CN103887267A - Power electronic module device with novel welding line - Google Patents
Power electronic module device with novel welding line Download PDFInfo
- Publication number
- CN103887267A CN103887267A CN201210570401.1A CN201210570401A CN103887267A CN 103887267 A CN103887267 A CN 103887267A CN 201210570401 A CN201210570401 A CN 201210570401A CN 103887267 A CN103887267 A CN 103887267A
- Authority
- CN
- China
- Prior art keywords
- module device
- power module
- welding line
- electric
- electronic power
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
Landscapes
- Wire Bonding (AREA)
Abstract
The invention relates to a power electronic power module device with a novel welding line. According to the invention, a metal material with a low expansion coefficient is used to replace a traditional aluminum material, and is used as a lead which connects chips or a chip and an electrode in the power electronic power module device. According to the power electronic power module device with the novel welding line, which is provided by the invention, the problem of large heat stress on the interface of a traditional aluminum welding line and a bonding material thereof is effectively solved; the safety of the metal welding line under a high temperature work condition is improved; and the service life of the whole power module is effectively improved.
Description
Technical field
The present invention relates to electric and electronic technical field, relate in particular to the application scenarios such as high-power electric semiconductor module, power control circuit, intelligent power assembly and high frequency switch power, specifically relate to a kind of electric and electronic power module device with novel bonding wire.
Background technology
In the development of electric and electronic power module, along with integrated level improves, volume reduces, and the power consumption on the unit's of making area of dissipation increases, thereby causes higher inside modules working temperature.Too high inside modules working temperature can be brought series of problems, and one of them is the safety issue of metal bonding wire.The metal bonding wire adopting in conventional electric power electron power module, is generally aluminum and makes, and aluminum has higher coefficient of thermal expansion (23.2 × 10
-6k
-1).When ambient temperature changes or in use adstante febre of assembly, can on the interface of metal bonding wire and heat dissipation metal base plate, produce thermal stress, bear for a long time such stress and can make metal bonding wire rupture, bring integrity problem, and then affect the life-span of whole module.
Given this, the present invention proposes a kind of novel bonding wire, can reduce metal bonding wire and engage the stress of material interface, has strengthened the reliability of bonding wire, improves the life-span of electric and electronic power module.
Summary of the invention
The present invention is directed to bonding wire in conventional electric power electron power module and engage the larger deficiency of stress between material, propose a kind of Novel welding wire material, and be applied to electric and electronic power module device.The electric and electronic power module device with novel bonding wire that the present invention proposes, compared with conventional module, can reduce metal bonding wire and engage the stress between material interface, strengthens its reliability, and the performance of whole power model is further improved.
In order to solve the problems of the technologies described above, the present invention is solved by following technical proposals:
Use has low-expansion metal substitute conventional aluminum metal, as the metal bonding wire in electric and electronic power module, reaches the object that reduces stress.
An electric and electronic power module device with novel bonding wire, is characterized in that: use and have low-expansion metal as the bonding wire that is connected between chip or between chip and bottom plate electrode.
As preferably, described metal bonding wire can adopt molybdenum (Mo), and its thermal coefficient of expansion is 5.2 × 10
-6k
-1.
As preferably, described metal bonding wire can adopt chromium metal (Cr), and its thermal coefficient of expansion is 6.2 × 10
-6k
-1.
The present invention is owing to having adopted above technical scheme, there is following significant technique effect: on the basis of conventional electric power electron power module device, by adopting novel low-expansion coefficient metal to replace aluminum metal as metal bonding wire, effectively solve the deficiency on the interface that conventional aluminum bonding wire engages material with larger thermal stress, effectively improve the safety issue of metal bonding wire, and the useful life of having improved whole power module device.
Accompanying drawing explanation
Fig. 1 is the schematic top plan view of the embodiment 1 of a kind of electric and electronic power module device with novel bonding wire of the present invention.
Fig. 2 is the schematic top plan view of the embodiment 2 of a kind of electric and electronic power module device with novel bonding wire of the present invention.
Wherein: 101-electrode, 102-heat dissipation metal base plate, 103-chip 1,104-metal bonding wire, 105-chip 2.
Embodiment
Below in conjunction with accompanying drawing, the present invention is described in further detail.
Embodiment 1
104 metal bonding wires adopt low-expansion coefficient metal molybdenum (Mo), and its thermal coefficient of expansion is 5.2 × 10
-6k
-1, conventionally adopt crimping mode.
Embodiment 2
104 metal bonding wires adopt low-expansion coefficient crome metal (Cr), and its thermal coefficient of expansion is 6.2 × 10
-6k
-1, conventionally adopt crimping mode.
Set forth the present invention by above-mentioned example, can adopt other examples to realize the present invention yet, the present invention does not limit to and above-mentioned instantiation simultaneously, and therefore the present invention is by claims circumscription.
Claims (5)
1. an electric and electronic power module device, integrated one or more chip.
2. electric and electronic power module device according to claim 1, is characterized in that: between described polylith chip, adopt welded wire interconnection.
3. electric and electronic power module device according to claim 1, is characterized in that: between described chip and electrode, adopt welded wire interconnection.
4. electric and electronic power module device according to claim 2, is characterized in that: described weld metal connecting line adopts low-expansion coefficient metal, as molybdenum (Mo) and chromium (Cr).
5. electric and electronic power module device according to claim 3, is characterized in that: described weld metal connecting line adopts low-expansion coefficient metal, as molybdenum (Mo) and chromium (Cr).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210570401.1A CN103887267A (en) | 2012-12-20 | 2012-12-20 | Power electronic module device with novel welding line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210570401.1A CN103887267A (en) | 2012-12-20 | 2012-12-20 | Power electronic module device with novel welding line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103887267A true CN103887267A (en) | 2014-06-25 |
Family
ID=50956095
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210570401.1A Pending CN103887267A (en) | 2012-12-20 | 2012-12-20 | Power electronic module device with novel welding line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103887267A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101443910A (en) * | 2006-05-12 | 2009-05-27 | 本田技研工业株式会社 | Power semiconductor module |
| CN101542725A (en) * | 2007-05-21 | 2009-09-23 | 丰田自动车株式会社 | Cooler for power module and power module |
| CN102468249A (en) * | 2010-11-01 | 2012-05-23 | 三星电机株式会社 | Power package module and method for fabricating the same |
-
2012
- 2012-12-20 CN CN201210570401.1A patent/CN103887267A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101443910A (en) * | 2006-05-12 | 2009-05-27 | 本田技研工业株式会社 | Power semiconductor module |
| CN101542725A (en) * | 2007-05-21 | 2009-09-23 | 丰田自动车株式会社 | Cooler for power module and power module |
| CN102468249A (en) * | 2010-11-01 | 2012-05-23 | 三星电机株式会社 | Power package module and method for fabricating the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140625 |
|
| WD01 | Invention patent application deemed withdrawn after publication |