CN103839098B - 用于打印的射频识别（rfid）标签的装置和方法 - Google Patents

用于打印的射频识别（rfid）标签的装置和方法 Download PDF

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Publication number
CN103839098B
CN103839098B CN201310538030.3A CN201310538030A CN103839098B CN 103839098 B CN103839098 B CN 103839098B CN 201310538030 A CN201310538030 A CN 201310538030A CN 103839098 B CN103839098 B CN 103839098B
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CN
China
Prior art keywords
receiving layer
antenna
substrate
chip
attached
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201310538030.3A
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English (en)
Chinese (zh)
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CN103839098A (zh
Inventor
Y·吴
P·F·史密斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xerox Corp
Original Assignee
Xerox Corp
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Publication date
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Publication of CN103839098A publication Critical patent/CN103839098A/zh
Application granted granted Critical
Publication of CN103839098B publication Critical patent/CN103839098B/zh
Expired - Fee Related legal-status Critical Current
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Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/07773—Antenna details
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49016—Antenna or wave energy "plumbing" making
    • Y10T29/49018—Antenna or wave energy "plumbing" making with other electrical component

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Details Of Aerials (AREA)
CN201310538030.3A 2012-11-20 2013-11-04 用于打印的射频识别（rfid）标签的装置和方法 Expired - Fee Related CN103839098B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/682,471 US9286564B2 (en) 2012-11-20 2012-11-20 Apparatuses and methods for printed radio frequency identification (RFID) tags
US13/682471 2012-11-20
US13/682,471 2012-11-20

Publications (2)

Publication Number Publication Date
CN103839098A CN103839098A (zh) 2014-06-04
CN103839098B true CN103839098B (zh) 2018-04-20

Family

ID=49818300

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310538030.3A Expired - Fee Related CN103839098B (zh) 2012-11-20 2013-11-04 用于打印的射频识别（rfid）标签的装置和方法

Country Status (4)

Country Link
US (1) US9286564B2 (enExample)
JP (1) JP6114677B2 (enExample)
CN (1) CN103839098B (enExample)
GB (1) GB2509374B (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
USD729808S1 (en) * 2013-03-13 2015-05-19 Nagrastar Llc Smart card interface
USD780763S1 (en) * 2015-03-20 2017-03-07 Nagrastar Llc Smart card interface
CN106626769B (zh) * 2017-01-04 2018-07-13 北京舞马科技有限公司 一种喷墨制造可变的Chipless RFID系统及方法
DE102017200132A1 (de) 2017-01-05 2018-07-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Antennenvorrichtung mit Bonddrähten
DE102017200131A1 (de) * 2017-01-05 2018-07-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Antennenvorrichtung, Antennenarray, elektrische Schaltung mit einer Antennenvorrichtung und Bändchenbondantenne
DE102017200130A1 (de) 2017-01-05 2018-07-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bändchenbondantennen
JP6658607B2 (ja) * 2017-02-22 2020-03-04 オムロン株式会社 製品の製造方法、外装部品およびアンテナパターン選択装置
CN108345930A (zh) * 2018-02-06 2018-07-31 深圳西文科技发展有限公司 一种可打印的rfid标签吊牌及制作方法
US10311264B1 (en) * 2018-04-30 2019-06-04 Xerox Corporation Printed RFID tag antenna array with interfering subarrays

Citations (4)

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CN1213449A (zh) * 1996-01-17 1999-04-07 格姆普拉斯有限公司 用于卡或标签的无触点电子组件
US6842148B2 (en) * 2001-04-16 2005-01-11 Skycross, Inc. Fabrication method and apparatus for antenna structures in wireless communications devices
CN101023560A (zh) * 2004-08-06 2007-08-22 国际商业机器公司 使用接合导线作为辐射元件构造天线的装置和方法
CN202142078U (zh) * 2011-06-24 2012-02-08 深圳光启高等理工研究院 读写器、电子标签和射频识别系统

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JP2001126044A (ja) * 1999-02-05 2001-05-11 Hitachi Maxell Ltd フレキシブルｉｃモジュール及びその製造方法並びにフレキシブルｉｃモジュールを用いた情報担体の製造方法
US6300914B1 (en) * 1999-08-12 2001-10-09 Apti, Inc. Fractal loop antenna
US20070169336A1 (en) * 2001-03-26 2007-07-26 Daniel Luch Electrically conductive patterns, antennas and methods of manufacture
JP2005266963A (ja) * 2004-03-16 2005-09-29 Omron Corp 薄型ｉｃタグおよびその製造方法
US7549591B2 (en) * 2004-06-28 2009-06-23 International Barcode Corporation Combined multi-frequency electromagnetic and optical communication system
US8425312B1 (en) * 2005-08-05 2013-04-23 Electronicard Corp. Playing card indentification system
US7954722B2 (en) * 2006-05-30 2011-06-07 Hitachi, Ltd. IC tag and inlet for IC tag
US8674888B2 (en) * 2006-06-21 2014-03-18 Broadcom Corporation Integrated circuit with power supply line antenna structure and methods for use therewith
US8322624B2 (en) * 2007-04-10 2012-12-04 Feinics Amatech Teoranta Smart card with switchable matching antenna
US8179231B1 (en) * 2006-09-28 2012-05-15 Louisiana Tech Research Foundation Transmission delay based RFID tag
US20080136861A1 (en) * 2006-12-11 2008-06-12 3M Innovative Properties Company Method and apparatus for printing conductive inks
US7796684B2 (en) * 2007-02-26 2010-09-14 Avago Technologies Ecbu Ip (Singapore) Pte. Ltd. RF transceiver adapted for signal isolators and proximity sensors
TWI423519B (zh) * 2007-09-04 2014-01-11 Mitsubishi Electric Corp Radio frequency identification tag
US8062698B2 (en) * 2008-03-10 2011-11-22 Xerox Corporation Synthesis of conductive metal markings for chipless RFID applications
US8534562B2 (en) * 2008-12-18 2013-09-17 Avery Dennison Corporation Badge with RFID device
US8613132B2 (en) * 2009-11-09 2013-12-24 Feinics Amatech Teoranta Transferring an antenna to an RFID inlay substrate
US20110186980A1 (en) * 2010-02-03 2011-08-04 Rfmarq, Inc. Wireless Element With Antenna Formed On A Thin Film Substrate For Embedding into Semiconductor packages
IT1398079B1 (it) 2010-02-10 2013-02-07 Lolli Apparato per realizzare antenne per dispositivi di identificazione a radiofrequenza
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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1213449A (zh) * 1996-01-17 1999-04-07 格姆普拉斯有限公司 用于卡或标签的无触点电子组件
US6842148B2 (en) * 2001-04-16 2005-01-11 Skycross, Inc. Fabrication method and apparatus for antenna structures in wireless communications devices
CN101023560A (zh) * 2004-08-06 2007-08-22 国际商业机器公司 使用接合导线作为辐射元件构造天线的装置和方法
CN202142078U (zh) * 2011-06-24 2012-02-08 深圳光启高等理工研究院 读写器、电子标签和射频识别系统

Also Published As

Publication number Publication date
GB2509374A (en) 2014-07-02
JP2014102826A (ja) 2014-06-05
CN103839098A (zh) 2014-06-04
GB201319704D0 (en) 2013-12-25
JP6114677B2 (ja) 2017-04-12
US20140138446A1 (en) 2014-05-22
US9286564B2 (en) 2016-03-15
GB2509374B (en) 2020-04-29

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Granted publication date: 20180420

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