CN102784794B - Method for recycling circuit board - Google Patents
Method for recycling circuit board Download PDFInfo
- Publication number
- CN102784794B CN102784794B CN201210298559.8A CN201210298559A CN102784794B CN 102784794 B CN102784794 B CN 102784794B CN 201210298559 A CN201210298559 A CN 201210298559A CN 102784794 B CN102784794 B CN 102784794B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- roller
- tooth
- recovery method
- upper roller
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02W—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO WASTEWATER TREATMENT OR WASTE MANAGEMENT
- Y02W30/00—Technologies for solid waste management
- Y02W30/50—Reuse, recycling or recovery technologies
- Y02W30/82—Recycling of waste of electrical or electronic equipment [WEEE]
Landscapes
- Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
The invention discloses a method for recycling a circuit board. The method includes stripping off an outer glass fiber cloth layer comprising a metal circuit, a middle copper foil layer and an inner glass fiber cloth layer after splitting layered structures of the circuit board; and then burning the glass fiber cloth layer comprising the metal circuit to obtain metal while not burning the glass fiber cloth layer without metal, and directly recycling copper foils. The method has the advantage that circuit board recycling cost and environmental pollution can be reduced.
Description
Technical field
the present invention relates to a kind of recovery method of circuit board.
Background technology
along with the developing rapidly and being widely used of electronic product, electronic waste also constantly increases, and annual with more than 5% speed increment.According to statistics, China's electronic waste in 2009 has exceeded 30,000 tons.Electronic waste has very high value, and it contains the precious metals such as copper, iron, lead, tin, chromium, cadmium, mercury, nickel, gold, silver, palladium, can bring severe contamination to environment if dealt with improperly, and if can effectively reclaim and utilize, can turn waste into wealth.
at present, in the recycling of electronic waste, by after disassembling electronic components, circuit board just no longer splits, but burns after being pulverized, and by high temperature, organic matter is vapored away, and remaining metal mixture refines again.The tenor of circuit board is generally 5% left and right, namely will burn at least more than 90% organic matter and can obtain the metal of 5% left and right.So, not only burn cost high, and caused comparatively serious pollution to environment.
Summary of the invention
technical problem to be solved by this invention is to overcome the deficiencies in the prior art, and a kind of recovery method of improved circuit board is provided.
for solving the problems of the technologies described above, the present invention adopts following technical scheme:
a kind of recovery method of circuit board, after it separates the layer structure of circuit board, the glass layer of cloth that skin is contained to metallic circuit, middle copper foil layer and the strip off of internal layer glass layer of cloth, again the glass layer of cloth that contains metallic circuit is burned and obtains metal, Copper Foil direct reuse, and metal-free glass layer of cloth does not burn.
preferably, described recovery method also comprise by described metal-free glass layer of cloth be cut into granular after as the reinforcing agent of plastics.
according to further embodiment of the present invention: adopt circuit board decker by the layer structure of circuit board separately, circuit board decker comprises:
bending mechanism, it makes circuit board produce internal stress by bent circuit board, this bending mechanism comprises roller set that at least 4 groups are arranged side by side and the driving mechanism for the work of driving rolls group, described roller set comprises the bottom roller that is positioned at the upper roller of top and is positioned at described upper roller below, described upper roller and the profile of bottom roller are all profile of tooth, and be circular arc at the bottom of the tooth top of the tooth that they have and tooth, and arc radius+circuit board thickness of the arc radius>=tooth top at the bottom of tooth, between described upper roller and bottom roller, phase rigid engagement is in transmission connection;
conveying device, its for make circuit board successively between described each group of upper roller and bottom roller by being bent;
heater, it,, for the process through being bent before described bending mechanism and at process bending mechanism at circuit board, heats it, and described heater at least can be heated to circuit board 180 DEG C.
further, the method that adopts circuit board decker that the layer structure of circuit board is separated is: first utilize described heater that circuit board is heated to more than 180 DEG C, then by circuit board successively by each roller set, circuit board is bent under the active force between upper roller and bottom roller, finally under the effect of internal stress, realizes separating of layer structure.Adopt above-mentioned specific circuit board decker to carry out the layering of circuit board, easy to operate, layered effect is good, and efficiency is high.
preferably, the arc radius of the tooth top of described upper roller, bottom roller is 0.5mm ~ 3mm.
preferably, having the circular pitch of the upper roller of one group of roller set and the profile tooth of bottom roller at least is 1.5 times of circular pitch of another group upper roller of roller set and the profile tooth of bottom roller.So, can avoid all roller set the bending point of circuit board to be overlapped and bending in the same way, thereby reach better bending effect.
preferably, described heater can be heated to circuit board 180 DEG C ~ 220 DEG C.
according to a concrete aspect, described heater is included in circuit board through circuit board being carried out pre-warmedly preheating plate and being distributed in the middle heating plate between adjacent two groups of roller set before described bending mechanism.
due to the employing of technique scheme, the present invention compared with prior art has following features:
the reuse method of circuit board of the present invention, does not directly burn circuit board, but by after circuit board layering strip off, only the glass layer of cloth that contains metallic circuit is burned and obtains due metal, on the one hand, greatly reduce burning cost, reduced and burn the pollution causing to environment; On the other hand, the glass-fiber-fabric that layering obtains can further be back to other purposes, turns waste into wealth.
Brief description of the drawings
below in conjunction with accompanying drawing and specific embodiment, the present invention will be further described in detail.
fig. 1 is the structural representation of the circuit board decker that adopts of the present invention;
fig. 2 be in Fig. 1 wherein one group of roller analyse and observe enlarged diagram;
fig. 3 is A place enlarged diagram in Fig. 2;
fig. 4 is the cooperation schematic diagram of upper roller and bottom roller in Fig. 1;
fig. 5 is the expanded view of the profile tooth of the bottom roller of one group of roller and the upper roller of another group roller;
fig. 6 is the hierarchy schematic diagram of circuit board;
wherein: 1, metallic circuit; 2,4, glass-fiber-fabric; 3, Copper Foil; 7, roller set; 70, upper roller; 71, bottom roller; 70a, 71a, denticle; 70b, 71b, teeth groove; 8, circuit board; 9, preheat plate; 10, middle heating plate; 11, carrier chain.
Detailed description of the invention
known, the structure of circuit board is stratiform.As shown in Figure 6, surface metallic circuit 1 be attached on outermost glass-fiber-fabric 2, be and then one deck Copper Foil 3, then the inside (general 5 layers) be again glass-fiber-fabric 4, use between layers glue bonding, and metal is just on metallic circuit 1 and Copper Foil 3.If can be by circuit board strip off from level to level, so just only need to burn outermost glass-fiber-fabric and just can obtain due metal, Copper Foil can direct reuse, this burns cost and the pollution to environment by reducing widely, in addition, the glass-fiber-fabric separating from circuit board can be cut into the enhancing of grain for plastics, know that glass is best plastics reinforcing agent, and its price is per ton more than ten thousand yuan.
below in conjunction with specific embodiment, the present invention is done to further detailed description, but the invention is not restricted to following examples.
embodiment 1
the present embodiment provides a kind of circuit board decker, and it comprises bending mechanism, heater and conveying device three parts.Below each several part is elaborated.
referring to Fig. 1, bending mechanism comprises the driving mechanism (not shown) that 4 groups of roller set that are arranged side by side 7 and driving rolls group 7 are rotated.Each roller set 7 is further made up of upper roller 70 and bottom roller 71.Referring to Fig. 2, Fig. 3 and Fig. 4, the tooth that the external form of upper roller 70 and bottom roller 71 is formed by the curve that is similar to circular arc forms, at the bottom of tooth top, tooth, be circular arc, the transmission of upper roller 70 and bottom roller is positive drive, the denticle 70a that guarantees upper roller 70 embeds in the teeth groove 71b of bottom roller 71, and the denticle 71a of bottom roller 71 embeds in the teeth groove 70b of upper roller 70.In addition,, for realizing the purpose of this utility model, also require the thickness of the arc radius >=tooth top arc radius+circuit board at the bottom of the tooth of upper roller 70, bottom roller 71.Circuit board 8 can be by being bent between upper roller 70 and bottom roller 71.In order further to guarantee the bending effect of bending mechanism to circuit board 8, preferably making the circular pitch of the profile tooth of the roller of one group of roller set is wherein 1.5 times of circular pitch of the roller 70 profile teeth of another group roller set.Referring to Fig. 5, below circuit board 8, be the expansion profile tooth of the bottom roller 71 of last group of roller set 7, above circuit board 8, be expansion profile tooth of upper roller 70 of another group roller set 7, the circular pitch L1 of upper roller 70 is 1.5 times of circular pitch L2 of bottom roller 71.So, if they have some bending points (A1 and B1) to overlap and be bending in the same way, must have the effect of the upper and lower bending of another bending point (A2 and B2) generation, thereby avoid the above all coincidences bending in the same way of bending point of bottom roller of many groups.
referring to Fig. 1, in this example, heater comprises and preheats plate 9 and multiple middle heating plate 10 being distributed between two groups of roller set 7.Preferably circuit board 8 can be heated to at least 180 DEG C by preheating plate 9, preferably circuit board 8 can be heated to 180 DEG C ~ 220 DEG C.Middle heating plate 10 is the temperature in BENDING PROCESS for holding circuit plate 8.Conveying device is the device through bending mechanism for delivery of circuit board, and it can adopt conventional version, for example the carrier chain 11 in this example.
embodiment 2
the present embodiment provides a kind of layered approach of circuit board, it adopts the circuit board decker described in embodiment 1 to carry out, specific as follows: first utilization preheats plate 9 circuit board 8 is heated to 180 DEG C ~ 220 DEG C, again circuit board 8 is passed through to 4 groups of roller set 7 successively, circuit board 8 is bent under the active force between upper roller 70 and bottom roller 71, through the effect of 4 groups of roller set 7, circuit board 8 produces enough internal stress, its layer structure is separated, and afterwards, circuit board 8 can be by layering strip off.
embodiment 3
the present embodiment provides a kind of reuse method of circuit board, and its method that adopts embodiment 2 is by circuit board from level to level after strip off, and outermost glass-fiber-fabric just can obtain due metal through burning, and Copper Foil can direct reuse; And the glass-fiber-fabric separating from circuit board is cut into the enhancing of grain for plastics.
the object of above-described embodiment is to allow person skilled in the art can understand content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences that Spirit Essence is done according to the present invention change or modify, within all should being encompassed in protection scope of the present invention.
Claims (7)
1. the recovery method of a circuit board, it is characterized in that: described recovery method is after the layer structure of circuit board is separated, the glass layer of cloth that skin is contained to metallic circuit, middle copper foil layer and the strip off of internal layer glass layer of cloth, again the glass layer of cloth that contains metallic circuit is burned and obtains metal, copper foil layer direct reuse, and metal-free glass layer of cloth does not burn, wherein
Adopt circuit board decker by described, the layer structure of circuit board to be separated, described circuit board decker comprises:
Bending mechanism, it makes circuit board produce internal stress by bent circuit board, this bending mechanism comprises roller set that at least 4 groups are arranged side by side and the driving mechanism for the work of driving rolls group, described roller set comprises the bottom roller that is positioned at the upper roller of top and is positioned at described upper roller below, described upper roller and the profile of bottom roller are all profile of tooth, and be circular arc at the bottom of the tooth top of the tooth that they have and tooth, and arc radius+circuit board thickness of the arc radius >=tooth top at the bottom of tooth, between described upper roller and bottom roller, phase rigid engagement is in transmission connection;
Conveying device, its for make circuit board successively between described each group of upper roller and bottom roller by being bent;
Heater, it,, for the process through being bent before described bending mechanism and at process bending mechanism at circuit board, heats it, and described heater at least can be heated to circuit board 180 DEG C.
2. the recovery method of circuit board according to claim 1, is characterized in that: described recovery method also comprise by described metal-free glass layer of cloth be cut into granular after as the reinforcing agent of plastics.
3. the recovery method of circuit board according to claim 1, it is characterized in that: the method that adopts circuit board decker that the layer structure of circuit board is separated is: first utilize described heater that circuit board is heated to more than 180 DEG C, then by circuit board successively by each roller set, circuit board is bent under the active force between upper roller and bottom roller, finally under the effect of internal stress, realizes separating of layer structure.
4. the recovery method of circuit board according to claim 3, is characterized in that: the circular pitch that has the upper roller of one group of roller set and the profile tooth of bottom roller at least is 1.5 times of another circular pitch of organizing upper roller of roller set and the profile tooth of bottom roller.
5. the recovery method of circuit board according to claim 1, is characterized in that: the arc radius of described upper roller, the tooth top of bottom roller is 0.5mm ~ 3mm.
6. the recovery method of circuit board according to claim 1, is characterized in that: described heater can be heated to circuit board 180 DEG C ~ 220 DEG C.
7. according to the recovery method of the circuit board described in claim 1 or 6, it is characterized in that: described heater is included in circuit board through circuit board being carried out pre-warmedly preheating plate and being distributed in the middle heating plate between adjacent two groups of roller set before described bending mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210298559.8A CN102784794B (en) | 2012-08-21 | 2012-08-21 | Method for recycling circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210298559.8A CN102784794B (en) | 2012-08-21 | 2012-08-21 | Method for recycling circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102784794A CN102784794A (en) | 2012-11-21 |
| CN102784794B true CN102784794B (en) | 2014-07-30 |
Family
ID=47150492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210298559.8A Active CN102784794B (en) | 2012-08-21 | 2012-08-21 | Method for recycling circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102784794B (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103895324B (en) * | 2014-03-27 | 2015-09-30 | 宁波同道恒信环保科技有限公司 | A kind of cyclic bending machine of circuit board layering |
| CN103895323B (en) * | 2014-03-27 | 2015-09-30 | 宁波同道恒信环保科技有限公司 | A kind of cyclic bending machine for circuit board layering and application thereof |
| CN103894391B (en) * | 2014-03-27 | 2015-08-12 | 宁波同道恒信环保科技有限公司 | A kind of delamination method of circuit board |
| CN113265685B (en) * | 2021-05-27 | 2024-01-23 | 益阳市菲美特新材料有限公司 | Porous copper foil and preparation method thereof |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4205405C1 (en) * | 1992-02-20 | 1993-08-19 | Schikora, Arno, O-1901 Nackel, De | Mechanical removal of electronic components from printed circuit boards - involves passing boards between pairs of drums fitted with flail-like elements which remove unwanted components and solder |
| DE19548213A1 (en) * | 1995-12-22 | 1997-06-26 | Agr Gmbh | Recycling of electronic circuit boards with circuit tracks |
| JP3878996B2 (en) * | 2002-12-24 | 2007-02-07 | 独立行政法人産業技術総合研究所 | Method and apparatus for recovering metal from printed circuit board |
| CN101269378A (en) * | 2008-04-23 | 2008-09-24 | 北京正康创智科技发展有限公司 | Method for separating fiberglass cloth and sheet metal in waste printed circuit board |
| CN101579686A (en) * | 2009-06-11 | 2009-11-18 | 四川长虹电器股份有限公司 | Non-metal material degrading method of circuit board |
| CN102350429A (en) * | 2011-07-13 | 2012-02-15 | 大连理工大学 | Method for separation and recovery of metal and nonmetal in waste printed circuit board |
| CN202366936U (en) * | 2011-12-15 | 2012-08-08 | 上海新金桥环保有限公司 | Waste printed circuit board recovery and disposal system |
-
2012
- 2012-08-21 CN CN201210298559.8A patent/CN102784794B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE4205405C1 (en) * | 1992-02-20 | 1993-08-19 | Schikora, Arno, O-1901 Nackel, De | Mechanical removal of electronic components from printed circuit boards - involves passing boards between pairs of drums fitted with flail-like elements which remove unwanted components and solder |
| DE19548213A1 (en) * | 1995-12-22 | 1997-06-26 | Agr Gmbh | Recycling of electronic circuit boards with circuit tracks |
| JP3878996B2 (en) * | 2002-12-24 | 2007-02-07 | 独立行政法人産業技術総合研究所 | Method and apparatus for recovering metal from printed circuit board |
| CN101269378A (en) * | 2008-04-23 | 2008-09-24 | 北京正康创智科技发展有限公司 | Method for separating fiberglass cloth and sheet metal in waste printed circuit board |
| CN101579686A (en) * | 2009-06-11 | 2009-11-18 | 四川长虹电器股份有限公司 | Non-metal material degrading method of circuit board |
| CN102350429A (en) * | 2011-07-13 | 2012-02-15 | 大连理工大学 | Method for separation and recovery of metal and nonmetal in waste printed circuit board |
| CN202366936U (en) * | 2011-12-15 | 2012-08-08 | 上海新金桥环保有限公司 | Waste printed circuit board recovery and disposal system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102784794A (en) | 2012-11-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102784794B (en) | Method for recycling circuit board | |
| CN102790132A (en) | Device for patterning welding ribbon, series welding method applying same and solar cell module manufactured by same | |
| CN102794977B (en) | Circuit board delamination method | |
| CN104868015A (en) | Solder strip shaping mechanism | |
| CN101986772A (en) | Method for manufacturing flexible circuit board | |
| CN103777834A (en) | Single-chip capacitor touch screen based on organic glass pane and preparation method of single-chip capacitor touch screen | |
| CN106271014B (en) | A kind of series-mounting and dereliction grid cell concatenation machine of dereliction grid solar cell | |
| CN202826654U (en) | Circuit board layering device | |
| CN203740671U (en) | Circuit board turnover mechanism for layering of circuit board | |
| CN108188816A (en) | A kind of square tube batch cutting machine | |
| CN207429647U (en) | A kind of anticollision slide plate end to end with anti-collision structure | |
| CN203077767U (en) | Rolling device | |
| CN103894391A (en) | Layered peeling method of circuit board | |
| CN108689619A (en) | A kind of processing technology of stamp laminated glass | |
| CN204975620U (en) | ECU product wave -soldering tool | |
| CN208095041U (en) | A kind of anti-screen iron cover of camera | |
| CN202115091U (en) | Cold stamping device for single paper sheets | |
| CN202166997U (en) | Touch control panel for pins on the same layer | |
| CN206149588U (en) | FPC, LED lamp strip and backlight | |
| CN203739381U (en) | Reciprocation bender for layering of circuit board | |
| CN206488699U (en) | A kind of dart target digital network | |
| CN112571504A (en) | Method for processing small skip edge of double-sided adhesive tape product | |
| CN102087429A (en) | Method for binding LCD of 3D glasses by using anisotropic conducting adhesive | |
| CN204763921U (en) | Electronic equipment's protective sheath | |
| CN103558940A (en) | Device and method for binding touch screen with FPCs (flexible circuit boards) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |