CN103811177A - Novel ceramic capacitor - Google Patents
Novel ceramic capacitor Download PDFInfo
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- CN103811177A CN103811177A CN201410087071.XA CN201410087071A CN103811177A CN 103811177 A CN103811177 A CN 103811177A CN 201410087071 A CN201410087071 A CN 201410087071A CN 103811177 A CN103811177 A CN 103811177A
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- epoxy resin
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Abstract
The invention discloses a novel ceramic capacitor and relates to an electronic component. The novel ceramic capacitor comprises a rectangular ceramic chip, a tin electrode is firmly connected with each of two opposite lateral surfaces of the ceramic chip, an epoxy resin packing layer is mounted at the outside of each of the ceramic chip and the tin electrodes, a pin is mounted on each of two tin electrodes, the cross section of each pin is rectangular, one end of each pin is firmly connected with the tin electrodes while the other end extends out of the epoxy resin packing layer, and a paint layer is respectively arranged between the ceramic chip and the epoxy resin packing layer, between the tin electrodes and the epoxy resin packing layer, and between the pins and the epoxy resin packing layer. The novel ceramic capacitor is simple in structure, is reasonable in design, is convenient to process, is capable of greatly improving the production efficiency, is large in capacitance, is suitable for such small communication equipments as mobile phone and palm computer, has good humidity resistance and is capable of preventing the outside water entering the ceramic chip in the ceramic capacitor so that the insulation resistance decrease and the undesirable voltage resistance of the ceramic capacitor due to moisture are avoided, and is practical.
Description
Technical field
The present invention relates to a kind of electronic devices and components, relate in particular to a kind of new ceramics capacitor.
Background technology
Ceramic capacitor is using pottery as dielectric capacitor, and existing ceramic capacitor generally comprises ceramic chip, pin and epoxy resin enclosed layer, and the cross section of existing pin is circular.The ceramic capacitor of this kind of structure, in the time producing, because cross section is that circular height of pin differs, cannot carry out mold pressing, therefore can only singlely weld and encapsulate, and production efficiency is lower.Most of ceramic capacitors use epoxy resin enclosed surface, after solidifying, epoxy resin enclosed layer forms shell, epoxy resin enclosed layer is by ceramic chip, electrode and a part of pin are sealed, use epoxy resin enclosed surface, can improve to a certain extent the withstand voltage of ceramic capacitor, insulation property, but due to the characteristic of epoxy resin self, the pore of the residual many perforations of meeting after it is curing, therefore ceramic capacitor is easy to make moist through after a period of time under the larger environment of humidity, steam enters ceramic chip inside, thereby cause ceramic capacitor insulation resistance to decline, proof voltage is bad, easily burn out.Now the equipment such as personal computer, mobile communication is day by day light, thin, short, little in addition, requirement to performance and function is also more and more stricter, larger to little, the capacious ceramic capacitor demand of volume, just need the ceramic capacitor that dielectric constant is higher, but dielectric constant is higher, the volume of ceramic capacitor is generally also just larger, and this is unsuitable for being applied in the small communication devices such as mobile phone, palmtop PC.
Summary of the invention
The problem existing for above-mentioned prior art, the invention provides a kind of new ceramics capacitor, simple in structure, reasonable in design, easy to process, can greatly enhance productivity, capacitance is large, is suitable for being applied in the small communication devices such as mobile phone, palmtop PC, and there is good humidity resistance, can prevent that extraneous steam from entering the ceramic chip of ceramic capacitor inside, insulation resistance decline, the proof voltage of avoiding ceramic capacitor to cause because making moist are bad, very practical.
Technical scheme of the present invention is: a kind of new ceramics capacitor, comprise ceramic chip, described ceramic chip is cuboid, ceramic chip is fixedly connected with respectively tin electrode on relative two sides, ceramic chip and tin electrode are outside equipped with epoxy resin enclosed layer, on two tin electrodes, be respectively arranged with pin, the cross section of described pin is rectangle, pin wherein one end is fixedly connected with tin electrode, the other end stretches out outside epoxy resin enclosed layer, between ceramic chip, tin electrode and pin and epoxy resin enclosed layer, is provided with skin of paint.
As preferably, described pin upper end and tin electrode welding, the thickness of described skin of paint is 5-10 micron.
As preferably, described pin adopts metal material to make.
The invention has the beneficial effects as follows: the present invention is simple in structure, reasonable in design, pin cross section is rectangle, can make the pin of ceramic capacitor be positioned on sustained height, when production, can multiple ceramic capacitors be welded and be encapsulated simultaneously by compression molding Soldered frame of ceramic capacitor, greatly improve production efficiency.Between ceramic chip, tin electrode and pin and epoxy resin enclosed layer, be provided with skin of paint, because skin of paint has the performance of good isolated steam, can stop extraneous steam to enter the ceramic chip of ceramic capacitor inside, therefore this ceramic capacitor has good humidity resistance, and insulation resistance decline, the proof voltage of avoiding ceramic capacitor to cause because making moist are bad.The present invention adopts tin electrode, can increase the dielectric constant of ceramic capacitor, makes ceramic capacitor in the situation that of small volume, produces larger capacitance, gives full play to stability and the reliability of capacitor.Be suitable for being applied in the small communication devices such as mobile phone, palmtop PC, there is good practicality.
Accompanying drawing explanation
Fig. 1 is structural representation of the present invention.
Embodiment
As one embodiment of the present invention, as shown in Figure 1, a kind of new ceramics capacitor, comprises ceramic chip 1, and described ceramic chip 1 is cuboid, ceramic chip 1 is fixedly connected with respectively tin electrode 2 on relative two sides, adopt tin electrode 2, can increase the dielectric constant of ceramic capacitor, make ceramic capacitor in the situation that of small volume, produce larger capacitance, give full play to stability and the reliability of capacitor.Be suitable for being applied in the small communication devices such as mobile phone, palmtop PC.Ceramic chip 1 and tin electrode 2 are outside equipped with epoxy resin enclosed layer 3, on two tin electrodes 2, be respectively arranged with pin 4, the cross section of described pin 4 is rectangle, can make the pin 4 of ceramic capacitor be positioned on sustained height, when production, can multiple ceramic capacitors be welded and be encapsulated simultaneously by compression molding Soldered frame of ceramic capacitor, greatly improve production efficiency.Pin 4 wherein one end is fixedly connected with tin electrode 2, the other end stretches out outside epoxy resin enclosed layer 3, between ceramic chip 1, tin electrode 2 and pin 4 and epoxy resin enclosed layer 3, be provided with skin of paint 5, as preferably, the thickness of described skin of paint 5 is 5-10 micron, and even thickness, the paint that forms skin of paint 5 adopts the paint of high temperature resistant (more than 300 ℃), insulation and environmental protection (conventionally not containing toluene, dimethylbenzene), as the CRC70 insulating varnish of U.S. Ao Sibang chemistry (China) Co., Ltd production.Skin of paint 5 has the performance of good isolated steam, can stop extraneous steam to enter the ceramic chip 1 of ceramic capacitor inside, makes ceramic capacitor have good humidity resistance, has good practicality.
In the present embodiment, as preferably, described pin 4 upper ends and tin electrode 2 weld, connect more firm, stable performance.
In the present embodiment, as preferably, described pin 4 adopts metal material to make.
Can manufacture in the steps below the present invention: first semi-finished product ceramic capacitor (made tin electrode 2 and welded pin 4 on ceramic chip 1) is dried; Then ceramic chip 1 and tin electrode 2 are immersed in to (part that now pin 4 is connected with tin electrode 2 is also immersed in paint liquid) in paint liquid, after taking-up, toast, around ceramic chip 1, tin electrode 2 and pin 4, form skin of paint 5; And then seal epoxy resin baking, and make epoxy resin cure, form epoxy resin enclosed layer 3.
Above a kind of new ceramics capacitor provided by the present invention is carried out to detailed introduction, applied specific case herein structure of the present invention and execution mode are set forth, the explanation of above embodiment is just for helping to understand structure of the present invention and core concept thereof; , for one of ordinary skill in the art, according to thought of the present invention, all will change in specific embodiments and applications, in sum, this description should not be construed as limitation of the present invention meanwhile.To be possible to change of the present invention and improvement, and can not exceed design and the scope that accessory claim can stipulate.
Claims (3)
1. a new ceramics capacitor, comprise ceramic chip, it is characterized in that: described ceramic chip is cuboid, ceramic chip is fixedly connected with respectively tin electrode on relative two sides, ceramic chip and tin electrode are outside equipped with epoxy resin enclosed layer, on two tin electrodes, be respectively arranged with pin, the cross section of described pin is rectangle, pin wherein one end is fixedly connected with tin electrode, the other end stretches out outside epoxy resin enclosed layer, between ceramic chip, tin electrode and pin and epoxy resin enclosed layer, is provided with skin of paint.
2. new ceramics capacitor according to claim 1, is characterized in that: described pin upper end and tin electrode welding, the thickness of described skin of paint is 5-10 micron.
3. new ceramics capacitor according to claim 1, is characterized in that: described pin adopts metal material to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410087071.XA CN103811177A (en) | 2014-03-11 | 2014-03-11 | Novel ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410087071.XA CN103811177A (en) | 2014-03-11 | 2014-03-11 | Novel ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103811177A true CN103811177A (en) | 2014-05-21 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410087071.XA Pending CN103811177A (en) | 2014-03-11 | 2014-03-11 | Novel ceramic capacitor |
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| CN (1) | CN103811177A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105118671A (en) * | 2015-08-31 | 2015-12-02 | 苏州斯尔特微电子有限公司 | Monomer ceramic capacitor |
| CN107579051A (en) * | 2017-10-19 | 2018-01-12 | 深圳弘远电气有限公司 | A kind of encapsulating structure |
| CN113744945A (en) * | 2021-08-02 | 2021-12-03 | 广东意杰科技有限公司 | Encapsulation method of carbon ceramic resistor |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202084436U (en) * | 2011-06-18 | 2011-12-21 | 汕头高新区松田实业有限公司 | Ceramic capacitor |
| US20120026659A1 (en) * | 2010-07-30 | 2012-02-02 | Joinset Co., Ltd. | Ceramic chip assembly |
| CN202633055U (en) * | 2012-04-17 | 2012-12-26 | 福建火炬电子科技股份有限公司 | Ceramic capacitor |
-
2014
- 2014-03-11 CN CN201410087071.XA patent/CN103811177A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20120026659A1 (en) * | 2010-07-30 | 2012-02-02 | Joinset Co., Ltd. | Ceramic chip assembly |
| CN202084436U (en) * | 2011-06-18 | 2011-12-21 | 汕头高新区松田实业有限公司 | Ceramic capacitor |
| CN202633055U (en) * | 2012-04-17 | 2012-12-26 | 福建火炬电子科技股份有限公司 | Ceramic capacitor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105118671A (en) * | 2015-08-31 | 2015-12-02 | 苏州斯尔特微电子有限公司 | Monomer ceramic capacitor |
| CN107579051A (en) * | 2017-10-19 | 2018-01-12 | 深圳弘远电气有限公司 | A kind of encapsulating structure |
| CN113744945A (en) * | 2021-08-02 | 2021-12-03 | 广东意杰科技有限公司 | Encapsulation method of carbon ceramic resistor |
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Application publication date: 20140521 |