CN103871975B - 一种芯片封装散热方法 - Google Patents
一种芯片封装散热方法 Download PDFInfo
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CN201410066209.8A CN103871975B (zh) | 2014-02-26 | 2014-02-26 | 一种芯片封装散热方法 |
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CN201410066209.8A CN103871975B (zh) | 2014-02-26 | 2014-02-26 | 一种芯片封装散热方法 |
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CN103871975A CN103871975A (zh) | 2014-06-18 |
CN103871975B true CN103871975B (zh) | 2017-02-01 |
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Families Citing this family (4)
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CN104159436A (zh) * | 2014-08-15 | 2014-11-19 | 韩百萍 | 一种自清洁散热翅片散热器 |
CN108926793B (zh) * | 2018-04-20 | 2020-05-01 | 宁波工程学院 | 一种基于热应变来自动释放干粉灭火剂的灭火装置 |
CN109027821A (zh) * | 2018-08-23 | 2018-12-18 | 重庆秉为科技有限公司 | 一种led灯的灯壳 |
CN109291655B (zh) * | 2018-12-10 | 2020-05-12 | 合肥菲力姆科技有限公司 | 一种具有散热功能的热敏打印头 |
Citations (3)
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US6864574B1 (en) * | 1999-11-29 | 2005-03-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor package |
CN101131982A (zh) * | 2007-09-13 | 2008-02-27 | 江苏长电科技股份有限公司 | 半导体器件无脚封装结构及其封装工艺 |
CN103206683A (zh) * | 2012-01-12 | 2013-07-17 | 长广科技有限公司 | 发光装置的led3d曲面导线架 |
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US20080014532A1 (en) * | 2006-07-14 | 2008-01-17 | 3M Innovative Properties Company | Laminate body, and method for manufacturing thin substrate using the laminate body |
KR20120031697A (ko) * | 2010-09-27 | 2012-04-04 | 삼성전자주식회사 | 패키지 적층 구조 및 그 제조 방법 |
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Publication number | Priority date | Publication date | Assignee | Title |
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US6864574B1 (en) * | 1999-11-29 | 2005-03-08 | Matsushita Electric Industrial Co., Ltd. | Semiconductor package |
CN101131982A (zh) * | 2007-09-13 | 2008-02-27 | 江苏长电科技股份有限公司 | 半导体器件无脚封装结构及其封装工艺 |
CN103206683A (zh) * | 2012-01-12 | 2013-07-17 | 长广科技有限公司 | 发光装置的led3d曲面导线架 |
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Effective date of registration: 20160523 Address after: 343000 Jinggangshan export processing zone, Jiangxi, No. Torch Road, No. 192 Applicant after: JIANGXI CHUANGCHENG ELECTRONIC CO., LTD. Address before: 343000 Jinggangshan export processing zone, Ji'an, Jiangxi (Jiangxi, Ji'an) Applicant before: JIANGXI CHUANGCHENG SEMICONDUCTOR CO., LTD. |
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Effective date of registration: 20170829 Address after: 343000 Torch Road 192, Jinggangshan economic and Technological Development Zone, Ji'an, Jiangxi Patentee after: Jiangxi creation Microelectronics Co., Ltd. Address before: 343000 Jinggangshan export processing zone, Jiangxi, No. Torch Road, No. 192 Patentee before: JIANGXI CHUANGCHENG ELECTRONIC CO., LTD. |
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