CN103811375B - The loading/unloading unit of batch processing silicon chip and Apparatus and method for - Google Patents

The loading/unloading unit of batch processing silicon chip and Apparatus and method for Download PDF

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CN103811375B
CN103811375B CN201210442167.4A CN201210442167A CN103811375B CN 103811375 B CN103811375 B CN 103811375B CN 201210442167 A CN201210442167 A CN 201210442167A CN 103811375 B CN103811375 B CN 103811375B
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silicon chip
batch
conveyer belt
feeding conveyer
loading
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CN103811375A (en
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高鹏
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Beijing North Microelectronics Co Ltd
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Beijing North Microelectronics Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/6776Continuous loading and unloading into and out of a processing chamber, e.g. transporting belts within processing chambers
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/52Controlling or regulating the coating process

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
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  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
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  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
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  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

The present invention discloses loading/unloading unit and the Apparatus and method for of a kind of batch processing silicon chip.Wherein first method comprises the steps:, after detection atmospheric mechanical hand in real time creates " taking sheet failure " or the error information of " box enters time-out ", generates the warning message of feeding platform belonging to present lot silicon chip;Then, control atmospheric mechanical hand according to warning message and stop capturing the operation of default batch silicon chip from the magazine of feeding platform belonging to described present lot silicon chip, and transfer the silicon chip counting loading transmission on feeding conveyer belt;Calculate residue on current feeding conveyer belt and preset the silicon chip quantity of batch, and be all loaded processing by the residue silicon chip of the default batch on current feeding conveyer belt according to result of calculation.The loading/unloading unit of batch processing silicon chip that the present invention provides and Apparatus and method for, while ensureing being smoothed out of charge and discharge operations of whole batch processed silicon chip, also achieve the automatization of batch processing silicon chip.

Description

The loading/unloading unit of batch processing silicon chip and Apparatus and method for
Technical field
The present invention relates to microelectronics technology, particularly relate to the loading/unloading unit of a kind of batch processing silicon chip And Apparatus and method for.
Background technology
In crystal silicon solar batteries manufacture process, plasma enhanced chemical vapor deposition equipment (Plasma Enhanced Chemical Vapor Deposition, PECVD) use In-line(line style more) hardware Version, uses the mesh reaching high efficiency, high yield at line style coating technique (In-line PECVD) 's.
The frame for movement of In-line PECVD is broadly divided into: handling microscope carrier, preheating cavity, process cavity, cooling chamber, Cooling stage and support plate recovery system.As it is shown in figure 1, the technological process of In-line PECVD is:
1), after handling microscope carrier load, support plate is transferred to preheating cavity;
2) silicon chip and support plate are heated by preheating cavity, after be transferred to process cavity;
3) process cavity carries out coating process to silicon chip, after be transferred to cooling chamber;
4) support plate is after cooling chamber and cooling stage cool down, and passes handling microscope carrier back via support plate recovery system, unloads In flakes, and prepare former of next round load by being transferred to relieving platform
, being filled with silicon chip in magazine 10 is 25 in prior art, in loading/unloading unit (as shown in Figure 2), Completed the most a piece of from magazine, silicon chip to be put into feeding conveyer belt 30 by atmospheric mechanical hand 20, and pass through gantry Frame 40 by the silicon slice loading of pretreatment to support plate 50, the finished product silicon chip that during unloading, portal frame 40 will process It is unloaded to from support plate on blanking conveyer belt 60.When existing loading/unloading unit carries out loading and unloading, each batch At the end of run into and all caused by the one of which situation in following two situation when system reports an error:
Situation one: " box enters time-out ", is filled with 25 in magazine, but after being removed last silicon chip in magazine, Empty magazine spreads out of, and technical staff should put into the silicon chip of a new batch in time.But because of beyond default time Between, therefore system produces " box enters time-out " mistake and shuts down.
Situation two: " taking sheet failure ", magazine is discontented with 25, when magazine deposits discontented 25 in advance, greatly Gas mechanical hand get the most a piece of after be still discontented with 25, at this moment atmospheric mechanical hand still performs to take sheet operation, but because of Not having follow-up silicon chip, the loading and unloading work of whole batch silicon chip will be shut down and be have impact on to system because taking sheet failure Make.
Now, report to the police due to both obstructive types and cannot be carried out automatic flow, quit work, and pass through skill Art personnel manually perform and include moving back the operations (as shown in Figure 3) such as box, fluctuating plate and support plate transmission, technology people Member is manually when processing that silicon chip system reports an error in batches, and situation processes that operation is the most complicated and efficiency is the lowest, behaviour Making the most loaded down with trivial details, not only step is many, and difficulty is big, especially for operating unfamiliar technical staff People, it is easy to maloperation or leakage operation occur, causes unnecessary loss, in some instances it may even be possible to dangerous generation, Efficiency is the lowest.
Generally speaking, loading/unloading unit and the method for existing batch processing silicon chip is processing batch silicon chip feeding Terminate and produce when reporting an error, mainly to face problems with, one, treatment effeciency low, process operation be all the completeest Becoming, and operating procedure is various, the impact for efficiency and production capacity is the biggest.Two, error rate is high, right Operate unfamiliar technical staff, it is easy to maloperation or leakage operation occur.Therefore for prior art, Carry out full automatic working the most efficiently when batch terminates to report an error, improve the handling of batch processed silicon chip Carry efficiency, it is achieved the loading and unloading of batch processing silicon chip achieve electronization and automatization is the most scabrous asking Topic.
Summary of the invention
The invention provides loading/unloading unit and the Apparatus and method for of a kind of batch processing silicon chip, it can be timely Process the problem that system reports an error when the loading and unloading of existing batch processing silicon chip operate.
Based on described problem, the loading/unloading unit of a kind of batch processing silicon chip that the present invention provides and equipment and side Method, wherein:
The loading/unloading unit of batch processing silicon chip, is applied to plasma enhanced chemical vapor deposition equipment, bag Include feeding platform, magazine, feeding conveyer belt, atmospheric mechanical hand, also include the control for controlling loading/unloading unit System processed, described control system includes feeding module, monitoring modular, transfers module, judging treatmenting module, Wherein:
Described feeding module, captures the silicon chip of described default batch also for controlling atmospheric mechanical hand from magazine It is put on feeding conveyer belt and counts and take sheet quantity, and to having been loaded into the silicon chip of transmission on feeding conveyer belt Count shipped quantity;
Described monitoring modular, for obtaining the predetermined number of the default batch silicon chip in magazine, and detects in real time Whether atmospheric mechanical hand produces " take sheet failure " or the error information of " box enters time-out ", reports an error letter in generation The warning message of feeding platform belonging to described present lot silicon chip is generated during breath;
Described transfer module, stop from described current batch for controlling atmospheric mechanical hand according to described warning message The magazine of feeding platform belonging to secondary silicon chip captures the operation presetting batch silicon chip, and transfers dress on feeding conveyer belt Carry the silicon chip counting transmitted;
Described judging treatmenting module, presets batch silicon chip counting and feeding conveyer belt for capturing according to mechanical hand On the silicon chip counting that the has been loaded into residue that calculates on current feeding conveyer belt preset the silicon chip quantity of batch, and According to result of calculation, the residue silicon chip of the default batch on current feeding conveyer belt is processed.
It is preferred that as a kind of embodiment.Described judging treatmenting module includes that calculating processes submodule, Wherein:
Described calculating processes submodule, and on the described current feeding conveyer belt calculated, residue presets batch Silicon chip quantity captures default batch silicon chip counting equal to mechanical hand and deducts the silicon chip having been loaded on feeding conveyer belt The value of counting, and result of calculation is sent to portal frame enforcement loading operation.
It is preferred that as a kind of embodiment.Described judging treatmenting module includes that loading processes submodule, Wherein:
Described loading processes submodule, presets the silicon chip number of batch for calculating residue on current feeding conveyer belt After amount N, when often loading a remaining silicon chip on process feeding conveyer belt, N is subtracted 1, circular treatment Until counting N=0 and terminating to preset on described current feeding platform the operation that batch silicon slice loading processes.
It is preferred that as a kind of embodiment.Described control system also include position correction device, portal frame, Support plate;
Described judging treatmenting module also includes that control processes submodule, wherein:
Described control processes submodule, is used for controlling the calibration of described position correction device and remains in feeding conveyer belt The silicon chip of described default batch, and control portal frame according to calibration result and reach the correspondence on feeding conveyer belt Take sheet position, from feeding conveyer belt, capture the silicon chip remained on feeding conveyer belt of described default batch also Loading is put on support plate.
It is preferred that as a kind of embodiment.Described control system is PLC control system and HMI operation The control system of the composition of system and host computer, described PLC control system respectively with HMI operating system and upper Position machine connects;
Described host computer is work station or industrial computer.
Correspondingly, a kind of plasma enhanced chemical vapor deposition equipment that the embodiment of the present invention also provides for, bag Include the loading/unloading unit of described batch processing silicon chip.
Correspondingly, the loading and unloading method of a kind of batch processing silicon chip that the embodiment of the present invention also provides for, use institute Stating device, the step of the loading and unloading method of described batch processing silicon chip is as follows:
Step S100, control atmospheric mechanical hand capture the silicon chip of described default batch from magazine and are put into feeding On conveyer belt and count and take sheet quantity, and the silicon chip having been loaded into transmitting on feeding conveyer belt is counted fill Carry quantity;
Step S200, the predetermined number of the default batch silicon chip obtained in magazine, and detect atmospheric mechanical in real time Whether hands produces " taking sheet failure " or the error information of " box enters time-out ", generates when producing error information The warning message of feeding platform belonging to described present lot silicon chip;
Step S300, according to described warning message control atmospheric mechanical hand stop from described present lot silicon chip institute Belong to and the magazine of feeding platform captures the operation presetting batch silicon chip, and transfer what loading on feeding conveyer belt transmitted Silicon chip counts;
Step S400, capture according to mechanical hand to preset and have been loaded on batch silicon chip counting and feeding conveyer belt Silicon chip counting calculates the residue on current feeding conveyer belt and presets the silicon chip quantity of batch, and according to result of calculation The residue silicon chip of the default batch on current feeding conveyer belt is processed.
It is preferred that as a kind of embodiment.In described step S400, the current feeding of described calculating passes Send the residue on band to preset the silicon chip quantity of batch, comprise the steps:
Step S410, calculating described current feeding conveyer belt on residue preset the silicon chip quantity of batch equal to machine Tool hands captures default batch silicon chip counting and deducts the value of the silicon chip counting having been loaded on feeding conveyer belt, and will Result of calculation is sent to portal frame and implements loading operation.
It is preferred that as a kind of embodiment.In described step S400, described according to result of calculation pair The residue silicon chip of the default batch on current feeding conveyer belt processes, and comprises the steps:
Step S420, calculate on current feeding conveyer belt silicon chip quantity N that residue presets batch after, often filling When load processes a remaining silicon chip on feeding conveyer belt, subtracting 1 by N, circular treatment is until counting N=0 also Terminate to preset on described current feeding platform the operation that batch silicon slice loading processes.
It is preferred that as a kind of embodiment.In described step S400, described according to result of calculation pair The residue silicon chip of the default batch on current feeding conveyer belt processes, and also comprises the steps:
Step S430, control described position correction device calibrate remain on feeding conveyer belt described default batch Silicon chip, and control portal frame according to calibration result and reach the correspondence on feeding conveyer belt and take sheet position, from upper Support plate put into by the silicon chip remained on feeding conveyer belt the loading that capture described default batch on material conveyer belt On.
The beneficial effect comprise that
The loading/unloading unit of a kind of batch processing silicon chip that the present invention provides and Apparatus and method for, the present invention is carried The loading and unloading method of the batch processing silicon chip of confession achieves automatization's emergency processing, can ensure whole batch processed Being smoothed out of the charge and discharge operations of silicon chip.Wherein, loading/unloading unit is carried out certainly by the present invention by control system Dynamicization control, when system certain batch silicon chip process terminate and produce report an error time, control system can be controlled automatically System coordinates each device and module and proceeds, it is to avoid the production line stop accident caused because reporting an error, and Decrease the use of human cost, the handling of batch processed silicon chip can also be improved simultaneously by Automated condtrol Carry efficiency.Generally speaking, compared with prior art, the loading and unloading of batch processing silicon chip provided by the present invention Method can improve the loading and unloading efficiency of batch processed silicon chip, can make up semi-automatic loading and dumping system simultaneously Deficiency, make the loading and unloading of batch processing silicon chip achieve electronization and automatization.
Accompanying drawing explanation
Fig. 1 is the system signal of each structure framework of plant equipment of In-line PECVD of the prior art Figure;
Fig. 2 is that automatic loading and unloading of the prior art carries the system simplified schematic diagram put;
Fig. 3 is that automatic loading and unloading of the prior art carries to put and terminates and report an error carrying out present lot silicon chip process Time manual mode process operational flowchart;
Fig. 4 is the loading/unloading unit of loading/unloading unit one specific embodiment that the present invention is directed to batch processing silicon chip Structural representation;
Fig. 5 is the loading and unloading method specific embodiment when process reports an error that the present invention is directed to batch processing silicon chip Schematic flow sheet;
Fig. 6 be the present invention is directed to batch processing silicon chip loading and unloading method process because of " box enters time-out " report an error time The operational flowchart of one specific embodiment one.
Detailed description of the invention
Below in conjunction with Figure of description, loading/unloading unit and the Apparatus and method for batch processing silicon chip of the present invention Detailed description of the invention illustrate.
Embodiments provide loading/unloading unit and the Apparatus and method for of a kind of batch processing silicon chip, this Bright embodiment, as a example by portal frame loading/unloading unit, illustrates the technical scheme of the embodiment of the present invention, but it should say Bright, it is not limited to this.
The loading/unloading unit for batch processing silicon chip that the embodiment of the present invention provides, as shown in Figure 4, application On plasma enhanced chemical vapor deposition equipment, including the multiple feedings for providing untreated silicon chip Platform (not shown) and multiple blanking bench (not shown) storing finished product silicon chip, be used for storing default batch processed The magazine 1 of silicon chip, for capture preset in described magazine batch silicon chip to the atmospheric mechanical on feeding conveyer belt Hands 2, for transmitting feeding conveyer belt 3 and the blanking conveyer belt (not shown) of silicon chip, is used for calibrating feeding and passes Send the position correction device 4 of band upper position of silicon wafer calibration, for from the dragon loaded and unloaded on support plate by default batch silicon chip Door frame 5, when portal frame takes sheet with on conveyer belt to take sheet position corresponding, also include entering pre-for carrying silicon chip The support plate 6 in hot chamber, feeding conveyer belt and feeding platform one_to_one corresponding, blanking conveyer belt and blanking bench one_to_one corresponding, With the control system 7 for controlling loading/unloading unit, control system 7 includes feeding module 70, monitoring modular 71, module 72, judging treatmenting module 73 are transferred, wherein:
Described feeding module 70, captures the silicon chip of described default batch for controlling atmospheric mechanical hand from magazine And be put on feeding conveyer belt and count and take sheet quantity, and to having been loaded into the silicon that transmits on feeding conveyer belt Sheet counts shipped quantity;
Described monitoring modular 71, for obtaining the predetermined number of the default batch silicon chip in magazine, and examines in real time Survey whether atmospheric mechanical hand produces " taking sheet failure " or the error information of " box enters time-out ", report an error in generation The warning message of feeding platform belonging to described present lot silicon chip is generated during information;
Described transfer module 72, for according to described warning message control atmospheric mechanical hand stop from described currently The magazine of feeding platform belonging to batch silicon chip captures the operation presetting batch silicon chip, and transfers on feeding conveyer belt Load the silicon chip counting transmitted;
Described judging treatmenting module 73, presets batch silicon chip counting and feeding transmission for capturing according to mechanical hand The residue that the silicon chip counting having been loaded on band calculates on current feeding conveyer belt presets the silicon chip quantity of batch, And according to result of calculation, the residue silicon chip of the default batch on current feeding conveyer belt is processed.
It is preferred that as a kind of embodiment.Described judging treatmenting module includes that calculating processes submodule, Wherein:
Described calculating processes submodule, presets the silicon of batch for calculating residue on described current feeding conveyer belt Sheet quantity captures default batch silicon chip counting equal to described mechanical hand and deducts the silicon having been loaded on feeding conveyer belt The value of sheet counting, and result of calculation is sent to portal frame enforcement loading operation.
It is preferred that as a kind of embodiment.Described judging treatmenting module includes that loading processes submodule, Wherein:
Described loading processes submodule, presets the silicon chip number of batch for calculating residue on current feeding conveyer belt After amount N, when often loading a remaining silicon chip on process feeding conveyer belt, N is subtracted 1, circular treatment Until counting N=0 and terminating to preset on described current feeding platform the operation that batch silicon slice loading processes.
It is preferred that as a kind of embodiment.Described control system also include position correction device, portal frame, Support plate;
Described judging treatmenting module also includes that control processes submodule, wherein:
Described control processes submodule, is used for controlling the calibration of described position correction device and remains in feeding conveyer belt The silicon chip of described default batch, and control portal frame according to calibration result and reach the correspondence on feeding conveyer belt Take sheet position, from feeding conveyer belt, capture the silicon chip remained on feeding conveyer belt of described default batch also Loading is put on support plate.
It is preferred that as a kind of embodiment.Described control system is PLC control system and HMI operation The control system of the composition of system and host computer, described PLC control system respectively with HMI operating system and upper Position machine connects;
Described host computer is work station or industrial computer.
It is preferred that as a kind of embodiment, described control system is PLC control system and HMI operation The control system of the composition of system and host computer, PLC control system respectively with HMI operating system and host computer Connect;
Host computer is work station or industrial computer.
It is preferred that as a kind of embodiment, described PLC control system include cpu central processing unit, Communication module, digital quantity I/O template, power template, cpu central processing unit respectively with communication module, number Word amount I/O template, power template connects.
Described PLC control system can perform the order to each control module by program and operate.
Further, the PLC control system in the embodiment of the present invention can use different communications protocol with upper Position machine connects, and by the serial communication of RS232, or can pass through RS485 serial communication, when with upper The serial communication of traditional D-shaped formula not only can be used, it is also possible to use suitableeer when of machine and PLC communication Close the PROFIBUS-DP communication of the two-wire of Industry Control.Selection about communications module belongs to art technology Personnel it will be appreciated that common knowledge, this is repeated no more by the embodiment of the present invention.
Correspondingly, based on same inventive concept, a kind of plasma enhancing that the embodiment of the present invention also provides for Learn vapor deposition apparatus, including the loading/unloading unit of described batch processing silicon chip.
The handling of the batch processing silicon chip in the plasma enhanced chemical vapor deposition equipment of the embodiment of the present invention Carry and put, its structure and the loading/unloading unit of the work process batch processing silicon chip above-mentioned with the embodiment of the present invention Identical, therefore, in embodiments of the present invention, the loading/unloading unit of this batch processing silicon chip is repeated no more.
Based on same inventive concept, the embodiment of the present invention additionally provides the loading and unloading side of a kind of batch processing silicon chip Method, owing to the method solves the principle of problem and the every of the loading/unloading unit of aforementioned a kind of batch processing silicon chip Functional similarity, therefore, the enforcement of the method can be realized by aforementioned means concrete function, in place of repetition not Repeat again.
The loading and unloading method of a kind of batch processing silicon chip that the embodiment of the present invention also provides for, uses described device, As it is shown in figure 5, the step of the loading and unloading method of described batch processing silicon chip is as follows:
Step S100, control atmospheric mechanical hand capture the silicon chip of described default batch from magazine and are put into feeding On conveyer belt and count and take sheet quantity, and the silicon chip having been loaded into transmitting on feeding conveyer belt is counted fill Carry quantity;
Step S200, the predetermined number of the default batch silicon chip obtained in magazine, and detect atmospheric mechanical in real time Whether hands produces " taking sheet failure " or the error information of " box enters time-out ", generates described when generation reports an error The warning message of feeding platform belonging to present lot silicon chip;
Step S300, according to described warning message control atmospheric mechanical hand stop from described present lot silicon chip institute Belong to and the magazine of feeding platform captures the operation presetting batch silicon chip, and transfer what loading on feeding conveyer belt transmitted Silicon chip counts;
Step S400, capture according to mechanical hand to preset and have been loaded on batch silicon chip counting and feeding conveyer belt Silicon chip counting calculates the residue on current feeding conveyer belt and presets the silicon chip quantity of batch, and according to result of calculation The residue silicon chip of the default batch on current feeding conveyer belt is processed.
It is preferred that as a kind of embodiment.In described step S400, the current feeding of described calculating passes Send the residue on band to preset the silicon chip quantity of batch, comprise the steps:
Step S410, calculating described current feeding conveyer belt on residue preset the silicon chip quantity of batch equal to machine Tool hands captures default batch silicon chip counting and deducts the value of the silicon chip counting having been loaded on feeding conveyer belt, and will Result of calculation is sent to portal frame and implements loading operation.
It is preferred that as a kind of embodiment.In described step S400, described according to result of calculation pair The residue silicon chip of the default batch on current feeding conveyer belt processes, and comprises the steps:
Step S420, calculate on current feeding conveyer belt silicon chip quantity N that residue presets batch after, often filling When load processes a remaining silicon chip on feeding conveyer belt, subtracting 1 by N, circular treatment is until counting N=0 also Terminate to preset on described current feeding platform the operation that batch silicon slice loading processes.
It is preferred that as a kind of embodiment.In described step S400, described according to result of calculation pair The residue silicon chip of the default batch on current feeding conveyer belt processes, and also comprises the steps:
Step S430, control described position correction device calibrate remain on feeding conveyer belt described default batch Silicon chip, and control portal frame according to calibration result and reach the correspondence on feeding conveyer belt and take sheet position, from upper Support plate put into by the silicon chip remained on feeding conveyer belt the loading that capture described default batch on material conveyer belt On.
The loading/unloading unit of the batch processing silicon chip that embodiments of the invention are provided can be real by computer program Existing.Those skilled in the art are it should be appreciated that described Module Division mode is only in numerous Module Division One, if being divided into other modules or not dividing module, as long as loading/unloading unit has described function, All should be within the protection domain of the application.
In order to loading/unloading unit and the Apparatus and method for of the batch processing silicon chip of the present invention are better described, below The plasma enhancing that act is realized by loading/unloading unit and the method for the batch processing silicon chip of the embodiment of the present invention The mistake of chemical vapor depsotition equipment (Plasma Enhanced Chemical Vapor Deposition, PECVD) The journey explanation present invention:
Embodiment one:
The present embodiment one provides loading/unloading unit and the Apparatus and method for of a kind of batch processing silicon chip, ties with feeding Illustrating as a example by after bundle, system reports an error because of " box enters time-out ", Fig. 6 is that the method for the present embodiment one is for whole The schematic flow sheet that batch silicon chip processes, comprises the steps:
S601, control atmospheric mechanical hand capture from magazine and preset the silicon chip of batch and be put on feeding conveyer belt And count, the silicon chip quantity having been loaded into transmitting on feeding conveyer belt is realized counting simultaneously;
S602, the default batch silicon chip quantity obtained in magazine, and whether detection atmospheric mechanical hand produces in real time " take sheet failure " or the error information of " box enters time-out ", after creating " box enters time-out " error information, Generate the warning message of feeding platform belonging to described present lot silicon chip;
S603, according to warning message control atmospheric mechanical hand stop from feeding platform belonging to described present lot silicon chip Magazine in capture the operation presetting batch silicon chip, and transfer the silicon chip number having loaded transmission on feeding conveyer belt Amount;
S604, according to described mechanical hand capture preset batch silicon chip counting and feeding conveyer belt on have been loaded into Silicon chip counting calculate the residue on feeding conveyer belt and preset the silicon chip quantity of batch, and according to result of calculation pair The silicon chip of the default batch on feeding conveyer belt processes;
The feeding platform reported to the police belonging to S605, disabling present lot silicon chip;
S606, control portal frame perform unloading finished product silicon chip operation, until all finished product silicon chips are completely transferred to On blanking conveyer belt;
S607, the most all feeding platforms of judgement are the most disabled;If judged result is no, then return step 601 continue executing with the batch silicon chip process operation processing other feeding platforms;If the determination result is YES, the most directly hold Row following step 608;
S608, terminate whole batch processed silicon chip loading and unloading operation.
In above-mentioned steps S602, obtain default batch silicon chip quantity in magazine information and by with PLC HMI operating system (Human Machine Interaction, the HMI) display that control system connects, passes through The predetermined number of the silicon chip of the present lot of each circular treatment of man machine interface schematic operation personnel, prompting operation Personnel put into correct silicon chip predetermined number.
It will be understood by those skilled in the art that described step S601 ~ S604 is skill provided by the present invention Art method, at the end of step S604, solves the feeding platform produced problem reported an error, subsequent step S605 ~ S608 is to explain that follow-up unloading operation will not be produced by this method in the operation tackling the process that reports an error Raw impact, therefore, the method that embodiment one is provided intactly explains the handling of whole batch processed silicon chip Carry the Automated condtrol flow process of operation.
The described device that the present invention is implemented a method provided and provided by the embodiment of the present invention divides in process When batch processing terminates and produces situation about reporting an error, it is that place should by the control of PLC control system and host computer Front batch silicon chip proceeds, it is achieved thereby that full-automatic.After generation reports an error, if feeding conveyer belt On have silicon chip, then control the calibration of position aligner and remain in the silicon chip of the default batch on feeding conveyer belt, make It can be correct arrive and corresponding take sheet position.Then control portal frame automatically silicon chip is put on support plate right In the position answered, then disable this feeding platform, without silicon chip, the most directly disable this feeding platform.So, Will not shut down because system reports an error, thus not interfere with feeding and the loading operation of all feeding platforms, the most not The unloading operation of silicon chip can be affected into.Until the most remaining new silicon chip that will carry out technique on support plate, and institute When having feeding platform the most disabled, the loading and unloading just completing whole batch silicon chip process.
Further, after control system judges that loading and unloading task is complete, will automatically perform support plate incoming The operation of preheating cavity.Then feeding platform can be lifted a ban by control system automatically, after waiting that operator puts into new magazine, New batch silicon chip loading and unloading operation starts.
The embodiment of the present invention carries out Automated condtrol by control system to loading/unloading unit, when system is at certain batch Secondary silicon chip process terminates and produces when reporting an error, and control system can automatically control each device of coordination and module continues Continuous carry out, it is to avoid the production line stop accident caused because reporting an error, and decrease the use of human cost, The loading and unloading efficiency of batch processed silicon chip can also be improved by Automated condtrol simultaneously.Generally speaking, with existing Having technology to compare, the loading and unloading method of batch processing silicon chip provided by the present invention can improve batch processed silicon The loading and unloading efficiency of sheet.The loading and unloading method of batch processing silicon chip provided by the present invention can make up and make half certainly The deficiency of dynamic makeup uninstalling system, makes the loading and unloading work of batch processing silicon chip achieve electronization and automatization.
Embodiment described above only have expressed the several embodiments of the present invention, and it describes more concrete and detailed, But therefore can not be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that, for this area Those of ordinary skill for, without departing from the inventive concept of the premise, it is also possible to make some deformation and Improving, these broadly fall into protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be with appended Claim is as the criterion.

Claims (6)

1. the loading/unloading unit of a batch processing silicon chip, it is applied to plasma enhanced chemical vapor deposition equipment, including magazine, feeding conveyer belt, atmospheric mechanical hand, it is characterized in that, also include the control system for controlling loading/unloading unit, described control system includes feeding module, monitoring modular, transfers module, judging treatmenting module, wherein:
Described feeding module, captures from magazine and presets the silicon chip of batch for controlling atmospheric mechanical hand and be put on feeding conveyer belt and count and take sheet quantity, and the silicon chip having been loaded into transmission on feeding conveyer belt is counted shipped quantity;
Described monitoring modular, the predetermined number of the default batch silicon chip in obtaining magazine, and whether detection atmospheric mechanical hand produces " taking sheet failure " or the error information of " box enters time-out " in real time, generates the warning message of feeding platform belonging to present lot silicon chip when producing error information;
Described transfer module, stop capturing from the magazine of feeding platform belonging to described present lot silicon chip preset the operation of batch silicon chip for controlling atmospheric mechanical hand according to described warning message, and transfer the silicon chip counting loading transmission on feeding conveyer belt;
Described judging treatmenting module, preset the silicon chip quantity of batch for capturing the residue preset on the silicon chip counting current feeding conveyer belt of calculating having been loaded on batch silicon chip counting and feeding conveyer belt according to mechanical hand, and according to result of calculation, the residue silicon chip of the default batch on current feeding conveyer belt is processed;
Described judging treatmenting module includes that calculating processes submodule, wherein:
Described calculating processes submodule, on the described current feeding conveyer belt of calculating, the silicon chip quantity of the default batch of residue is equal to mechanical hand crawl default batch silicon chip counting and deducts the value that the silicon chip having been loaded on feeding conveyer belt counts, and result of calculation is sent to portal frame enforcement loading operation;
Described judging treatmenting module includes that loading processes submodule, wherein:
Described loading processes submodule, after silicon chip quantity N calculating the default batch of residue on current feeding conveyer belt, when often loading a remaining silicon chip on process feeding conveyer belt, subtracting 1 by N, circular treatment is until counting N=0 and terminating to preset on described current feeding platform the operation that batch silicon slice loading processes.
The loading/unloading unit of batch processing silicon chip the most according to claim 1, it is characterised in that also include position correction device, portal frame, support plate;
Described judging treatmenting module also includes that control processes submodule, wherein:
Described control processes submodule, the silicon chip of the described default batch on feeding conveyer belt is remained in for controlling the calibration of described position correction device, and control portal frame according to calibration result and reach the correspondence on feeding conveyer belt and take sheet position, the silicon chip remained on feeding conveyer belt the loading that capture described default batch from feeding conveyer belt are put on support plate.
The loading/unloading unit of batch processing silicon chip the most according to claim 1 and 2, it is characterized in that, described control system is the control system of the composition of PLC control system and HMI operating system and host computer, and described PLC control system is connected with HMI operating system and host computer respectively;
Described host computer is work station or industrial computer.
4. a plasma enhanced chemical vapor deposition equipment, it is characterised in that include the loading/unloading unit of batch processing silicon chip as described in any one of claims 1 to 3.
5. the loading and unloading method of a batch processing silicon chip, it is characterised in that comprise the steps:
Step S100, the atmospheric mechanical hand that controls capture from magazine to be preset the silicon chip of batch and is put on feeding conveyer belt and counts and take sheet quantity, and the silicon chip having been loaded into transmission on feeding conveyer belt is counted shipped quantity;
Step S200, the predetermined number of the default batch silicon chip obtained in magazine, and whether detection atmospheric mechanical hand produces " taking sheet failure " or the error information of " box enters time-out " in real time, generates the warning message of feeding platform belonging to present lot silicon chip when producing error information;
Step S300, the atmospheric mechanical hand that controls according to described warning message stop capturing the operation presetting batch silicon chip from the magazine of feeding platform belonging to described present lot silicon chip, and transfer the silicon chip counting loading transmission on feeding conveyer belt;
Step S400, the silicon chip quantity of the default batch of residue captured according to mechanical hand on the silicon chip counting current feeding conveyer belt of calculating having been loaded on default batch silicon chip counting and feeding conveyer belt, and according to result of calculation, the residue silicon chip of the default batch on current feeding conveyer belt is processed;
In described step S400, the residue on described calculating current feeding conveyer belt presets the silicon chip quantity of batch, comprises the steps:
Step S410, calculating described current feeding conveyer belt on residue preset batch silicon chip quantity equal to mechanical hand capture preset batch silicon chip counting deduct have been loaded on feeding conveyer belt silicon chip counting value, and result of calculation is sent to portal frame implement loading operation;
In described step S400, described according to result of calculation, the residue silicon chip of the default batch on current feeding conveyer belt is processed, comprise the steps:
Step S420, calculate on current feeding conveyer belt silicon chip quantity N that residue presets batch after, when often loading a remaining silicon chip on process feeding conveyer belt, subtracting 1 by N, circular treatment is until counting N=0 and terminating to preset on described current feeding platform the operation that batch silicon slice loading processes.
The loading and unloading method of batch processing silicon chip the most according to claim 5, it is characterised in that in described step S400, described processes the residue silicon chip of the default batch on current feeding conveyer belt according to result of calculation, also comprises the steps:
Step S430, the aligner calibration of control position remain in the silicon chip of the described default batch on feeding conveyer belt, and control portal frame according to calibration result and reach the correspondence on feeding conveyer belt and take sheet position, the silicon chip remained on feeding conveyer belt the loading that capture described default batch from feeding conveyer belt are put on support plate.
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Address after: 100176 Beijing economic and Technological Development Zone, Wenchang Road, No. 8, No.

Patentee after: Beijing North China microelectronics equipment Co Ltd

Address before: 100176 Beijing economic and Technological Development Zone, Beijing, Wenchang Road, No. 8, No.

Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing