CN103909121B - For the cyclic bending machine of circuit board layering - Google Patents
For the cyclic bending machine of circuit board layering Download PDFInfo
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- CN103909121B CN103909121B CN201410118124.XA CN201410118124A CN103909121B CN 103909121 B CN103909121 B CN 103909121B CN 201410118124 A CN201410118124 A CN 201410118124A CN 103909121 B CN103909121 B CN 103909121B
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Abstract
The present invention relates to a kind of cyclic bending machine for circuit board layering, it comprises frame, bending mechanism, bending mechanism comprises the fixing backing plate be arranged in frame, be positioned at the pressure strip above fixing backing plate, be positioned at the upper twisted plate in pressure strip front, be positioned at the lower twisted plate below twisted plate, described pressure strip, upper twisted plate and lower twisted plate can move back and forth along above-below direction respectively, bending mechanism also comprises the compression cylinder for driving pressure strip to move back and forth, for the cam driving gear driving upper twisted plate and lower twisted plate to move back and forth, bending machine also comprises the electrical apparatus control system for controlling compression cylinder action.Circuit board delamination effectively can be arranged simple, good reliability by the present invention.
Description
Technical field
the present invention relates to a kind of cyclic bending machine for circuit board layering.
Background technology
along with the progress of science and technology, the shortening in electronic product update cycle, electronic waste, just with the speed increment in year more than 20%, becomes fastest-rising rubbish in the world.According to interrelated data, the annual electronic waste produced in the whole world is more than 5,000 ten thousand tons at present, and wherein 70% is discarded in China by various mode, and the electronic waste that China produced in 2007 is more than 2,300,000 tons.So huge electronic waste, if process the bad environmental pollution caused to equal to natural disaster, if process appropriate, not only can not cause environmental pollution, therefrom can also reclaim a large amount of precious metal resources, also very favourable to the fast development of electronic product.
in the recycling of electronic waste, useless circuit board is the most unmanageable, mainly because the substrate (be called for short PCB, lower with) of circuit board Copper Foil epoxy resin by multilayer glass-fiber-fabric wrapped folder to form by high pressure is bonding, want the glass-fiber-fabric of PCB to be separated with Copper Foil very difficult.At present three kinds are mainly contained to the processing method of PCB: 1) burning method, be exactly by high temperature by glass-fiber-fabric carbonization volatilization only Footwall drift, because the waste gas of burning method discharge contains a large amount of bioxin, can cause serious atmosphere pollution, country has forbidden to adopt; 2) strong acid dissolution method, adopt strong acid (as sulfuric acid or chloroazotic acid) dissolving metal in PCB out to be discarded other nonmetal object exactly, the waste liquid that this method is discharged is seriously polluted with discarded nonmetal object, and country has also forbidden to adopt; 3) comminuting method, is ground into powder PCB exactly, then by suspension method or centrifugal process by metallic particles and glass powder separation, Footwall drift, metal recovery rate 90-95%, and the glass powder accounting for PCB weight 80% is again without value, landfill can contaminated land, discard in outdoor more can contaminated air.
chinese invention patent application 201210298559.8 proposes a kind of recovery method of circuit board, it is after the layer structure of circuit board being separated, skin is contained the glass layer of cloth of metallic circuit, middle copper foil layer and the strip off of internal layer glass layer of cloth, again burning is carried out to the glass layer of cloth containing metallic circuit and obtain metal, copper foil layer direct reuse, and metal-free glass layer of cloth does not burn.This recovery method on the one hand, greatly reduces burning cost, reduces the pollution of burning and causing to environment; On the other hand, the glass-fiber-fabric that layering obtains can be back to other purposes further, turns waste into wealth.The layer structure of circuit board will effectively be separated by key that this recovery method is implemented exactly.Report according to the document, first utilize heater that circuit board is heated to more than 180 DEG C, then circuit board is passed through successively at least four group roller set of bending mechanism, be bent under making the active force of circuit board between upper roller and bottom roller, under the effect of internal stress, finally realize separating of layer structure.The method of this layering makes to be difficult to pcb board delamination owing to there is following deficiency:
1, see Fig. 1, circuit board can not layering at the break place (A) of roller crown, and only just can layering between break and break, so will through repeatedly roll extrusion, and the break of each roll extrusion can not be overlapping, just can make the layering of pcb board large area;
2, see Fig. 1, oral area (B) layering that how many times roll extrusion all cannot make PCB no matter is carried out;
3, see Fig. 2, a pcb board has usually up to a hundred and even thousands of jacks (C), these jacks are similar to rivet by PCB riveting jail, and the circuit board around socket cannot be layered.
Summary of the invention
technical problem to be solved by this invention overcomes the deficiencies in the prior art, provide a kind of can the cyclic bending machine that each layer of circuit board is separated easily and effectively.
for solving above technical problem, the present invention takes following technical scheme:
a kind of cyclic bending machine for circuit board layering, it comprises frame, be arranged on the bending mechanism in frame, described bending mechanism comprises the fixing backing plate be arranged in frame, be positioned at the pressure strip above fixing backing plate, be positioned at the upper twisted plate in pressure strip front, be positioned at the lower twisted plate below twisted plate, described pressure strip, upper twisted plate and lower twisted plate can move back and forth along above-below direction respectively, bending mechanism also comprises the compression cylinder for driving pressure strip to move back and forth, for the cam driving gear driving upper twisted plate and lower twisted plate to move back and forth, described bending machine also comprises the electrical apparatus control system for controlling described compression cylinder action.
further, the level interval L3 between described upper twisted plate and fixing backing plate, the level interval L4 between lower twisted plate and fixing backing plate are all less than or equal to 3 times of circuit board thickness, are more than or equal to circuit board thickness.The fixing forward position of close upper twisted plate of backing plate, the forward position of the close lower twisted plate of pressure strip are fillet, and the radius of fillet is all less than or equal to 2 times of circuit board thickness.
preferably, described cyclic bending machine also comprises for the feed mechanism of transporting circuit board by described bending mechanism, and described feed mechanism is controlled by described electrical apparatus control system, namely stops after described circuit board is fed forward setpoint distance.Further, feed mechanism comprises a pair feed rolls and for driving the drive motors of feed rolls, drive motors is stepper motor or servomotor.
preferably, the lower twisted plate roller that above-mentioned cam driving gear comprises cam, the motor for driving described cam to rotate, the upper twisted plate roller be connected with upper twisted plate and is connected with lower twisted plate, cam have respectively with upper twisted plate track and the lower twisted plate track of upper twisted plate roller and lower twisted plate roller contact.
further, described upper twisted plate track and lower twisted plate track all extend along the circumference of cam, and lay respectively on the relative two side faces of cam.
preferably, cam often rotates a circle cyclic bending machine and just completes a cyclic bending cycle, and this cyclic bending cycle comprises following five action: a, circuit board is fed forward certain distance; B, compression cylinder drive pressure strip to compress circuit board; On c, actuated by cams, twisted plate is bent downwardly circuit board and returns fast; Under d, actuated by cams, twisted plate is bent upwards circuit board and returns fast; E, compression cylinder drive pressure strip to unclamp circuit board, and the order of described five actions is a → b → c → d → e or a → b → d → c → e.
further, described bending mechanism also comprises collecting states angular displacement of the cam information and the cam angle degree positioner collected information being passed to electrical apparatus control system, and electrical apparatus control system controls feed mechanism and compression cylinder action according to the cam angle degree information of collecting.Cam angle degree positioner can be such as inductive switch or travel switch.
according to the present invention, described cam can be radial cams also can be axial cam.
preferably, described bending mechanism also comprises and makes them can only do the restraint device pumped for limiting pressure strip, upper twisted plate and lower twisted plate.
preferably, being respectively arranged with at least one in described fixing backing plate, pressure strip, upper twisted plate and lower twisted plate can by the heater between heating temperatures to 120 DEG C ~ 300 DEG C.
preferably, described cyclic bending machine also comprises and is arranged on the heat-insulation layer of bending mechanism periphery for being incubated the working environment of circuit board.
due to the enforcement of above technical scheme, the present invention compared with prior art tool has the following advantages:
cyclic bending machine of the present invention can not only by circuit board adjacent two layers effectively separately, and glass-fiber-fabric and rivet also easily depart from, therefore, can effectively by circuit board delamination; In addition, good reliability of the present invention, structure simple, arrange conveniently.
Accompanying drawing explanation
below in conjunction with accompanying drawing and specific embodiment, the present invention will be further described in detail:
fig. 1 carries out the bending schematic diagram of circuit board for the roller bending method adopting 2012102985598 to provide;
fig. 2 is the jack structure schematic diagram of circuit board;
fig. 3 is the schematic front view according to cyclic bending machine of the present invention;
fig. 4 be in Fig. 3 A-A to cross-sectional schematic;
fig. 5 is upper twisted plate roller and the regional distribution chart of lower twisted plate roller design when same direction, footpath;
fig. 6 is a cross-sectional schematic of cam;
fig. 7 is the right side schematic view of Fig. 6, which show lower twisted plate track;
fig. 8 is the left side schematic diagram of Fig. 6, which show twisted plate track;
fig. 9 is the schematic diagram of circuit board when being in state to be bent;
figure 10 is the schematic diagram after circuit board is bent downwardly;
wherein: 1, circuit board; 3, cyclic bending machine; 30a, feed rolls; 30b, heating and thermal insulation plate; 31, fixing backing plate; 32, pressure strip; 33, upper twisted plate; 34, lower twisted plate; 350, cam; 351, compression cylinder; 352, upper twisted plate roller; 353, lower twisted plate roller; 354, cam angle degree positioner; 36, twisted plate slide bar; 37, pressure strip slide bar; 38, frame; 39, heat-insulation layer; J1, upper twisted plate track; J2, lower twisted plate track; Q1, feeding district; Q2, plastic zone; Q3, upper buckled zone; Q4, lower buckled zone.
Detailed description of the invention
embodiment 1
as shown in Figures 3 to 8, cyclic bending machine 3 of the present invention is primarily of feed mechanism, fixing backing plate 31, pressure strip 32, upper twisted plate 33, lower twisted plate 34, drive unit, twisted plate slide bar 36, pressure strip slide bar 37, frame 38, heat-insulation layer 39 and corresponding inductive switch or the composition such as travel switch, electrical apparatus control system.Drive unit comprises cam driving gear and compression cylinder 351.Fixing backing plate 31 is fixed in frame 38.Pressure strip 32 can move along pressure strip slide bar 37.Upper twisted plate 33 and lower twisted plate 34 can move along twisted plate slide bar 36.The action message of feed mechanism and each cylinder is collected by corresponding inductive switch or travel switch, and their coordination is completed by electrical apparatus control system.Pressure strip 32 is driven the reciprocating motion doing above-below direction by compression cylinder 351, upper twisted plate 33 and lower twisted plate 34 drive the reciprocating motion doing above-below direction by cam driving gear.
level interval L3 between upper twisted plate 33 and fixing backing plate 31, the level interval L4 between lower twisted plate 34 and fixing backing plate 31 are all less than or equal to 3 times of circuit board 1 thickness.Fixing the forward position R1 of close upper twisted plate 33 of backing plate 31, the forward position R2 of the close lower twisted plate 34 of pressure strip 32 are fillet, and the radius of fillet is all less than or equal to 2 times of circuit board 1 thickness.
in this example, cam driving gear comprises motor, decelerator and by motor-driven cam 350, upper twisted plate roller 352, lower twisted plate roller 353.Cam 350 is Combined cams.The relative two side faces of cam 350 is established upper twisted plate track J1 and lower twisted plate track J2 respectively that extend along its circumference.Upper twisted plate roller 352, lower twisted plate roller 353 are corresponding respectively to contact with upper twisted plate track J1 and lower twisted plate track J2.Described cyclic bending machine also comprises cam angle degree positioner 354.This cam angle degree positioner 354 is collected the information of cam 350 rotational angle and this information is passed to electrical apparatus control system, controls feed mechanism and compression cylinder does corresponding actions by electrical apparatus control system.
in this example, when being designed to turn around by cam 350, cyclic bending machine completes a cyclic bending cycle.This cyclic bending cycle comprises following five action: a, the feed mechanism that carry out successively and circuit board 1 is fed forward certain distance; B, compression cylinder 351 drive pressure strip 32 to compress circuit board 1; C, cam 350 drive upper twisted plate 33 be bent downwardly circuit board 1 and return fast; D, cam 350 drive lower twisted plate 34 be bent upwards circuit board 1 and return fast; E, compression cylinder 351 drive pressure strip 32 to unclamp circuit board 1.See Fig. 5, in 360 degree that turn around at cam 350, be designed with feeding district Q1, plastic zone Q2, upper buckled zone Q3, lower buckled zone Q4.When cam 350 rotates in the angular range that each district is corresponding, corresponding actions can be carried out.Such as, when cam 350 rotates in the angular range of feeding district Q1, circuit board 1 can be fed forward certain distance by feed mechanism; When cam 350 rotates in the angular range of plastic zone Q2, compression cylinder 351 drives pressure strip 32 to be compressed by circuit board 1, and outside the Q2 of plastic zone, pressure strip 32 unclamps circuit board 1; When cam 350 rotates in the angular range of upper buckled zone Q3, cam 350 drives upper pressure strip 33 to be bent downwardly, and when cam 350 rotates in the angular range of lower buckled zone Q4, cam 350 drives lower pressure strip 34 to be bent upwards.
in this example, feed mechanism comprises a pair feed rolls 30a and for driving the drive motors of feed rolls 30a, drive motors is stepper motor or servomotor.Feed mechanism also can comprise the plate of the heating and thermal insulation up and down 30b be arranged in frame 38 further, allows circuit board 1 pass through between upper and lower heating and thermal insulation plate 30b.
the step that employing the present invention carries out circuit board layering is as follows:
namely circuit board is fed forward certain distance L1 by a, feed mechanism stops; B, pressure strip compress circuit board under the driving of compression cylinder; C, upper twisted plate are bent downwardly circuit board and return fast under the driving of cam; D, lower twisted plate are bent upwards circuit board and return fast under the ordering about of cam; E, compression cylinder drive pressure strip to unclamp circuit board.Above 5 steps are a cyclic bending cycle, the continuous repetition cyclic bending cycle, until feed mechanism cannot effectively be fed forward by control circuit board, then circuit board is turned around to proceed the above cyclic bending cycle, until whole circuit board is all through cyclic bending.
embodiment 2
this example provides each amount of feeding of a kind of method (cyclic bending method or bending staggered floor method) utilizing the cyclic bending machine of embodiment 1 to bend circuit board to be L(L=3mm), in circuit board, every layer thickness is a (a=0.2 mm), see Fig. 9, when compression is carried out bending to it, the phenomenon as Figure 10 will be produced, internal layer and skin will be forced the H (H=1.884) that staggers, adjacent two layers also can be staggered h (h=0.314), h=(a × Π) ÷ 2, the offset h of adjacent two layers is removed the degree of staggering being referred to as adjacent two layers in amount of feeding L by us, and represent with d, then d=h/L, when degree of staggering d is sufficiently more than the percentage elongation of material itself, the power that staggers of adjacent two layers will overcome the adhesion between them and produce and staggers, circuit board forms by multilayer glass-fiber-fabric is bonding, the percentage elongation of glass-fiber-fabric 180 degree time is less than 0.3%, degree of the staggering d that Figure 10 provides is 10.47%(d=0.314/3), much larger than the percentage elongation of glass-fiber-fabric, degree of staggering is relevant with the amount of feeding, the amount of feeding is unsuitable excessive.When jack rivet moves to bending staggered floor district, rivet can be stretched inclination certain angle and unclamping, and glass-fiber-fabric hole also can be drawn as ellipse, and glass-fiber-fabric and rivet are easily departed from, if cyclic bending staggered floor, glass-fiber-fabric and rivet have just more easily departed from.
above to invention has been detailed description; its object is to allow the personage being familiar with this art can understand content of the present invention and be implemented; can not limit the scope of the invention with this; the equivalence change that all Spirit Essences according to the present invention are done or modification, all should be encompassed in protection scope of the present invention.
Claims (8)
1., for a cyclic bending machine for circuit board layering, it comprises frame, the bending mechanism be arranged in described frame, it is characterized in that:
Described bending mechanism comprises the fixing backing plate be arranged in described frame, be positioned at pressure strip above described fixing backing plate, be positioned at the upper twisted plate in described pressure strip front, be positioned at lower twisted plate below described upper twisted plate, the forward position of the forward position of the close described upper twisted plate of described fixing backing plate, the close described lower twisted plate of described pressure strip is fillet, and the radius of fillet is all less than or equal to 2 times of circuit board thickness;
Described pressure strip, upper twisted plate and lower twisted plate can move back and forth along above-below direction respectively, and described bending mechanism also comprises the compression cylinder for driving described pressure strip to move back and forth, the cam driving gear for driving described upper twisted plate and lower twisted plate to move back and forth;
Described bending machine also comprises the electrical apparatus control system for controlling compression cylinder action;
Level interval L3 between described upper twisted plate and described fixing backing plate, level interval L4 between described lower twisted plate and described fixing backing plate are all less than or equal to 3 times of circuit board thickness, are more than or equal to circuit board thickness.
2. the cyclic bending machine for circuit board layering according to claim 1, it is characterized in that: the lower twisted plate roller that described cam driving gear comprises cam, the motor for driving described cam to rotate, the upper twisted plate roller be connected with described upper twisted plate and is connected with described lower twisted plate, described cam have respectively with upper twisted plate track and the lower twisted plate track of described upper twisted plate roller and lower twisted plate roller contact.
3. the cyclic bending machine for circuit board layering according to claim 2, it is characterized in that: described upper twisted plate track and described lower twisted plate track all extend along the circumference of described cam, and lay respectively on the relative two side faces of described cam.
4. the cyclic bending machine for circuit board layering according to Claims 2 or 3, it is characterized in that: described cam rotates the described cyclic bending machine of a circle and completes a cyclic bending cycle, and the described cyclic bending cycle comprises following five action: a, circuit board is fed forward certain distance; B, compression cylinder drive pressure strip to compress circuit board; On c, actuated by cams, twisted plate is bent downwardly circuit board and returns fast; Under d, actuated by cams, twisted plate is bent upwards circuit board and returns fast; E, compression cylinder drive pressure strip to unclamp circuit board, and the order of described five actions is a → b → c → d → e or a → b → d → c → e.
5. the cyclic bending machine for circuit board layering according to claim 4, it is characterized in that: described cyclic bending machine also comprises for the feed mechanism of transporting circuit board by described bending mechanism, described feed mechanism is controlled by described electrical apparatus control system, namely stops after described circuit board is fed forward setpoint distance.
6. the cyclic bending machine for circuit board layering according to claim 5, it is characterized in that: described bending mechanism also comprises collects described angular displacement of the cam information and the cam angle degree positioner collected information being passed to electrical apparatus control system, and described electrical apparatus control system controls described feed mechanism and described compression cylinder action according to the cam angle degree information of collecting.
7. the cyclic bending machine for circuit board layering according to claim 1, is characterized in that: described bending mechanism also comprises makes them can only do the restraint device pumped for limiting described pressure strip, upper twisted plate and lower twisted plate.
8. the cyclic bending machine for circuit board layering according to claim 1, is characterized in that: being respectively arranged with at least one in described fixing backing plate, pressure strip, upper twisted plate and lower twisted plate can by the heater between heating temperatures to 120 DEG C ~ 300 DEG C; Described cyclic bending machine also comprises and is arranged on the heat-insulation layer of described bending mechanism periphery for being incubated the working environment of circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201410118124.XA CN103909121B (en) | 2014-03-27 | 2014-03-27 | For the cyclic bending machine of circuit board layering |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410118124.XA CN103909121B (en) | 2014-03-27 | 2014-03-27 | For the cyclic bending machine of circuit board layering |
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| Publication Number | Publication Date |
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| CN103909121A CN103909121A (en) | 2014-07-09 |
| CN103909121B true CN103909121B (en) | 2015-09-16 |
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Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| AT508923B1 (en) * | 2009-11-10 | 2011-05-15 | Trumpf Maschinen Austria Gmbh | MANUFACTURING SYSTEM, ESPECIALLY FOR FREEFORM BENDING |
| CN101941029A (en) * | 2010-09-17 | 2011-01-12 | 安徽省三力机床制造股份有限公司 | Multifunctional numerical control bending machine for molding irregular plates |
| CN102688915B (en) * | 2012-06-18 | 2014-12-17 | 天津力神电池股份有限公司 | Bending machine and bending method of battery protection board |
| CN202826654U (en) * | 2012-08-21 | 2013-03-27 | 中国科学院化学研究所 | Circuit board layering device |
| CN203494955U (en) * | 2013-09-02 | 2014-03-26 | 洛阳市宇龙办公机具有限公司 | Sheet edge bending mechanism |
| CN203739380U (en) * | 2014-03-27 | 2014-07-30 | 宁波同道恒信环保科技有限公司 | Reciprocating bending machine for layering circuit boards |
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2014
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Effective date of registration: 20231115 Address after: Room 2025, Building 005, No. 750 Chuangyuan Road, High tech Zone, Ningbo City, Zhejiang Province, 315100 Patentee after: NINGBO TONGDAO HENGXIN ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. Patentee after: INSTITUTE OF CHEMISTRY, CHINESE ACADEMY OF SCIENCES Address before: Room 2025, Building 005, No. 750 Chuangyuan Road, High tech Zone, Ningbo City, Zhejiang Province, 315100 Patentee before: NINGBO TONGDAO HENGXIN ENVIRONMENTAL PROTECTION TECHNOLOGY Co.,Ltd. |
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