CN202084436U - Ceramic capacitor - Google Patents
Ceramic capacitor Download PDFInfo
- Publication number
- CN202084436U CN202084436U CN2011202068956U CN201120206895U CN202084436U CN 202084436 U CN202084436 U CN 202084436U CN 2011202068956 U CN2011202068956 U CN 2011202068956U CN 201120206895 U CN201120206895 U CN 201120206895U CN 202084436 U CN202084436 U CN 202084436U
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- China
- Prior art keywords
- paint
- coated
- epoxy resin
- skin
- ceramic
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Abstract
The utility model discloses a ceramic capacitor which comprises a ceramic chip, two silver electrodes, two metal leads and an epoxy resin encapsulating layer; the two silver electrodes are respectively arranged on two sides of the ceramic chip; and the upper ends of the two metal leads are respectively welded together with the two silver electrodes. The ceramic capacitor is characterized in that a paint layer is coated on the ceramic chip and the silver electrodes; and the epoxy resin encapsulating layer is coated on the paint layer. The paint layer is firstly coated on the ceramic chip and the silver electrodes; then the epoxy resin encapsulating layer is coated on the paint layer; as the paint layer has excellent water vapour isolation performance, the ceramic capacitor has excellent humidity resistance; external water vapour can be prevented from entering the ceramic chip inside the ceramic capacitor; and the reduced insulation resistance and the bad voltage resistance of the ceramic capacitor caused by being affected by damp are avoided.
Description
Technical field
The utility model relates to capacitor, specifically, relates to a kind of ceramic capacitor.
Background technology
Ceramic capacitor is as dielectric capacitor with pottery.At present, most of ceramic capacitors use epoxy resin enclosed surface, and epoxy resin enclosed layer solidifies the back and forms shell.This ceramic capacitor generally comprises ceramic chip, two silver electrodes, two metal lead wires and epoxy resin enclosed layer, two silver electrodes are located at respectively on the two sides of ceramic chip, two metal lead wires weld together with two silver electrodes respectively, epoxy resin enclosed layer is sealed ceramic chip, silver electrode and a part of metal lead wire (being the part that metal lead wire is connected with silver electrode), is connected with circuit or other element when two metal lead wires are in part outside epoxy resin enclosed layer and are used for assembling circuit.Use epoxy resin enclosed surface, can improve withstand voltage, the insulation property of ceramic capacitor to a certain extent, but because epoxy resin self characteristics, the pore of the residual many perforations of meeting after it solidifies, therefore ceramic capacitor is being easy to make moist under the bigger environment of humidity after after a while, and steam enters ceramic chip inside, thereby causes the ceramic capacitor insulation resistance to descend, proof voltage is bad, burns out easily.
Summary of the invention
Technical problem to be solved in the utility model provides a kind of ceramic capacitor, this ceramic capacitor has good humidity resistance, can prevent that extraneous steam from entering the ceramic chip of ceramic capacitor inside, the insulation resistance of avoiding ceramic capacitor to cause because of making moist descends, proof voltage is bad.The technical scheme that adopts is as follows:
A kind of ceramic capacitor, comprise ceramic chip, two silver electrodes, two metal lead wires and epoxy resin enclosed layer, two silver electrodes are located at respectively on the two sides of ceramic chip, two metal lead wire upper ends weld together with two silver electrodes respectively, it is characterized in that: be coated with skin of paint on described ceramic chip and the silver electrode, described epoxy resin enclosed layer is coated on the skin of paint.
Usually, above-mentioned skin of paint also metal lead wire top is coated, and two metal lead wire bottoms is not coated by skin of paint except ceramic chip and silver electrode are coated fully; The skin of paint that is coated on ceramic chip and the silver electrode is coated fully by epoxy resin enclosed layer, and the skin of paint that is coated on metal lead wire top is coated (this moment, whole skin of paint was in epoxy resin enclosed layer the inside) fully by epoxy resin enclosed layer or part coats that (expose in epoxy resin enclosed layer outside the bottom that is coated on the skin of paint on metal lead wire top this moment, and preferably this part length of exposing at the skin of paint of epoxy resin enclosed layer outside is the 0.2-0.8 millimeter.When being used for assembling circuit by the part of skin of paint and epoxy resin enclosed layer coating, metal lead wire is not connected with circuit or other element.
Above-mentioned skin of paint has the performance of good isolated steam, can stop extraneous steam to enter the ceramic chip of ceramic capacitor inside; Above-mentioned epoxy resin enclosed layer (solidifying the back) forms shell, and the welding position of skin of paint, ceramic chip, silver electrode and silver electrode and metal lead wire is played a good protection.
The thickness of preferred above-mentioned skin of paint is 5-10 micron (μ m), makes skin of paint thickness even usually as far as possible.
The paint that is used to form skin of paint is insulating paint, preferentially selects the paint of high temperature resistant (as more than 300 ℃), insulation and environmental protection (not containing toluene, dimethylbenzene usually), as the CRC70 insulating varnish of U.S. Ao Sibang chemistry (China) Co., Ltd production.
Can make above-mentioned ceramic capacitor by following step: earlier semi-finished product ceramic capacitor (made silver electrode and welded metal lead wire on ceramic chip) is dried; Then ceramic chip and silver electrode are immersed in (part that this moment, metal lead wire was connected with silver electrode also is immersed in the paint liquid) in the paint liquid, toast after the taking-up, around ceramic chip and silver electrode, form skin of paint; And then seal epoxy resin and baking, and make epoxy resin cure, form epoxy resin enclosed layer (being shell).
The utility model coated epoxy resin encapsulated layer again after coating skin of paint on ceramic chip and the silver electrode, because skin of paint has the performance of good isolated steam, can stop extraneous steam to enter the ceramic chip of ceramic capacitor inside, therefore this ceramic capacitor has good humidity resistance, can prevent that extraneous steam from entering the ceramic chip of ceramic capacitor inside, the insulation resistance of avoiding ceramic capacitor to cause because of making moist descends, proof voltage is bad.
Description of drawings
Fig. 1 is the structural representation of the utility model preferred embodiment.
Embodiment
As shown in Figure 1, this ceramic capacitor comprises ceramic chip 1, two silver electrodes 2, two metal lead wires 3, skin of paint 4 and epoxy resin enclosed layers 5; Two silver electrodes 2 are located at respectively on the two sides of ceramic chip 1, and two metal lead wire 3 upper ends weld together with two silver electrodes 2 respectively; Skin of paint 4 is coated on ceramic chip 1 and the silver electrode 2; Epoxy resin enclosed layer 5 is coated on the skin of paint 4.
Skin of paint 4 also metal lead wire 3 tops are coated, and two metal lead wire 3 bottoms is not coated by skin of paint 4 except ceramic chip 1 and silver electrode 2 are coated fully; The skin of paint 4 that is coated on ceramic chip 1 and the silver electrode 2 is coated fully by epoxy resin enclosed layer 5, and the skin of paint 4 that is coated on metal lead wire 3 tops is coated by epoxy resin enclosed layer 5 part, that is to say, expose in epoxy resin enclosed layer 5 outside the bottom that is coated on the skin of paint 4 on metal lead wire 3 tops, and this part length of exposing at the skin of paint 4 of epoxy resin enclosed layer 5 outside is 0.5 millimeter.When being used for assembling circuit by the part of skin of paint 4 and epoxy resin enclosed layer 5 coating, metal lead wire 3 bottoms are not connected with circuit or other element.
The thickness of skin of paint 4 is 5-10 micron (μ m), and thickness is even.
The paint that is used to form skin of paint 4 adopts the paint of high temperature resistant (as more than 300 ℃), insulation and environmental protection (not containing toluene, dimethylbenzene usually), as the CRC70 insulating varnish of U.S. Ao Sibang chemistry (China) Co., Ltd production.
Skin of paint 4 has the performance of good isolated steam, can stop extraneous steam to enter the ceramic chip 1 of ceramic capacitor inside, makes ceramic capacitor have good humidity resistance.
Claims (3)
1. ceramic capacitor, comprise ceramic chip, two silver electrodes, two metal lead wires and epoxy resin enclosed layer, two silver electrodes are located at respectively on the two sides of ceramic chip, two metal lead wire upper ends weld together with two silver electrodes respectively, it is characterized in that: be coated with skin of paint on described ceramic chip and the silver electrode, described epoxy resin enclosed layer is coated on the skin of paint.
2. ceramic capacitor according to claim 1 is characterized in that: described skin of paint coats ceramic chip and silver electrode fully, and metal lead wire top is coated; The skin of paint that is coated on ceramic chip and the silver electrode is coated fully by epoxy resin enclosed layer, and expose in epoxy resin enclosed layer outside the bottom that is coated on the skin of paint on metal lead wire top.
3. ceramic capacitor according to claim 1 and 2 is characterized in that: the thickness of described skin of paint is the 5-10 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202068956U CN202084436U (en) | 2011-06-18 | 2011-06-18 | Ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202068956U CN202084436U (en) | 2011-06-18 | 2011-06-18 | Ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202084436U true CN202084436U (en) | 2011-12-21 |
Family
ID=45345058
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202068956U Expired - Fee Related CN202084436U (en) | 2011-06-18 | 2011-06-18 | Ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202084436U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103811177A (en) * | 2014-03-11 | 2014-05-21 | 成都市容华电子有限公司 | Novel ceramic capacitor |
| CN103854853A (en) * | 2012-12-03 | 2014-06-11 | 六和电子（江西）有限公司 | Epoxy resin one-step packaging production technology of foil-type capacitor |
| CN104579215A (en) * | 2014-12-04 | 2015-04-29 | 湖南嘉业达电子有限公司 | Method for insulation and moisture resistance of chips of suspended piezoelectric ceramic frequency device |
| CN109856899A (en) * | 2019-03-21 | 2019-06-07 | 中影光峰激光影院技术（北京）有限公司 | A kind of projection chip cooling system of super brightness projection device |
-
2011
- 2011-06-18 CN CN2011202068956U patent/CN202084436U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103854853A (en) * | 2012-12-03 | 2014-06-11 | 六和电子（江西）有限公司 | Epoxy resin one-step packaging production technology of foil-type capacitor |
| CN103811177A (en) * | 2014-03-11 | 2014-05-21 | 成都市容华电子有限公司 | Novel ceramic capacitor |
| CN104579215A (en) * | 2014-12-04 | 2015-04-29 | 湖南嘉业达电子有限公司 | Method for insulation and moisture resistance of chips of suspended piezoelectric ceramic frequency device |
| CN109856899A (en) * | 2019-03-21 | 2019-06-07 | 中影光峰激光影院技术（北京）有限公司 | A kind of projection chip cooling system of super brightness projection device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111221 Termination date: 20200618 |