CN103878503B - A kind of scaling powder and preparation method thereof - Google Patents
A kind of scaling powder and preparation method thereof Download PDFInfo
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- CN103878503B CN103878503B CN201410083911.5A CN201410083911A CN103878503B CN 103878503 B CN103878503 B CN 103878503B CN 201410083911 A CN201410083911 A CN 201410083911A CN 103878503 B CN103878503 B CN 103878503B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/40—Making wire or rods for soldering or welding
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Abstract
The invention provides a kind of scaling powder and preparation method thereof, scaling powder comprises with parts by weight: rosin 10 ~ 25 parts, EVA resin 7 ~ 20 parts, ethylamine hydrochloride 0.5 ~ 0.8 part, isopropyl alcohol 1 ~ 5 part, 3 ~ 10 parts, ethyl acetate, 1 ~ 6 part, turpentine oil, butyl cellulose 0.9 ~ 3.5 part, polyethylene 2 ~ 8 parts, glutaric acid 1 ~ 4 part, APES 2 ~ 5 parts, amino-acid ester 0.2 ~ 1.8 part, octanol 20 ~ 40 parts, Pyrogentisinic Acid 0.1 ~ 0.6 part, dimethylacetylamide 0.8 ~ 2.7 part, phenoxy polyol resin 2 ~ 9 parts, BTA 0.5 ~ 2.5 part, o-fluorobenzoic acid 1.2 ~ 3.6 parts, butyl acetate 10 ~ 30 parts and septichen 0.3 ~ 0.9 part, first constituent part is mixed, then add remaining ingredient hybrid filtering and get final product.The scaling powder rate of spread of the present invention is greater than 80%, and halogen-free, surface insulation resistance is 10
10grade.
Description
Technical field
The invention belongs to technical field of welding materials, be specifically related to a kind of scaling powder and preparation method thereof.
Background technology
Along with the enhancing of people's environmental protection consciousness, the concern of people to halogen problem also strengthens day by day.European Union has expressly provided the most high-load requirement of halogen in wiring board electronic welding material, Halogen becomes the green revolution again of electron trade after RoHS instruction, halogen plays crucial activating agent effect in scaling powder, must have higher requirement after non-halogen in activity, stability, reliability to scaling powder.
The scaling powder that current electronics packing field uses mainly is divided into the liquid scaling powder of abietyl and liquid scaling powder two type of No clean type.The liquid scaling powder main feature of abietyl is that activity is higher, and insulation impedance is also higher containing a certain amount of rosin, but after welding, PCB surface is residual dirtier, and relatively more sticky hand, time length also easily occurs rosin blushing problems.It is very low that the liquid scaling powder of No clean type does not contain rosin or rosin or rosin content, active relatively low, ensureing, on active basis, to need the addition increasing other activating agents, so just cause the problem that postwelding insulation impedance is lower, easily appearance electric leakage risk.
Summary of the invention
The object of this invention is to provide a kind of scaling powder and preparation method thereof.
A kind of scaling powder, comprise with parts by weight: rosin 10 ~ 25 parts, EVA resin 7 ~ 20 parts, ethylamine hydrochloride 0.5 ~ 0.8 part, isopropyl alcohol 1 ~ 5 part, 3 ~ 10 parts, ethyl acetate, 1 ~ 6 part, turpentine oil, butyl cellulose 0.9 ~ 3.5 part, polyethylene 2 ~ 8 parts, glutaric acid 1 ~ 4 part, APES 2 ~ 5 parts, amino-acid ester 0.2 ~ 1.8 part, octanol 20 ~ 40 parts, Pyrogentisinic Acid 0.1 ~ 0.6 part, dimethylacetylamide 0.8 ~ 2.7 part, phenoxy polyol resin 2 ~ 9 parts, BTA 0.5 ~ 2.5 part, o-fluorobenzoic acid 1.2 ~ 3.6 parts, butyl acetate 10 ~ 30 parts, septichen 0.3 ~ 0.9 part.
As foregoing invention further preferably, described polyethylene powders particle diameter is less than 10 microns.
As foregoing invention further preferably, described APES is OPEO or dodecyl phenol polyethenoxy ether.
The preparation method of above-mentioned scaling powder, comprises the following steps:
Step 1, by rosin, EVA resin, isopropyl alcohol, ethyl acetate, turpentine oil, butyl cellulose, polyethylene, glutaric acid, amino-acid ester, octanol, Pyrogentisinic Acid, dimethylacetylamide, butyl acetate mixing, is stirred to component and dissolves completely;
Step 2, adds in step 1 gained mixture by remaining ingredient, limit edged stirs, and after mixing, filters and get final product.
As the further improvement of foregoing invention, the whipping temp in step 1 is preferably 30 ~ 45 DEG C.
As the further improvement of foregoing invention, the whipping temp in step 2 is preferably 35 ~ 40 DEG C.
The scaling powder rate of spread of the present invention is greater than 80%, and weldering property is moderate, halogen-free, and ionic pollution degree reaches highest level, is applicable to highly reliable electronic product, and by bronze mirror corrosion test, surface insulation resistance is in 1010 grades.
Detailed description of the invention
Embodiment 1
A kind of scaling powder, comprises with parts by weight: rosin 10 parts, EVA resin 7 parts, ethylamine hydrochloride 0.5 part, isopropyl alcohol 1 part, 3 parts, ethyl acetate, 1 part, turpentine oil, butyl cellulose 0.9 part, polyethylene 2 parts, glutaric acid 1 part, APES 2 parts, amino-acid ester 0.2 part, octanol 20 parts, Pyrogentisinic Acid 0.1 part, dimethylacetylamide 0.8 part, phenoxy polyol resin 2 parts, BTA 0.5 part, o-fluorobenzoic acid 1.2 parts, butyl acetate 10 parts, septichen 0.3 part.
Described polyethylene powders particle diameter is less than 10 microns; Described APES is OPEO.
The preparation method of above-mentioned scaling powder, comprises the following steps:
Step 1, by rosin, EVA resin, isopropyl alcohol, ethyl acetate, turpentine oil, butyl cellulose, polyethylene, glutaric acid, amino-acid ester, octanol, Pyrogentisinic Acid, dimethylacetylamide, butyl acetate mixing, is stirred to component and dissolves completely;
Step 2, adds in step 1 gained mixture by remaining ingredient, limit edged stirs, and after mixing, filters and get final product.
Whipping temp in step 1 is 30 DEG C; Whipping temp in step 2 is 40 DEG C.
Embodiment 2
A kind of scaling powder, comprises with parts by weight: rosin 13 parts, EVA resin 15 parts, ethylamine hydrochloride 0.7 part, isopropyl alcohol 2 parts, 5 parts, ethyl acetate, 3 parts, turpentine oil, butyl cellulose 1.2 parts, polyethylene 4 parts, glutaric acid 2 parts, APES 4 parts, amino-acid ester 0.7 part, octanol 24 parts, Pyrogentisinic Acid 0.2 part, dimethylacetylamide 1.2 parts, phenoxy polyol resin 4 parts, BTA 0.9 part, o-fluorobenzoic acid 1.6 parts, butyl acetate 14 parts, septichen 0.5 part.
Described polyethylene powders particle diameter is less than 10 microns; Described APES is dodecyl phenol polyethenoxy ether.
The preparation method of above-mentioned scaling powder, comprises the following steps:
Step 1, by rosin, EVA resin, isopropyl alcohol, ethyl acetate, turpentine oil, butyl cellulose, polyethylene, glutaric acid, amino-acid ester, octanol, Pyrogentisinic Acid, dimethylacetylamide, butyl acetate mixing, is stirred to component and dissolves completely;
Step 2, adds in step 1 gained mixture by remaining ingredient, limit edged stirs, and after mixing, filters and get final product.
Whipping temp in step 1 is 45 DEG C; Whipping temp in step 2 is 35 DEG C.
Embodiment 3
A kind of scaling powder, comprises with parts by weight: rosin 17 parts, EVA resin 16 parts, ethylamine hydrochloride 0.8 part, isopropyl alcohol 4 parts, 9 parts, ethyl acetate, 5 parts, turpentine oil, butyl cellulose 2.1 parts, polyethylene 7 parts, glutaric acid 2 parts, APES 4 parts, amino-acid ester 1.3 parts, octanol 28 parts, Pyrogentisinic Acid 0.5 part, dimethylacetylamide 1.6 parts, phenoxy polyol resin 9 parts, BTA 1.8 parts, o-fluorobenzoic acid 2.4 parts, butyl acetate 24 parts, septichen 0.7 part.
Described polyethylene powders particle diameter is less than 10 microns; Described APES is dodecyl phenol polyethenoxy ether.
The preparation method of above-mentioned scaling powder, comprises the following steps:
Step 1, by rosin, EVA resin, isopropyl alcohol, ethyl acetate, turpentine oil, butyl cellulose, polyethylene, glutaric acid, amino-acid ester, octanol, Pyrogentisinic Acid, dimethylacetylamide, butyl acetate mixing, is stirred to component and dissolves completely;
Step 2, adds in step 1 gained mixture by remaining ingredient, limit edged stirs, and after mixing, filters and get final product.
Whipping temp in step 1 is 32 DEG C; Whipping temp in step 2 is 38 DEG C.
Embodiment 4
A kind of scaling powder, comprises with parts by weight: rosin 20 parts, EVA resin 18 parts, ethylamine hydrochloride 0.7 part, isopropyl alcohol 4 parts, 9 parts, ethyl acetate, 5 parts, turpentine oil, butyl cellulose 3.1 parts, polyethylene 7 parts, glutaric acid 3 parts, APES 4 parts, amino-acid ester 1.3 parts, octanol 36 parts, Pyrogentisinic Acid 0.5 part, dimethylacetylamide 2.3 parts, phenoxy polyol resin 8 parts, BTA 2.3 parts, o-fluorobenzoic acid 2.8 parts, butyl acetate 25 parts, septichen 0.7 part.
Described polyethylene powders particle diameter is less than 10 microns; Described APES is OPEO.
The preparation method of above-mentioned scaling powder, comprises the following steps:
Step 1, by rosin, EVA resin, isopropyl alcohol, ethyl acetate, turpentine oil, butyl cellulose, polyethylene, glutaric acid, amino-acid ester, octanol, Pyrogentisinic Acid, dimethylacetylamide, butyl acetate mixing, is stirred to component and dissolves completely;
Step 2, adds in step 1 gained mixture by remaining ingredient, limit edged stirs, and after mixing, filters and get final product.
Whipping temp in step 1 is 40 DEG C; Whipping temp in step 2 is 38 DEG C.
Embodiment 5
A kind of scaling powder, comprises with parts by weight: rosin 22 parts, EVA resin 17 parts, ethylamine hydrochloride 0.6 part, isopropyl alcohol 3 parts, 6 parts, ethyl acetate, 4 parts, turpentine oil, butyl cellulose 3.2 parts, polyethylene 6 parts, glutaric acid 3 parts, APES 4 parts, amino-acid ester 1.3 parts, octanol 22 parts, Pyrogentisinic Acid 0.2 part, dimethylacetylamide 0.9 part, phenoxy polyol resin 3 parts, BTA 0.6 part, o-fluorobenzoic acid 1.6 parts, butyl acetate 23 parts, septichen 0.5 part.
Described polyethylene powders particle diameter is less than 10 microns; Described APES is OPEO.
The preparation method of above-mentioned scaling powder, comprises the following steps:
Step 1, by rosin, EVA resin, isopropyl alcohol, ethyl acetate, turpentine oil, butyl cellulose, polyethylene, glutaric acid, amino-acid ester, octanol, Pyrogentisinic Acid, dimethylacetylamide, butyl acetate mixing, is stirred to component and dissolves completely;
Step 2, adds in step 1 gained mixture by remaining ingredient, limit edged stirs, and after mixing, filters and get final product.
Whipping temp in step 1 is 42 DEG C; Whipping temp in step 2 is 35 DEG C.
Embodiment 6
A kind of scaling powder, comprises with parts by weight: rosin 25 parts, EVA resin 20 parts, ethylamine hydrochloride 0.8 part, isopropyl alcohol 5 parts, 10 parts, ethyl acetate, 6 parts, turpentine oil, butyl cellulose 3.5 parts, polyethylene 8 parts, glutaric acid 4 parts, APES 5 parts, amino-acid ester 1.8 parts, octanol 40 parts, Pyrogentisinic Acid 0.6 part, dimethylacetylamide 2.7 parts, phenoxy polyol resin 9 parts, BTA 2.5 parts, o-fluorobenzoic acid 3.6 parts, butyl acetate 30 parts, septichen 0.9 part.
Described polyethylene powders particle diameter is less than 10 microns; Described APES is dodecyl phenol polyethenoxy ether.
The preparation method of above-mentioned scaling powder, comprises the following steps:
Step 1, by rosin, EVA resin, isopropyl alcohol, ethyl acetate, turpentine oil, butyl cellulose, polyethylene, glutaric acid, amino-acid ester, octanol, Pyrogentisinic Acid, dimethylacetylamide, butyl acetate mixing, is stirred to component and dissolves completely;
Step 2, adds in step 1 gained mixture by remaining ingredient, limit edged stirs, and after mixing, filters and get final product.
Whipping temp in step 1 is 32 DEG C; Whipping temp in step 2 is 39 DEG C.
Embodiment 7
The difference of the present embodiment and embodiment 6 is not containing septichen.Specifically:
A kind of scaling powder, comprises with parts by weight: rosin 25 parts, EVA resin 20 parts, ethylamine hydrochloride 0.8 part, isopropyl alcohol 5 parts, 10 parts, ethyl acetate, 6 parts, turpentine oil, butyl cellulose 3.5 parts, polyethylene 8 parts, glutaric acid 4 parts, APES 5 parts, amino-acid ester 1.8 parts, octanol 40 parts, Pyrogentisinic Acid 0.6 part, dimethylacetylamide 2.7 parts, phenoxy polyol resin 9 parts, BTA 2.5 parts, o-fluorobenzoic acid 3.6 parts, butyl acetate 30 parts.
Described polyethylene powders particle diameter is less than 10 microns; Described APES is dodecyl phenol polyethenoxy ether.
The preparation method of above-mentioned scaling powder, comprises the following steps:
Step 1, by rosin, EVA resin, isopropyl alcohol, ethyl acetate, turpentine oil, butyl cellulose, polyethylene, glutaric acid, amino-acid ester, octanol, Pyrogentisinic Acid, dimethylacetylamide, butyl acetate mixing, is stirred to component and dissolves completely;
Step 2, adds in step 1 gained mixture by remaining ingredient, limit edged stirs, and after mixing, filters and get final product.
Whipping temp in step 1 is 32 DEG C; Whipping temp in step 2 is 39 DEG C.
Embodiment 1 ~ 7 gained sample is carried out performance measurement, and result is as follows:
As can be seen from the table, the scaling powder rate of spread provided by the invention is all greater than 80%, and weldering property is moderate, halogen-free, and ionic pollution degree reaches highest level, is all better than comparative example.In addition, owing to not adding septichen in comparative example, result in scaling powder hydraulic performance decline, this may be because septichen has the surface tension reducing liquid solder and embody at welded material surface, the mobility of liquid solder and spreading ability are strengthened, thus affects scaling powder performance.In addition, the embodiment 4 gained scaling powder rate of spread, ionic pollution degree, surface insulation resistance are all better, are optimum embodiment of the present invention.
Claims (6)
1. a scaling powder, it is characterized in that: comprise with parts by weight: rosin 10 ~ 25 parts, EVA resin 7 ~ 20 parts, ethylamine hydrochloride 0.5 ~ 0.8 part, isopropyl alcohol 1 ~ 5 part, 3 ~ 10 parts, ethyl acetate, 1 ~ 6 part, turpentine oil, butyl cellulose 0.9 ~ 3.5 part, polyethylene 2 ~ 8 parts, glutaric acid 1 ~ 4 part, APES 2 ~ 5 parts, amino-acid ester 0.2 ~ 1.8 part, octanol 20 ~ 40 parts, Pyrogentisinic Acid 0.1 ~ 0.6 part, dimethylacetylamide 0.8 ~ 2.7 part, phenoxy polyol resin 2 ~ 9 parts, BTA 0.5 ~ 2.5 part, o-fluorobenzoic acid 1.2 ~ 3.6 parts, butyl acetate 10 ~ 30 parts, septichen 0.3 ~ 0.9 part.
2. a kind of scaling powder according to claim 1, is characterized in that: described polyethylene powders particle diameter is less than 10 microns.
3. a kind of scaling powder according to claim 1, is characterized in that: described APES is OPEO or dodecyl phenol polyethenoxy ether.
4. the preparation method of the scaling powder described in any one of claims 1 to 3, is characterized in that: comprise the following steps:
Step 1, by rosin, EVA resin, isopropyl alcohol, ethyl acetate, turpentine oil, butyl cellulose, polyethylene, glutaric acid, amino-acid ester, octanol, Pyrogentisinic Acid, dimethylacetylamide, butyl acetate mixing, is stirred to component and dissolves completely;
Step 2, adds in step 1 gained mixture by remaining ingredient, limit edged stirs, and after mixing, filters and get final product.
5. the preparation method of scaling powder according to claim 4, is characterized in that: the whipping temp in step 1 is 30 ~ 45 DEG C.
6. the preparation method of scaling powder according to claim 4, is characterized in that: the whipping temp in step 2 is 35 ~ 40 DEG C.
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| CN106271219A (en) * | 2016-08-26 | 2017-01-04 | 王泽陆 | A kind of No clean high-temperature electronic brazing flux and preparation method thereof |
| CN108274162A (en) * | 2018-04-11 | 2018-07-13 | 苏州龙腾万里化工科技有限公司 | A kind of anti-oxidant scaling powder |
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| JP2013146740A (en) * | 2012-01-17 | 2013-08-01 | Denso Corp | Flux for resin flux cored solder, and resin flux cored solder |
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| CN103447716A (en) * | 2013-08-23 | 2013-12-18 | 吴江龙硕金属制品有限公司 | Halogen-free soldering flux and preparation method thereof |
| CN103521952A (en) * | 2012-07-06 | 2014-01-22 | 重庆微世特电子材料有限公司 | Welding-bonding dual-purpose halogen-free electronic addition agent and preparation method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| TW201309410A (en) * | 2011-08-12 | 2013-03-01 | Hitachi Chemical Co Ltd | Solder bonded body, method for producing solder bonded body, element, photovoltaic cell, method for producing element and method for producing photovoltaic cell |
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| CN101412166A (en) * | 2008-11-28 | 2009-04-22 | 廖龙根 | Halogen-free scaling powder |
| CN102513733A (en) * | 2010-12-31 | 2012-06-27 | 广东中实金属有限公司 | Flux |
| JP2013146740A (en) * | 2012-01-17 | 2013-08-01 | Denso Corp | Flux for resin flux cored solder, and resin flux cored solder |
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