CN103811382B - Device for the corrosion of slug type semiconductor part chip table - Google Patents
Device for the corrosion of slug type semiconductor part chip table Download PDFInfo
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- CN103811382B CN103811382B CN201410030804.6A CN201410030804A CN103811382B CN 103811382 B CN103811382 B CN 103811382B CN 201410030804 A CN201410030804 A CN 201410030804A CN 103811382 B CN103811382 B CN 103811382B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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Abstract
The invention discloses a kind of device for the corrosion of slug type semiconductor part chip table, including: fixture one, fixture two and partition.Fixture one and fixture two all use cirque structure, are fastenedly connected each other.Fixture one with fixture two by the edge of the chip that two anode surfaces dock being fastened the sealing realizing its anode surface and edge.Partition is arranged on outside the cathode plane of two chips being mutually butted, it is achieved the sealing of the cathode plane of chip.Gap is left so that the table top of chip can be corroded, and the part that chip is in addition to table top is protected between partition and the assembly being made up of fixture one, fixture two and chip.Can not well protect the technical problem of chip when instant invention overcomes slug type semiconductor part chip table corrosion in prior art, improve the corrosion quality of slug type semiconductor part chip table, product percent of pass is greatly improved.
Description
Technical field
The present invention relates to field of manufacturing semiconductor devices, especially relate to a kind of device being applied to the corrosion of slug type semiconductor part chip table.
Background technology
Slug type semiconductor device chip is a kind of chip molybdenum sheet, aluminium and silicon chip being sintered together, including rectifier tube chip, thyristor chip etc..As shown in Figure 1, chip 9 includes silicon chip 14 and the molybdenum sheet 15 as anode, and the outer surface at silicon chip 14 has aluminium lamination 16 as negative electrode, is provided with table top 17 at the lateral edge of silicon chip 14 and molybdenum sheet 15.The P-N junction surface of semiconductor devices, particularly high tension apparatus, extremely sensitive to polluting, surface contamination severely impacts the performance of device.The tube core of slug type device after sandblasting and angle lap machine moulding, rough surface and seriously polluted, therefore can obtain higher surface pressure and guarantee tracking current relatively low and stablize in table top moulding, the corrosion quality of table top to be depended on.
Mesa etch is usually corrodes the chip table after angle lap, in this process, by chemical reaction, the rough surface after angle lap is become smooth smooth finish surface, eliminate mechanical damage and surface defect, get rid of pollutant and the metal ion being attached to table top 17 surface simultaneously, reach the effect of stable semiconductor device chip surface electrical.Mesa etch, is indispensable key link in slug type semiconductor device chip manufacture process.When carrying out mesa etch, need to molybdenum sheet 15 and cathode plane be protected, only table top 17 is exposed outside.
Slug type semiconductor device chip is after table top moulding; mesa etch have to be carried out; a how etched mesa; protection (not corroding) other parts (back side, centre and marginal portion) in addition to table top are the keys of problem; when slug type semiconductor device chip is carried out mesa etch; needing the back side, centre and marginal portion in addition to table top 17, the chip both sides to be effectively protected, only table top 17 is exposed outside, the most just can easily carry out the corrosion of table top 17.In the prior art, during to the mesa etch of slug type semiconductor device chip, the method for protection other parts in addition to table top typically has two kinds:
The first is the pitch-dark Protection Code of chip, it is simply that protects with the organic pitch-dark back side, centre and marginal portion by the two sides of chip 9 in addition to table top 17, then carries out mesa etch.The pitch-dark Protection Code of chip, although also can protect the chip 9 back side in addition to table top 17, centre and marginal portion, completes next step mesa etch technique.But owing to being artificial japanning, efficiency is the lowest, there is again a lot of uncertainty simultaneously.First, artificial japanning mode is it cannot be guaranteed that coating uniform, rule and complete, and the lighter causes mesa etch irregular, has aluminium lamination and molybdenum sheet to be corroded time serious.Secondly, pitch-dark need to use the ultrasonic removal of organic solvent, easily chip table be caused secondary pollution.
Second method is spin spray etching method, it is simply that make chip high speed rotate by special equipment, then to table top 17 jet etching liquid, due to High Rotation Speed and the bottom water spray protection of chip 9, makes corrosive liquid etched mesa 17.Spin spray etching method, is generally used at present, but it is matched to need to buy jet etching machine, and etching machine is expensive, and general enterprises is difficult to bear.Simultaneously as equipment is under corrosive environment for a long time, the most easily break down.What is particularly worth mentioning is that, when corroding the chip 9 of major diameter, chip 9 jitter phenomenon is serious, easily makes the mesa surfaces situation after corrosion undesirable, causes yield rate the lowest.
Summary of the invention
In view of this, it is an object of the invention to provide a kind of device for the corrosion of slug type semiconductor part chip table, when overcoming slug type semiconductor part chip table corrosion in prior art, can not well protect the technical problem of chip.
In order to realize foregoing invention purpose, the present invention specifically provides the technic relization scheme of a kind of device for the corrosion of slug type semiconductor part chip table, a kind of device for the corrosion of slug type semiconductor part chip table, including: fixture one, fixture two and partition, described fixture one all uses cirque structure with fixture two, is fastenedly connected each other.Described fixture one with fixture two by the edge of the chip that two anode surfaces dock being fastened the sealing realizing its anode surface and edge.Described partition is arranged on outside the cathode plane of two described chips being mutually butted, it is achieved the sealing of the cathode plane of described chip.Gap is left so that the table top of described chip can be corroded, and the part that described chip is in addition to table top is protected between described partition and the assembly being made up of described fixture one, fixture two and chip.
Preferably, it is provided with flange one at the internal edge of described fixture one, being provided with flange two at the internal edge of described fixture two, described fixture one and fixture two-way are crossed the chip that two anode surfaces dock by flange one and flange two and are fastened the sealing realized at described chip edge.
Preferably, described partition is provided with the fin of annular near the one side of chip, described fin, for isolating the cathode plane of described chip, makes to leave certain gap, to carry out the corrosion of table top between described partition and the assembly being made up of described fixture one, fixture two and chip simultaneously.
Preferably, described device includes the plural assembly being made up of described fixture one, fixture two and partition, to realize the corrosion of the chip of multiple anode surface docking.The another side of described partition is also equipped with the fin of annular, for the isolation of the assembly of fixture described in two or more one, fixture two and partition.
Preferably, the annular fin being arranged on described two faces of partition uses different diameters, for concatenating the described chip of different-diameter.
Preferably, described device also includes retention mechanism and increased pressure board, and the assembly of fixture described in two or more one, fixture two and partition is fastened between two pieces of increased pressure boards by described retention mechanism, and described increased pressure board contacts with described partition.
Preferably, described retention mechanism farther includes support plate, support rod, locating dowel and pressurization screw rod.Described locating dowel is arranged on one piece of support plate, and described pressurization screw rod is arranged on another block support plate, and described support rod is arranged between two pieces of support plates.The assembly of fixture described in two or more one, fixture two and partition is fastened between two pieces of increased pressure boards by described fastener by described locating dowel and pressurization screw rod.
Preferably, described device is applied to the corrosion of slug type semiconductor part chip table and any corrosion with similar structures semiconductor part chip table.By implementing the device for the corrosion of slug type semiconductor part chip table that the invention described above provides, have the following technical effect that
(1) present invention is when carrying out mesa etch to slug type semiconductor device chip, and the back side, centre and marginal portion in addition to table top, the chip both sides can be effectively protected by device；
(2) present invention need not the jet etching equipment using expensive semiconductor part chip table corrosion special, decreases the fund input of enterprise；
(3) present invention is simple to operate, slug type semiconductor devices disposably can carry out the mesa etch operation of multi-chip, production efficiency is greatly improved；
(4) the invention enables slug type semiconductor device chip when carrying out mesa etch, it is possible to well to be protected, improve the corrosion quality of semiconductor part chip table, the qualification rate of product is greatly improved.
Accompanying drawing explanation
In order to be illustrated more clearly that the embodiment of the present invention or technical scheme of the prior art, the accompanying drawing used required in embodiment or description of the prior art will be briefly described below, apparently, accompanying drawing in describing below is only some embodiments of the present invention, for those of ordinary skill in the art, on the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings.
Fig. 1 is the structural representation of slug type semiconductor device chip in the present invention；
Fig. 2 is present invention fixture one and assembling structural representation of 21 kinds of detailed description of the invention of fixture in the device that slug type semiconductor part chip table corrodes；
Fig. 3 is the structural representation of the chip that two anode surfaces are mutually butted in the present invention；
Fig. 4 is the present invention assembling structural representation that fixture one, fixture two and chipset are fit in the device that slug type semiconductor part chip table corrodes；
Fig. 5 is present invention structural representation of fixture two in the device that slug type semiconductor part chip table corrodes；
Fig. 6 is present invention structural representation of fixture one in the device that slug type semiconductor part chip table corrodes；
Fig. 7 is present invention assembling structural representation of fixture one, fixture two, chip and partition assembly in the device that slug type semiconductor part chip table corrodes；
Fig. 8 is the present invention cross-sectional view that fixture one, fixture two and chipset are fit in the device that slug type semiconductor part chip table corrodes；
Fig. 9 is present invention fixture one, fixture two, chip and cross-sectional view of partition assembly in the device that slug type semiconductor part chip table corrodes；
Figure 10 is the present invention multiple fixtures one, fixture two, chip and cross-sectional view of partition assembly concatenation in the device that slug type semiconductor part chip table corrodes；
Figure 11 is present invention fixture one, fixture two, chip, partition and cross-sectional view of fastener assembly in the device that slug type semiconductor part chip table corrodes；
Figure 12 is present invention fixture one, fixture two, chip, partition and perspective view of fastener assembly in the device that slug type semiconductor part chip table corrodes；
In figure: 1-fixture one, 2-fixture two, 3-partition, 4-increased pressure board, 5-support plate, 6-support rod, 7-locating dowel, 8-pressurizes screw rod, 9-chip, 10-chip and fixture combination body, 11-flange one, 12-flange two, 13-fin, 14-silicon chip, 15-molybdenum sheet, 16-aluminium lamination, 17-table top.
Detailed description of the invention
For making the purpose of the embodiment of the present invention, technical scheme and advantage clearer, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only a part of embodiment of the present invention rather than whole embodiments.Based on the embodiment in the present invention, the every other embodiment that those of ordinary skill in the art are obtained under not making creative work premise, broadly fall into the scope of protection of the invention.
As shown in accompanying drawing 1 to accompanying drawing 12, giving the present invention specific embodiment of the device for slug type semiconductor part chip table corrodes, the invention will be further described with specific embodiment below in conjunction with the accompanying drawings.
As shown in Figure 1, chip 9 includes silicon chip 14 and the molybdenum sheet 15 as anode, and the outer surface at silicon chip 14 has aluminium lamination 16 as negative electrode, is provided with table top 17 at the lateral edge of silicon chip 14 and molybdenum sheet 15.When slug type semiconductor device chip as shown in Figure 1 is carried out mesa etch; the back side, centre and marginal portion in addition to table top 17, the chip both sides is needed to be effectively protected; only table top 17 is exposed outside; the most just can easily carry out the corrosion of table top 17, and produce the chip 9 conformed to quality requirements.
As shown in accompanying drawing 2 to accompanying drawing 8, the specific embodiment of a kind of device for the corrosion of slug type semiconductor part chip table, including: fixture 1, fixture 22 and partition 3, fixture 1 and fixture 22 all use cirque structure, are fastenedly connected each other.The edge of fixture 1 and fixture 22 chip 9 by docking two anode surfaces fastens the sealing realizing its anode surface and edge.Partition 3 is arranged on outside the cathode plane of two chips being mutually butted 9, it is achieved the sealing of the cathode plane of chip 9.The assembling schematic diagram of two chips 9 of anode surface docking is as shown in Figure 3.As shown in Figure 9; gap L is left further between partition 3 and the assembly being made up of fixture 1, fixture 22 and chip 9; making table top 17 expose and be not protected, so that the table top 17 of chip 9 can be corroded, and the other parts that chip 9 is in addition to table top 17 are protected.
As shown in accompanying drawing 5 and accompanying drawing 6, fixture 1 and fixture 22 interfix, flange 1 it is provided with at the internal edge of fixture 1, it is provided with flange 2 12, fixture 1 and fixture 22 at the internal edge of fixture 22 and by flange 1 and flange 2 12, the chip 9 that two anode surfaces dock is fastened the sealing realizing chip 9 edge respectively.The flange 1 of the interior top edge of fixture 1 and the flange 2 12 of the interior lower limb of fixture 22; by two outer peripheral fastenings to chip 9; edge and the anode surface of the chip 9 of two anode surface docking are sealed in the assembly of the fixture being made up of fixture 1 and fixture 22, thus reach to protect chip 9 edge and the purpose of the back side (anode surface).The assembling structure of fixture 1 and fixture 22 as shown in Figure 2, between fixture 1 and fixture 22 can by use such as screw wait be similar in the way of realize being fastenedly connected.
As shown in Figure 9, partition 3 is further provided with the fin 13 of annular near the one side of chip 9, and fin 13 is not corroded for the aluminium lamination of the cathode plane of isolating seal chip 9, the aluminium lamination of protection cathode plane.Make to leave certain gap L, to carry out the corrosion of table top 17 between partition 3 and the assembly being made up of fixture 1, fixture 22 and chip 9 simultaneously.As shown in Figure 4, it is the assembling structural representation of assembly of fixture 1, fixture 22 and chip 9.As shown in Figure 8, it is the cross-sectional view after the assembly of fixture 1, fixture 22 and chip 9 completes assembling.
As shown in Figure 10, the device for the corrosion of slug type semiconductor part chip table farther includes the plural assembly being made up of fixture 1, fixture 22 and partition 3, to realize the corrosion of the chip 9 of multiple anode surface docking.The another side of partition 3 is also equipped with the fin 13 of annular, for the isolation of the assembly of two or more fixture 1, fixture 22 and partition 3 so that apparatus of the present invention can be applied to the corrosion of multi-chip table top.As shown in accompanying drawing 7 and accompanying drawing 9, be respectively two or more fixture 1, fixture 22 and partition 3 assembly assembling structural representation and complete assembling after cross-sectional view.The annular fin 13 being arranged on 3 two faces of partition can use different diameters, for concatenating the chip 9 of different-diameter.The annular fin 13 in 3 two faces of partition may be arranged as identical diameter, and for the chip table top etching that diameter is identical, each fixture partition 3 equipped with chip 9 separates.
As shown figs. 11 and 12, device for the corrosion of slug type semiconductor part chip table also includes retention mechanism and increased pressure board 4, the assembly of two or more fixture 1, fixture 22 and partition 3 is fastened between two pieces of increased pressure boards 4 by retention mechanism, and increased pressure board 4 contacts with partition 3.As shown figs. 11 and 12, it is provided with several partitions 3, chip and fixture combination body 10 between two pieces of increased pressure boards 4.Retention mechanism farther includes support plate 5, support rod 6, locating dowel 7 and pressurization screw rod 8.Locating dowel 7 is arranged on one piece of support plate 5, and pressurization screw rod 8 is arranged on another block support plate 5, and support rod 6 is arranged between two pieces of support plates 5.The assembly of two or more fixture 1, fixture 22 and partition 3 is fastened between two pieces of increased pressure boards 4 by fastener by locating dowel 7 and pressurization screw rod 8.As one of the present invention preferably specific embodiment, it is also possible to arrange anchor point, locating dowel 7 and pressurization screw rod 8 on two pieces of increased pressure boards 4 and be fixed on the positioning by anchor point.
The present invention can not only be applied to the corrosion of slug type semiconductor part chip table for the device that slug type semiconductor part chip table corrodes, it is also possible to is applied to any corrosion with similar structures semiconductor part chip table.Device for semiconductor part chip table corrosion includes that fixture 1, fixture 22, partition 3, increased pressure board 4 and retention mechanism are resistant material in the material of interior all parts, and its size, size and dimension all size, size and dimensions with chip 9 match.When carrying out chip table top etching operation, the fixture partition 3 installing chip 9 is separated, then fixes between increased pressure board 4 by retention mechanism, just complete the protection of all parts in addition to table top 17 of the two sides to chip 9 and edge.Then the assembly including fixture, partition 3, increased pressure board 4, retention mechanism and chip 9 is soaked in corrosive liquid, completes the etching process of table top 17.
The device for the corrosion of slug type semiconductor part chip table that the specific embodiment of the invention describes uses fixture to protect semiconductor device chip, and this fixture can effectively make the protected chip 9 back side in addition to table top 17 and marginal portion not be corroded.Meanwhile, the mid portion of burning chip 9 is made not to be corroded by partition 3.Therefore so that when chip 9 is carried out mesa etch, the back side, centre and marginal portion in addition to table top 17, the both sides of chip 9 is all effectively protected by fixture and partition 3, and only naked being exposed on the external of table top 17 is corroded.The device for the corrosion of slug type semiconductor part chip table that the specific embodiment of the invention describes possesses following advantage:
(1) present invention is when carrying out mesa etch to slug type semiconductor device chip, and the back side, centre and marginal portion in addition to table top, the chip both sides can be effectively protected by device；
(2) present invention need not the jet etching equipment using expensive semiconductor part chip table corrosion special, decreases the fund input of enterprise；
(3) present invention is simple to operate, slug type semiconductor devices disposably can carry out the mesa etch operation of multi-chip, production efficiency is greatly improved；
(4) the invention enables slug type semiconductor device chip when carrying out mesa etch, it is possible to well to be protected, improve the corrosion quality of semiconductor part chip table, the qualification rate of product is greatly improved.
In this specification, each embodiment uses the mode gone forward one by one to describe, and what each embodiment stressed is the difference with other embodiments, and between each embodiment, identical similar portion sees mutually.
The above, be only presently preferred embodiments of the present invention, and the present invention not makees any pro forma restriction.Although the present invention is disclosed above with preferred embodiment, but it is not limited to the present invention.Any those of ordinary skill in the art, in the case of without departing from the Spirit Essence of the present invention and technical scheme, technical solution of the present invention is made many possible variations and modification by the method and the technology contents that all may utilize the disclosure above, or is revised as the Equivalent embodiments of equivalent variations.Therefore, every content without departing from technical solution of the present invention, to any simple modification made for any of the above embodiments, equivalent, equivalence change and modify according to the technical spirit of the present invention, all still fall within the range of technical solution of the present invention protection.
Claims (7)
1. the device for the corrosion of slug type semiconductor part chip table, it is characterised in that including: fixture one (1), fixture two (2) and partition (3), described fixture one (1) all uses cirque structure with fixture two (2), is fastenedly connected each other；The edge of described fixture one (1) and fixture two (2) chip (9) by docking two anode surfaces fastens the sealing realizing its anode surface and edge；Described partition (3) is arranged on outside the cathode plane of two described chips (9) being mutually butted, it is achieved the sealing of the cathode plane of described chip (9)；Gap is left between described partition (3) and the assembly being made up of described fixture one (1), fixture two (2) and chip (9); the table top (17) making described chip (9) can be corroded, and the part that described chip (9) is in addition to table top (17) is protected；The one side of the close chip (9) of described partition (3) is provided with the fin (13) of annular, described fin (13) is used for isolating the cathode plane of described chip (9), make to leave gap, to carry out the corrosion of table top (17) between described partition (3) and the assembly being made up of described fixture one (1), fixture two (2) and chip (9) simultaneously.
A kind of device for the corrosion of slug type semiconductor part chip table the most according to claim 1, it is characterized in that: at the internal edge of described fixture one (1), be provided with flange one (11), it is provided with flange two (12), described fixture one (1) and fixture two (2) at the internal edge of described fixture two (2) chip (9) that two anode surfaces dock to be carried out fastening realize the sealing of described chip (9) edge by flange one (11) and flange two (12).
A kind of device for the corrosion of slug type semiconductor part chip table the most according to claim 1 and 2, it is characterized in that: described device includes the plural assembly being made up of described fixture one (1), fixture two (2) and partition (3), to realize the corrosion of the chip (9) of multiple anode surface docking；The another side of described partition (3) is also equipped with the fin (13) of annular, for the isolation of the assembly of fixture described in two or more one (1), fixture two (2) and partition (3).
A kind of device for the corrosion of slug type semiconductor part chip table the most according to claim 3, it is characterized in that: the annular fin (13) being arranged on described (3) two faces of partition uses different diameters, for concatenating the described chip (9) of different-diameter.
5. according to a kind of device for the corrosion of slug type semiconductor part chip table described in any claim in claim 1,2 or 4, it is characterized in that: described device also includes retention mechanism and increased pressure board (4), the assembly of fixture described in two or more one (1), fixture two (2) and partition (3) is fastened between two pieces of increased pressure boards (4) by described retention mechanism, and described increased pressure board (4) contacts with described partition (3).
A kind of device for the corrosion of slug type semiconductor part chip table the most according to claim 5, it is characterized in that: described retention mechanism farther includes support plate (5), support rod (6), locating dowel (7) and pressurization screw rod (8), described locating dowel (7) is arranged on one piece of support plate (5), described pressurization screw rod (8) is arranged on another block support plate (5), and described support rod (6) is arranged between two pieces of support plates (5)；The assembly of fixture described in two or more one (1), fixture two (2) and partition (3) is fastened between two pieces of increased pressure boards (4) by described fastener by described locating dowel (7) and pressurization screw rod (8).
7. according to a kind of device for the corrosion of slug type semiconductor part chip table described in any claim in claim 1,2,4 or 6, it is characterised in that: described device is applied to the corrosion of slug type semiconductor part chip table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410030804.6A CN103811382B (en) | 2014-01-23 | 2014-01-23 | Device for the corrosion of slug type semiconductor part chip table |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410030804.6A CN103811382B (en) | 2014-01-23 | 2014-01-23 | Device for the corrosion of slug type semiconductor part chip table |
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| CN103811382A CN103811382A (en) | 2014-05-21 |
| CN103811382B true CN103811382B (en) | 2016-08-17 |
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| CN116564852A (en) * | 2023-05-05 | 2023-08-08 | 纳宇半导体材料(宁波)有限责任公司 | Jig for sintering interconnection and patch between semiconductor devices and method for interconnection and patch |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1813116A (en) * | 2003-07-31 | 2006-08-02 | 马特森技术公司 | Wedge-shaped window for providing a pressure differential |
| CN101123173A (en) * | 2007-09-20 | 2008-02-13 | 株洲南车时代电气股份有限公司 | Spraying and erosion local protection method and device for semiconductor part chip table |
| CN201084711Y (en) * | 2007-09-20 | 2008-07-09 | 株洲南车时代电气股份有限公司 | A chip-gripping device for a serial-press corrosion of semiconductor chips |
| CN101217108A (en) * | 2008-01-02 | 2008-07-09 | 株洲南车时代电气股份有限公司 | A chip table top etching device |
| CN201126816Y (en) * | 2007-12-25 | 2008-10-01 | 中国电子科技集团公司第四十五研究所 | Porous ceramic sheet-holding table |
-
2014
- 2014-01-23 CN CN201410030804.6A patent/CN103811382B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1813116A (en) * | 2003-07-31 | 2006-08-02 | 马特森技术公司 | Wedge-shaped window for providing a pressure differential |
| CN101123173A (en) * | 2007-09-20 | 2008-02-13 | 株洲南车时代电气股份有限公司 | Spraying and erosion local protection method and device for semiconductor part chip table |
| CN201084711Y (en) * | 2007-09-20 | 2008-07-09 | 株洲南车时代电气股份有限公司 | A chip-gripping device for a serial-press corrosion of semiconductor chips |
| CN201126816Y (en) * | 2007-12-25 | 2008-10-01 | 中国电子科技集团公司第四十五研究所 | Porous ceramic sheet-holding table |
| CN101217108A (en) * | 2008-01-02 | 2008-07-09 | 株洲南车时代电气股份有限公司 | A chip table top etching device |
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Effective date of registration: 20201026 Address after: 412001 Room 309, floor 3, semiconductor third line office building, Tianxin hi tech park, Shifeng District, Zhuzhou City, Hunan Province Patentee after: Zhuzhou CRRC times Semiconductor Co.,Ltd. Address before: The age of 412001 in Hunan Province, Zhuzhou Shifeng District Road No. 169 Patentee before: ZHUZHOU CRRC TIMES ELECTRIC Co.,Ltd. |
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