CN103889728A - 混合通信模块 - Google Patents

混合通信模块 Download PDF

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CN103889728A
CN103889728A CN201180073922.XA CN201180073922A CN103889728A CN 103889728 A CN103889728 A CN 103889728A CN 201180073922 A CN201180073922 A CN 201180073922A CN 103889728 A CN103889728 A CN 103889728A
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equipment
series
bonding pads
communication module
electrical bonding
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F·勒什莱泰
C·盖东
L·贝尔达勒
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Linxens Holding SAS
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    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04W—WIRELESS COMMUNICATION NETWORKS
    • H04W4/00—Services specially adapted for wireless communication networks; Facilities therefor
    • H04W4/80—Services using short range communication, e.g. near-field communication [NFC], radio-frequency identification [RFID] or low energy communication
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Abstract

一种设备系统，其包括第一系列（30）和第二系列（36）的设备，每个设备或者属于第一系列或者属于第二系列，并且适于接收通信耗材装置（31）并且包括与所述耗材装置（31）通信的通信装置（34，37），第一系列（30）的设备的所述通信装置（34）包括电触指（35），第二系列（36）的设备的通信装置（37）是非接触式的。所述设备系统还包括多个同样的耗材装置（31），每个耗材装置都包括混合通信模块（32），所述混合通信模块（32）包括：电焊盘（6a,6b,6c,6d），其被构造和设置为由第一系列（30）的设备的触指（15a,15b,15c,5d）连接；以及天线电路（10），其适于与第二系列（36）的设备进行非接触式通信。

Description

混合通信模块
技术领域
本发明涉及一种通信模块，特别是用于插入在耗材装置中的通信模块，以便与接收耗材装置的设备进行通信数据交换。例如，该通信模块可以被用于接收在打印机中的墨盒中。
背景技术
传统的通信模块是插入在墨盒中的。传统的通信模块包括电接触焊盘。打印机包括柔性触指，当墨盒插入打印机时该柔性触指被弯曲。交换的数据可以是首次使用的日期和/或墨盒中墨位数据，或者类似数据。打印机读取该信息，并且能够将警告信息传送给用户。此类通信模块的缺点是触指易碎且能够被墨盒的错误插入操作所损坏。另一缺点是必须精确控制并确保墨盒在打印机中的相对位置。
在该领域，由于在批发商库存、零售商库存、商店库存、固定库存以及任何家庭库存中分布有大量耗材，因此经济限制影响耗材技术的任何变化。对于耗材技术变化的技术限制来自当新的耗材装置小于旧的耗材装置，为了限制发生在执行耗材装置的设备内部的变化仅需要提出新技术。
本发明提出一种通信模块，以及一种墨盒和使用耗材装置的设备系统，该耗材装置包括这种通信模块，其可以克服至少一个以上缺点，并考虑以上的限制因素。
本发明的目的是提供更加灵活的通信模块来插入耗材装置中，耗材装置能够与更大范围的接收这些通信耗材装置的设备相兼容。
发明内容
根据一个实施例，本发明提供一种设备系统，该设备系统包括第一和第二系列的设备。属于第一或者第二系列的每个设备都适于接收通信耗材装置并且包括与所述耗材装置通信的通信装置。第一系列的设备的通信装置包括电触指。第二系列的设备的通信装置是非接触式的。该系统还包括多个相同的耗材装置，每个耗材装置都包括混合通信模块，该模块具有电焊盘，其被构造和设置为由第一系列设备的电触指相连接，其还具有天线电路，适于与第二系列设备进行非接触式通信。
在该系统中，属于第一系列传统设备的使用者可以继续使用其仅仅具有电焊盘的传统耗材装置的正常库存。之后，他可以在无需中断服务的情况下对根据该系统的耗材装置进行重新补给。然后，他可以购买根据系统第二系列的设备并且仍然可以对两种设备使用该系统的同样的耗材装置。因此，传统的耗材装置可以终止并且被上述系统所取代而无需中断任何服务。
根据另一方面，本发明提供一种用于耗材装置的通信模块，该耗材装置被接收在设备中，耗材装置例如是打印机墨盒，通信模块包括：
--柔性电路，其包括在柔性电路的第一表面上延伸的一系列电焊盘，电焊盘被构造及设置为由该设备的触指连接，以及
--与这些电焊盘连接的电子芯片，
--天线电路，其在柔性电路的与第一表面相反的第二表面上延伸，该天线电路位于至少一个电焊盘的前方，所述电子芯片与天线电路连接并且适于与所述设备非接触式通信。
该天线电路提供了非接触式通信的能力。天线在所述电焊盘前方的特定位置使得本发明的通信模块的尺寸与传统的仅仅具有电焊盘的电子芯片的通信模块的尺寸相同或类似。所以，本发明的通信模块在相似的空间内提供额外的通信能力。
在一些其他实施例中，还可以使用从属权利要求限定的特征中的一个或者更多特征。
附图说明
本发明的其它特征或优点将从以下作为非限制性例子提供的一些实施例以及附图的描述中更加明显地得出。
在附图中：
图1是通信模块的第一实施例的俯视图；
图2是第一实施例的沿图1的平面Ⅱ-Ⅱ的横截面图；
图3是第二实施例的横截面图；
图4是第三实施例的横截面图；
图5A和5B示出了设备系统。
具体实施方式
如图1所示，通信模块1包括柔性电路2和电子芯片3。柔性电路2在于由合成材料制造的柔性电绝缘板4。在柔性板4的两侧敷设有金属层22，该金属层22仅仅在预定区域延伸从而形成彼此独立的电路。在图1所示的柔性电路2的第一表面18上，柔性电路2包括四个独立的电路5a、5b、5c、5d。每个电路都包括电焊盘6a、6b、6c、6d，细电线7a、7b、7c、7d和电气端子8a、8b、8c、8d。电焊盘沿着焊盘段9彼此并排排列，所述每个电焊盘具有矩形的形状。所有的电气端子8a、8b、8c、8d都靠近电子芯片3设置。第一表面18也称为正面18。
天线电路10在第二表面17（也称为背面17）上延伸，背面17与柔性电路2的正面18相反。天线电路10在图1中用虚线表示。天线电路10也是由蚀刻的金属沉积层构成从而形成唯一的金属导体10。形成天线电路10的金属导体10具有螺旋形状且包括四个均基本为方形的相互包含（concatained）且同心的环。所述唯一导体10的两个末端11a和11b被连接到对应的盲通孔12a和12b，该孔贯穿柔性电路2的厚度（参看图2）。
电子芯片3包括四个专用于接触通信的电气端子13a、13b、13c、13d，和两个专用于非接触式通信的电气端子14a、14b。一种线接合将每个电气端子13a、13b、13c、13d连接到电路5a、5b、5c、5d相应的端子8a、8b、8c、8d上。两个电气端子14a、14b也通过线接合连接到盲通孔12a、12b。
电子芯片3是双电子芯片，其被设计以通过四个电气端子13a、13b、13c、13d或者通过两个电气端子14a、14b来进行相同的通信。特别的，天线电路10用于接收能量和发射响应信号。当电子芯片3使用电焊盘6a、6b、6d时，它们之中的两个可以用于输入并且另外两个可以用于输出。
天线电路10的宽度等于焊盘段9的长度。因此，柔性电路2的背面的用于天线电路10的面积最小并且与用于电焊盘6a、6b、6c、6d的宽度相对应。
天线电路10包括围绕盲通孔12a的局部U形，该盲通孔12a与外环的末端11a连接。该盲通孔12b位于电线7a和内环内部之间。因此，天线电路10的形状是在天线电路10的环的内部面积最大化和柔性电路2的表面最小化之间的折中。换句话说，天线电路10围绕背面17的面积是与柔性电路2正面上设置四个电焊盘6a、6b、6c、6d，电子芯片3和两个通孔12a、12b所需的最小表面相对应的。
如图2所示，盲通孔12a仅仅在延伸有天线电路10的背面17上镀有金属。因此，线接合必须到达在通孔12a处在底部延伸的金属层。填充树脂19（例如环氧型树脂）围绕所有线接合，所有电气端子8a、8b、8c、8d，整个电子芯片3和两个盲通孔12a、12b。填充树脂19不覆盖电焊盘6a、6b、6c、6d。柔性触指15a、15b、15c、15d可以与相应的电焊盘6a、6b、6c、6d连接。
第一实施例的底面基本上是平的，其（例如通过粘结）容易固定到耗材装置的平坦表面上。
如图3所示，第2实施例的电子芯片3被放置在延伸有天线电路10的背面17上。盲通孔23可以设置在其中一个电焊盘的下方。第二实施例的优点是正面18完全没有填充树脂19。这给出机会使用更大的电焊盘6a、6b、6d以及减少将通信模块和耗材装置定位于设备之内所需的公差。
如图4所示，盲通孔23现在是镀有金属的通孔。在电焊盘6c和金属层20之间具有电连接，金属层20在背面17上围绕镀有金属的通孔23延伸。电子芯片3与金属层20通过倒装技术连接。电子芯片3的电气端子13a、13b、13c、13d以及电气端子14a、14b被引向芯片3的底面，与连接到通孔23的金属层20直接接触或者与连接到天线电路10的电气端子21直接接触。
如图5a、5b所示，该设备系统的实施例包括第一系列30设备，例如打印机（图5a）。第一系列30的每个设备接收通信耗材装置31，通信耗材装置31包括通信模块32。通信耗材装置31可以是墨盒。第一系列30的设备包括定位装置33a和包括触指35的通信装置34。
该设备系统还包括类似类型的第二系列36的设备（图5b），例如打印机。第二系列36的每个设备接收通信耗材装置31，其与被第一系列30的每个设备接收的通信耗材装置相同。第二系列36的每个设备还包括非接触式的通信装置37，其不包括触指。
换句话说，第二系列36的设备与由第一系列30的设备接收的通信耗材装置31之间的兼容性仅仅由耗材装置31自身和其通信模块32提供。
第二系列36的每个设备包括定位装置33b，其与第一系列30的打印机的定位装置33a相同。可替代地，定位装置33b可以是不同的且与同一耗材装置31相兼容。

Claims (18)

1.一种设备系统，其包括第一系列（30）和第二系列（36）的设备，每个设备或者属于第一系列或者属于第二系列，并且适于接收通信耗材装置（31）并且包括与所述耗材装置（31）通信的通信装置（34，37），第一系列（30）的设备的所述通信装置（34）包括电触指（35），第二系列（36）的设备的通信装置（37）是非接触式的，其特征在于，所述设备系统还包括多个同样的耗材装置（31），每个耗材装置（31）都包括混合通信模块（32），所述混合通信模块（32）包括：电焊盘（6a,6b,6c,6d），其被构造和设置为由第一系列（30）的设备的触指（15a,15b,15c,5d）连接；以及天线电路（10），其适于与第二系列（36）的设备进行非接触式通信。
2.如权利要求1所述的设备系统，其中每个通信耗材装置（31）还包括同样的定位装置，其被构造和设置为或者与第一系列（30）设备的第一互补定位装置（33a）配合或者与第二系列（36）设备的第二互补定位装置（33b）配合。
3.如权利要求1或2所述的设备系统，其中所述通信模块包括：
--柔性电路（2），其包括一系列电焊盘（6a,6b,6c,6d），所述电焊盘在所述柔性电路（2）的第一表面（18）上延伸，所述电焊盘被构造并设置为由第一系列设备的触指（15a,15b,15c,15d）连接，和
--与这些电焊盘（6a,6b,6c,6d）连接的电子芯片（3）；
--至少位于电焊盘（6a,6b,6c,6d）前方的天线电路（10），所述电子芯片（3）与天线电路（10）连接并且适于与第二系列的所述设备进行非接触式通信。
4.如权利要求3所述的设备系统，其中每个通信模块的所有电焊盘（6a,6b,6c,6d）都沿着焊盘段（9）并排排列，所述天线电路（10）在其宽度上被限制在面对焊盘段（9）的区域之内。
5.如以上任一权利要求所述的设备系统，其中每个通信模块的天线电路（10）都具有实质上为方形的形状。
6.如以上任一权利要求所述的设备系统，其中所述电子芯片（3）被固定在通信模块的第一表面（18）上，且天线电路末端（11a,11b）通过线接合或者通过镀有金属的盲孔或通孔（23）与电子芯片（3）连接。
7.如权利要求3到5任一项所述的设备系统，其中每个通信模块的电子芯片（3）被固定在第二表面（17）上，且电焊盘（6a,6b,6c,6d）通过线接合或者通过镀有金属的盲孔或通孔（23）与电子芯片（3）连接。
8.如权利要求6或7所述的设备系统，其中每个通信模块的电子芯片（3）与该芯片（3）通过倒装或通过线接合所位于的表面（17，18）的电路（5a,5b,5c,5d，10）连接。
9.如权利要求1到8中任一项所述的设备系统，其中所述设备为打印机且耗材装置为墨盒。
10.用于以上任一权利要求所述的设备系统的墨盒。
11.如权利要求10所述的墨盒，所述墨盒还包括适于将墨盒定位在打印机内的定位装置。
12.用于权利要求1到9中任一项的设备系统的通信模块。
13.用于待被接收在设备中的耗材装置（31）的通信模块（1），所述耗材装置（31）例如是打印机墨盒，所述通信模块包括：
--柔性电路（2），其包括一系列电焊盘（6a,6b,6c,6d），所述电焊盘在所述柔性电路（2）的第一表面（18）上延伸，所述电焊盘被构造并设置为由设备的触指（15a,15b,15c,15d,35）连接，和
--与这些电焊盘（6a,6b,6c,6d）连接的电子芯片（3），
其特征在于：所述通信模块包括天线电路（10），其在柔性电路（2）的与第一表面（18）相反的第二表面（17）上延伸，并且至少位于电焊盘（6a,6b,6c,6d）的前方，所述电子芯片（3）与天线电路（10）连接并且适于与所述设备非接触式通信。
14.如权利要求13所述的通信模块，其中所有的电焊盘（6a,6b,6c,6d）沿着焊盘段（9）并排排列，天线电路（10）在其宽度上被限制在面向焊盘段（9）的区域之内。
15.如以上任一权利要求所述的通信模块，其中所述天线电路（10）具有实质上为方形的形状。
16.如权利要求13到15中任一项所述的通信模块，其中所述电子芯片（3）被固定在第一表面（18）上，且天线电路末端（11a,11b）通过线接合或者通过镀有金属的盲孔或通孔（23）被连接到电子芯片（3）。
17.如权利要求13到15中任一项所述的通信模块，其中所述电子芯片（3）被固定在第二表面（17）上，且电焊盘（6a,6b,6c,6d）通过线接合或者通过镀有金属的盲孔或通孔（23）被连接到电子芯片（3）。
18.如权利要求16或17所述的通信模块，其中所述电子芯片（3）被连接到该芯片（3）通过倒装或通过线接合所位于的表面（17，18）的电路（5a,5b,5c,5d,10）。
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Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0710568A2 (en) * 1994-11-02 1996-05-08 Seiko Epson Corporation Ink jet type recording unit, and printer with it
US6263170B1 (en) * 1999-12-08 2001-07-17 Xerox Corporation Consumable component identification and detection
US20010019343A1 (en) * 1999-04-20 2001-09-06 Walker Ray A. Method and apparatus for product regionalization
US20040239706A1 (en) * 2002-10-28 2004-12-02 Seiko Epson Corporation Recording apparatus and communication method
CN101100136A (zh) * 2006-07-06 2008-01-09 佳能株式会社 液体容器和记录设备
CN101874252A (zh) * 2007-07-31 2010-10-27 意法半导体鲁塞有限公司 抗撕裂电路
CN101947886A (zh) * 2010-09-21 2011-01-19 珠海天威技术开发有限公司 耗材芯片及耗材容器
CN101954794A (zh) * 2010-09-10 2011-01-26 珠海天威技术开发有限公司 耗材芯片及其制作方法、耗材容器
CN101954796A (zh) * 2010-10-16 2011-01-26 珠海天威技术开发有限公司 耗材芯片及其数据清除方法、耗材容器
CN102009530A (zh) * 2010-10-15 2011-04-13 珠海天威技术开发有限公司 成像装置、其改装方法及耗材容器
CN102054184A (zh) * 2011-01-04 2011-05-11 上海众人网络安全技术有限公司 一种实现双界面智能卡实时交易数据信息显示的系统及方法
CN102166886A (zh) * 2011-05-05 2011-08-31 珠海天威技术开发有限公司 耗材芯片及其数据读写方法、耗材容器
CN201950971U (zh) * 2011-02-17 2011-08-31 珠海天威技术开发有限公司 耗材芯片及耗材容器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4023145B2 (ja) * 2000-12-05 2007-12-19 セイコーエプソン株式会社 印刷装置、インクカートリッジ
JP2007001066A (ja) * 2005-06-22 2007-01-11 Canon Inc インクカートリッジ
JP2007086863A (ja) * 2005-09-20 2007-04-05 Fuji Xerox Co Ltd 非接触ｉｃタグ、非接触ｉｃタグを備えた部材のパッケージ及び非接触ｉｃタグを備えた部材を用いる装置
WO2008018176A1 (fr) * 2006-08-08 2008-02-14 Seiko Epson Corporation Réservoir de liquide et dispositif consommateur de liquide
US8599424B2 (en) * 2008-09-04 2013-12-03 Fb Sistemas S.A. Printer cartridge microchip
JP5344000B2 (ja) * 2011-05-09 2013-11-13 大日本印刷株式会社 接触非接触両用ｉｃモジュール及びｉｃカード

Patent Citations (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0710568A2 (en) * 1994-11-02 1996-05-08 Seiko Epson Corporation Ink jet type recording unit, and printer with it
US20010019343A1 (en) * 1999-04-20 2001-09-06 Walker Ray A. Method and apparatus for product regionalization
US6263170B1 (en) * 1999-12-08 2001-07-17 Xerox Corporation Consumable component identification and detection
US20040239706A1 (en) * 2002-10-28 2004-12-02 Seiko Epson Corporation Recording apparatus and communication method
CN101100136A (zh) * 2006-07-06 2008-01-09 佳能株式会社 液体容器和记录设备
CN101874252A (zh) * 2007-07-31 2010-10-27 意法半导体鲁塞有限公司 抗撕裂电路
CN101954794A (zh) * 2010-09-10 2011-01-26 珠海天威技术开发有限公司 耗材芯片及其制作方法、耗材容器
CN101947886A (zh) * 2010-09-21 2011-01-19 珠海天威技术开发有限公司 耗材芯片及耗材容器
CN102009530A (zh) * 2010-10-15 2011-04-13 珠海天威技术开发有限公司 成像装置、其改装方法及耗材容器
CN101954796A (zh) * 2010-10-16 2011-01-26 珠海天威技术开发有限公司 耗材芯片及其数据清除方法、耗材容器
CN102054184A (zh) * 2011-01-04 2011-05-11 上海众人网络安全技术有限公司 一种实现双界面智能卡实时交易数据信息显示的系统及方法
CN201950971U (zh) * 2011-02-17 2011-08-31 珠海天威技术开发有限公司 耗材芯片及耗材容器
CN102166886A (zh) * 2011-05-05 2011-08-31 珠海天威技术开发有限公司 耗材芯片及其数据读写方法、耗材容器

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