CN109856899A - A kind of projection chip cooling system of super brightness projection device - Google Patents
A kind of projection chip cooling system of super brightness projection device Download PDFInfo
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- CN109856899A CN109856899A CN201910218093.8A CN201910218093A CN109856899A CN 109856899 A CN109856899 A CN 109856899A CN 201910218093 A CN201910218093 A CN 201910218093A CN 109856899 A CN109856899 A CN 109856899A
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Abstract
The invention discloses a kind of projection chip cooling systems of super brightness projection device, belong to digital projector field, including projection chip, the projection chip supporting element positioned at projection chip lower end, soaking plate, TEC, cold plate, refrigeration system pipeline, refrigeration system and projection chip radiating surface monitoring temperature point, it further include ambient temperature and humidity monitoring point and cold plate temperature monitoring point at cold plate, from TEC huyashi-chuuka (cold chinese-style noodles) on heat-transfer path, all outer drain surfaces also cover one layer of insulation waterproof material vapor projection chip radiating surface.Advantage is that the present invention can increase TEC refrigerating capacity, improve the refrigerating efficiency of cooling system, the problem of can be avoided condensation vapor again, and the waterproofs such as epoxy resin material vapor can be effectively by the huyashi-chuuka (cold chinese-style noodles) such as projection chip, TEC and air insulated, so that steam be avoided to condense on the surfaces such as projection chip and TEC.
Description
Technical field
The present invention relates to digital projector fields, more specifically to a kind of projection core of super brightness projection device
Piece cooling system.
Background technique
Crucial original part-projection chip of digital projector is a kind of high precision device.The performance of projection chip and can
It is very sensitive to temperature by property, thermoelectric cooler (TEC) active refrigeration is usually used, chip shell temperature is made to be maintained at lower temperature, example
Such as 25 DEG C, this active refrigeration device of TEC, when its cold and hot surface temperature difference is smaller, refrigerating efficiency is higher, with the cold and hot surface temperature difference
Increase, efficiency sharply declines.Therefore, for high brightness projector (luminous flux is greater than 10000 lumens), water cooling is generallyd use
System cools down the hot face TEC, its hot-face temperature is controlled in reduced levels.But the cold row of usually water-cooling system is to pass through environment
The hot-face temperature of TEC cannot be reduced under environment temperature by air come what is radiated.Such as Chinese patent
A kind of new film cooling system of CN201510209531.6, it discloses specific pipeline jointing constructions, but it does not play and avoids
The effect of condensation vapor.For super brightness projector, since projection chip heat loads on board is very big, TEC is needed cold and hot
The refrigerating capacity to match could be provided under the lesser operating condition of the temperature difference of end, active refrigeration technology will be used at this time by the hot face temperature of TEC
Degree is cooled to the temperature being close with its huyashi-chuuka (cold chinese-style noodles), when environment temperature is higher, it means that TEC hot-face temperature can be lower than environment temperature
The problem of degree, this may cause water vapor in air to condense, and lead to corrosion or other influences system reliability.
Summary of the invention
1. technical problems to be solved
Aiming at the problems existing in the prior art, the purpose of the present invention is to provide a kind of throwings of super brightness projection device
Shadow chip-cooling system, it can increase TEC refrigerating capacity, improve the refrigerating efficiency of cooling system, and can be avoided condensation vapor
The problem of.
2. technical solution
To solve the above problems, the present invention adopts the following technical scheme that.
A kind of projection chip cooling system of super brightness projection device, including projection chip, be located at projection chip lower end
Projection chip supporting element, soaking plate, TEC, cold plate, refrigeration system pipeline, refrigeration system and projection chip radiating surface temperature prison
Point is controlled, the soaking plate is located at the lower end of projection chip, and the TEC is located at the lower end of soaking plate, and the cold plate is located under TEC
End, and the cold plate left and right ends are connect with refrigeration system pipeline respectively, and the refrigeration system is arranged in sky with can be convenient
Between enough places, cold plate and connecting for refrigeration system to form a loop respectively by the refrigeration system pipeline,
The projection chip radiating surface monitoring temperature point is located at the lower end of projection chip, the projection chip of the super brightness projection device
Cooling system further includes ambient temperature and humidity monitoring point and cold plate temperature monitoring point at cold plate, and ambient temperature and humidity monitors at the cold plate
Point is located at the certain point in the air of cold plate, and the cold plate temperature monitoring point is certain point on cold plate.Advantage is that it can be with
Increase TEC refrigerating capacity, the problem of improving the refrigerating efficiency of cooling system, and can be avoided condensation vapor.
Preferably, pump, water tank, cold row and fan are generally included inside the refrigeration system.Advantage is a variety of radiating parts
The refrigeration system with the use of composition of part can quickly carry out heat exchange, realize the heat dissipation of projection chip.
Preferably, from TEC huyashi-chuuka (cold chinese-style noodles) on heat-transfer path, all outer drain surfaces cover one layer absolutely projection chip radiating surface
Hot waterproof material vapor, advantage are that the waterproof material vapor of surface covering can avoid steam solidifying on surfaces such as projection chip, cold plates
Bear water vapour.
Preferably, the insulation waterproof material vapor can be the materials such as epoxy resin.Advantage is the materials such as epoxy resin
It can be effectively by the materials such as projection chip and cold plate and air insulated, to avoid steam on the surfaces such as projection chip and cold plate
Condensation.
Preferably, it is filled with and leads between the soaking plate and the contact surface of projection chip, TEC and soaking plate, TEC and cold plate
Thermal interfacial material, advantage are that heat-conducting interface material can quickly transmit heat to cooling medium, to reach fast cooling
Result.
Preferably, the projection chip cooling system of the super brightness projection device passes through ambient temperature and humidity at cold plate first
Monitoring point detects environment temperature and relative humidity, and calculates the dew-point temperature T under current environmentdew, and temperature control target value is set
Tset, then cold plate temperature T measured by cold plate temperature monitoring pointmeasureIf | Tset-Tmeasure| < maximum allowable offset Tdiff, then
The cooling system calculates suitable temperature spot by adjusting TEC and refrigerant system capacity.Advantage is the superelevation
The projection chip cooling system of brightness projection equipment can intelligence control system according to temperature control target value TsetAdjust TEC and system
Cooling system refrigerating capacity, so that cold plate temperature is controlled in the suitable temperature point calculated according to dew-point temperature, to prevent steam solidifying
Knot.
3. beneficial effect
Compared with the prior art, the present invention has the advantages that
(1) this programme is added to ambient temperature and humidity monitoring point and cold plate temperature monitoring point at cold plate compared with the existing technology,
It may be implemented to increase TEC refrigerating capacity, the problem of improving the refrigerating efficiency of cooling system, and can be avoided condensation vapor.
(2) in the refrigeration system in this programme a variety of thermal components with the use of composition refrigeration system can quickly into
The exchange of row heat, realizes the heat dissipation of projection chip.
(3) from TEC huyashi-chuuka (cold chinese-style noodles) on heat-transfer path, all outer drain surfaces cover one projection chip radiating surface in this programme
Layer insulation waterproof material vapor, the waterproof material vapor of surface covering can avoid steam from condensing on surfaces such as projection chip, cold plates
Steam.
(4) materials such as epoxy resin in this programme can effectively by the materials such as projection chip and cold plate and air every
From so that steam be avoided to condense on the surfaces such as projection chip and cold plate.
(5) it is filled between the soaking plate and projection chip in this programme, TEC and soaking plate, TEC and the contact surface of cold plate
Heat-conducting interface material, the thermal interfacial material can quickly transmit heat to cooling medium, to reach the result of fast cooling.
(6) the control temperature system that the temperature control program in this programme can be intelligent is according to temperature control target value TsetAdjust TEC and
Refrigerant system capacity, so that cold plate temperature is controlled in the suitable temperature point calculated according to dew-point temperature, to prevent steam
Condensation.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of projection chip cooling system of the invention；
Fig. 2 is the schematic diagram of cooling system control flow of the invention；
Fig. 3 is the structural schematic diagram that projection chip component low-temperature surface of the invention covers heat insulation layer；
Figure label explanation:
201 projection chips, 202 projection chip supporting elements, 203 soaking plates, 204TEC, 205 cold plates, 206 refrigeration system pipes
Road, 207 refrigeration systems, 208 projection chip radiating surface monitoring temperature points, ambient temperature and humidity monitoring point, 210 cold plates at 209 cold plates
Monitoring temperature point, 211 insulation waterproof material vapors.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description；Obviously, described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments, is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the instruction such as term " on ", "lower", "inner", "outside", " top/bottom end "
Orientation or positional relationship be based on the orientation or positional relationship shown in the drawings, be merely for convenience of description the present invention and simplification retouch
It states, rather than the device or element of indication or suggestion meaning must have a particular orientation, be constructed and operated in a specific orientation,
Therefore it is not considered as limiting the invention.In addition, term " first ", " second " are used for description purposes only, and cannot understand
For indication or suggestion relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation " " is set
Be equipped with ", " be arranged/connect ", " connection " etc., shall be understood in a broad sense, such as " connection ", may be a fixed connection, be also possible to removable
Connection is unloaded, or is integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also be in
Between medium be indirectly connected, can be the connection inside two elements.It for the ordinary skill in the art, can be specific
Situation understands the concrete meaning of above-mentioned term in the present invention.
Embodiment:
Fig. 1 shows the embodiment of the present invention.As shown in Figure 1, a kind of projection chip of super brightness projection device is cooling
System, including projection chip 201, the projection chip supporting element 202 positioned at projection chip lower end, soaking plate 203, TEC204, cold
Plate 205, refrigeration system pipeline 206, refrigeration system 207 and projection chip radiating surface monitoring temperature point 208, soaking plate 203 is located at
The lower end of projection chip 201, TEC204 are located at the lower end of soaking plate 203, and cold plate 205 is located at the lower end of TEC204, and cold plate
Left and right ends are connect with refrigeration system pipeline 206 respectively, and 207 left and right ends of refrigeration system connect refrigeration system pipeline 206, refrigeration
System pipeline 206 connects cold plate 205 and refrigeration system 207 to form a loop, projection chip radiating surface temperature
Monitoring point 208 is located at the lower end of projection chip 201, and the projection chip cooling system of super brightness projection device further includes at cold plate
Ambient temperature and humidity monitoring point 209 and cold plate temperature monitoring point 210, ambient temperature and humidity monitoring point 209 is located at close to cold plate at cold plate
Certain point in 205 air, cold plate temperature monitoring point 210 are certain point on cold plate 205.It is generally included inside refrigeration system 207
Compressor, throttle valve, cold row and fan.The heat-transfer path between 201 radiating surfaces from TEC204 huyashi-chuuka (cold chinese-style noodles) to projection chip in assembly
On, all outer drain surfaces also cover one layer of insulation waterproof material vapor 211.Insulation waterproof material vapor 211 can be epoxy resin etc.
Material.It is filled between soaking plate 203 and projection chip 201, TEC204 and soaking plate 203, TEC204 and the contact surface of cold plate 205
There is heat-conducting interface material.
The course of work of embodiment are as follows: heat radiates from projection chip 201 to be exported, by soaking plate 203, thermoelectric cooler
TEC204,205 shell of cold plate, pass to the coolant liquid in refrigeration system, and coolant temperature raising takes away heat, is recycled to cold row
Place carries out heat exchange with surrounding air and releases heat, and temperature is circulated again into cold plate 205 and absorbs heat, so recycles after reducing
Back and forth to achieve the purpose that cool down to projection chip 201.The projection chip cooling system of the super brightness projection device simultaneously
Environment temperature and relative humidity are detected by ambient temperature and humidity monitoring point 209 at cold plate, and calculates the dew point under current environment
Temperature Tdew, and temperature control target value T is setset, then pass through cold plate temperature monitoring point 210 and measure cold plate temperature TmeasureIf | Tset-
Tmeasure| < maximum allowable offset Tdiff, then the cooling system is calculated suitable by adjusting TEC and refrigerant system capacity
Temperature spot.Wherein temperature control target value TsetIt can be set and be higher than TdewTemperature, for example Tdew+0.5℃.Advantage is this example
Ambient temperature and humidity monitoring point and cold plate temperature monitoring point at the cold plate of middle addition, it may be implemented to increase TEC refrigerating capacity, improve cold
But the refrigerating efficiency of system, and the problem of can be avoided condensation vapor；It is passed simultaneously from TEC huyashi-chuuka (cold chinese-style noodles) to projection chip radiating surface
On hot path, one layer of insulation waterproof material vapor of all outer drain surface coverings can be effectively by materials such as projection chip and cold plates
With air insulated, thus avoid steam the surfaces such as projection chip and cold plate condense；Temperature control program can intelligence control temperature
System is according to temperature control target value TsetTEC and refrigerant system capacity are adjusted, so that cold plate temperature control is according to dew-point hygrometer
The suitable temperature point of calculating, to prevent condensation vapor.
Projection chip provided by the present invention, projection chip supporting element, TEC, soaking plate, cold plate, refrigeration system, refrigeration system
Road under the overall leadership, projection chip radiating surface monitoring temperature point, ambient temperature and humidity monitoring point and cold plate temperature monitoring point at cold plate；Project core
Piece, projection chip supporting element, TEC, soaking plate, cold plate, refrigeration system, refrigeration system pipeline, projection chip radiating surface temperature prison
Control point is existing independent structure, what installation form and connection structure were well known to the skilled person, therefore
There is no the concrete shape and connection structure between full disclosure separate part, the present invention uses external active refrigeration equipment (cold water
Machine, fluorine cool equipment etc.), refrigeration system be include pump, water tank, cold row and fan, the structure and connection type of application are equal
It is range achieved by the operator of this field for existing independent structure and connection for the prior art, for the present invention
The technical field operator general form and structure, so the present invention does not disclose one by one.
The foregoing is intended to be a preferred embodiment of the present invention；But scope of protection of the present invention is not limited thereto.
Anyone skilled in the art in the technical scope disclosed by the present invention, according to the technique and scheme of the present invention and its
It improves design and is subject to equivalent substitution or change, should be covered by the scope of protection of the present invention.
Claims (7)
1. a kind of projection chip cooling system of super brightness projection device, including projection chip (201), it is located at projection chip
(201) the projection chip supporting element (202) of lower end, soaking plate (203), TEC (204), cold plate (205), refrigeration system pipeline
(206), refrigeration system (207) and projection chip radiating surface monitoring temperature point (208), the soaking plate (203) are located at the throwing
The lower end of shadow chip (201), the TEC (204) are located at the lower end of the soaking plate (203), and the cold plate (205) is located at TEC
(204) lower end, and the cold plate (205) left and right ends are connect with refrigeration system pipeline (206) respectively, the refrigeration system
(207) left and right ends connection refrigeration system pipeline (206), the refrigeration system pipeline (206) is respectively by cold plate (205) and refrigeration
The left end of system (207) and right end connect to form a loop, the projection chip radiating surface monitoring temperature point
(208) it is located at the lower end of projection chip (201), it is characterised in that: the projection chip cooling system of the super brightness projection device
It further include ambient temperature and humidity monitoring point (209) and cold plate temperature monitoring point (210) at cold plate, ambient temperature and humidity is supervised at the cold plate
It controls point (209) and is located at the certain point in the air of cold plate (205), the cold plate temperature monitoring point (210) is on cold plate (205)
Certain point.
2. a kind of projection chip cooling system of super brightness projection device according to claim 1, it is characterised in that: institute
Stating refrigeration system (207) is active cooling systems, and Temperature of Working can be lower than environment temperature, commonly use the cold system of refrigeration system such as fluorine
System, inside generally includes the main components such as compressor, throttle valve, cold row and fan；Or cooling-water machine system, it is internal in addition to fluorine is cold
System unit further includes the water-cooling systems component such as pump, water tank.
3. a kind of projection chip cooling system of super brightness projection device according to claim 1, it is characterised in that: from
TEC (204) huyashi-chuuka (cold chinese-style noodles) is between projection chip (201) radiating surface on heat-transfer path, cold plate (205), TEC (204), soaking plate
(203), the outer drain surface of projection chip (201) also covers one layer of insulation waterproof material vapor (211).
4. a kind of projection chip cooling system of super brightness projection device according to claim 3, it is characterised in that: institute
Stating insulation waterproof material vapor (211) is epoxide resin material.
5. a kind of projection chip cooling system of super brightness projection device according to claim 1, it is characterised in that: institute
State the contact of soaking plate (203) with projection chip (201), TEC (204) and soaking plate (203), TEC (204) and cold plate (205)
Heat-conducting interface material is filled between face.
6. a kind of projection chip cooling system of super brightness projection device according to claim 1, it is characterised in that: should
The projection chip cooling system of super brightness projection device, which passes through first at cold plate ambient temperature and humidity monitoring point (209), detects environment
Temperature and relative humidity, and calculate the dew-point temperature T under current environmentdew, and temperature control target value T is setset, then pass through cold plate
Monitoring temperature point (210) measures cold plate temperature TmeasureIf | Tset-Tmeasure| < maximum allowable offset Tdiff, then the cooling system
System calculates suitable temperature spot by adjusting TEC and refrigerant system capacity.
7. a kind of projection chip cooling system of super brightness projection device according to claim 6, it is characterised in that: control
Warm target value TsetTemperature setting is higher than TdewTemperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910218093.8A CN109856899A (en) | 2019-03-21 | 2019-03-21 | A kind of projection chip cooling system of super brightness projection device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910218093.8A CN109856899A (en) | 2019-03-21 | 2019-03-21 | A kind of projection chip cooling system of super brightness projection device |
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| CN109856899A true CN109856899A (en) | 2019-06-07 |
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| CN201910218093.8A Pending CN109856899A (en) | 2019-03-21 | 2019-03-21 | A kind of projection chip cooling system of super brightness projection device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110780519A (en) * | 2019-09-29 | 2020-02-11 | 深圳市火乐科技发展有限公司 | Projector with a light source |
| CN111830769A (en) * | 2020-08-05 | 2020-10-27 | 成都极米科技股份有限公司 | A novel cooling system for DMD of projecting apparatus |
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