: the supply voltage of high voltage driver amplifier 11 is ± 280V, the low-voltage analog signal that low-voltage simulation drive singal transmission link 8 inputs is amplified to by it ± 250V after, achieved by high voltage analog signal transmission link 13 and the fine motion of N-111.2A piezoelectric ceramic actuator 20 controlled;
Step 4: the displacement of eyeglass is gathered by D-E30.500 capacitive transducer 19, the analog electrical capacitance collected transfers in the artificial capacitor signal acquisition circuit 17 in electric capacity analog to digital conversion circuit 14 through artificial capacitor signal transmission link 18, analog electrical capacitance can be converted to voltage signal by artificial capacitor signal acquisition circuit 17, and after transferring to analog to digital conversion and protocol encapsulation circuit 15 by low-voltage simulation capacitance signal transmission link 16, analog to digital conversion and protocol encapsulation is carried out by analog to digital conversion and protocol encapsulation circuit 15 pairs of voltage signals, analog to digital conversion and protocol encapsulation circuit 15 by packaged digital voltage signal via low pressure digital difference signal transmission link 12, low-voltage digital capacity signal acquisition circuit 10 and low-voltage digital capacity signal transmission link 6 transfer to XC5VLX50T chip 3,
Step 5: XC5VLX50T chip 3 pairs of OMAP-L138 main control chips 1 produce capacitance signal collection and complete interruption, OMAP-L138 main control chip 1 reads capacitive feedback signal by asynchronous bus 2, the new displacement of N-111.2A piezoelectric ceramic actuator 20 is produced after fuzzy PID algorithm calculates, repeat step, start next servo period, until meet lens orientation demand.
Claims (5)
1. the circuit structure that controls of photoetching projection objective lens micrometric displacement, is characterized in that, comprise algorithm and timing generator circuit (7), high drive and digital capacitance Acquisition Circuit (9) and electric capacity analog to digital conversion circuit (14);
Described algorithm and timing generator circuit (7) and use custom protocol communication between described high drive and digital capacitance Acquisition Circuit (9), and realize physical connection by the P1 connector in VME bus specification, described high drive and use custom protocol communication between digital capacitance Acquisition Circuit (9) and electric capacity analog to digital conversion circuit (14), and realize physical connection by low-voltage differential digital signal transmission line cable;
Described circuit structure adopts N-111.2A piezoelectric ceramic actuator (20) as executive component, adopts D-E30.500 capacitive transducer (19) as feedback element.
2. the circuit structure of a kind of photoetching projection objective lens micrometric displacement control according to claim 1, it is characterized in that, described algorithm and timing generator circuit (7) comprise OMAP-L138 main control chip (1), XC5VLX50T chip (3) and high precision DA change-over circuit (5), connected by asynchronous bus (2) between described OMAP-L138 main control chip (1) and XC5VLX50T chip (3), connected by low pressure digital drive signals transmission link (4) between described XC5VLX50T chip (3) and high precision DA change-over circuit (5).
3. the circuit structure of a kind of photoetching projection objective lens micrometric displacement control according to claim 2, it is characterized in that described high drive and digital capacitance Acquisition Circuit (9) comprise low-voltage digital capacity signal acquisition circuit (10) and high voltage driver amplifier (11), connected by low-voltage simulation drive singal transmission link (8) between high voltage driver amplifier (11) and high precision DA change-over circuit (5), connected by low-voltage digital capacity signal transmission link (6) between low-voltage digital capacity signal acquisition circuit (10) and XC5VLX50T chip (3), connected by high voltage analog signal transmission link (13) between high voltage driver amplifier (11) and N-111.2A piezoelectric ceramic actuator (20).
4. the circuit structure that controls of a kind of photoetching projection objective lens micrometric displacement according to claim 3, is characterized in that described electric capacity analog to digital conversion circuit (14) comprises analog to digital conversion and protocol encapsulation circuit (15) and artificial capacitor signal acquisition circuit (17); Analog to digital conversion is connected by low pressure digital difference signal transmission link (12) with between protocol encapsulation circuit (15) and low-voltage digital capacity signal acquisition circuit (10), analog to digital conversion is connected by low-voltage simulation capacitance signal transmission link (16) with between protocol encapsulation circuit (15) and artificial capacitor signal acquisition circuit (17), is connected between artificial capacitor signal acquisition circuit (17) and D-E30.500 capacitive transducer (19) by artificial capacitor signal transmission link (18).
5. the circuit structure of a kind of photoetching projection objective lens micrometric displacement control according to claim 2, it is characterized in that in described OMAP-L138 main control chip (1), ARM926EJ-S examines existing external interface, C674x examines existing Fuzzy PID, adopts Virtex-5 Series FPGA XC5VLX50T as timing sequencer and interface controller.
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| CN104503302B (en) * | 2014-11-26 | 2017-02-22 | 三英精控（天津）科技有限公司 | Precision motion control system and control method thereof |
| CN104516215A (en) * | 2014-12-25 | 2015-04-15 | 中国科学院长春光学精密机械与物理研究所 | Photolithographic projection objective control device |
| CN105159034B (en) * | 2015-09-21 | 2017-08-25 | 中国科学院长春光学精密机械与物理研究所 | Photoetching projection objective lens fault tolerant control |
| US10157741B1 (en) * | 2017-07-31 | 2018-12-18 | Taiwan Semiconductor Manufacturing Company Ltd. | Method of manufacturing a semiconductor structure |
| CN108459471B (en) * | 2018-03-20 | 2020-04-10 | 中国科学院光电技术研究所 | Five-degree-of-freedom online adjustment control system for movable mirror based on DSP |
| CN110263588B (en) * | 2019-07-23 | 2023-05-16 | 南方电网科学研究院有限责任公司 | Physical unclonable function circuit, integrated circuit and preparation method |
| CN110928177B (en) * | 2019-11-14 | 2021-12-10 | 上海咏昕信息科技有限公司 | Clock synchronization system and method |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101751851A (en) * | 2010-01-21 | 2010-06-23 | 上海大学 | Film electroluminescence display driver |
| CN103472690A (en) * | 2013-09-25 | 2013-12-25 | 中国科学院长春光学精密机械与物理研究所 | Axial adjusting device for optical element in projection objective system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010062396A (en) * | 2008-09-04 | 2010-03-18 | Canon Inc | Drive device, exposure device, and device manufacturing method |
-
2014
- 2014-03-27 CN CN201410120352.0A patent/CN103926800B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101751851A (en) * | 2010-01-21 | 2010-06-23 | 上海大学 | Film electroluminescence display driver |
| CN103472690A (en) * | 2013-09-25 | 2013-12-25 | 中国科学院长春光学精密机械与物理研究所 | Axial adjusting device for optical element in projection objective system |
Non-Patent Citations (1)
| Title |
|---|
| 光刻物镜中压电陶瓷驱动器的动态性能研究;王学亮 等;《光子学报》;20120930;第41卷(第9期);第1071-1075页 * |
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Effective date of registration: 20190829 Address after: Room 601-10, 6th floor, 52 Block 2, Jingyuan North Street, Beijing Economic and Technological Development Zone, 100176 Patentee after: Beijing Guowang Optical Technology Co., Ltd. Address before: 130033 southeast Lake Road, Jilin, Changchun, No. 3888 Patentee before: Changchun Inst. of Optics and Fine Mechanics and Physics, Chinese Academy of Sci |