CN103895323B - A kind of cyclic bending machine for circuit board layering and application thereof - Google Patents
A kind of cyclic bending machine for circuit board layering and application thereof Download PDFInfo
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- CN103895323B CN103895323B CN201410117451.3A CN201410117451A CN103895323B CN 103895323 B CN103895323 B CN 103895323B CN 201410117451 A CN201410117451 A CN 201410117451A CN 103895323 B CN103895323 B CN 103895323B
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- bending machine
- pressure strip
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- 238000005452 bending Methods 0.000 title claims abstract description 76
- 125000004122 cyclic group Chemical group 0.000 title claims abstract description 34
- 230000007246 mechanism Effects 0.000 claims abstract description 36
- 230000006835 compression Effects 0.000 claims abstract description 9
- 238000007906 compression Methods 0.000 claims abstract description 9
- 230000009471 action Effects 0.000 claims abstract description 8
- 230000001939 inductive effect Effects 0.000 claims abstract description 5
- 238000009413 insulation Methods 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 17
- 239000004744 fabric Substances 0.000 abstract description 16
- 230000032798 delamination Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 6
- 239000010793 electronic waste Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000011978 dissolution method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- NICDRCVJGXLKSF-UHFFFAOYSA-N nitric acid;trihydrochloride Chemical compound Cl.Cl.Cl.O[N+]([O-])=O NICDRCVJGXLKSF-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
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- Press Drives And Press Lines (AREA)
Abstract
The present invention relates to a kind of cyclic bending machine for circuit board layering, it comprises frame, be arranged on the bending mechanism in frame, particularly, bending mechanism comprises the fixing backing plate be arranged in frame, be positioned at the pressure strip above fixing backing plate, be positioned at the upper twisted plate in pressure strip front, be positioned at the lower twisted plate below twisted plate, described pressure strip, upper twisted plate and lower twisted plate can move back and forth along above-below direction respectively, bending mechanism also comprise be respectively used to drive pressure strip, the compression cylinder that upper twisted plate and lower twisted plate move back and forth, upper bending cylinder and lower bending cylinder, described cyclic bending machine also comprises inductive switch for collecting each cylinder action message or travel switch, and electrical apparatus control system.Cyclic bending machine of the present invention can not only by circuit board adjacent two layers effectively separately, and glass-fiber-fabric also easily departs from rivet, therefore, can effectively by circuit board delamination, in addition, structure of the present invention is simple, arrange convenience.
Description
Technical field
the present invention relates to a kind of cyclic bending machine for circuit board layering and application thereof.
Background technology
along with the progress of science and technology, the shortening in electronic product update cycle, electronic waste, just with the speed increment in year more than 20%, becomes fastest-rising rubbish in the world.According to interrelated data, the annual electronic waste produced in the whole world is more than 5,000 ten thousand tons at present, and wherein 70% is discarded in China by various mode, and the electronic waste that China produced in 2007 is more than 2,300,000 tons.So huge electronic waste, if process the bad environmental pollution caused to equal to natural disaster, if process appropriate, not only can not cause environmental pollution, therefrom can also reclaim a large amount of precious metal resources, also very favourable to the fast development of electronic product.
in the recycling of electronic waste, useless circuit board is the most unmanageable, mainly because the substrate (be called for short PCB, lower with) of circuit board Copper Foil epoxy resin by multilayer glass-fiber-fabric wrapped folder to form by high pressure is bonding, want the glass-fiber-fabric of PCB to be separated with Copper Foil very difficult.At present three kinds are mainly contained to the processing method of PCB: 1) burning method, be exactly by high temperature by glass-fiber-fabric carbonization volatilization only Footwall drift, because the waste gas of burning method discharge contains a large amount of bioxin, can cause serious atmosphere pollution, country has forbidden to adopt; 2) strong acid dissolution method, adopt strong acid (as sulfuric acid or chloroazotic acid) dissolving metal in PCB out to be discarded other nonmetal object exactly, the waste liquid that this method is discharged is seriously polluted with discarded nonmetal object, and country has also forbidden to adopt; 3) comminuting method, is ground into powder PCB exactly, then by suspension method or centrifugal process by metallic particles and glass powder separation, Footwall drift, metal recovery rate 90-95%, and the glass powder accounting for PCB weight 80% is again without value, landfill can contaminated land, discard in outdoor more can contaminated air.
chinese invention patent application 201210298559.8 proposes a kind of recovery method of circuit board, it is after the layer structure of circuit board being separated, skin is contained the glass layer of cloth of metallic circuit, middle copper foil layer and the strip off of internal layer glass layer of cloth, again burning is carried out to the glass layer of cloth containing metallic circuit and obtain metal, copper foil layer direct reuse, and metal-free glass layer of cloth does not burn.This recovery method on the one hand, greatly reduces burning cost, reduces the pollution of burning and causing to environment; On the other hand, the glass-fiber-fabric that layering obtains can be back to other purposes further, turns waste into wealth.The layer structure of circuit board will effectively be separated by key that this recovery method is implemented exactly.Report according to the document, first utilize heater that circuit board is heated to more than 180 DEG C, then circuit board is passed through successively at least four group roller set of bending mechanism, be bent under making the active force of circuit board between upper roller and bottom roller, under the effect of internal stress, finally realize separating of layer structure.The method of this layering makes to be difficult to pcb board delamination owing to there is following deficiency:
1, see Fig. 1, circuit board can not layering at the break place (A) of roller crown, and only just can layering between break and break, so will through repeatedly roll extrusion, and the break of each roll extrusion can not be overlapping, just can make the layering of pcb board large area;
2, see Fig. 1, oral area (B) layering that how many times roll extrusion all cannot make PCB no matter is carried out;
3, see Fig. 2, a pcb board has usually up to a hundred and even thousands of jacks (C), these jacks are similar to rivet by PCB riveting jail, and the circuit board around socket cannot be layered.
Summary of the invention
technical problem to be solved by this invention overcomes the deficiencies in the prior art, provide a kind of structure simple, can the cyclic bending machine that each layer of circuit board is separated easily and effectively.
for solving above technical problem, the present invention takes following technical scheme:
a kind of cyclic bending machine for circuit board layering, it comprises frame, be arranged on the bending mechanism in frame, particularly, bending mechanism comprises the fixing backing plate be arranged in frame, be positioned at the pressure strip above fixing backing plate, be positioned at the upper twisted plate in pressure strip front, be positioned at the lower twisted plate below twisted plate, described pressure strip, upper twisted plate and lower twisted plate can move back and forth along above-below direction respectively, bending mechanism also comprise be respectively used to drive pressure strip, the compression cylinder that upper twisted plate and lower twisted plate move back and forth, upper bending cylinder and lower bending cylinder, described cyclic bending machine also comprises inductive switch for collecting each cylinder action message or travel switch, and electrical apparatus control system.
further, the level interval L3 between described upper twisted plate and fixing backing plate, the level interval L4 between lower twisted plate and fixing backing plate are all less than or equal to 3 times of circuit board thickness, are more than or equal to circuit board thickness.The fixing forward position of close upper twisted plate of backing plate, the forward position of the close lower twisted plate of pressure strip are fillet, and the radius of fillet is all less than or equal to 2 times of circuit board thickness.
according to an aspect of the present invention: bending mechanism also comprises and being arranged in frame and the twisted plate slide bar extended along the vertical direction, and described upper twisted plate and lower twisted plate all can be slidably arranged on described twisted plate slide bar.
according to another aspect of the invention: bending mechanism also comprises and being separately positioned in frame and the upper twisted plate slide bar extended along the vertical direction and lower twisted plate slide bar, and upper twisted plate and lower twisted plate can be slidably arranged on twisted plate slide bar and lower twisted plate slide bar respectively.
according to another aspect of the invention, described bending mechanism also comprises and being arranged in frame and the pressure strip slide bar extended along the vertical direction, and pressure strip can be slidably arranged on described pressure strip slide bar.
further, described bending machine also comprises for the feed mechanism of transporting circuit board by bending mechanism, and this feed mechanism is controlled by described electrical apparatus control system, namely stops after described circuit board is fed forward setpoint distance.According to a concrete aspect, described feed mechanism comprises a pair feed rolls and for driving the motor of described feed rolls, described motor is stepper motor or servomotor.Preferably, described feed mechanism also comprises and is arranged on upper heating and thermal insulation plate in described frame and lower heating and thermal insulation plate, form the passage that power circuit board passes through between described upper heating and thermal insulation plate and lower heating and thermal insulation plate, described upper heating and thermal insulation plate and lower heating and thermal insulation plate are formed respectively for dodge described feed rolls and with the escape groove of described channel connection.
described heating and thermal insulation plate refers to the plate with heating and/or heat insulation function.
preferably, described cyclic bending machine also comprises and is arranged on the heat-insulation layer of described bending mechanism periphery for being incubated the working environment of circuit board.
the present invention is also in particular to the application of above-mentioned cyclic bending machine in circuit board reclaims.
due to the enforcement of above technical scheme, the present invention compared with prior art tool has the following advantages:
cyclic bending machine of the present invention can not only by circuit board adjacent two layers effectively separately, and glass-fiber-fabric also easily departs from rivet, therefore, can effectively by circuit board delamination, in addition, structure of the present invention is simple, arrange convenience.
Accompanying drawing explanation
below in conjunction with accompanying drawing and specific embodiment, the present invention will be further described in detail:
fig. 1 carries out the bending schematic diagram of circuit board for the roller bending method adopting 2012102985598 to provide;
fig. 2 is the jack structure schematic diagram of circuit board;
fig. 3 is the schematic front view according to cyclic bending machine of the present invention;
fig. 4 be in Fig. 3 A-A to schematic diagram;
fig. 5 be in Fig. 3 C-C to schematic diagram;
fig. 6 is the close-up schematic view of Fig. 5;
fig. 7 is the schematic diagram of circuit board when being in state to be bent;
fig. 8 is the schematic diagram after circuit board is bent downwardly;
wherein: 1, circuit board; 3, cyclic bending machine; 30a, feed rolls; 30b, heating and thermal insulation plate; 31, fixing backing plate; 32, pressure strip; 33, upper twisted plate; 34, lower twisted plate; 35a, compression cylinder; 35b, upper bending cylinder; 35c, lower bending cylinder; 36, twisted plate slide bar; 37, pressure strip slide bar; 38, frame; 39, heat-insulation layer.
Detailed description of the invention
embodiment 1
this example provides a kind of cyclic bending machine.As shown in Figures 3 to 5, cyclic bending machine 3 of the present invention is primarily of feed mechanism, fixing backing plate 31, pressure strip 32, upper twisted plate 33, lower twisted plate 34, cylinder (comprising compression cylinder 35a, upper bending cylinder 35b, lower bending cylinder 35c), twisted plate slide bar 36, pressure strip slide bar 37, frame 38, heat-insulation layer 39 and corresponding inductive switch or the composition such as travel switch, electrical apparatus control system.Feed mechanism comprises a pair feed rolls 30a, for driving stepper motor or the servomotor of feed rolls 30a.Fixing backing plate 31 is fixed in frame 38; Pressure strip 32 can move along pressure strip slide bar 37, is controlled by compression cylinder 35a; Upper twisted plate 33 can move along twisted plate slide bar 36, is controlled by upper bending cylinder 35b; Lower twisted plate 34 can move along twisted plate slide bar 37, is controlled by lower bending cylinder 35c.The action message of feed mechanism and each cylinder is collected by corresponding inductive switch or travel switch, and their coordination is completed by electrical apparatus control system.
level interval L3 between upper twisted plate 33 and fixing backing plate 31, the level interval L4 between lower twisted plate 34 and fixing backing plate 31 are all less than or equal to 3 times of circuit board 1 thickness.Fixing the forward position R1 of close upper twisted plate 33 of backing plate 31, the forward position R2 of the close lower twisted plate 34 of pressure strip 32 are fillet, and the radius of fillet is all less than or equal to 2 times of circuit board 1 thickness.
above-described twisted plate slide bar 36 can by upper and lower separately design.
in addition, feed mechanism also can comprise the plate of the heating and thermal insulation up and down 30b be arranged in frame 38 further, allows circuit board 1 pass through between upper and lower heating and thermal insulation plate 30b.Cyclic bending machine also comprises and is arranged on the heat-insulation layer 39 of bending mechanism periphery for being incubated the working environment of circuit board 1.
the step that employing the present invention carries out circuit board layering is as follows:
namely circuit board is fed forward certain distance L1 by a, feed mechanism stops; B, compression cylinder action, pressure strip compresses circuit board; C, upper bending cylinder action, upper twisted plate is bent downwardly circuit board and returns fast; D, lower bending cylinder action, lower twisted plate is bent upwards circuit board and returns fast; E, compression cylinder action, pressure strip unclamps circuit board.Feed mechanism starts again, circuit board is carried certain distance L 2 forward again, again repeat 5 above steps, above 5 steps are a cyclic bending cycle, the continuous repetition cyclic bending cycle, until feed mechanism cannot effectively be fed forward by control circuit board, then circuit board is turned around to proceed the above cyclic bending cycle, until whole circuit board is all through cyclic bending.
embodiment 2
this example provides each amount of feeding of a kind of method (cyclic bending method or bending staggered floor method) utilizing the cyclic bending machine of embodiment 1 to bend circuit board to be L(L=3mm), in circuit board, every layer thickness is a (a=0.2 mm), see Fig. 7, when compression is carried out bending to it, the phenomenon as Fig. 8 will be produced, internal layer and skin will be forced the H (H=1.884) that staggers, adjacent two layers also can be staggered h (h=0.314), h=(a × Π) ÷ 2, the offset h of adjacent two layers is removed the degree of staggering being referred to as adjacent two layers in amount of feeding L by us, and represent with d, then d=h/L, when degree of staggering d is sufficiently more than the percentage elongation of material itself, the power that staggers of adjacent two layers will overcome the adhesion between them and produce and staggers, circuit board forms by multilayer glass-fiber-fabric is bonding, the percentage elongation of glass-fiber-fabric 180 degree time is less than 0.3%, degree of the staggering d that Fig. 8 provides is 10.47%(d=0.314/3), much larger than the percentage elongation of glass-fiber-fabric, degree of staggering is relevant with the amount of feeding, the amount of feeding is unsuitable excessive.When jack rivet moves to bending staggered floor district, rivet can be stretched inclination certain angle and unclamping, and glass-fiber-fabric hole also can be drawn as ellipse, and glass-fiber-fabric and rivet are easily departed from, if cyclic bending staggered floor, glass-fiber-fabric and rivet have just more easily departed from.
above to invention has been detailed description; its object is to allow the personage being familiar with this art can understand content of the present invention and be implemented; can not limit the scope of the invention with this; the equivalence change that all Spirit Essences according to the present invention are done or modification, all should be encompassed in protection scope of the present invention.
Claims (8)
1., for a cyclic bending machine for circuit board layering, it comprises frame, the bending mechanism be arranged in described frame, it is characterized in that:
Described bending mechanism comprises the fixing backing plate be arranged in described frame, be positioned at pressure strip above described fixing backing plate, be positioned at the upper twisted plate in described pressure strip front, be positioned at lower twisted plate below described upper twisted plate, described pressure strip, upper twisted plate and lower twisted plate can move back and forth along above-below direction respectively, and described bending mechanism also comprises the compression cylinder being respectively used to drive described pressure strip, upper twisted plate and lower twisted plate to move back and forth, upper bending cylinder and lower bending cylinder;
Described cyclic bending machine also comprises inductive switch for collecting described each described cylinder action message or travel switch, and electrical apparatus control system;
Level interval L3 between described upper twisted plate and described fixing backing plate, level interval L4 between described lower twisted plate and described fixing backing plate are all less than or equal to 3 times of circuit board thickness and are more than or equal to circuit board thickness;
Described bending machine also comprises for the feed mechanism of transporting circuit board by bending mechanism, and this feed mechanism is controlled by described electrical apparatus control system, namely stops after described circuit board is fed forward setpoint distance.
2. the cyclic bending machine for circuit board layering according to claim 1, it is characterized in that: the forward position of the forward position of the close described upper twisted plate of described fixing backing plate, the close described lower twisted plate of described pressure strip is fillet, and the radius of fillet is all less than or equal to 2 times of circuit board thickness.
3. the cyclic bending machine for circuit board layering according to claim 1, it is characterized in that: described feed mechanism comprises a pair feed rolls and for driving the motor of described feed rolls, described motor is stepper motor or servomotor, described feed mechanism also comprises and is arranged on upper heating and thermal insulation plate in described frame and lower heating and thermal insulation plate, the passage that power circuit board passes through is formed between described upper heating and thermal insulation plate and lower heating and thermal insulation plate, described upper heating and thermal insulation plate and lower heating and thermal insulation plate are formed respectively for dodge described feed rolls and with the escape groove of described channel connection.
4. the cyclic bending machine for circuit board layering according to claim 1, it is characterized in that: described bending mechanism also comprises and being arranged in described frame and the twisted plate slide bar extended along the vertical direction, and described upper twisted plate and lower twisted plate all can be slidably arranged on described twisted plate slide bar.
5. the cyclic bending machine for circuit board layering according to claim 1, it is characterized in that: described bending mechanism also comprises and being separately positioned in described frame and the upper twisted plate slide bar extended along the vertical direction and lower twisted plate slide bar, and described upper twisted plate and lower twisted plate can be slidably arranged on described upper twisted plate slide bar and lower twisted plate slide bar respectively.
6. the cyclic bending machine for circuit board layering according to claim 1, it is characterized in that: described bending mechanism also comprises and being arranged in described frame and the pressure strip slide bar extended along the vertical direction, and described pressure strip can be slidably arranged on described pressure strip slide bar.
7. the cyclic bending machine for circuit board layering according to claim 1, is characterized in that: described cyclic bending machine also comprises and is arranged on the heat-insulation layer of described bending mechanism periphery for being incubated the working environment of circuit board.
8. the application of the cyclic bending machine any one of claim 1 to 7 as described in claim in circuit board reclaims.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410117451.3A CN103895323B (en) | 2014-03-27 | 2014-03-27 | A kind of cyclic bending machine for circuit board layering and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410117451.3A CN103895323B (en) | 2014-03-27 | 2014-03-27 | A kind of cyclic bending machine for circuit board layering and application thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103895323A CN103895323A (en) | 2014-07-02 |
| CN103895323B true CN103895323B (en) | 2015-09-30 |
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| CN201410117451.3A Active CN103895323B (en) | 2014-03-27 | 2014-03-27 | A kind of cyclic bending machine for circuit board layering and application thereof |
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Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4206286B2 (en) * | 2003-03-27 | 2009-01-07 | 日新製鋼株式会社 | Flange bending method for painted steel sheet |
| CN102784794B (en) * | 2012-08-21 | 2014-07-30 | 中国科学院化学研究所 | Method for recycling circuit board |
| CN203494955U (en) * | 2013-09-02 | 2014-03-26 | 洛阳市宇龙办公机具有限公司 | Sheet edge bending mechanism |
| CN103639522B (en) * | 2013-11-15 | 2015-11-18 | 四川银河钢结构工程有限公司 | A kind of fixed length plate shearing machine being applicable to different thickness of slab |
| CN203725551U (en) * | 2014-03-27 | 2014-07-23 | 宁波同道恒信环保科技有限公司 | Reciprocating bending machine for laminating circuit board |
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| CN103895323A (en) | 2014-07-02 |
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Effective date of registration: 20231128 Address after: Room 2025, Building 005, No. 750 Chuangyuan Road, High tech Zone, Ningbo City, Zhejiang Province, 315100 Patentee after: NINGBO TONGDAO HENGXIN ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. Patentee after: INSTITUTE OF CHEMISTRY, CHINESE ACADEMY OF SCIENCES Address before: Room 2025, Building 005, No. 750 Chuangyuan Road, High tech Zone, Ningbo City, Zhejiang Province, 315100 Patentee before: NINGBO TONGDAO HENGXIN ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. |
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