CN103918063A - 化学机械抛光后清洁装置及方法 - Google Patents

化学机械抛光后清洁装置及方法 Download PDF

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Publication number
CN103918063A
CN103918063A CN201280045932.7A CN201280045932A CN103918063A CN 103918063 A CN103918063 A CN 103918063A CN 201280045932 A CN201280045932 A CN 201280045932A CN 103918063 A CN103918063 A CN 103918063A
Authority
CN
China
Prior art keywords
brush
substrate
nodules
cylindrical base
nodule
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201280045932.7A
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English (en)
Chinese (zh)
Inventor
钦腾·帕特尔
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of CN103918063A publication Critical patent/CN103918063A/zh
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0412—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly scrubbing means, e.g. brushes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P70/00—Cleaning of wafers, substrates or parts of devices
    • H10P70/20—Cleaning during device manufacture
    • H10P70/27—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers
    • H10P70/277—Cleaning during device manufacture during, before or after processing of conductive materials, e.g. polysilicon or amorphous silicon layers the processing being a planarisation of conductive layers

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Cleaning In General (AREA)
  • Rolls And Other Rotary Bodies (AREA)
CN201280045932.7A 2011-09-26 2012-09-26 化学机械抛光后清洁装置及方法 Pending CN103918063A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201161539342P 2011-09-26 2011-09-26
US61/539,342 2011-09-26
PCT/US2012/057337 WO2013049207A2 (en) 2011-09-26 2012-09-26 Post-cmp cleaning apparatus and method

Publications (1)

Publication Number Publication Date
CN103918063A true CN103918063A (zh) 2014-07-09

Family

ID=47996722

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280045932.7A Pending CN103918063A (zh) 2011-09-26 2012-09-26 化学机械抛光后清洁装置及方法

Country Status (6)

Country Link
US (1) US20140230170A1 (https=)
JP (1) JP2014534615A (https=)
KR (1) KR20140069043A (https=)
CN (1) CN103918063A (https=)
TW (1) TW201318779A (https=)
WO (1) WO2013049207A2 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109075049A (zh) * 2016-04-12 2018-12-21 株式会社荏原制作所 清洗部件及基板清洗装置
CN110914969A (zh) * 2017-05-19 2020-03-24 伊利诺斯工具制品有限公司 用于刷子调理的化学品输送的方法和装置

Families Citing this family (20)

* Cited by examiner, † Cited by third party
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US10504753B2 (en) * 2013-12-13 2019-12-10 Taiwan Semiconductor Manufacturing Co., Ltd. Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
US10790167B2 (en) 2014-02-20 2020-09-29 Entegris, Inc. Nodule ratios for targeted enhanced cleaning performance
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
SG11201703114QA (en) 2014-10-17 2017-06-29 Applied Materials Inc Cmp pad construction with composite material properties using additive manufacturing processes
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
JP6316730B2 (ja) * 2014-10-31 2018-04-25 株式会社荏原製作所 ロール部材、ペンシル部材、及びそれらの少なくともいずれか一方を含む基板処理装置
KR102389613B1 (ko) 2015-05-06 2022-04-22 삼성전자주식회사 기판 세정 장치
KR20230169424A (ko) 2015-10-30 2023-12-15 어플라이드 머티어리얼스, 인코포레이티드 원하는 제타 전위를 가진 연마 제품을 형성하는 장치 및 방법
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11694910B2 (en) * 2019-09-10 2023-07-04 Illinois Tool Works Inc. Brush with non-constant nodule density
US11470956B2 (en) 2020-03-06 2022-10-18 Applied Materials, Inc. Brush, method of forming a brush, and structure embodied in a machine readable medium used in a design process
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
JP2022134658A (ja) * 2021-03-03 2022-09-15 アイオン株式会社 ブラシローラ
JP2024047416A (ja) * 2022-09-26 2024-04-05 株式会社Ｓｃｒｅｅｎホールディングス 基板洗浄ブラシおよび基板洗浄装置

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4566911A (en) * 1982-07-05 1986-01-28 Kanebo Limited Method for cleaning article by scrubbing with cleaning roll
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
CN1863645A (zh) * 2003-08-08 2006-11-15 安格斯公司 用于制作浇注在可旋转基体上的整体式多孔垫的方法和材料
US7469443B2 (en) * 2005-01-10 2008-12-30 Intel Corporation Brush for cleaning wafer

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Publication number Priority date Publication date Assignee Title
JP4554011B2 (ja) * 1999-08-10 2010-09-29 ルネサスエレクトロニクス株式会社 半導体集積回路装置の製造方法
JP2001358110A (ja) * 2000-06-13 2001-12-26 Hitachi Ltd スクラブ洗浄装置およびそれを用いた半導体装置の製造方法
JP2003051481A (ja) * 2001-08-07 2003-02-21 Hitachi Ltd 半導体集積回路装置の製造方法
JP2008119621A (ja) * 2006-11-14 2008-05-29 Matsushita Electric Ind Co Ltd 洗浄用ローラブラシ
JP2009117765A (ja) * 2007-11-09 2009-05-28 Aion Kk 洗浄用スポンジローラ
KR101579572B1 (ko) * 2008-06-30 2015-12-22 아이온 가부시키가이샤 세정용 스폰지 롤러
USD682497S1 (en) * 2010-12-21 2013-05-14 Entegris, Inc. Substrate cleaning brush

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4566911A (en) * 1982-07-05 1986-01-28 Kanebo Limited Method for cleaning article by scrubbing with cleaning roll
US6299698B1 (en) * 1998-07-10 2001-10-09 Applied Materials, Inc. Wafer edge scrubber and method
US6467120B1 (en) * 1999-09-08 2002-10-22 International Business Machines Corporation Wafer cleaning brush profile modification
CN1863645A (zh) * 2003-08-08 2006-11-15 安格斯公司 用于制作浇注在可旋转基体上的整体式多孔垫的方法和材料
US7469443B2 (en) * 2005-01-10 2008-12-30 Intel Corporation Brush for cleaning wafer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109075049A (zh) * 2016-04-12 2018-12-21 株式会社荏原制作所 清洗部件及基板清洗装置
CN109075049B (zh) * 2016-04-12 2023-07-25 株式会社荏原制作所 清洗部件、基板清洗装置及基板处理装置
CN110914969A (zh) * 2017-05-19 2020-03-24 伊利诺斯工具制品有限公司 用于刷子调理的化学品输送的方法和装置
CN110914969B (zh) * 2017-05-19 2023-12-26 伊利诺斯工具制品有限公司 用于刷子调理的化学品输送的方法和装置

Also Published As

Publication number Publication date
WO2013049207A2 (en) 2013-04-04
US20140230170A1 (en) 2014-08-21
TW201318779A (zh) 2013-05-16
WO2013049207A3 (en) 2013-07-11
JP2014534615A (ja) 2014-12-18
KR20140069043A (ko) 2014-06-09

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Application publication date: 20140709

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