CN103883927B - Backlight module - Google Patents
Backlight module Download PDFInfo
- Publication number
- CN103883927B CN103883927B CN201210553419.0A CN201210553419A CN103883927B CN 103883927 B CN103883927 B CN 103883927B CN 201210553419 A CN201210553419 A CN 201210553419A CN 103883927 B CN103883927 B CN 103883927B
- Authority
- CN
- China
- Prior art keywords
- framework
- light
- diode chip
- emitting diode
- backlight unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000000084 colloidal system Substances 0.000 claims description 10
- 239000000843 powder Substances 0.000 claims description 9
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 description 3
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910002114 biscuit porcelain Inorganic materials 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
Abstract
A kind of backlight module, the framework of light-emitting diode chip for backlight unit is set including circuit board, light-emitting diode chip for backlight unit and enclosing, the light-emitting diode chip for backlight unit is attached on board top surface, the circuit board depression is contained in the accepting groove to be fixed on the circuit board formed with accepting groove, the bottom of the framework.In the present invention, because light-emitting diode chip for backlight unit is housed in accepting groove directly against being located on the top surface of circuit board and enclose the bottom of the framework for setting light-emitting diode chip for backlight unit, so, the height of the backlight module in the vertical direction is minimized relative to traditional backlight module, disclosure satisfy that the requirement of thin type.
Description
Technical field
The present invention relates to a kind of backlight module, more particularly to a kind of LED backlight module.
Background technology
Traditional backlight module includes a circuit board and is attached at some spaced light-emitting diodes of circuit board side
Pipe encapsulating structure.Each package structure for LED includes two electrodes for being spaced and being arranged side by side, is fixed on an electrode simultaneously
A light-emitting diode chip for backlight unit of two electrode is electrically connected with, is fixed on two electrodes and encloses and set the light-emitting diode chip for backlight unit
Empty framework and it is contained in the framework in one and wraps up a phosphor powder layer of light-emitting diode chip for backlight unit.The end of two electrode
End is welded on the conductive junction point of circuit board by tin cream.The backlight module of such a structure is due to these LED package knots
Structure protrudes outward directly from circuit board, causes backlight module in the vertical direction to have larger height, is unfavorable for backlight module
Thin type design, radiating inconvenience.
The content of the invention
In view of this, it is necessary to which a kind of simple in construction, less backlight module of thickness is provided.
A kind of backlight module, including circuit board, light-emitting diode chip for backlight unit and the framework for setting light-emitting diode chip for backlight unit is enclosed, institute
State light-emitting diode chip for backlight unit to be attached on board top surface, the circuit board depression is formed with accepting groove, the bottom of the framework
It is contained in the accepting groove to be fixed on the circuit board.
In the present invention, because light-emitting diode chip for backlight unit sets light-emitting diodes tube core directly against being located on the top surface of circuit board and enclose
The bottom of the framework of piece is housed in accepting groove, in this way, the height of the backlight module in the vertical direction is relative to traditional
Backlight module is minimized, and disclosure satisfy that the requirement of thin type.
Brief description of the drawings
Fig. 1 is the schematic diagram after the backlight module combination of the present invention.
Main element symbol description
| Circuit board | 10 |
| Conductive junction point | 11 |
| Accepting groove | 12 |
| Framework | 20 |
| Reflecting layer | 21 |
| Light-emitting diode chip for backlight unit | 30 |
| Plain conductor | 31 |
| Colloid | 40 |
| Phosphor powder layer | 50 |
| Backlight module | 100 |
Following embodiment will combine above-mentioned accompanying drawing and further illustrate the present invention.
Embodiment
Referring to Fig. 1, the present invention backlight module 100 include a circuit board 10, be fixed on circuit board 10 and it is some
Interior empty framework 20, the light-emitting diode chip for backlight unit 30 for being fixed on circuit board 10 and being contained in respectively in each framework 20, filling
In these frameworks 20 and wrap up the colloid 40 of light-emitting diode chip for backlight unit 30 and be fixed on a fluorescent material on these tops of framework 20
Layer 50.
The circuit board 10 is the plate body of a lengthwise, has a smooth top surface and relative bottom surface parallel with top surface.Institute
State on top surface formed with circuit（It is not shown）And the conductive junction point 11 being electrically connected with circuit.These conductive junction points 11 from top surface to
Protrude out and be arranged at intervals outside.Each light emitting diode has two plain conductors 31.These light-emitting diode chip for backlight unit 30 are attached at electricity
On the top surface of road plate 10 and two plain conductors 31 are electrically connected with two conductive junction points 11 respectively.These conductive junction points 11 are from top surface
The height protruded out upwards is less than the height that light-emitting diode chip for backlight unit 30 protrudes out upwards from top surface.Some accepting grooves 12 are from top surface direction
Bottom surface is recessed to be formed, for housing the framework 20, so as to reduce the height of the in the vertical direction of backlight module 100.
Each framework 20 is ring bodies empty in one, and its bottom is contained in corresponding accepting groove 12, top is positioned at luminous
The top of the top surface of diode chip for backlight unit 30.After these frameworks 20 are installed on the circuit board 10, its top parallel co-planar.Each framework 20
Inner surface on beyond the top surface of circuit board 10 be partially coated with luminescent material, so as to form a reflecting layer 21 be used for Refl-Luminous
The light that diode chip for backlight unit 30 is sent, and then improve the light extraction efficiency of light-emitting diode chip for backlight unit 30.It is contained in corresponding framework 20
Light-emitting diode chip for backlight unit 30 be located at the middle part of the framework 20.In the present embodiment, the outside wall surface side of these frameworks 20 is mutual
Connection, so that these frameworks 20 link together.It should be understood that in other embodiments, these frameworks 20 can also phase
Mutually it is arranged at intervals.
The colloid 40 fills up the accepting groove 12 and its top and the top parallel co-planar of framework 20.The colloid 40
Also can uniform mixed fluorescent powder for transparent or semitransparent colloid 40, in it.
The phosphor powder layer 50 is lamellar body in uniform thickness, is fixed on the top of framework 20 and is completely covered described luminous two
Pole pipe chip 30, its its bottom surface and the top surface of light-emitting diode chip for backlight unit 30 are arranged at intervals.
The backlight module 100 is in use, directive is located at after the light that light-emitting diode chip for backlight unit 30 is sent wears injection body 40
Fluorescent material in the phosphor powder layer 50 on its top and excitated fluorescent powder layer 50 and send white light.
In the present invention, because light-emitting diode chip for backlight unit 30 sets light-emitting diodes directly against being located on the top surface of circuit board 10 and enclose
The bottom of the framework 20 of die 30 is housed in the accepting groove 12 for being recessed formation downwards from the top surface of circuit board 10, in this way, described
The height of the in the vertical direction of backlight module 100 is minimized relative to traditional backlight module 100, disclosure satisfy that thin type
It is required that.
Further, in the present invention, because phosphor powder layer 50 in uniform thickness is located at the top of light-emitting diode chip for backlight unit 30
And the light-emitting diode chip for backlight unit 30 is completely covered, in this way, the light that the light-emitting diode chip for backlight unit 30 is sent can swash simultaneously
Fluoresce the generation for obtaining the white light of colour temperature always everywhere, avoiding color temperature shift phenomenon of bisque 50.
Claims (5)
1. a kind of backlight module, including circuit board, light-emitting diode chip for backlight unit, enclose the framework for setting light-emitting diode chip for backlight unit and be filled in
Framework is interior and wraps up the colloid of light-emitting diode chip for backlight unit, it is characterised in that：The light-emitting diode chip for backlight unit is attached at circuit board top
On face, the circuit board depression each contains a framework, and each framework formed with multiple accepting grooves in the accepting groove
Bottom be fixed in the accepting groove, the top of each framework protrudes from the top surface of the light-emitting diode chip for backlight unit, is contained in
Light-emitting diode chip for backlight unit in corresponding framework is located at the middle part of the framework, and the colloid fills up the accepting groove and its top
With the top parallel co-planar of framework, the accepting groove is recessed to be formed from the top surface of circuit board towards bottom surface, the interior table of each framework
Reflectorized material is partially coated with beyond board top surface on face, is used for Refl-Luminous diode chip for backlight unit so as to form a reflecting layer
The light sent, the outside wall surface side of these frameworks is connected with each other, so that these frameworks link together.
2. backlight module as claimed in claim 1, it is characterised in that：The colloid is transparent or semitransparent colloid.
3. backlight module as claimed in claim 1, it is characterised in that：Fluorescent material is uniformly mixed with the colloid.
4. backlight module as claimed in claim 1, it is characterised in that：Further comprise being fixed on the framework away from circuit board
Top phosphor powder layer.
5. backlight module as claimed in claim 4, it is characterised in that：The phosphor powder layer is thickness identical lamellar body.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210553419.0A CN103883927B (en) | 2012-12-19 | 2012-12-19 | Backlight module |
| CN201810028406.9A CN108050400A (en) | 2012-12-19 | 2012-12-19 | Backlight module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210553419.0A CN103883927B (en) | 2012-12-19 | 2012-12-19 | Backlight module |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810028406.9A Division CN108050400A (en) | 2012-12-19 | 2012-12-19 | Backlight module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103883927A CN103883927A (en) | 2014-06-25 |
| CN103883927B true CN103883927B (en) | 2017-12-26 |
Family
ID=50952968
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810028406.9A Pending CN108050400A (en) | 2012-12-19 | 2012-12-19 | Backlight module |
| CN201210553419.0A Active CN103883927B (en) | 2012-12-19 | 2012-12-19 | Backlight module |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810028406.9A Pending CN108050400A (en) | 2012-12-19 | 2012-12-19 | Backlight module |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN108050400A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1381904A (en) * | 2001-04-18 | 2002-11-27 | 银河光电有限公司 | Package of LED chip and its light-gathering lens |
| CN101988663A (en) * | 2010-10-15 | 2011-03-23 | 深圳市华星光电技术有限公司 | Backlight module and display device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6476551B1 (en) * | 1998-01-30 | 2002-11-05 | Ricoh Company, Ltd. | LED array head and minute reflection optical elements array for use in the LED array head |
| CN1783521A (en) * | 2004-12-01 | 2006-06-07 | 中华映管股份有限公司 | White-light luminous diode |
| JP2006303122A (en) * | 2005-04-19 | 2006-11-02 | Citizen Electronics Co Ltd | Chip type led |
| KR101104034B1 (en) * | 2007-12-06 | 2012-01-09 | 엘지이노텍 주식회사 | Lighting emitting diode, Lighting Emitting Apparatus and fabrication method thereof |
| US20100096658A1 (en) * | 2008-10-20 | 2010-04-22 | Wu Ming-Chang | Structure of Light Emitting Diode |
| KR101076738B1 (en) * | 2009-01-09 | 2011-10-26 | 주식회사 이츠웰 | Fablication method of light emitting diode and light emitting diode using the same |
| CN201672376U (en) * | 2010-04-19 | 2010-12-15 | 深圳市劲升迪龙科技发展有限公司 | LED backlight light bar encapsulated in chip-on-board way |
| CN102797985A (en) * | 2011-05-25 | 2012-11-28 | 展晶科技(深圳)有限公司 | Light-emitting diode (LED) light source device |
-
2012
- 2012-12-19 CN CN201810028406.9A patent/CN108050400A/en active Pending
- 2012-12-19 CN CN201210553419.0A patent/CN103883927B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1381904A (en) * | 2001-04-18 | 2002-11-27 | 银河光电有限公司 | Package of LED chip and its light-gathering lens |
| CN101988663A (en) * | 2010-10-15 | 2011-03-23 | 深圳市华星光电技术有限公司 | Backlight module and display device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103883927A (en) | 2014-06-25 |
| CN108050400A (en) | 2018-05-18 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20170920 Address after: Guangdong province Shenzhen city Longhua District Dalang street community of Longsheng gold dragon road e-commerce incubator exhibition Tao Commercial Plaza E block 706 Applicant after: Shenzhen step Technology Transfer Center Co., Ltd. Address before: 518109 Guangdong city of Shenzhen province Baoan District Longhua Town Industrial Zone tabulaeformis tenth East Ring Road No. 2 two Applicant before: Hongfujin Precise Industry (Shenzhen) Co., Ltd. Applicant before: Hon Hai Precision Industry Co., Ltd. |
|
| TA01 | Transfer of patent application right | ||
| CB03 | Change of inventor or designer information | ||
| CB03 | Change of inventor or designer information |
Inventor after: Chen Chugeng Inventor before: Lai Zhicheng |
|
| TA01 | Transfer of patent application right |
Effective date of registration: 20171130 Address after: 518105 eleventh buildings of Mau Chau Industrial District, Baoan District Songgang street, Shenzhen, Guangdong Province, 1 and 2 buildings Applicant after: Shenzhen Zhongshen Optoelectronics Co., Ltd. Address before: 518000 Guangdong Province, Shenzhen New District of Longhua City, Dalang street, Longsheng Gold Dragon Road community e-commerce incubator exhibition Tao Commercial Plaza E block 706 Applicant before: Shenzhen step Technology Transfer Center Co., Ltd. |
|
| TA01 | Transfer of patent application right | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518105 eleventh buildings of Mau Chau Industrial District, Baoan District Songgang street, Shenzhen, Guangdong Province, 1 and 2 buildings Patentee after: Shenzhen Zhongshen Au Optronics Co Address before: 518105 eleventh buildings of Mau Chau Industrial District, Baoan District Songgang street, Shenzhen, Guangdong Province, 1 and 2 buildings Patentee before: Shenzhen Zhongshen Optoelectronics Co., Ltd. |