CN114755879A - Temperature control and noise reduction system for high-power laser projector - Google Patents
Temperature control and noise reduction system for high-power laser projector Download PDFInfo
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- CN114755879A CN114755879A CN202210328288.XA CN202210328288A CN114755879A CN 114755879 A CN114755879 A CN 114755879A CN 202210328288 A CN202210328288 A CN 202210328288A CN 114755879 A CN114755879 A CN 114755879A
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 91
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- 230000001276 controlling effect Effects 0.000 description 5
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/16—Cooling; Preventing overheating
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- G—PHYSICS
- G10—MUSICAL INSTRUMENTS; ACOUSTICS
- G10K—SOUND-PRODUCING DEVICES; METHODS OR DEVICES FOR PROTECTING AGAINST, OR FOR DAMPING, NOISE OR OTHER ACOUSTIC WAVES IN GENERAL; ACOUSTICS NOT OTHERWISE PROVIDED FOR
- G10K11/00—Methods or devices for transmitting, conducting or directing sound in general; Methods or devices for protecting against, or for damping, noise or other acoustic waves in general
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Abstract
The invention discloses a temperature control and noise reduction system for a high-power laser projector, which comprises a laser head, a DMD chip and two sets of temperature control and noise reduction systems, wherein the temperature control and noise reduction system I is connected with the laser head, and the temperature control and noise reduction system II is connected with the DMD chip; each temperature control and noise reduction system comprises liquid spray cooling equipment, a thermoelectric refrigerating device, a heat dissipation circulating system, a temperature induction control system and a sound induction control system; the heat dissipation circulating system comprises a pipeline system, a cooling section and a heat dissipation section which are connected by the pipeline system; a plurality of groups of fans and blowers are arranged in the heat dissipation section. The invention discloses a temperature control and noise reduction system for a high-power laser projector, which can accurately control the working temperature of a laser head and a DMD chip and reduce the noise generated when the high-power laser projector works.
Description
Technical Field
The invention relates to the field of manufacturing of high-power laser projectors, in particular to a temperature control and noise reduction system for a high-power laser projector.
Background
Currently, laser projection display technologies are divided into two categories: firstly, blue laser is used as a main light source, light emitted by the blue laser is subjected to color separation into three colors of red, green and blue through a color wheel, and then the three colors of light are projected on a DMD chip through a diffusion sheet, a light pipe and the like, so that an image seen by human eyes is formed; and secondly, the three-color laser is controlled to be manufactured into a module, the laser expands beams of an optical element and a processing chip in the machine and then transmits the beams to an X prism to integrate the three beams of laser, and the three beams of laser are transmitted to the curtain by a projection objective so as to complete the whole display process. Laser displays have great potential in many applications, and many large companies have been involved in the development of laser projectors.
However, since the high power laser projector is continuously developed to the targets of high brightness, low noise and long service life, and the power of the semiconductor laser is generally only 1, 2 watts, a plurality of semiconductor laser arrays are usually used to form the light source of the laser projector, which results in very high integration of the laser head, the photoelectric conversion efficiency of the laser light source on the market is generally below 40%, and rarely exceeds 40%, so the calorific value of the laser head is increased, and researches show that the temperature greatly affects the reliability of the microelectronic device, and the reliability of the device is reduced by 5% for every 1 ℃ increase of the device temperature on the level of 70-80 ℃. Temperature accounts for up to 55% of the major factors that cause electronic component failure. In addition, the DMD chip also generates a large amount of heat during high power operation, and therefore, the normal and stable operation of the DMD chip can only be ensured by precisely and strictly controlling the temperature of the high power laser projection. The heat dissipation mode of the air cooling heating electric refrigeration or the liquid cooling is generally used in the market, but when the air cooling mode is used at high power, the rotating speed of a fan can be increased, noise can be generated, the use experience of a user can be influenced, the decibel of the noise must be controlled, and the influence on the use experience is reduced.
Disclosure of Invention
Aiming at the problems in the prior art, the invention discloses a temperature control and noise reduction system for a high-power laser projector, which can accurately control the working temperature of a laser head and a DMD chip and reduce the noise generated during the working of the high-power laser projector.
The specific technical scheme is as follows:
a temperature control and noise reduction system for a high-power laser projector comprises a laser head, a DMD chip and two sets of temperature control and noise reduction systems, wherein a temperature control and noise reduction system I is connected with the laser head, and a temperature control and noise reduction system II is connected with the DMD chip;
the temperature control and noise reduction system I comprises first liquid spray cooling equipment, a first thermoelectric refrigerating device, a heat dissipation circulating system I, a temperature induction control system I and a sound induction control system I;
the heat dissipation circulating system I comprises a pipeline system I, and a first cooling section and a first heat dissipation section which are connected through the pipeline system I;
a plurality of groups of fans and blowers are arranged in the first heat dissipation section;
the temperature control and noise reduction system II comprises a second liquid spray cooling device, a second thermoelectric refrigerating device, a heat dissipation circulating system II, a temperature induction control system II and a sound induction control system II;
The heat dissipation circulating system II comprises a pipeline system II, and a second cooling section and a second heat dissipation section which are connected by the pipeline system II; and a plurality of groups of fans and blowers are arranged in the second heat dissipation section.
The invention discloses a special temperature control and noise reduction system for a high-power laser projector, which applies liquid spray cooling equipment, a thermoelectric refrigerating device and a high-wind-pressure low-wind-volume fan to the temperature control and noise reduction of a laser head and a DMD chip of the high-power laser projector, improves the heat dispersion of the high-power laser projection laser head and the DMD chip, reduces the noise generated during the work of the high-power laser projector, realizes the automatic adjustment of the temperature and the noise during the work of the projector through the temperature control and noise reduction system, and ensures the integral stability of the high-power laser projector and the use feeling of customers.
The invention discloses a special temperature control and noise reduction system for a high-power laser projector, which comprises two sets of temperature control and noise reduction systems, wherein one set of temperature control and noise reduction systems is connected with a laser head and is used for controlling the temperature and reducing the noise of the laser head; and the other set of the circuit board is connected with the DMD chip and used for controlling temperature and reducing noise of the DMD chip. The two sets of temperature control and noise reduction systems have basically the same composition, and the liquid spray cooling equipment, the thermoelectric refrigerating device and the heat dissipation circulating system are two relatively independent sets; the temperature sensor and the sound sensor in the temperature sensing control system and the sound sensing control system are relatively independent, but the temperature control chip and the noise reduction system are shared.
First liquid spray cooling device set up in the laser head top is equipped with a plurality of shower nozzles in the first liquid spray cooling device, through the shower nozzle sprays atomizing cooling liquid to on the laser head.
The second liquid sprays cooling arrangement set up in DMD chip top is equipped with a plurality of shower nozzles in the second liquid sprays cooling arrangement, through the shower nozzle sprays atomizing cooling liquid to on the DMD chip.
The liquid spray cooling device adopted in the invention mainly realizes the atomization of liquid by means of the spray head, the atomized cooling liquid is sprayed on the electronic components, the heat on the surfaces of the electronic components is absorbed and then the cooling liquid is gasified, and the phase change heat absorption process can realize the cooling of the electronic components. The cooling liquid steam after heat absorption and gasification is brought into the heat exchanger for condensation, and the condensed liquid is conveyed into the spraying device again by the circulating pump to complete a closed cycle. The liquid spray cooling equipment is very efficient and can realize heat exchange with higher heat flow density.
And the cold end of the first thermoelectric refrigerating device is tightly attached to the back surface of the laser head, and the hot end of the first thermoelectric refrigerating device is tightly attached to the first cooling section.
And the cold end of the second thermoelectric refrigerating device is tightly attached to the back surface of the DMD chip, and the hot end of the second thermoelectric refrigerating device is tightly attached to the second cooling section.
Preferably, the first thermoelectric refrigerating device and the laser head, and the first thermoelectric refrigerating device and the first cooling section are fixed through the directional heat transfer adhesive tape, so that the heat transfer efficiency is further improved.
And the second thermoelectric refrigerating device and the DMD chip as well as the second thermoelectric refrigerating device and the second cooling section are fixed by the directional heat transfer adhesive tape.
The thermoelectric refrigeration employed in the present invention utilizes the peltier effect of certain conductor materials. When current is passed through two different semiconductor materials, the temperature at one end will increase and the temperature at the other end will decrease at the junction of the two materials. Thermoelectric refrigeration has no moving parts, does not need a refrigerant, has quick thermal response, can be directly contacted and accurately controlled by a solid surface at the cold end and the hot end, but is controlled by a high-quality coefficient, and has low heat exchange efficiency at high temperature.
The heat dissipation circulation system in the invention is a forced convection cooling heat dissipation circulation system.
In the heat dissipation circulation system I, an outlet and an inlet are formed in the first cooling section and the first heat dissipation section respectively and communicated with the pipeline system I respectively, and the first cooling section and the first heat dissipation section are communicated through the pipeline system I to form a closed loop.
The outlet and the inlet of the pipeline system I are respectively provided with a fan, and the middle of the pipeline system I is also provided with a pump.
Preferably, a total of four fans are arranged in the pipeline system I and are respectively arranged at the inlet and the outlet of the first cooling section and the inlet and the outlet of the first heat dissipation section. Wherein the entry of first cooling section and the entry setting of first heat dissipation section all are air supply fan, and the export of first cooling section and the export setting of first heat dissipation section all are air exhaust fan.
In the heat dissipation circulation system II, an outlet and an inlet are also respectively arranged on the second cooling section and the second heat dissipation section, the outlet and the inlet are respectively communicated with the pipeline system II, and the second cooling section and the second heat dissipation section form a closed loop through the pipeline system II.
And a fan is respectively arranged at the outlet and the inlet of the pipeline system II, and a pump is also arranged in the middle of the pipeline system II.
Preferably, a total of four fans are arranged in the pipeline system II and are respectively arranged at the inlet and the outlet of the second cooling section and the inlet and the outlet of the second heat dissipation section. Wherein the entry of second cooling section and the entry setting of second heat dissipation section all are air supply fan, and the export of second cooling section and the export setting of second heat dissipation section all are air exhaust fan.
The temperature sensing control system I comprises a first temperature sensor and a temperature control chip, and the temperature sensing control system II comprises a second temperature sensor and a temperature control chip. The temperature control chip can simultaneously regulate and control the temperatures of the two sets of temperature control and noise reduction systems.
The temperature control chip is connected with the temperature sensor, so that the temperature control chip can receive a temperature signal detected by the temperature sensor in real time; the temperature control chip is also respectively connected with the liquid spray cooling device, the thermoelectric refrigerating device and the heat dissipation circulating system, and regulates and controls the amount of cooling liquid in the liquid spray cooling device, the refrigerating capacity of the thermoelectric refrigerating device, the pumping force of a pump in the heat dissipation circulating system, the rotating speeds of a fan and the like in real time according to the received temperature signals.
Preferably, the first temperature sensor is installed on the laser head, the temperature control chip comprises a temperature receiving module and a temperature processing module, the temperature receiving module receives a temperature signal detected by the first temperature sensor in real time and sends a command to the temperature processing module, and the temperature processing module receives the command and then regulates and controls the first liquid spray cooling device, the first thermoelectric refrigerating device and the heat dissipation circulation system I.
The second temperature sensor is installed on the DMD chip, the temperature control chip comprises a temperature receiving module and a temperature processing module, the temperature receiving module receives a temperature signal detected immediately from the second temperature sensor and sends a command to the temperature processing module, and the temperature processing module regulates and controls second liquid spraying cooling equipment, a second thermoelectric refrigerating device and a heat dissipation circulating system II after receiving the command.
The temperature sensing control system disclosed by the invention can realize triple temperature control processing, when the temperature sensor detects that the temperature of the laser head or the DMD chip is lower than the upper limit of the working temperature of the laser head or the DMD chip, the temperature control chip controls and starts the fan and the blower in the heat dissipation circulation system, and the aim of reducing the temperature of the laser head or the DMD chip is fulfilled by adjusting the rotating speed of the fan and the blower and the pumping force of the pump; when the temperature sensor detects that the temperature of the laser head or the DMD chip reaches the upper limit of the respective working temperature, the temperature control chip can control the thermoelectric refrigerating device to be started, the refrigerating capacity of the thermoelectric refrigerating device, the rotating speed of the fan and the pumping power of the pump to achieve the purpose of reducing the temperature of the laser head or the DMD chip and enabling the temperature to be lower than the upper limit of the respective working temperature; when the temperature sensor detects that the temperature of the laser head or the DMD chip exceeds the upper limit of the working temperature of the laser head or the DMD chip, the temperature control chip controls and starts the liquid spray cooling device, controls the amount of cooling liquid in the liquid spray cooling device, the refrigerating capacity of the thermoelectric refrigerating device, the rotating speeds of the fan and the blower and the pumping force of the pump, reduces the brightness of the high-power laser projector, and gives a warning and shuts down automatically when the overtemperature is serious.
The sound induction control system I comprises a first sound inductor and a noise reduction system; the sound induction control system II comprises a second sound inductor and a noise reduction system; the noise reduction system can regulate and control the sound of the two sets of temperature control noise reduction systems at the same time.
The noise reduction system is connected with the sound sensor, so that the sound sensor can receive the sound signal detected in real time; and the noise reduction system is also connected with the heat dissipation circulating system and is used for switching on and off and adjusting the rotating speed of a fan and a fan arranged in the heat dissipation section in real time according to the received sound signals.
Preferably, the first sound sensor is installed on the outer side of the first heat dissipation section, the noise reduction system comprises a processing module and a control module, the processing module is used for receiving a sound signal detected by the first sound sensor in real time and sending a command to the control module, and the control module regulates and controls the heat dissipation circulation system I after receiving the command.
The second sound sensor is installed on the outer side of the second heat dissipation section, the noise reduction system comprises a processing module and a control module, the processing module is used for receiving a sound signal which is instantly detected by the second sound sensor and sending a command to the control module, and the control module regulates and controls the heat dissipation circulation system II after receiving the command.
The noise reduction system disclosed by the invention has the noise processing capacity, when the sound decibel sensed by the sound sensor is less than 50dB, the control module controls the fan and the fan to be turned on, and adjusts the rotating speeds of the fan and the fan according to a program to carry out heat dissipation; when the sound decibel sensed by the sound sensor is greater than 50dB, the fan is turned off, and noise reduction and heat dissipation are carried out only by the fan.
Preferably, the fan is a high-wind-pressure low-wind-capacity fan.
Compared with the prior art, the invention has the following beneficial effects:
the invention discloses a special temperature control and noise reduction system for a high-power laser projector, which applies liquid spray cooling equipment, a thermoelectric refrigerating device and a high-wind-pressure low-wind-volume fan to the temperature control and noise reduction of a laser head and a DMD chip of the high-power laser projector, improves the heat dissipation performance of the high-power laser projection laser head and the DMD chip, reduces the volume ratio of a radiator in the whole machine, controls temperature fluctuation in a smaller range, and reduces the noise generated when the high-power laser projector works; the temperature control and noise reduction system can realize triple automatic temperature control according to actual use conditions, can control the sound decibel in working below 50dB, and ensures the overall stability of the high-power laser projector and the use feeling of customers.
Drawings
FIG. 1 is a schematic structural diagram of a temperature control and noise reduction system according to the present disclosure;
in the figure:
1-a first temperature sensor, 2-a laser head, 3-a first liquid spray cooling device, 4-a first thermoelectric refrigeration device, 5-a first cooling section, 6-a pump I, 7-a first heat dissipation section, 8-a first sound sensor, 9-a pipeline system I, 10-a second temperature sensor, 11-a DMD chip, 12-a second liquid spray cooling device, 13-a second thermoelectric refrigeration device, 14-a second cooling section, 15-a pump II, 16-a second heat dissipation section, 17-a second sound sensor, 18-a pipeline system II, 19-a temperature receiving module, 20-a temperature processing module, 21-a processing module and 22-a control module;
51-air supply fan, 52-air exhaust fan;
71-an air draft fan, 72-an air supply fan, 73, 76-a fan, 74, 75-a fan;
141-an air draft fan and 142-an air supply fan;
161-supply fan, 162-exhaust fan, 163, 165-fan, 164, 166-fan.
Detailed Description
The present invention will be described in further detail with reference to examples, and it should be noted that in the following embodiments, in order to clearly illustrate the structure of the present invention, the structure shown in the drawings is not drawn to a general scale, and is partially enlarged, deformed and simplified, and therefore, the present invention should not be construed as limited thereto.
Examples
As shown in fig. 1, the temperature control and noise reduction system for a high power laser projector disclosed in this embodiment includes a laser head 2, a temperature control and noise reduction system i for controlling temperature and reducing noise of the laser head 2, a DMD chip 11, and a temperature control and noise reduction system ii for controlling temperature and reducing noise of the DMD chip 11.
Temperature control and noise reduction system I includes first liquid spray cooling device 3, first thermoelectric refrigerating device 4, heat dissipation circulation system I, temperature-sensing control system I and sound sensing control system I.
First liquid sprays cooling arrangement 3 and fixes and set up in laser head 2 top, include atomizer in the first liquid sprays cooling arrangement 3, heat exchanger and circulating pump, be equipped with a plurality of shower nozzles in the atomizer, can spray atomizing cooling liquid on laser head 3 through these shower nozzles, gasify after having absorbed the heat on laser head 3 surface, this phase transition heat absorption process can realize the cooling to laser head 3, coolant liquid steam after the heat absorption gasification is taken to the interior condensation of heat exchanger, liquid after the condensation is carried spraying arrangement once more by the circulating pump, accomplish a confined circulation.
The cold end of the first thermoelectric cooling device 4 is connected to the back of the laser head 2 through a directional heat transfer tape (here, the laser emitting side of the laser head is the front side, and the opposite side is the back side of the laser head).
The heat dissipation circulation system I comprises a first cooling section 5, a first heat dissipation section 7 and a pipeline system I for communicating the first cooling section and the first heat dissipation section.
The first cooling section 5 is a cuboid cavity, one face of the cavity is connected with the hot end of the first thermoelectric refrigerating device 4 through a directional heat transfer adhesive tape, the rest faces of the cavity form a closed cavity through welding, the first cooling section 5 is also provided with an outlet and an inlet, an air supply fan 51 is arranged at the inlet, and an exhaust fan 52 is arranged at the outlet. The outlet and the inlet are both communicated with a pipeline system I9, and are communicated with the first heat dissipation section 7 through the pipeline system I.
The first heat dissipation section 7 is also a rectangular parallelepiped cavity, and a plurality of high-wind-pressure low-wind- capacity fans 73 and 76 and fans 74 and 75 are disposed inside the first heat dissipation section, so that the number of the fans and fans can be increased or decreased, or the fans and fans can be connected in series or in parallel according to specific conditions. The first heat dissipation section 7 is also provided with an outlet and an inlet, wherein the inlet is provided with an air supply fan 72, and the outlet is provided with an air exhaust fan 71. The outlet and the inlet are both communicated with a pipeline system I9.
Still be equipped with pump I6 on pipe-line system I9, through pipe-line system I9, form closed circuit between first cooling section 5 and first heat dissipation section 7.
The pipelines adopted in the pipeline system I9 are hoses, and the direction and the length can be adjusted at will.
Temperature-sensing control system I includes first temperature-sensing ware 1, and it is installed on laser head 2, can respond to the temperature of laser head 2 in real time.
The temperature sensing control system I further comprises a temperature control chip composed of a temperature receiving module 19 and a temperature processing module 20, the temperature receiving module 19 receives a temperature signal detected immediately from the first temperature sensor 1 and sends a command to the temperature processing module 20, the temperature processing module 20 is respectively connected with the liquid spraying cooling device, the thermoelectric refrigerating device and the heat dissipation circulating system, and the quantity of cooling liquid in the liquid spraying cooling device, the refrigerating capacity of the thermoelectric refrigerating device, the pumping power of a pump in the heat dissipation circulating system, the rotating speeds of a fan and the like are regulated and controlled in real time according to the received temperature signal.
The sound sensing control system I comprises a first sound sensor 8, and the first sound sensor 8 is installed at the outer side of the first heat dissipation section 7.
The sound induction control system I further comprises a noise reduction system composed of a processing module 21 and a control module 22, the processing module 21 receives a sound signal which is detected instantly by the first sound inductor 8 and sends a command to the control module 22, the control module 22 is connected with the heat dissipation circulation system, and a fan which are arranged in the heat dissipation section are switched on and off and the rotating speed of the fan and the fan is adjusted in real time according to the received sound signal.
The temperature control and noise reduction system II comprises a second liquid spray cooling device 12, a second thermoelectric refrigerating device 13, a heat dissipation circulating system II, a temperature induction control system II and a sound induction control system II.
The second liquid spray cooling device 12 is disposed above the DMD chip 11, and has the same composition and operation principle as the first liquid spray cooling device 3, which are not described herein again.
And a second thermoelectric refrigerating device 13 with a cold end clinging to the back surface of the DMD chip 11.
The heat dissipation circulation system II comprises a second cooling section 14, a second heat dissipation section 16 and a pipeline system II for communicating the second cooling section and the second heat dissipation section.
The second cooling section 14 is a cuboid cavity, one face of the cavity is connected with the hot end of the second thermoelectric refrigerating device 13 through a directional heat transfer adhesive tape, the rest faces form a closed cavity through welding, the second cooling section 14 is also provided with an outlet and an inlet, an air supply fan 142 is arranged at the inlet, and an air exhaust fan 141 is arranged at the outlet. The outlet and the inlet are both communicated with a pipeline system II 18, and are communicated with the second heat dissipation section 16 through the pipeline system II.
The second heat dissipation section 16 is also a cuboid cavity, and a plurality of high-wind-pressure low-wind- capacity fans 163 and 165 and fans 164 and 166 are arranged in the second heat dissipation section; the second heat dissipation section 16 is also provided with an outlet and an inlet, wherein the inlet is provided with an air supply fan 161 and the outlet is provided with an air exhaust fan 162. The outlet and the inlet are communicated with a pipeline system II 18.
And a pump II 15 is further arranged on the pipeline system II 18, and a closed loop is formed between the second cooling section 14 and the second heat dissipation section 16 through the pipeline system II 18.
Temperature-sensing control system II includes second temperature-sensing ware 10, and it installs on DMD chip 11, can respond to DMD chip 11's temperature in real time.
The temperature sensing control system ii further comprises a temperature control chip composed of a temperature receiving module 19 and a temperature processing module 20, and the working principle is the same as that in the temperature sensing control system i, which is not described herein again.
The sound-sensing control system ii comprises a second sound sensor 17, and the second sound sensor 17 is mounted on the outer side of the second heat dissipation section 16.
The sound sensing control system ii further includes a noise reduction system composed of a processing module 21 and a control module 22, and the working principle is the same as that in the sound sensing control system i, which is not described herein again.
The working principle is as follows:
the two sets of temperature control and noise reduction systems have the same working principle, and the difference is only that the objects to be processed are different, one is that the laser head and the other is a DMD chip, and the description is given by taking the object to be processed as the laser head.
The high-power laser projector starts to work to generate heat, the temperature receiving module 19 obtains a temperature signal and converts the temperature signal into an electronic signal to be transmitted to the temperature processing module 20 through the first temperature sensor 1, and the temperature processing module 20 judges the electronic signal: when the temperature of the laser head is lower than the upper limit of the working temperature, the temperature control chip controls to start the pump, the fan and the fan in the heat dissipation circulating system I, and adjusts the suction force of the pump and the rotating speeds of the fan and the fan according to a program to dissipate heat. The heat dissipation circulation system I utilizes a forced convection cooling technology to convey hot gas diffused into the first cooling section 5 from an outlet to the first heat dissipation section 7 through the pipeline system I9, the hot gas is cooled through the fan 74 and the fan 73 which are opened in the first heat dissipation section 7, the cooled gas is discharged from the outlet of the first heat dissipation section 7, and the cooled gas is conveyed to the first cooling section 5 through the pump I6 and the fan.
When the temperature of the laser head 2 reaches the upper limit of the working temperature, the temperature control chip can control and start the first thermoelectric refrigerating device 4, the pump, the fan and the fan in the heat dissipation circulating system I, and adjust the refrigerating capacity of the first thermoelectric refrigerating device 4, the suction force of the pump and the rotating speeds of the fan and the fan according to a program.
When the temperature of the laser head 2 exceeds the upper limit of the working temperature, the temperature control chip can continuously start the first liquid spray cooling device 3, the first thermoelectric cooling device 4 and the pump, the fan and the fan in the heat dissipation circulating system I, and adjust the amount of the cooling liquid in the first liquid spray cooling device 3, the refrigerating capacity of the first thermoelectric cooling device 4, the pumping power of the pump and the rotating speed of the fan and the fan according to a program, and simultaneously reduce the brightness of the high-power laser projector, and give a warning and automatically shut down when the overtemperature is serious.
The high power laser projector starts to work and generates noise, and the processing module 21 receives the instant detected signal from the first sound sensor 8 through the first sound sensor 8 and sends a command to the control module 22, and the control module 22 switches on and off the fan and the blower fan arranged in the first heat dissipation section 7, or adjusts the rotation speed of the fan and the blower fan in real time. When the sound decibel sensed by the first sound sensor 8 is less than 50dB, the fan and the blower are turned on to dissipate heat; when the sound decibel sensed by the first sound sensor 8 is greater than 50dB, the fan is turned off, and noise reduction and heat dissipation are performed only by means of the fan.
Claims (9)
1. A temperature control and noise reduction system for a high-power laser projector comprises a laser head and a DMD chip and is characterized by further comprising two sets of temperature control and noise reduction systems, wherein a temperature control and noise reduction system I is connected with the laser head, and a temperature control and noise reduction system II is connected with the DMD chip;
the temperature control and noise reduction system I comprises a first liquid spray cooling device, a first thermoelectric refrigerating device, a heat dissipation circulating system I, a temperature induction control system I and a sound induction control system I;
the heat dissipation circulating system I comprises a pipeline system I, and a first cooling section and a first heat dissipation section which are connected by the pipeline system I;
a plurality of groups of fans and blowers are arranged in the first heat dissipation section;
the temperature control and noise reduction system II comprises a second liquid spray cooling device, a second thermoelectric refrigerating device, a heat dissipation circulating system II, a temperature induction control system II and a sound induction control system II;
the heat dissipation circulating system II comprises a pipeline system II, and a second cooling section and a second heat dissipation section which are connected by the pipeline system II;
and a plurality of groups of fans and blowers are arranged in the second heat dissipation section.
2. The temperature controlled noise reduction system for high power laser projectors of claim 1, wherein:
The first liquid spray cooling device is arranged above the laser head, a plurality of spray heads are arranged in the first liquid spray cooling device, and atomized cooling liquid is sprayed onto the laser head through the spray heads;
and the cold end of the first thermoelectric refrigerating device is tightly attached to the back surface of the laser head, and the hot end of the first thermoelectric refrigerating device is tightly attached to the first cooling section.
3. The temperature controlled noise reduction system for high power laser projectors of claim 1, wherein:
the outlet and the inlet of the pipeline system I are respectively provided with a fan, and the middle of the pipeline system I is also provided with a pump.
4. The temperature controlled noise reduction system for high power laser projectors of claim 1, wherein:
the temperature sensing control system I comprises a first temperature sensor and a temperature control chip;
the first temperature sensor is arranged on the laser head, and the temperature control chip comprises a temperature receiving module and a temperature processing module;
the temperature receiving module receives a temperature signal detected by the first temperature sensor in real time and sends a command to the temperature processing module, and the temperature processing module receives the command and then regulates and controls the first liquid spray cooling device, the first thermoelectric refrigerating device and the heat dissipation circulation system I;
The sound induction control system I comprises a first sound inductor and a noise reduction system;
the first sound sensor is arranged on the outer side of the first heat dissipation section, and the noise reduction system comprises a processing module and a control module;
the processing module is used for receiving the sound signals detected by the first sound sensor in real time and sending commands to the control module, and the control module regulates and controls the heat dissipation circulation system I after receiving the commands.
5. The temperature controlled noise reduction system for high power laser projectors of claim 1, wherein:
the second liquid spray cooling device is arranged above the DMD chip, a plurality of spray heads are arranged in the second liquid spray cooling device, and atomized cooling liquid is sprayed onto the DMD chip through the spray heads;
and the cold end of the second thermoelectric refrigerating device is tightly attached to the back surface of the DMD chip, and the hot end of the second thermoelectric refrigerating device is tightly attached to the second cooling section.
6. The temperature controlled noise reduction system for high power laser projectors of claim 1, wherein:
and a fan is respectively arranged at the outlet and the inlet of the pipeline system II, and a pump is also arranged in the middle of the pipeline system II.
7. The temperature controlled noise reduction system for high power laser projectors of claim 1, wherein:
The temperature sensing control system II comprises a second temperature sensor and a temperature control chip;
the second temperature sensor is arranged on the DMD chip, and the temperature control chip comprises a temperature receiving module and a temperature processing module;
the temperature receiving module receives a temperature signal detected by the second temperature sensor in real time and sends a command to the temperature processing module, and the temperature processing module receives the command and then regulates and controls the second liquid spray cooling device, the second thermoelectric refrigerating device and the heat dissipation circulation system II;
the sound induction control system II comprises a second sound inductor and a noise reduction system;
the second sound sensor is arranged on the outer side of the second heat dissipation section, and the noise reduction system comprises a processing module and a control module;
the processing module is used for receiving the sound signals detected by the second sound sensor instantly and sending commands to the control module, and the control module regulates and controls the heat dissipation circulation system II after receiving the commands.
8. The temperature controlled noise reduction system for high power laser projectors of claim 2, 3, 5 or 6, wherein:
the first thermoelectric refrigerating device is fixed with the laser head and the first cooling section through a directional heat transfer adhesive tape;
The second thermoelectric refrigerating device, the DMD chip and the second cooling section are also fixed through the directional heat transfer adhesive tape.
9. The temperature control and noise reduction system for a high power laser projector of claim 1, wherein the fan is a high air pressure low air volume type fan.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210328288.XA CN114755879A (en) | 2022-03-30 | 2022-03-30 | Temperature control and noise reduction system for high-power laser projector |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210328288.XA CN114755879A (en) | 2022-03-30 | 2022-03-30 | Temperature control and noise reduction system for high-power laser projector |
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