CN103895323A - Reciprocating bending machine for layering circuit boards and application of reciprocating bending machine - Google Patents
Reciprocating bending machine for layering circuit boards and application of reciprocating bending machine Download PDFInfo
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- CN103895323A CN103895323A CN201410117451.3A CN201410117451A CN103895323A CN 103895323 A CN103895323 A CN 103895323A CN 201410117451 A CN201410117451 A CN 201410117451A CN 103895323 A CN103895323 A CN 103895323A
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- circuit board
- plate
- twisted plate
- bending machine
- bending
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- 238000005452 bending Methods 0.000 title claims abstract description 91
- 230000006835 compression Effects 0.000 claims abstract description 15
- 238000007906 compression Methods 0.000 claims abstract description 15
- 125000004122 cyclic group Chemical group 0.000 claims description 32
- 238000009413 insulation Methods 0.000 claims description 22
- 238000010438 heat treatment Methods 0.000 claims description 17
- 230000001939 inductive effect Effects 0.000 claims description 4
- 239000004744 fabric Substances 0.000 abstract description 16
- 239000011521 glass Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 16
- 238000010586 diagram Methods 0.000 description 8
- 239000010793 electronic waste Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 238000001125 extrusion Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 238000003763 carbonization Methods 0.000 description 1
- 238000011978 dissolution method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005300 metallic glass Substances 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- NICDRCVJGXLKSF-UHFFFAOYSA-N nitric acid;trihydrochloride Chemical compound Cl.Cl.Cl.O[N+]([O-])=O NICDRCVJGXLKSF-UHFFFAOYSA-N 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000010970 precious metal Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000002912 waste gas Substances 0.000 description 1
Images
Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Abstract
The invention relates to a reciprocating bending machine for layering circuit boards. The reciprocating bending machine comprises a stander and a bending mechanism arranged on the stander. The reciprocating bending machine is characterized in that the bending mechanism comprises a fixed gasket, a compression plate, an upper bending plate, a lower bending plate, a compression air cylinder, an upper bending air cylinder and a lower air cylinder, wherein the fixed gasket is arranged on the stander, the compression plate is located above the fixed gasket, the upper bending plate is located in front of the compression plate, the lower bending plate is located below the upper bending plate; the compression plate, the upper bending plate and the lower bending plate can respectively do a reciprocating motion along the longitudinal direction, and the compression air cylinder, the upper bending air cylinder and the lower air cylinder are used for respectively driving the compression plate, the upper bending plate and the lower bending plate to do the reciprocating motion. The reciprocating bending machine further comprises a sensing switch or a travel switch and an electrical apparatus control system, wherein the sensing switch or the travel switch is used for collecting action information of each air cylinder. According to the reciprocating bending machine, two layers of adjacent circuit boards can be effectively separated, and a glass fabric and rivets can be easily separated, so that the circuit boards can be effectively layered and stripped; besides, the reciprocating bending machine is simple in structure and is convenient to arrange.
Description
Technical field
the present invention relates to a kind of cyclic bending machine and application thereof for circuit board layering.
Background technology
along with scientific and technological progress, the shortening in electronic product update cycle, just more than 20% speed increment with year of electronic waste, becomes fastest-rising rubbish in the world.According to interrelated data, at present the annual electronic waste producing in the whole world exceedes 5,000 ten thousand tons, wherein 70% be discarded in China by variety of way, and the electronic waste that China produced in 2007 exceedes 2,300,000 tons.So huge electronic waste, equals to natural disaster if process the bad environmental pollution causing, if process appropriately, not only can not cause environmental pollution, can also therefrom reclaim a large amount of precious metal resources, also very favourable to the fast development of electronic product.
in the recycling of electronic waste, useless circuit board is the most unmanageable, be mainly because the substrate of circuit board (being called for short PCB, lower same) is Copper Foil epoxy resin by multilayer glass-fiber-fabric wrapped folder to form by high pressure is bonding, want the glass-fiber-fabric of PCB to separate with Copper Foil very difficult.At present the processing method of PCB is mainly contained to three kinds: 1) burning method, by high temperature, glass-fiber-fabric carbonization volatilization is only reclaimed to metal exactly, because the waste gas of burning method discharge contains a large amount of bioxin, can cause serious atmosphere pollution, country has forbidden to adopt; 2) strong acid dissolution method, adopts strong acid (as sulfuric acid or chloroazotic acid) dissolving metal in PCB out to be discarded to other nonmetal object exactly, and the waste liquid that this method is discharged and discarded nonmetal object are seriously polluted, and country has also forbidden to adopt; 3) comminuting method, is ground into powder PCB exactly, then by suspension method or centrifugal process by metallic particles and glass powder separation, only reclaim metal, metal recovery rate 90-95%, and the glass powder that accounts for PCB weight 80% is again without value, landfill can contaminated land, discard in outdoor more can contaminated air.
chinese invention patent application 201210298559.8 has proposed a kind of recovery method of circuit board, it is after the layer structure of circuit board is separated, the glass layer of cloth that skin is contained to metallic circuit, middle copper foil layer and the strip off of internal layer glass layer of cloth, again the glass layer of cloth that contains metallic circuit is burned and obtains metal, copper foil layer direct reuse, and metal-free glass layer of cloth does not burn.This recovery method on the one hand, has greatly reduced burning cost, reduces and burns the pollution causing to environment; On the other hand, the glass-fiber-fabric that layering obtains can further be back to other purposes, turns waste into wealth.The key that this recovery method is implemented will effectively be separated the layer structure of circuit board exactly.Report according to the document, first utilize heater that circuit board is heated to more than 180 DEG C, then circuit board is passed through at least four group roller set of bending mechanism successively, circuit board is bent under the active force between upper roller and bottom roller, finally under the effect of internal stress, realizes separating of layer structure.The method of this layering is owing to existing following deficiency to make to be difficult to by pcb board delamination:
1, referring to Fig. 1, circuit board can layering at the break place of roller crown (A), and only just can layering between break and break, thus will be through repeatedly roll extrusion, and the break of each roll extrusion can not be overlapping, just can make the layering of pcb board large area;
2, referring to Fig. 1, no matter carry out how many times roll extrusion and all cannot make oral area (B) layering of PCB;
3, referring to Fig. 2, on a pcb board, conventionally there are up to a hundred and even thousands of jacks (C), these jacks are similar to rivet by PCB riveting jail, and socket circuit board around cannot be by layering.
Summary of the invention
technical problem to be solved by this invention is to overcome the deficiencies in the prior art, provide a kind of simple in structure, can be easily and effectively by each layer of the circuit board cyclic bending machine separating.
for solving above technical problem, the present invention takes following technical scheme:
a kind of cyclic bending machine for circuit board layering, it comprises frame, be arranged on the bending mechanism in frame, particularly, bending mechanism comprises the fixing backing plate being arranged in frame, be positioned at the pressure strip of fixing backing plate top, be positioned at the upper twisted plate in pressure strip front, be positioned at the lower twisted plate of twisted plate below, described pressure strip, upper twisted plate and lower twisted plate can move back and forth along above-below direction respectively, bending mechanism also comprises and is respectively used to drive pressure strip, the compression cylinder that upper twisted plate and lower twisted plate move back and forth, upper bending cylinder and lower bending cylinder, described cyclic bending machine also comprises inductive switch or the travel switch for collecting each cylinder action message, and electrical apparatus control system.
further, the level interval L4 between the level interval L3 between described upper twisted plate and fixing backing plate, lower twisted plate and fixing backing plate is all less than or equal to 3 times of circuit board thickness, is more than or equal to circuit board thickness.The forward position of the forward position of the close upper twisted plate of fixing backing plate, the close lower twisted plate of pressure strip is fillet, and the radius of fillet is all less than or equal to 2 times of circuit board thickness.
according to an aspect of the present invention: bending mechanism also comprises the twisted plate slide bar that is arranged in frame and extends along the vertical direction, and described upper twisted plate and lower twisted plate all can be slidably arranged on described twisted plate slide bar.
according to another aspect of the invention: bending mechanism also comprises the upper twisted plate slide bar and the lower twisted plate slide bar that are separately positioned in frame and extend along the vertical direction, and upper twisted plate and lower twisted plate can be slidably arranged in respectively on twisted plate slide bar and lower twisted plate slide bar.
according to another aspect of the invention, described bending mechanism also comprises the pressure strip slide bar that is arranged in frame and extends along the vertical direction, and pressure strip can be slidably arranged on described pressure strip slide bar.
further, described bending machine also comprises that for delivery of circuit board, by the feed mechanism of bending mechanism, this feed mechanism, by described electrical apparatus control system control, stops after described circuit board is fed forward to setpoint distance.According to a concrete aspect, described feed mechanism comprises a pair of feed rolls and for driving the motor of described feed rolls, described motor is stepper motor or servomotor.Preferably, described feed mechanism also comprises the upper heating and thermal insulation plate and the lower heating and thermal insulation plate that are arranged in described frame, between described upper heating and thermal insulation plate and lower heating and thermal insulation plate, form the passage that power circuit board passes through, on described upper heating and thermal insulation plate and lower heating and thermal insulation plate, be formed with respectively for dodging described feed rolls and the groove of dodging with described channel connection.
described heating and thermal insulation plate refers to have the plate of heating and/or heat insulation function.
preferably, described cyclic bending machine also comprises and is arranged on the heat-insulation layer of described bending mechanism periphery for the working environment of circuit board is incubated.
the present invention is also particularly related to the application of above-mentioned cyclic bending machine in circuit board reclaims.
due to the enforcement of above technical scheme, the present invention compared with prior art tool has the following advantages:
cyclic bending machine of the present invention not only can by circuit board adjacent two layers effectively separately, and glass-fiber-fabric also easily departs from rivet, therefore, can be effectively by circuit board delamination, in addition, the present invention is simple in structure, convenience is set.
Brief description of the drawings
below in conjunction with accompanying drawing and specific embodiment, the present invention will be further described in detail:
the schematic diagram of Fig. 1 for adopting the 2012102985598 roller bending methods that provide to carry out circuit board bending;
fig. 2 is the jack structure schematic diagram of circuit board;
fig. 3 looks schematic diagram according to the master of cyclic bending machine of the present invention;
fig. 4 be in Fig. 3 A-A to schematic diagram;
fig. 5 be in Fig. 3 C-C to schematic diagram;
fig. 6 is the local enlarged diagram of Fig. 5;
fig. 7 is the schematic diagram of circuit board in the time of state to be bent;
fig. 8 is the schematic diagram after circuit board is bent downwardly;
wherein: 1, circuit board; 3, cyclic bending machine; 30a, feed rolls; 30b, heating and thermal insulation plate; 31, fixing backing plate; 32, pressure strip; 33, upper twisted plate; 34, lower twisted plate; 35a, compression cylinder; 35b, upper bending cylinder; 35c, lower bending cylinder; 36, twisted plate slide bar; 37, pressure strip slide bar; 38, frame; 39, heat-insulation layer.
Detailed description of the invention
this example provides a kind of cyclic bending machine.As shown in Figures 3 to 5, cyclic bending machine 3 of the present invention is mainly made up of feed mechanism, fixing backing plate 31, pressure strip 32, upper twisted plate 33, lower twisted plate 34, cylinder (comprising compression cylinder 35a, upper bending cylinder 35b, lower bending cylinder 35c), twisted plate slide bar 36, pressure strip slide bar 37, frame 38, heat-insulation layer 39 and corresponding inductive switch or travel switch, electrical apparatus control system etc.Feed mechanism comprises a pair of feed rolls 30a, for driving stepper motor or the servomotor of feed rolls 30a.Fixing backing plate 31 is fixed in frame 38; Pressure strip 32 can move along pressure strip slide bar 37, and by compression cylinder, 35a controls; Upper twisted plate 33 can move along twisted plate slide bar 36, is controlled by upper bending cylinder 35b; Lower twisted plate 34 can move along twisted plate slide bar 37, is controlled by lower bending cylinder 35c.The action message of feed mechanism and each cylinder is collected by corresponding inductive switch or travel switch, and their coordination is completed by electrical apparatus control system.
level interval L4 between level interval L3, lower twisted plate 34 and fixing backing plate 31 between upper twisted plate 33 and fixing backing plate 31 is all less than or equal to 3 times of circuit board 1 thickness.The forward position R2 of the forward position R1 of the close upper twisted plate 33 of fixing backing plate 31, the close lower twisted plate 34 of pressure strip 32 is fillet, and the radius of fillet is all less than or equal to 2 times of circuit board 1 thickness.
above-described twisted plate slide bar 36 can be by upper and lower separately design.
in addition, feed mechanism also can further comprise the plate of the heating and thermal insulation up and down 30b being arranged in frame 38, allows circuit board 1 pass through between upper and lower heating and thermal insulation plate 30b.Cyclic bending machine also comprises and is arranged on the heat-insulation layer 39 of bending mechanism periphery for the working environment of circuit board 1 is incubated.
the step that employing the present invention carries out circuit board layering is as follows:
circuit board is fed forward certain distance L 1 by a, feed mechanism stops; B, compression cylinder action, pressure strip compresses circuit board; C, upper bending cylinder action, upper twisted plate is bent downwardly circuit board and returns fast; D, lower bending cylinder action, lower twisted plate is bent upwards circuit board and returns fast; E, compression cylinder action, pressure strip unclamps circuit board.Feed mechanism starts again, circuit board is carried to certain distance L 2 more forward, again repeat 5 above steps, above 5 steps are a cyclic bending cycle, constantly repeat the cyclic bending cycle, until feed mechanism effectively control circuit board be fed forward, then circuit board is turned around to proceed the above cyclic bending cycle, until whole circuit board all passes through cyclic bending.
embodiment 2
it is L(L=3mm that this example provides the cyclic bending machine of a kind of embodiment of utilization 1 to carry out the each amount of feeding of bending method (cyclic bending method or bending staggered floor method) to circuit board), in circuit board, every layer thickness is a (a=0.2 mm), see Fig. 7, in the time that compression is carried out bending to it, will produce the phenomenon as Fig. 8, internal layer and skin will be forced to stagger H (H=1.884), the adjacent two layers h (h=0.314) that also can be staggered, h=(a × Π) ÷ 2, we remove the amount of the staggering h of adjacent two layers the degree of staggering that is referred to as adjacent two layers in amount of feeding L, and represent with d, d=h/L, when degree of staggering d is sufficiently more than the percentage elongation of material itself, the power that staggers of adjacent two layers will overcome the adhesion between them and produce and staggers, circuit board forms by multilayer glass-fiber-fabric is bonding, the percentage elongation of glass-fiber-fabric in the time that 180 spend is less than 0.3%, degree of the staggering d that Fig. 8 provides is 10.47%(d=0.314/3), much larger than the percentage elongation of glass-fiber-fabric, degree of staggering is relevant with the amount of feeding, the amount of feeding is unsuitable excessive.In the time that jack rivet moves to bending staggered floor district, rivet can be stretched inclination certain angle and unclamp, and glass-fiber-fabric hole also can be drawn as ellipse, and glass-fiber-fabric and rivet are easily departed from, if cyclic bending staggered floor, glass-fiber-fabric and rivet have just more easily departed from.
above the present invention is described in detail; its object is to allow the personage who is familiar with this art can understand content of the present invention and be implemented; can not limit the scope of the invention with this; the equivalence that all Spirit Essences according to the present invention are done changes or modifies, and all should be encompassed in protection scope of the present invention.
Claims (10)
1. for a cyclic bending machine for circuit board layering, it comprises frame, is arranged on the bending mechanism in described frame, it is characterized in that:
Described bending mechanism comprises fixing backing plate, the pressure strip that is positioned at described fixing backing plate top, the upper twisted plate that is positioned at described pressure strip front being arranged in described frame, the lower twisted plate that is positioned at described upper twisted plate below, described pressure strip, upper twisted plate and lower twisted plate can move back and forth along above-below direction respectively, and described bending mechanism also comprises and is respectively used to the compression cylinder that drives described pressure strip, upper twisted plate and lower twisted plate to move back and forth, upper bending cylinder and lower bending cylinder;
Described cyclic bending machine also comprises inductive switch or the travel switch for collecting described each described cylinder action message, and electrical apparatus control system.
2. the cyclic bending machine for circuit board layering according to claim 1, is characterized in that: the level interval L4 between the level interval L3 between described upper twisted plate and described fixing backing plate, described lower twisted plate and described fixing backing plate is all less than or equal to 3 times of circuit board thickness, is more than or equal to circuit board thickness.
3. the cyclic bending machine for circuit board layering according to claim 1, it is characterized in that: the forward position of the forward position of the close described upper twisted plate of described fixing backing plate, the close described lower twisted plate of described pressure strip is fillet, and the radius of fillet is all less than or equal to 2 times of circuit board thickness.
4. the cyclic bending machine for circuit board layering according to claim 1, it is characterized in that: described bending machine also comprises for delivery of circuit board by the feed mechanism of bending mechanism, this feed mechanism, by described electrical apparatus control system control, stops after described circuit board is fed forward to setpoint distance.
5. the cyclic bending machine for circuit board layering according to claim 4, it is characterized in that: described feed mechanism comprises a pair of feed rolls and for driving the motor of described feed rolls, described motor is stepper motor or servomotor, described feed mechanism also comprises the upper heating and thermal insulation plate and the lower heating and thermal insulation plate that are arranged in described frame, between described upper heating and thermal insulation plate and lower heating and thermal insulation plate, form the passage that power circuit board passes through, on described upper heating and thermal insulation plate and lower heating and thermal insulation plate, be formed with respectively for dodging described feed rolls and the groove of dodging with described channel connection.
6. the cyclic bending machine for circuit board layering according to claim 1, it is characterized in that: described bending mechanism also comprises the twisted plate slide bar that is arranged in described frame and extends along the vertical direction, and described upper twisted plate and lower twisted plate all can be slidably arranged on described twisted plate slide bar.
7. the cyclic bending machine for circuit board layering according to claim 1, it is characterized in that: described bending mechanism also comprises the upper twisted plate slide bar and the lower twisted plate slide bar that are separately positioned in described frame and extend along the vertical direction, described upper twisted plate and lower twisted plate can be slidably arranged in respectively on described upper twisted plate slide bar and lower twisted plate slide bar.
8. the cyclic bending machine for circuit board layering according to claim 1, it is characterized in that: described bending mechanism also comprises the pressure strip slide bar that is arranged in described frame and extends along the vertical direction, and described pressure strip can be slidably arranged on described pressure strip slide bar.
9. the cyclic bending machine for circuit board layering according to claim 1, is characterized in that: described cyclic bending machine also comprises and is arranged on the heat-insulation layer of described bending mechanism periphery for the working environment of circuit board is incubated.
10. the cyclic bending machine as described in any one claim in claim 1 to 9 application in circuit board reclaims.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410117451.3A CN103895323B (en) | 2014-03-27 | 2014-03-27 | A kind of cyclic bending machine for circuit board layering and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410117451.3A CN103895323B (en) | 2014-03-27 | 2014-03-27 | A kind of cyclic bending machine for circuit board layering and application thereof |
Publications (2)
| Publication Number | Publication Date |
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| CN103895323A true CN103895323A (en) | 2014-07-02 |
| CN103895323B CN103895323B (en) | 2015-09-30 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004291397A (en) * | 2003-03-27 | 2004-10-21 | Nisshin Steel Co Ltd | Coated steel strip for bending flange and method for bending flange of coated steel strip |
| CN102784794A (en) * | 2012-08-21 | 2012-11-21 | 中国科学院化学研究所 | Method for recycling circuit board |
| CN103639522A (en) * | 2013-11-15 | 2014-03-19 | 四川银河钢结构工程有限公司 | Fixed length plate shearing machine applicable to plates of different thicknesses |
| CN203494955U (en) * | 2013-09-02 | 2014-03-26 | 洛阳市宇龙办公机具有限公司 | Sheet edge bending mechanism |
| CN203725551U (en) * | 2014-03-27 | 2014-07-23 | 宁波同道恒信环保科技有限公司 | Reciprocating bending machine for laminating circuit board |
-
2014
- 2014-03-27 CN CN201410117451.3A patent/CN103895323B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004291397A (en) * | 2003-03-27 | 2004-10-21 | Nisshin Steel Co Ltd | Coated steel strip for bending flange and method for bending flange of coated steel strip |
| CN102784794A (en) * | 2012-08-21 | 2012-11-21 | 中国科学院化学研究所 | Method for recycling circuit board |
| CN203494955U (en) * | 2013-09-02 | 2014-03-26 | 洛阳市宇龙办公机具有限公司 | Sheet edge bending mechanism |
| CN103639522A (en) * | 2013-11-15 | 2014-03-19 | 四川银河钢结构工程有限公司 | Fixed length plate shearing machine applicable to plates of different thicknesses |
| CN203725551U (en) * | 2014-03-27 | 2014-07-23 | 宁波同道恒信环保科技有限公司 | Reciprocating bending machine for laminating circuit board |
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| CN103895323B (en) | 2015-09-30 |
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Effective date of registration: 20231128 Address after: Room 2025, Building 005, No. 750 Chuangyuan Road, High tech Zone, Ningbo City, Zhejiang Province, 315100 Patentee after: NINGBO TONGDAO HENGXIN ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. Patentee after: INSTITUTE OF CHEMISTRY, CHINESE ACADEMY OF SCIENCES Address before: Room 2025, Building 005, No. 750 Chuangyuan Road, High tech Zone, Ningbo City, Zhejiang Province, 315100 Patentee before: NINGBO TONGDAO HENGXIN ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. |
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