CN103811648A - Novel wire welding process - Google Patents
Novel wire welding process Download PDFInfo
- Publication number
- CN103811648A CN103811648A CN201210454908.0A CN201210454908A CN103811648A CN 103811648 A CN103811648 A CN 103811648A CN 201210454908 A CN201210454908 A CN 201210454908A CN 103811648 A CN103811648 A CN 103811648A
- Authority
- CN
- China
- Prior art keywords
- chips
- chip
- welding
- wire
- tweezers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Abstract
The invention relates to a novel wire welding process which is characterized by including the following steps of printed circuit board (PCB) cleaning which includes scraping aluminum wires, insulation glue and chips through a blade, utilizing a cotton ball to dip in alcohol and wipe a PCB and erasing rust stain through an eraser; chip selection which includes utilizing a complete inspection machine to conduct testing and selecting chips at the middle position from chips with good parameters; conducting die bonding which includes utilizing tweezers to press the chips flat lightly with appropriate glue quantity in the way that the tweezers are used at the lower position to the greatest extent, and the surfaces and the PN joint position cannot be damaged; conducting baking under the temperature of 150 DEG C for 1 hour; conducting wire welding. The insulation glue is hardened and prone to deviate from a welding disc if the baking time is too long. The welding point is located at the middle position of an electrode, the radian is good, a tail wire is proper, and the problems of insufficient welding, welding skips, wire folding, wire breaking and the like are solved. The process is simple in operation, the chips subjected to wire welding is quick in heat dissipation, and the change of various parameters of the chips can be truly reflected.
Description
Technical field
The present invention relates to a kind of new bonding wire craft, belong to LED detection field.
Background technology
First conventional chip soldering Wiring technology process is to cover chip mount point at the bond pad surface insulating cement of pcb board at present; then chip is directly placed on insulating cement; till being heat-treated to chip and being securely fixed on pad; between chip and pad, directly set up electrical connection by the method for wire bond more subsequently; because current bonding wire craft is not very ripe; therefore often there will be bonding wire not thorough, the detection of chip produced to error, from but detect and lost meaning.
Summary of the invention
The present invention is directed to deficiency, a kind of new bonding wire craft is provided.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of new bonding wire craft, it is characterized in that, and described method step is as follows:
(1) pcb board is clean---and first with blade, aluminium wire, insulating cement and chip are struck off, cotton balls dips alcohol wipe, and rust stain is wiped with erasing rubber;
(2) chip is chosen---get the centre position chip that sub-elects parameter good chips after full inspection machine is tested;
(3) whether die bond---suitably glue amount, notes tweezers as far as possible on the lower, and not scratch chip surface and PN junction position flattens gently with tweezers, check to have to leak the phenomenons such as solid, anisotropy, chip stain, damaged, glue amount is too much, very few after die bond;
(4) baking---150 ℃, 1 hour, overlong time caused insulating cement sclerosis, easily departs from pad;
(5) bonding wire---bond pad locations should be positioned at electrode centre position, radian is good, tailfiber is suitable, without phenomenons such as rosin joint, solder skip, broken line, broken strings.
The invention has the beneficial effects as follows: this method is simple to operate, the rapid heat dissipation of the complete rear chip of bonding wire, more really reaction chip parameters change.
Embodiment
Below principle of the present invention and feature are described, example, only for explaining the present invention, is not intended to limit scope of the present invention.
A new bonding wire craft, is characterized in that, described method step is as follows:
(1) pcb board is clean---and first with blade, aluminium wire, insulating cement and chip are struck off, cotton balls dips alcohol wipe, and rust stain is wiped with erasing rubber;
(2) chip is chosen---get the centre position chip that sub-elects parameter good chips after full inspection machine is tested;
(3) whether die bond---suitably glue amount, notes tweezers as far as possible on the lower, and not scratch chip surface and PN junction position flattens gently with tweezers, check to have to leak the phenomenons such as solid, anisotropy, chip stain, damaged, glue amount is too much, very few after die bond;
(4) baking---150 ℃, 1 hour, overlong time caused insulating cement sclerosis, easily departs from pad;
(5) bonding wire---bond pad locations should be positioned at electrode centre position, radian is good, tailfiber is suitable, without phenomenons such as rosin joint, solder skip, broken line, broken strings.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (1)
1. a new bonding wire craft, is characterized in that, described method step is as follows:
(1) pcb board is clean---and first with blade, aluminium wire, insulating cement and chip are struck off, cotton balls dips alcohol wipe, and rust stain is wiped with erasing rubber;
(2) chip is chosen---get the centre position chip that sub-elects parameter good chips after full inspection machine is tested;
(3) whether die bond---suitably glue amount, notes tweezers as far as possible on the lower, and not scratch chip surface and PN junction position flattens gently with tweezers, check to have to leak the phenomenons such as solid, anisotropy, chip stain, damaged, glue amount is too much, very few after die bond;
(4) baking---150 ℃, 1 hour, overlong time caused insulating cement sclerosis, easily departs from pad;
(5) bonding wire---bond pad locations should be positioned at electrode centre position, radian is good, tailfiber is suitable, without phenomenons such as rosin joint, solder skip, broken line, broken strings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210454908.0A CN103811648A (en) | 2012-11-13 | 2012-11-13 | Novel wire welding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210454908.0A CN103811648A (en) | 2012-11-13 | 2012-11-13 | Novel wire welding process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103811648A true CN103811648A (en) | 2014-05-21 |
Family
ID=50708120
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210454908.0A Pending CN103811648A (en) | 2012-11-13 | 2012-11-13 | Novel wire welding process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103811648A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119516A (en) * | 2018-09-11 | 2019-01-01 | 台山鸿隆光电科技有限公司 | A kind of LED light vermicelli production technique |
| CN111897049A (en) * | 2020-08-27 | 2020-11-06 | 四川天邑康和通信股份有限公司 | Automatic chip mounting production process for optical splitter chip |
| CN115188694A (en) * | 2022-09-08 | 2022-10-14 | 福建慧芯激光科技有限公司 | Excessive mucilage binding remove device of chip package |
-
2012
- 2012-11-13 CN CN201210454908.0A patent/CN103811648A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109119516A (en) * | 2018-09-11 | 2019-01-01 | 台山鸿隆光电科技有限公司 | A kind of LED light vermicelli production technique |
| CN111897049A (en) * | 2020-08-27 | 2020-11-06 | 四川天邑康和通信股份有限公司 | Automatic chip mounting production process for optical splitter chip |
| CN115188694A (en) * | 2022-09-08 | 2022-10-14 | 福建慧芯激光科技有限公司 | Excessive mucilage binding remove device of chip package |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103170739B (en) | Laser adhesive-removing process | |
| CN105252094B (en) | A kind of highly reliable assembling method of high pressure welding point | |
| CN111579972B (en) | Service life detection method for PCBA board-level component | |
| CN104597389A (en) | Quick evaluation method for plastic encapsulated integrated circuit reliability under marine environment condition | |
| CN103811648A (en) | Novel wire welding process | |
| TW200608036A (en) | Pretreatment method, pretreatment device, method and device for electric inspection of conductor pattern, inspected printed circuit board and semiconductor device | |
| TWI263293B (en) | Probe card for integrated circuits | |
| CN105388413B (en) | Chip failure analysis instrument | |
| CN202662615U (en) | Axial diode | |
| RU2450903C2 (en) | Solder paste | |
| CN209640378U (en) | The adapter base structure of test fixture | |
| US7960190B2 (en) | Temporary package for at-speed functional test of semiconductor chip | |
| CN106304627B (en) | A kind of test pad structure and preparation method thereof | |
| Lahokallio et al. | Performance of passive RFID tags in a high temperature cycling test | |
| KR100801899B1 (en) | Testing method for printed circuit board | |
| Kong et al. | The reliability challenges of qfn packaging | |
| CN205263260U (en) | Chip failure analysis's testing arrangement | |
| CN204216026U (en) | A kind of high-cooling property diode | |
| CN104362137A (en) | High-heat-dissipativity diode | |
| CN211718455U (en) | Novel PCBA test fixture | |
| KR101237483B1 (en) | Method for manufacturing a printed circuit board | |
| KR102311179B1 (en) | Anisotropic conductive adhesives with solder conductive particles and flux additives for a thermo-compression bonding and electrical interconnection method of electrical component using the same | |
| KR102263049B1 (en) | Apparatus for testing of pcb and its inspection method | |
| CN101572214A (en) | Tin ball removing method of semiconductor packaging element | |
| CN205595312U (en) | A electric performance detection device for semiconductor chip |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140521 |