CN208157852U - A kind of laser diode cooling system of laser-projector - Google Patents
A kind of laser diode cooling system of laser-projector Download PDFInfo
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- CN208157852U CN208157852U CN201820633861.7U CN201820633861U CN208157852U CN 208157852 U CN208157852 U CN 208157852U CN 201820633861 U CN201820633861 U CN 201820633861U CN 208157852 U CN208157852 U CN 208157852U
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- laser
- temperature
- chilling plate
- semiconductor chilling
- heat dissipation
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Abstract
The utility model discloses a kind of laser diode cooling systems of laser-projector, including semiconductor chilling plate, heat dissipation circulating system, temperature sensor and temperature-controlling system；Heat dissipation circulating system includes colling end, radiating end, pump, circulation line and fan, and colling end, radiating end and pump connect into closed circulation channel by circulation line, and fan is close to radiating end；Heat dissipation circulating system is water-cooling heat radiating system, and circulation line is hose；The huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate is close to the laser light source mould group back side, and the colling end of heat dissipation circulating system is close in the hot face of semiconductor chilling plate；Temperature sensor is installed in laser light source mould group；Temperature sensor is connected with temperature-controlling system, and temperature-controlling system is connected with semiconductor chilling plate, pump and fan respectively.The utility model solves heat dissipation problem when laser diode power is higher in laser-projector, is of great significance to the universal of laser-projector.
Description
Technical field
The utility model relates to laser-projector manufacturing fields, more particularly, to a kind of laser two of laser-projector
Pole pipe cooling system.
Background technique
Laser projection is that frame out is transmitted using the laser beam of semiconductor laser, including red, green, blue three
Laser light source mould group is respectively prepared in redgreenblue laser by color laser, by the expansion of corresponding optical element and processing chip
Shu Houzai projects X prism and integrates three beams of laser, and the laser after integration is then transmitted to projection screen by projection objective again
On, it completes entire laser projection and shows process.Laser-projector is because its projected image is clear, coloration is high, long service life etc.
Advantage becomes existing market and falls over each other the high-tech new product that competition is released.
But the high thermal energy discharged when semiconductor laser work also limits its use, in general, semiconductor laser
The power of device can only achieve a watt grade, such as 1~2 watt, so wanting more semiconductor lasers usually to carry out array composition laser
Light source module group, however, the calorific value of entire mould group greatly increases therewith.Laser diode in semiconductor laser is to work temperature
That spends is more demanding, and some special semiconductor lasers even require operating temperature will be lower than room temperature, therefore, it is necessary to give laser
Diode provides the operating temperature stablized and be capable of accurate adjustment, just can guarantee that it exports suitable power.
Summary of the invention
The purpose of this utility model is to provide a kind of laser diode cooling systems of laser-projector, can precisely control
The operating temperature of laser diode processed.
To achieve the above object, the technical solution of the utility model is as follows：
A kind of laser diode cooling system of laser-projector, which is characterized in that followed including semiconductor chilling plate, heat dissipation
Loop system, temperature sensor and temperature-controlling system；
The heat dissipation circulating system includes colling end, radiating end, pump, circulation line and fan, and the colling end described dissipates
Hot end and described pump connect into closed circulation channel by the circulation line, and the fan is close to the radiating end；Wherein, institute
Stating circulation line is hose；The heat dissipation circulating system is the water-cooling circulatory system；
The huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate is close to the laser light source mould group back side, and the hot face of the semiconductor chilling plate is close to
The colling end of the heat dissipation circulating system；
The temperature sensor is installed in laser light source mould group；
The temperature sensor is connected with the temperature-controlling system, the temperature-controlling system respectively with the semiconductor chilling plate,
The pump is connected with the fan.
Further, the temperature-controlling system includes processing chip and control chip, and the processing chip comes from for receiving
The electric signal that the real-time detection of temperature sensor arrives, and issue and instruct to the control chip, the control chip is for opening
The semiconductor chilling plate, the pump and the fan, and adjust the stream of the refrigerating capacity of the semiconductor chilling plate, the pump
The revolving speed of amount and the fan.
Further, the temperature-controlling system includes overtemperature processing module, when the temperature that temperature sensor detects is more than to swash
When the operating temperature upper limit T of radiant mould group, overtemperature processing module is triggered, overtemperature processing module issues overtemperature alarm prompt, and
Reduce the display brightness of laser-projector, or the power supply of cutting laser-projector.
Further, between the huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate and the laser light source mould group back side, and described half
Heat-conducting silicone grease is provided between the hot face of conductor cooling piece and the colling end of the heat dissipation circulating system.
It can be seen from the above technical proposal that semiconductor chilling plate is applied to dissipating for laser light source mould group by the utility model
In heat, the heat dissipation performance of laser light source mould group is not only improved, it might even be possible to realize the operating condition for being lower than room temperature, pass through temperature control
System realizes the automatic adjustment of entire cooling system working condition, not only extends the service life of laser diode, Er Qieshi
Existing low energy consumption.
Detailed description of the invention
Fig. 1 is the structural representation of the laser diode cooling system of the laser-projector of one specific embodiment of the utility model
Figure；
In figure：1 is laser light source mould group, and 2 be semiconductor chilling plate, and 3 be colling end, and 4 be circulation line, and 5 be radiating end,
6 be fan, and 7 be pump, and 8 be temperature sensor, and A is between the huyashi-chuuka (cold chinese-style noodles) and the laser light source mould group back side of semiconductor chilling plate, and B is half
Between the hot face of conductor cooling piece and colling end.
Specific embodiment
With reference to the accompanying drawing, specific embodiment of the present utility model is described in further detail.
It should be noted that in following specific embodiments, when the embodiments of the present invention is described in detail, in order to
The structure of the utility model is clearly showed that in order to illustrate, spy does not draw to the structure in attached drawing according to general proportion, goes forward side by side
Gone partial enlargement, deformation and simplify processing, therefore, should be avoided in this, as the restriction to the utility model to understand.
The utility model uses the working principle of semiconductor chilling plate.Semiconductor chilling plate is also thermoelectric module, is
A kind of heat pump.Using the Peltier effect of semiconductor material, when the electricity that direct current is connected by two kinds of different semiconductor materials
When even, heat can be absorbed respectively at the both ends of galvanic couple and releases heat, the purpose of refrigeration may be implemented.It is that a kind of generate is born
The Refrigeration Technique of thermal resistance, the temperature difference range can be realized from 90 DEG C to 130 DEG C of negative temperature of positive temperature.Its main feature is that movement-less part,
Reliability is also relatively high.
In following specific embodiment of the present utility model, Fig. 1 is please referred to.As shown, the laser of the utility model
The laser diode cooling system of projector, including semiconductor chilling plate 2, heat dissipation circulating system, temperature sensor 8 and temperature control system
System.
Heat dissipation circulating system includes colling end 3, radiating end 5, pump 7, circulation line 4 and fan 6.Semiconductor chilling plate 2
Huyashi-chuuka (cold chinese-style noodles) is close to 1 back side of laser light source mould group, is forced to laser light source mould group refrigeration, and heat dissipation is close in the hot face of semiconductor chilling plate 2
The colling end 3 of the circulatory system, the heat of generation is conducted to heat dissipation circulating system, in order to increase heat transfer efficiency, in semiconductor system
Between cold huyashi-chuuka (cold chinese-style noodles) and the laser light source mould group back side (location A in Fig. 1), and followed with heat dissipation in the hot face of semiconductor chilling plate
(B location in Fig. 1) is coated with heat-conducting silicone grease between the colling end of loop system.
Due to the refrigeration temperature levels of semiconductor chilling plate be positive temperature 90 DEG C to 130 DEG C of negative temperature, heat dissipation cyclic system
System uses the water-cooling circulatory system.Cooling water in 7 driving circulation line of pump is recycled, and takes away heat from colling end,
Heat is discharged at radiating end 5, cooling water after cooling returns colling end, cycle operation.In order to enhance radiating efficiency, radiating end can
To increase the existing radiator structure such as radiating fin, protrusion.Fan can also be increased in radiating end, further strengthen radiating efficiency.
It can also be by adjusting the flow of pump and the rotational speed regulation radiating efficiency of fan.
In order to keep layout of the cooling system in laser-projector more reasonable, more compact structure preferably sets circulation line
It is set to hose, therefore, radiating end can be laid out in any suitable position.
In order to be precisely controlled the temperature of laser light source mould group, the utility model further includes temperature-controlling system, including processing chip
With control chip, processing chip issues instruction for receiving the electric signal from temperature sensor, and to control chip, controls core
Piece for opening the semiconductor chilling plate, the pump and the fan, and adjust the semiconductor chilling plate refrigerating capacity,
The revolving speed of the flow of the pump and the fan.Specifically, warm spot mounting temperature sensor, moment are adopted in laser light source mould group
The temperature of laser light source mould group is acquired, the temperature of acquisition is converted into electric signal and is sent to processing chip, and processing chip passes through pre-
If program, control chip is sent for analytic signal according to temperature signal, control chip links semiconductor chilling plate, pump and wind
Fan can control the switch and refrigerating capacity of semiconductor chilling plate according to the analytic signal of processing chip, and pump capacity and fan turn
Speed.
One specific works mode of temperature-controlling system includes the following steps：
1, laser light source mould group, which shines, starts to work, and generates heat.
2, by temperature sensor, processing chip obtains temperature signal, just when starting, since temperature is less high, at this time to
It controls chip and issues instruction, can only start water pump and fan.
3, laser light source mould group power continues to increase, and handles chip by temperature sensor and detects laser light source mould group temperature
When degree raising reaches laser light source mould group operating temperature upper limit T, at this point, processing chip, which can control chip, issues instruction, starting
Semiconductor chilling plate carries out forced refrigeration, and increases pump capacity and rotation speed of the fan according to data with existing model.
4, it is repeatedly exported and feedback regulation, stablizes temperature to normal operating conditions.
Temperature-controlling system further includes overtemperature processing module, when the temperature that temperature sensor detects is more than laser light source mould group
When operating temperature upper limit T, overtemperature processing module is triggered, overtemperature processing module issues super by modes such as prompt tone, prompt
Warm warning note, meanwhile, if the display brightness of laser-projector is too high, force the display brightness for reducing laser-projector, drop
The power of low laser light source mould group can be with the electricity of force disconnect laser-projector if reducing brightness is still unable to satisfy requirement
Source avoids damage laser-projector.
By temperature-controlling system, it can achieve and laser light source module temperature is precisely controlled, keep laser diode most
Good working condition, projected image is apparent, and prolongs the service life.
When laser-projector is colour projection, three color laser light source mould group of red, green, blue, different laser are generally included
Under light source module group and different configuration states, operating temperature upper limit T is different, and operating temperature upper limit T is as the case may be
Specific setting.Since red laser light source module group is to temperature requirement height, semiconductor chilling plate is generally arranged at red laser
In the cooling system of light source module group, but it is not limited to red diodes and semiconductor chilling plate can be used.
The preferable specific embodiment of the above, only the utility model, but the protection scope of the utility model is not
It is confined to this, anyone skilled in the art is within the technical scope disclosed by the utility model, practical according to this
Novel technical solution and its inventive concept is subject to equivalent substitution or change, should all cover the protection scope of the utility model it
It is interior.
Claims (4)
1. a kind of laser diode cooling system of laser-projector, which is characterized in that including semiconductor chilling plate, heat dissipation circulation
System, temperature sensor and temperature-controlling system；
The heat dissipation circulating system includes colling end, radiating end, pump, circulation line and fan, the colling end, the radiating end
Closed circulation channel is connected by the circulation line with the pump, the fan is close to the radiating end；Wherein, described to follow
Endless tube road is hose；The heat dissipation circulating system is the water-cooling circulatory system；
The huyashi-chuuka (cold chinese-style noodles) of the semiconductor chilling plate is close to the laser light source mould group back side, described in the hot face of the semiconductor chilling plate is close to
The colling end of heat dissipation circulating system；
The temperature sensor is installed in laser light source mould group；
The temperature sensor is connected with the temperature-controlling system, the temperature-controlling system respectively with the semiconductor chilling plate, described
Pump is connected with the fan.
2. the laser diode cooling system of laser-projector according to claim 1, which is characterized in that the temperature control system
System includes processing chip and control chip, and the processing chip is for receiving the telecommunications that the real-time detection from temperature sensor arrives
Number, and to the control chip issue instruct, the control chip for open the semiconductor chilling plate, it is described pump and it is described
Fan, and adjust refrigerating capacity, the flow of the pump and the revolving speed of the fan of the semiconductor chilling plate.
3. the laser diode cooling system of laser-projector according to claim 1, which is characterized in that the temperature control system
System includes overtemperature processing module, when the temperature that temperature sensor detects is more than the operating temperature upper limit T of laser light source mould group,
Overtemperature processing module is triggered, overtemperature processing module issues overtemperature alarm prompt, and reduces the display brightness of laser-projector, or cut
The power supply of disconnected laser-projector.
4. the laser diode cooling system of laser-projector according to claim 1, which is characterized in that partly led described
Between the huyashi-chuuka (cold chinese-style noodles) and the laser light source mould group back side of body cooling piece, and the semiconductor chilling plate hot face with it is described heat dissipation follow
Heat-conducting silicone grease is provided between the colling end of loop system.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820633861.7U CN208157852U (en) | 2018-04-29 | 2018-04-29 | A kind of laser diode cooling system of laser-projector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820633861.7U CN208157852U (en) | 2018-04-29 | 2018-04-29 | A kind of laser diode cooling system of laser-projector |
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| Publication Number | Publication Date |
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| CN208157852U true CN208157852U (en) | 2018-11-27 |
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| CN201820633861.7U Active CN208157852U (en) | 2018-04-29 | 2018-04-29 | A kind of laser diode cooling system of laser-projector |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109856899A (en) * | 2019-03-21 | 2019-06-07 | 中影光峰激光影院技术（北京）有限公司 | A kind of projection chip cooling system of super brightness projection device |
| CN110262588A (en) * | 2019-07-04 | 2019-09-20 | 歌尔股份有限公司 | Temprature control method, control system and computer readable storage medium |
| CN110609393A (en) * | 2019-09-23 | 2019-12-24 | 山西傲维光视光电科技有限公司 | Laser light source system for balancing service life of laser and eliminating speckles for cinema |
| CN113589634A (en) * | 2021-08-10 | 2021-11-02 | 吉林省钜鸿智能技术有限公司 | High-efficient cooling LCOS miniature projecting apparatus |
| CN114755879A (en) * | 2022-03-30 | 2022-07-15 | 中国计量大学 | Temperature control and noise reduction system for high-power laser projector |
-
2018
- 2018-04-29 CN CN201820633861.7U patent/CN208157852U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109856899A (en) * | 2019-03-21 | 2019-06-07 | 中影光峰激光影院技术（北京）有限公司 | A kind of projection chip cooling system of super brightness projection device |
| CN110262588A (en) * | 2019-07-04 | 2019-09-20 | 歌尔股份有限公司 | Temprature control method, control system and computer readable storage medium |
| CN110609393A (en) * | 2019-09-23 | 2019-12-24 | 山西傲维光视光电科技有限公司 | Laser light source system for balancing service life of laser and eliminating speckles for cinema |
| CN113589634A (en) * | 2021-08-10 | 2021-11-02 | 吉林省钜鸿智能技术有限公司 | High-efficient cooling LCOS miniature projecting apparatus |
| CN114755879A (en) * | 2022-03-30 | 2022-07-15 | 中国计量大学 | Temperature control and noise reduction system for high-power laser projector |
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