CN113589634A - High-efficient cooling LCOS miniature projecting apparatus - Google Patents
High-efficient cooling LCOS miniature projecting apparatus Download PDFInfo
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- CN113589634A CN113589634A CN202110913007.2A CN202110913007A CN113589634A CN 113589634 A CN113589634 A CN 113589634A CN 202110913007 A CN202110913007 A CN 202110913007A CN 113589634 A CN113589634 A CN 113589634A
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- heat
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- heat dissipation
- lcos
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/005—Projectors using an electronic spatial light modulator but not peculiar thereto
- G03B21/006—Projectors using an electronic spatial light modulator but not peculiar thereto using LCD's
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- General Physics & Mathematics (AREA)
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Abstract
The invention relates to an efficient cooling LCOS miniature projector, and belongs to the technical field of LCOS miniature projectors. The problems of low cooling efficiency and high noise of the cooling method of the LCOS miniature projector in the prior art are solved. The invention relates to an efficient cooling LCOS miniature projector, which comprises a power supply, a light source, a semiconductor refrigerating sheet, a radiating piece and a sealing sheet; wherein, the light source is a light source plate; the power supply supplies power to the light source and the semiconductor refrigerating sheet; the cold end face of the semiconductor refrigeration sheet is fixed on the back face of the light source through the aligned sticking of the edge of the first heat-conducting silica gel layer; the heat radiating piece is fixed on the hot end surface of the semiconductor refrigerating piece through a second heat conducting silica gel layer in a sticking mode; the front face of the sealing sheet is fixed on the back face of the heat dissipation member. This LCOS miniature projecting apparatus directly sets up the cooling of semiconductor refrigeration piece on the light source, and cooperates the radiating piece to keep the difference in temperature of semiconductor refrigeration piece cold junction and hot junction, and the cooling efficiency is high, can keep the continuous stable work of projecting apparatus, and noiselessness.
Description
Technical Field
The invention belongs to the technical field of LCOS miniature projectors, and particularly relates to an efficient cooling LCOS miniature projector.
Background
LCOS (Liquid Crystal on Silicon ) is a reflective Liquid Crystal display device. The LCOS generally includes a silicon substrate with MOS transistors, a first alignment layer, a liquid crystal layer, a second alignment layer, and an ITO glass substrate, which are sequentially disposed from top to bottom. Compared with the transmission LCD and the DLP, the LCOS has the characteristics of high light utilization efficiency, small volume, high resolution, high aperture ratio, mature manufacturing technology and the like, can easily realize high resolution and sufficient color expression, and has good application prospect in the aspects of video glasses and micro projectors.
The structure of the LCOS micro projector mainly includes a backlight, an LCOS, and an optical projection system. The projection process is as follows: the light emitted by the backlight enters the LCOS, the liquid crystal screen is modulated by liquid crystal molecules to control a display picture to be reflected through a mirror layer on a silicon chip to form a projection picture, but the projector always has a requirement on the brightness of a projected image when in use, so that the requirement on the brightness of the backlight is high. The backlight source must generate a large amount of heat to achieve high brightness, which causes heat dissipation. The pico-projector also typically needs to be provided with a cooling system. In the prior art, an air cooling method is usually adopted to reduce the heat of a backlight source, but the cooling efficiency of the cooling method is low, so that the temperature in a projector is often too high, and the problems that a light-emitting device and an LCOS (liquid crystal on silicon) rapidly lose efficacy or work is unstable and the like are caused, and the use effect of a product is influenced due to large noise of a fan.
Disclosure of Invention
The invention provides an efficient cooling LCOS miniature projector, aiming at solving the problems of lower cooling efficiency and high noise of a cooling method of the LCOS miniature projector in the prior art.
The technical scheme adopted by the invention for solving the technical problems is as follows.
The invention provides a high-efficiency cooling LCOS miniature projector, which comprises a power supply, a light source, a semiconductor refrigerating sheet, a heat radiating member and a sealing sheet, wherein the semiconductor refrigerating sheet is arranged on the semiconductor refrigerating sheet;
the light source is a light source plate;
the power supply supplies power to the light source and the semiconductor refrigerating sheet;
the outer contour dimension of the semiconductor refrigeration piece is the same as that of the light source, and the cold end face of the semiconductor refrigeration piece is fixed on the back face of the light source through the aligned sticking of the edge of the first heat-conducting silica gel layer;
the heat dissipation piece is of a flat plate structure, the size of the outer contour of the heat dissipation piece is 1.5-2.5 times of that of the outer contour of the semiconductor refrigeration piece, the heat dissipation piece is fixed on the hot end face of the semiconductor refrigeration piece through a second heat conduction silica gel layer in a sticking mode, and the heat dissipation piece and the semiconductor refrigeration piece are coaxial; the back surface of the heat dissipation part is uniformly provided with a plurality of grooves which are arranged in parallel along the axial direction to form a first heat dissipation fin, the inner wall and the bottom of each groove are provided with a plurality of micron-sized hole structures, phase-change gel is filled in each groove, and the phase-change gel absorbs heat when the ambient temperature is higher than a set temperature and releases heat when the ambient temperature is lower than the set temperature; a plurality of first through grooves are uniformly distributed at the position where the front surface of the heat radiating piece is contacted with the second heat conducting silica gel layer, the plurality of first through grooves are arranged in parallel along the axial direction to form a second heat radiating fin, a plurality of micron-sized hole structures are processed on the side wall and the bottom of each first through groove, and heat conducting silica gel is filled in each first through groove; a plurality of second through grooves are formed in the side face of the heat dissipation piece and are perpendicular to the axial direction and arranged in parallel to form third heat dissipation fins; the heat dissipation piece is made of copper;
the size of the outer contour of the sealing sheet is the same as that of the outer contour of the heat dissipation member, the front surface of the sealing sheet is fixed on the back surface of the heat dissipation member, the phase change gel is sealed in the first through groove, and the back surface of the sealing sheet is provided with a fourth heat dissipation fin; the material of the sealing sheet and the fourth heat dissipation fin is copper.
Furthermore, the LCOS miniature projector with high-efficiency cooling also comprises a controller and a temperature sensor.
The temperature sensor is fixed on the light source, collects the temperature of the light source in real time and transmits a temperature signal to the controller;
the controller is connected with the temperature sensor and the semiconductor refrigerating piece, receives a temperature signal acquired by the temperature sensor and judges whether the temperature is higher than a set temperature or not, if the temperature is higher than the set temperature, the semiconductor refrigerating piece is controlled to start working, and if the temperature is equal to or lower than the set temperature, the semiconductor refrigerating piece is controlled to stop working.
Further, the minimum thickness of the first heat-conducting silica gel layer and the second heat-conducting silica gel layer is 0.15 mm;
furthermore, the second heat-conducting silica gel layer and the first heat-conducting silica gel in the through groove are integrally formed.
Furthermore, the thickness of each first radiating fin, each second radiating fin and each third radiating fin is 0.05-0.2mm, and the interval between each adjacent first radiating fin, each adjacent second radiating fin and each adjacent third radiating fin is 0.1-0.2 mm.
Further, the volume of the micron-sized porous structure on each first radiator fin does not exceed 50% of the total volume of the first radiator fins; the volume of the micro-scale porous structures on each second fin is no more than 50% of the total volume of the second fin.
Further, the groove depth of the groove is 45-50% of the thickness of the heat dissipation piece; the depth of the first through groove is 20-30% of the thickness of the heat dissipation piece; the depth of the second through groove is 15% -25% of the height of the heat dissipation piece.
Further, the width of the heat dissipation piece is 1.5-2 times of the thickness of the semiconductor refrigeration piece.
Further, the sealing sheet and the heat dissipation member are fixed through bolts or welding.
Further, the thickness of the sealing piece is 0.2-1 mm.
The principle of the invention is as follows: the semiconductor refrigerating sheet contains an N-type semiconductor material and a P-type semiconductor material, when a thermocouple formed by connecting the N-type semiconductor material and the P-type semiconductor material has current to pass through, heat transfer can be generated between two ends, and the heat can be transferred from one end to the other end, so that temperature difference is generated to form a cold and hot end. The semiconductor refrigerating sheet is directly fixed on the light source of the LCOS projector, and the refrigerating sheet is directly contacted with the heat source, so that the temperature of the light source can be effectively reduced. In addition, because the semiconductor has resistance, when current passes through the semiconductor, heat is generated, and the heat between the two polar plates can be reversely transferred through air and the semiconductor material, when the two heat transfer quantities are equal, the forward and reverse heat transfer are mutually counteracted, and the temperature of the cold end and the hot end can not be continuously changed. Therefore, the heat dissipation piece is adopted to quickly dissipate heat of the hot end face of the semiconductor refrigeration piece, the second heat dissipation fins are firstly utilized to form a deep-in type heat conduction silica gel structure, the depth degree and the contact area are increased by the micron-sized holes, the heat is guaranteed to quickly enter the heat dissipation piece from the hot end face of the semiconductor refrigeration piece, and then on one hand, the heat is quickly dissipated through the third heat dissipation fins, on the other hand, the heat is transmitted to the phase change gel through the phase change gel with the embedded large contact area (through the micron-sized holes) in the first heat dissipation fins, the phase change gel absorbs the heat to achieve a secondary refrigeration process, and the absorbed heat is dissipated through the surface sealing piece and the fourth heat dissipation fins.
Compared with the prior art, the invention has the beneficial effects that:
according to the LCOS micro projector provided by the invention, the semiconductor refrigerating sheet is directly arranged on the backlight source for cooling, the temperature difference between the cold end and the hot end of the semiconductor refrigerating sheet is kept by matching with the heat radiating piece, the cooling efficiency is high, the projector can be kept to work continuously and stably, and no noise exists.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of an LCOS micro projector with high cooling efficiency according to the present invention;
FIG. 2 is a control schematic diagram of the high efficiency cooling LCOS miniature projector of the present invention;
in the figure, the LED lamp comprises a controller 1, a controller 2, a power supply 3, a semiconductor refrigeration sheet 4, a temperature sensor 5, a light source 6, a first heat-conducting silica gel layer 7, a heat-radiating piece 7-1, a first heat-radiating fin 7-2, a second heat-radiating fin 7-3, a third heat-radiating fin 8, phase-change gel 9, a second heat-conducting silica gel layer 10, heat-conducting silica gel 11, a sealing sheet 11-1 and a fourth heat-radiating fin.
Detailed Description
For the purpose of further illustrating the invention, preferred embodiments of the invention are described below in conjunction with the detailed description, but it is to be understood that these descriptions are only intended to further illustrate the features and advantages of the invention, and not to limit the claims of the invention.
The LCOS micro projector with the high-efficiency cooling function comprises a power supply 2, a light source 5, a semiconductor refrigerating sheet 3, a heat radiating member 7, a sealing sheet 11, a controller 1 and a temperature sensor 4. In addition, other components which may be included in the existing LCOS pico projector, such as LCOS, an optical projection system, etc., can be included, and since the other components are the prior art and are not the improvement of the present application, they are not described much, so long as the LCOS pico projector including the components of the present application can perform an efficient cooling function no matter how the other components are arranged according to the prior art.
The light source 2 of the present invention is a light source plate, and is not particularly limited, and is typically an LED light source plate.
The power supply 1 of the present invention supplies power to the light source 5 and the semiconductor cooling plate 3, and is not particularly limited.
The outer contour dimension of the semiconductor refrigeration piece 3 is the same as that of the light source 2, and the cold end face of the semiconductor refrigeration piece 3 is fixed on the back face of the light source 5 through the edge alignment and adhesion of the first heat conduction silica gel layer 6.
The heat dissipation piece 7 is of a flat plate structure, the size of the outer contour of the heat dissipation piece 7 is 1.5-2.5 times of the outer contour of the semiconductor refrigeration piece 3 in order to achieve a higher heat dissipation effect, the heat dissipation piece 7 is fixedly adhered to the hot end face of the semiconductor refrigeration piece 3 through the second heat conduction silica gel layer 9, and the heat dissipation piece 7 and the semiconductor refrigeration piece are coaxially arranged in order to ensure uniform heat dissipation. A plurality of grooves are uniformly distributed on the back surface of the heat dissipation member 7, the grooves are arranged in parallel along the axial direction to form a first heat dissipation fin 7-1, a plurality of micron-sized hole structures are processed on the inner wall and the bottom of each groove, phase change gel 8 is filled in each groove, and the phase change gel 8 absorbs heat when the ambient temperature is higher than a set temperature and releases heat when the ambient temperature is lower than the set temperature; the phase-change gel can achieve the above purpose without special limitation, the temperature is usually set to be the normal working temperature of the projector, the phase-change gel can be commercially available or prepared according to the prior art, and if the phase-change temperature is required to be set to be 2-8 ℃, the phase-change gel prepared in the preparation method of the high-stability composite phase-change gel for 2-8 ℃ medicine cold chain transportation of Chinese patent 111826131B can be adopted. A plurality of first through grooves are uniformly distributed at the position, opposite to the second heat-conducting silica gel layer 9, of the front surface of the heat dissipation member 7, the first through grooves are axially arranged in parallel to form second heat dissipation fins 7-2, a plurality of micron-sized hole structures are processed on the side walls and the bottoms of the first through grooves, and heat-conducting silicon 10 is filled in the first through grooves; the side surface of the heat dissipation member 7 is provided with a plurality of second through grooves which are arranged in parallel perpendicular to the axial direction to form third heat dissipation fins 7-3. The first radiating fins 7-1, the second radiating fins 7-2 and the third radiating fins 7-3 adopt the design basis of realizing the fastest heat dissipation. Preferably, the thickness of each first radiator fin 7-1, each second radiator fin 7-2 and each third radiator fin 7-3 is preferably 0.05-0.2mm, and the interval between the adjacent first radiator fins 7-1, the adjacent second radiator fins 7-2 and the adjacent third radiator fins 7-3 is preferably 0.1-0.2 mm. The groove depth of the groove is 45-50% of the thickness of the heat sink 7. The groove depth of the first through groove is 20-30% of the thickness of the heat sink 7. The depth of the second through groove is 15% -25% of the height of the heat dissipation piece 7. The volume of the micro-scale porous structure on each of the first radiator fins 7-1 is not more than 50% of the total volume of the first radiator fins 7-1. The volume of the micro-scale porous structure on each second radiator fin 7-2 does not exceed 50% of the total volume of the second radiator fin 7-2. The width of the heat dissipation piece 7 is 1.5-2 times of the thickness of the semiconductor refrigeration piece 3. The material of the heat sink 7 is copper. The minimum thickness of the first heat-conducting silica gel layer 6 and the second heat-conducting silica gel layer 9 is preferably 0.15mm, and more preferably 0.25-0.3 mm; the second heat conductive silicone gel layer 9 and the heat conductive silicone gel 10 in the first through groove are usually integrally formed.
The size of the outer contour of the sealing sheet 11 is the same as that of the outer contour of the back surface of the heat dissipation member, the front surface of the sealing sheet 11 is fixed on the back surface of the heat dissipation member 7, the phase change gel 8 is sealed in the first through groove, and the sealing sheet 11 and the heat dissipation member 7 are fixed through bolts or welding. The back of the sealing sheet 11 is provided with a fourth heat dissipation fin 11-1. The thickness of the sealing piece 11 is preferably 0.2 to 1 mm. The material of the sealing piece 11 is a copper plate.
The LCOS micro projector capable of efficiently cooling down the temperature can not contain the controller 1 and the temperature sensor 4, if the controller 1 and the temperature sensor 4 are not contained, the semiconductor refrigerating sheet 3 starts to work when the light source 5 starts to work; when the light source 5 stops working, the semiconductor refrigerating sheet 3 stops working. If the controller 1 and the temperature sensor 4 are included, the temperature sensor 4 is fixed on the light source 5, collects the temperature of the light source 5 in real time and transmits temperature information to the controller 1; the controller 1 is connected with the temperature sensor 4 and the semiconductor refrigeration piece 3, the controller 1 receives temperature information collected by the temperature sensor 4 and judges whether the temperature is higher than a set temperature or not, if the temperature is higher than the set temperature, the semiconductor refrigeration piece 3 is controlled to start working, and if the temperature is equal to or lower than the set temperature, the semiconductor refrigeration piece 3 is controlled to stop working.
It should be understood that the above embodiments are only examples for clearly illustrating the present invention, and are not intended to limit the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications therefrom are within the scope of the invention.
Claims (9)
1. The LCOS miniature projector with high-efficiency cooling comprises a power supply (2) and a light source (5), and is characterized by further comprising a semiconductor refrigerating sheet (3), a heat radiating member (7) and a sealing sheet (11);
the light source (5) is a light source plate;
the power supply (2) supplies power to the light source (5) and the semiconductor refrigerating sheet (3);
the outer contour dimension of the semiconductor refrigeration piece (3) is the same as that of the light source (5), and the cold end face of the semiconductor refrigeration piece (3) is aligned and fixed on the back face of the light source (5) through the edge of the first heat-conducting silica gel layer (6);
the heat dissipation piece (7) is of a flat plate structure, the size of the outer contour of the heat dissipation piece is 1.5-2.5 times that of the outer contour of the semiconductor refrigeration piece (3), the heat dissipation piece (7) is fixedly adhered to the hot end face of the semiconductor refrigeration piece (3) through a second heat conduction silica gel layer (9), and the heat dissipation piece (7) is coaxial with the semiconductor refrigeration piece (3); the back of the heat dissipation piece (7) is uniformly provided with a plurality of grooves which are arranged in parallel along the axial direction to form a first heat dissipation fin (7-1), the inner wall and the bottom of each groove are provided with a plurality of micron-sized hole structures, phase change gel (8) is filled in each groove, and the phase change gel (8) absorbs heat when the ambient temperature is higher than a set temperature and releases heat when the ambient temperature is lower than the set temperature; a plurality of first through grooves are uniformly distributed at the position where the front surface of the heat radiating piece (7) is contacted with the second heat conducting silica gel layer (9), the first through grooves are axially arranged in parallel to form a second heat radiating fin (7-2), a plurality of micron-sized hole structures are processed on the side wall and the bottom of each first through groove, and heat conducting silica gel (10) is filled in each first through groove; a plurality of second through grooves are formed in the side face of the heat dissipation piece (7), and the second through grooves are perpendicular to the axial direction and are arranged in parallel to form a third heat dissipation fin (7-3); the heat dissipation piece (7) is made of copper;
the size of the outer contour of the sealing sheet (11) is the same as that of the outer contour of the heat dissipation member (7), the front surface of the sealing sheet (11) is fixed on the back surface of the heat dissipation member (7), the phase change gel (8) is sealed in the first through groove, and the back surface of the sealing sheet (11) is provided with a fourth heat dissipation fin (11-1); the sealing sheet (11) and the fourth heat dissipation fin (11-1) are made of copper.
2. The high efficiency cooling LCOS pico projector of claim 1, further comprising a controller (1) and a temperature sensor (4);
the temperature sensor (4) is fixed on the light source (5), collects the temperature of the light source (5) in real time and transmits a temperature signal to the controller (1);
the controller (1) is connected with the temperature sensor (4) and the semiconductor refrigerating piece (3), receives a temperature signal collected by the temperature sensor (4), judges whether the temperature is higher than a set temperature or not, controls the semiconductor refrigerating piece (3) to start working if the temperature exceeds the set temperature, and controls the semiconductor refrigerating piece (3) to stop working if the temperature is equal to or lower than the set temperature.
3. The LCOS miniature projector of claim 1 or 2, wherein the minimum thickness of the first and second heat-conducting silicone layers (6, 9) is 0.15 mm; and the second heat-conducting silica gel layer (9) and the heat-conducting silica gel (10) in the first through groove are integrally formed.
4. The LCOS pico projector of claim 1 or 2, wherein the thickness of each first radiator fin (7-1), each second radiator fin (7-2) and each third radiator fin (7-3) is 0.05-0.2mm, and the spacing between adjacent first radiator fins (7-1), adjacent second radiator fins (7-2) and adjacent third radiator fins (7-3) is 0.1-0.2 mm.
5. An efficient cooling LCOS miniature projector as claimed in claim 1 or 2, wherein the volume of the micro-scale porous structure on each first radiator fin (7-1) does not exceed 50% of the total volume of the first radiator fin (7-1); the volume of the micron-sized porous structure on each second radiator fin (7-2) does not exceed 50% of the total volume of the second radiator fins (7-2).
6. An efficient cooling LCOS miniature projector as claimed in claim 1 or 2, wherein the groove depth of said groove is 45-50% of the thickness of the heat sink (7); the depth of the first through groove is 20-30% of the thickness of the heat dissipation piece (7); the depth of the second through groove is 15% -25% of the height of the heat dissipation piece (7).
7. An efficient cooling LCOS pico projector as claimed in claim 1 or 2, characterized in that the width of the heat sink (7) is 1.5-2 times the thickness of the semiconductor cooling plate (3).
8. The LCOS miniature projector according to claim 1, wherein said sealing plate (11) and said heat dissipating member (7) are fixed by bolts or welding.
9. An efficient cooling LCOS pico projector as claimed in claim 1, wherein the thickness of the sealing plate (11) is 0.2-1 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110913007.2A CN113589634A (en) | 2021-08-10 | 2021-08-10 | High-efficient cooling LCOS miniature projecting apparatus |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110913007.2A CN113589634A (en) | 2021-08-10 | 2021-08-10 | High-efficient cooling LCOS miniature projecting apparatus |
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| CN113589634A true CN113589634A (en) | 2021-11-02 |
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| CN202110913007.2A Pending CN113589634A (en) | 2021-08-10 | 2021-08-10 | High-efficient cooling LCOS miniature projecting apparatus |
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| CN101989030A (en) * | 2010-07-19 | 2011-03-23 | 深圳雅图数字视频技术有限公司 | Liquid crystal on silicon (LCOS) projector |
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| CN204345424U (en) * | 2015-01-14 | 2015-05-20 | 深圳宏鑫瑞特科技有限公司 | The LED bay light of high efficiency and heat radiation |
| CN105351899A (en) * | 2015-09-23 | 2016-02-24 | 华南理工大学 | LED heat-dissipating device adopting semiconductor refrigerating plate and phase change materials |
| CN208157852U (en) * | 2018-04-29 | 2018-11-27 | 中国华录集团有限公司 | A kind of laser diode cooling system of laser-projector |
| CN209879240U (en) * | 2019-07-02 | 2019-12-31 | 广州无缝绿色科技有限公司 | Heat dissipation mechanism of projector |
| CN112888255A (en) * | 2021-01-20 | 2021-06-01 | 四川中科友成科技有限公司 | Controllable heat dissipation system and controllable heat dissipation method based on semiconductor refrigeration |
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2021
- 2021-08-10 CN CN202110913007.2A patent/CN113589634A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101989030A (en) * | 2010-07-19 | 2011-03-23 | 深圳雅图数字视频技术有限公司 | Liquid crystal on silicon (LCOS) projector |
| CN204094313U (en) * | 2014-07-14 | 2015-01-14 | 成都荣乐激光技术有限公司 | A kind of semiconductor refrigeration type laser marking machine |
| CN204345424U (en) * | 2015-01-14 | 2015-05-20 | 深圳宏鑫瑞特科技有限公司 | The LED bay light of high efficiency and heat radiation |
| CN105351899A (en) * | 2015-09-23 | 2016-02-24 | 华南理工大学 | LED heat-dissipating device adopting semiconductor refrigerating plate and phase change materials |
| CN208157852U (en) * | 2018-04-29 | 2018-11-27 | 中国华录集团有限公司 | A kind of laser diode cooling system of laser-projector |
| CN209879240U (en) * | 2019-07-02 | 2019-12-31 | 广州无缝绿色科技有限公司 | Heat dissipation mechanism of projector |
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Application publication date: 20211102 |