CN103826392A - Identification structure in exposure process of high-density interconnection circuit board - Google Patents
Identification structure in exposure process of high-density interconnection circuit board Download PDFInfo
- Publication number
- CN103826392A CN103826392A CN201210466030.2A CN201210466030A CN103826392A CN 103826392 A CN103826392 A CN 103826392A CN 201210466030 A CN201210466030 A CN 201210466030A CN 103826392 A CN103826392 A CN 103826392A
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- China
- Prior art keywords
- film
- hole
- circuit board
- identification
- exposure
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- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention relates to an identification structure in an exposure structure of a high-density interconnection circuit board. The identification structure includes a film. A graphic area is arranged on the film. At least one through hole is manufactured in the film at the outer side of the graphic area. A film piece which cooperates with the through hole is embedded in each through hole. Each film piece is connected with the film through a scotch tape. Identification symbols are arranged on the film pieces. In the identification structure in the exposure process of the high-density interconnection circuit board, at least one through hole is manufactured in the film at the outer side of the graphic area and a film piece with an identification symbol is embedded in each through hole; when exposure is performed, the identification symbols on the film pieces are also transferred on a product board; and after an acid etching process, the product board is provided with the identification symbols which can show operators and manufacturing devices and thus during post processing, once problems occur, past manufacturing conditions can be traced well and significantly conveniently.
Description
Technical field
The invention belongs to high-density interconnected circuit board exposure technology technical field, the recognition structure in especially a kind of high-density interconnected circuit board exposure technology.
Background technology
Circuit board, take insulating material as basic unit, is laid Copper Foil conductor layer and various electronic component in this basic unit, circuit board has been widely used the every aspect in people's routine work life.In the course of processing of circuit board, figure on film need to be shifted, specific operation process is: first carry out the exposure of film 3, the figure of graph area 4 on film is transferred on production board, this production board carries out completing after acid etching the transfer of figure again.
After aforesaid operations process completes, production board enters next process processing, but in existing technique, the exposure of film by who operating personnel is completed, or by any platform exposure machine complete all and cannot search, this be mainly on production board without any effective mark, once that is to say and go wrong, this production board cannot effectively be reviewed.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art, provide a kind of scientific and reasonable, be convenient to identification high-density interconnected circuit board exposure technology in recognition structure.
The technical scheme that the present invention takes is:
Recognition structure in a kind of high-density interconnected circuit board exposure technology, comprise film, on film, be provided with graph area, it is characterized in that: on the film in graph area outside, make at least one through hole, the film block that in each through hole, setting-in one matches with through hole, each film block is connected with film by adhesive tape, in described film block, is provided with identifier.
And two end faces of each described film block connect the same side surface of film by an adhesive tape respectively.
Advantage of the present invention and good effect are:
In the present invention, on the film in graph area outside, at least make a through hole, in each through hole, setting-in is with the film block of identifier, and in the time exposing, the identifier in film block is transferred equally on production board, after acid etching, production board is with the identifier that operating personnel and process equipment can be described, while carrying out post-processed like this, once go wrong, can well review processing situation in the past, very convenient.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention;
Fig. 2 is that the A-A of Fig. 1 is to sectional view;
Fig. 3 is the axial view of film block.
Embodiment
Below in conjunction with embodiment, the present invention is further described, and following embodiment is illustrative, is not determinate, can not limit protection scope of the present invention with following embodiment.
Recognition structure in a kind of high-density interconnected circuit board exposure technology, as shown in Figures 1 to 3, comprise film 3, on film, be provided with graph area 4, it is characterized in that: on the film in graph area outside, make at least one through hole 5, the film block 1,2 that in each through hole, setting-in one matches with through hole, each film block is connected with film by adhesive tape 6, is provided with identifier 7 in described film block.
In the present embodiment, through hole made on material and shape size and film identical with film that film block adopts is identical, film block is two, be respectively that operating personnel identify film block 1 and process equipment identification film block 2, two end faces of these two film block connect the same side surface of film by two adhesive tapes 6.
When the present invention uses:
1. drilling on film, then embeds the film block with identifier.
2. operating personnel use adhesive tape to fix film block, carry out exposing operation.
3. the identifier in film block is transferred on production board, carries out after acid etching, and identifier is solidificated on production board.
In the present invention, on the film in graph area outside, at least make a through hole, in each through hole, setting-in is with the film block of identifier, and in the time exposing, the identifier in film block is transferred equally on production board, after acid etching, production board is with the identifier that operating personnel and process equipment can be described, while carrying out post-processed like this, once go wrong, can well review processing situation in the past, very convenient.
Claims (2)
1. the recognition structure in a high-density interconnected circuit board exposure technology, comprise film, on film, be provided with graph area, it is characterized in that: on the film in graph area outside, make at least one through hole, the film block that in each through hole, setting-in one matches with through hole, each film block is connected with film by adhesive tape, in described film block, is provided with identifier.
2. the recognition structure in high-density interconnected circuit board exposure technology according to claim 1, is characterized in that: two end faces of each described film block connect the same side surface of film by an adhesive tape respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210466030.2A CN103826392A (en) | 2012-11-16 | 2012-11-16 | Identification structure in exposure process of high-density interconnection circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210466030.2A CN103826392A (en) | 2012-11-16 | 2012-11-16 | Identification structure in exposure process of high-density interconnection circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103826392A true CN103826392A (en) | 2014-05-28 |
Family
ID=50761138
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210466030.2A Pending CN103826392A (en) | 2012-11-16 | 2012-11-16 | Identification structure in exposure process of high-density interconnection circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103826392A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105407641A (en) * | 2015-10-29 | 2016-03-16 | 北大方正集团有限公司 | Circuit board film, management method and device |
| CN110557901A (en) * | 2018-05-31 | 2019-12-10 | Oppo广东移动通信有限公司 | A tool and workstation for SMT paster |
-
2012
- 2012-11-16 CN CN201210466030.2A patent/CN103826392A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105407641A (en) * | 2015-10-29 | 2016-03-16 | 北大方正集团有限公司 | Circuit board film, management method and device |
| CN105407641B (en) * | 2015-10-29 | 2019-07-02 | 北大方正集团有限公司 | Circuit board negative and its management method, device |
| CN110557901A (en) * | 2018-05-31 | 2019-12-10 | Oppo广东移动通信有限公司 | A tool and workstation for SMT paster |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140528 |