CN209624965U - A kind of projection chip cooling system that can be anti-condensation - Google Patents
A kind of projection chip cooling system that can be anti-condensation Download PDFInfo
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- CN209624965U CN209624965U CN201920367077.0U CN201920367077U CN209624965U CN 209624965 U CN209624965 U CN 209624965U CN 201920367077 U CN201920367077 U CN 201920367077U CN 209624965 U CN209624965 U CN 209624965U
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- projection chip
- refrigeration
- projection
- condensation
- dehumidifier
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Abstract
The utility model discloses a kind of projection chip cooling systems that can be anti-condensation, belong to digital projector field, a kind of projection chip cooling system that can be anti-condensation, including projection chip, the projection chip supporting element positioned at projection chip lower end, refrigeration component, refrigeration system pipeline, refrigeration system and projection chip radiating surface monitoring temperature point, further include dehumidifier and dehumidifier air duct and supporting element, is filled with heat-conducting interface material between the contact surfaces such as projection chip and water-cooled plate.Advantage is that heat-conducting interface material can quickly transmit heat to cooling medium, to reach the result of fast cooling, dehumidifier and dehumidifier air duct and supporting element may be implemented to form dry air atmosphere around the low-temperature surfaces such as projection chip, refrigeration component, prevent the generation of dew condensation phenomenon.
Description
Technical field
The utility model relates to digital projector fields, cold more specifically to a kind of projection chip that can be anti-condensation
But system.
Background technique
Crucial original part-projection chip of digital projector is a kind of high precision device.The performance of projection chip and can
It is very sensitive to temperature by property, thermoelectric cooler (TEC) active refrigeration is usually used, chip shell temperature is made to be maintained at lower temperature, example
Such as 25 DEG C, such as a kind of chip-cooling system of Chinese patent CN201510209531.6, it discloses specific pipeline jointing construction,
But it does not play effect that can be anti-condensation.For super brightness projection device, very due to projection chip heat loads on board
Greatly, the shell temperature of projection chip needs to control even lower at 20 DEG C.When environment temperature is higher, this can cause water vapor in air
The problem of condensing in the low-temperature surfaces such as chip carrier, leading to corrosion or other influences system reliability.
Utility model content
1. technical problems to be solved
Aiming at the problems existing in the prior art, the purpose of this utility model is to provide a kind of projection cores that can be anti-condensation
Piece cooling system, it may be implemented to form dry air around the low-temperature surfaces such as projection chip, soaking plate, TEC, water-cooled plate
Atmosphere prevents the generation of dew condensation phenomenon.
2. technical solution
To solve the above problems, the utility model adopts the following technical scheme.
A kind of projection chip cooling system that can be anti-condensation, including projection chip, positioned at the projection core of projection chip lower end
Piece supporting element, refrigeration component, refrigeration system pipeline, refrigeration system and projection chip radiating surface monitoring temperature point, the refrigeration structure
Part is located at the lower end of projection chip, and the refrigeration system is located at the downside of water-cooled plate, and the refrigeration system pipeline is respectively by water cooling
The left end of plate and refrigeration system and right end connect to form a loop, the projection chip radiating surface monitoring temperature point
Positioned at the lower end of projection chip, the projection chip cooling system that this can be anti-condensation further includes dehumidifier and dehumidifier air duct and support
Part, the dehumidifier air duct and supporting element are located on the downside of refrigeration component, and the shells temperature such as projection chip is lower than to the mould of environment temperature
In group is wrapped in, the refrigeration system pipeline is pierced by from its wall surface, and the dehumidifier is mounted on dehumidifier air duct and supporting element
At lower ending opening.Advantage is that it may be implemented to form dry air around the low-temperature surfaces such as projection chip, refrigeration component
Atmosphere prevents the generation of dew condensation phenomenon.
Preferably, the refrigeration component includes soaking plate, TEC and water-cooled plate, and the soaking plate is located under projection chip
End, the TEC are located at the lower end of soaking plate, and the water-cooled plate is located at the lower end of TEC, and its left and right ends is with refrigeration respectively
System piping connection.Advantage is that it may be implemented to be formed around the low-temperature surfaces such as projection chip, TEC, soaking plate and water-cooled plate
Dry air atmosphere prevents the generation of dew condensation phenomenon.
Preferably, heat-conducting interface material is filled between the projection chip, soaking plate, TEC and water-cooled plate contact surface.It is excellent
Point is that heat-conducting interface material can quickly transmit heat to cooling medium, to reach the result of fast cooling.
Preferably, the refrigeration component is the special-shaped water-cooled plate directly contacted with projection chip lower end radiating surface, and its
Left and right ends are connect with refrigeration system pipeline respectively.Advantage is to eliminate the intermediate ring of TEC and two layers of heat-conducting interface material
Section, so that the heat of projection chip directly passes through water-cooled plate and passes to cooling medium in refrigeration system, to improve entire
The efficiency of refrigeration system.
Preferably, heat-conducting interface material is filled between the special-shaped water-cooled plate and projection chip contact surface.Advantage is
Heat-conducting interface material can quickly transmit heat to cooling medium, to reach the result of fast cooling.
Preferably, pump, water tank, cold row and fan are generally included inside the refrigeration system.
3. beneficial effect
Compared with the prior art, utility model has the advantages that
(1) this programme is added to dehumidifier and dehumidifier air duct and supporting element compared with the existing technology, may be implemented throwing
Dry air atmosphere is formed around the low-temperature surfaces such as shadow chip, refrigeration component, prevents the generation of dew condensation phenomenon.
(2) heat-conducting interface material is filled between the projection chip in this programme, soaking plate, TEC and water-cooled plate contact surface,
Its heat-conducting interface material can quickly transmit heat to cooling medium, to reach the result of fast cooling.
(3) intermediate link of TEC and two layers of heat-conducting interface material are eliminated in this programme, so that the heat of projection chip
The cooling medium in refrigeration system is directly passed to by water-cooled plate, to improve the efficiency of entire refrigeration system.
(4) heat-conducting interface material, thermally conductive boundary are filled between special-shaped water-cooled plate and projection chip contact surface in this programme
Plane materiel material can quickly transmit heat to cooling medium, to reach the result of fast cooling.
Detailed description of the invention
Fig. 1 is the schematic structural diagram of the first embodiment of the utility model；
Fig. 2 is the schematic structural diagram of the second embodiment of the utility model；
Figure label explanation:
201 projection chips, 202 projection chip supporting elements, 203 soaking plates, 204 TEC, 205 water-cooled plates, 206 refrigeration systems
Pipeline, 207 refrigeration systems, 208 projection chip radiating surface monitoring temperature points, 209 dehumidifier air ducts and supporting element, 210 dehumidifiers.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe；Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment, based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
In the description of the present invention, it should be noted that term " on ", "lower", "inner", "outside", " top/bottom end " etc.
The orientation or positional relationship of instruction is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of description the utility model
It is described with simplifying, rather than the device or element of indication or suggestion meaning must have a particular orientation, with specific orientation structure
It makes and operates, therefore should not be understood as limiting the present invention.In addition, term " first ", " second " are only used for description mesh
, it is not understood to indicate or imply relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " being provided with ", " be arranged/connect ", " connection " etc., shall be understood in a broad sense, such as " connection ", may be a fixed connection, can also be with
It is to be detachably connected, or be integrally connected；It can be mechanical connection, be also possible to be electrically connected；It can be directly connected, it can also be with
Indirectly connected through an intermediary, it can be the connection inside two elements.For the ordinary skill in the art, may be used
The concrete meaning of above-mentioned term in the present invention is understood with concrete condition.
Embodiment 1:
Fig. 1 shows the first embodiment of present device.As shown in Figure 1, a kind of projection chip that can be anti-condensation is cooling
System, including projection chip 201, the projection chip supporting element 202 positioned at 201 lower end of projection chip, refrigeration component, refrigeration system
Pipeline 206, refrigeration system 207 and projection chip radiating surface monitoring temperature point 208, refrigeration component are located under projection chip 201
End, refrigeration system 207 are located at the downside of water-cooled plate 205, and refrigeration system pipeline 206 is respectively by water-cooled plate 205 and refrigeration system 207
Left end and right end connect to form a loop, projection chip radiating surface monitoring temperature point 208 is located at projection chip
201 lower end, projection chip cooling system that can be anti-condensation further includes dehumidifier 210 and dehumidifier air duct and supporting element 209, is removed
Wet device air duct and supporting element 209 are located on the downside of refrigeration component, and the shells temperature such as projection chip 201 are lower than to the mould group packet of environment temperature
In being rolled in, refrigeration system pipeline 206 is pierced by from its wall surface, and dehumidifier 210 is mounted on the lower end in dehumidifier air duct and supporting element 209
Opening.The component that freezes includes soaking plate 203, TEC204 and water-cooled plate 205, and soaking plate 203 is located under projection chip 201
End, TEC204 are located at the lower end of soaking plate 203, and water-cooled plate 205 is located at the lower end of TEC204, and its left and right ends respectively with system
Cooling system pipeline 206 connects.Filled with thermally conductive between projection chip 201,205 contact surface of soaking plate 203, TEC204 and water-cooled plate
Boundary material.
The course of work of first embodiment are as follows: heat radiates from projection chip 201 to be exported, by soaking plate 203, thermoelectricity system
Cooler TEC204,205 shell of water-cooled plate, pass to the coolant liquid in water-cooling system, and coolant temperature raising is taken away heat, recycled
At to cold row, heat exchange is carried out with surrounding air and releases heat, temperature is circulated again into water-cooled plate 205 and absorbs heat after reducing,
It loops back and forth like this to achieve the purpose that cool down to projection chip 201.Dehumidifier 210 sucks ambient air simultaneously, through removing
Dry air after wet blows to the low-temperature surfaces such as projection chip 201, soaking plate 203, TEC204, water-cooled plate 205, in these low temperature
Dry air atmosphere is formed around surface.Advantage in this present embodiment projection chip 201, soaking plate 203, TEC204 and
Heat-conducting interface material is filled between 205 contact surface of water-cooled plate, heat-conducting interface material can quickly transmit heat to cooling
Medium, to reach the result of fast cooling；Dehumidifier 210 in the present embodiment and dehumidifier air duct and supporting element 209 simultaneously
It may be implemented to form dry air atmosphere around the low-temperature surfaces such as projection chip 201, refrigeration component, prevent dew condensation phenomenon
Occur.
Embodiment 2:
Fig. 2 shows the second embodiments of present device.As shown in Fig. 2, a kind of projection chip that can be anti-condensation is cooling
System, including projection chip 201, the projection chip supporting element 202 positioned at 201 lower end of projection chip, refrigeration component, refrigeration system
Pipeline 206, refrigeration system 207 and projection chip radiating surface monitoring temperature point 208, refrigeration component are located under projection chip 201
End, refrigeration system 207 are located at the downside of water-cooled plate 205, and refrigeration system pipeline 206 is respectively by water-cooled plate 205 and refrigeration system 207
Left end and right end connect to form a loop, projection chip radiating surface monitoring temperature point 208 is located at projection chip
201 lower end, projection chip cooling system that can be anti-condensation further includes dehumidifier 210 and dehumidifier air duct and supporting element 209, is removed
Wet device air duct and supporting element 209 are located on the downside of refrigeration component, and the shells temperature such as projection chip 201 are lower than to the mould group packet of environment temperature
In being rolled in, refrigeration system pipeline 206 is pierced by from its wall surface, and dehumidifier 210 is mounted on the lower end in dehumidifier air duct and supporting element 209
Opening.Refrigeration component is the special-shaped water-cooled plate 205 directly contacted with 201 lower end radiating surface of projection chip, and its left and right two
End is connect with refrigeration system pipeline 206 respectively.Thermally conductive boundary is filled between 201 contact surface of special-shaped water-cooled plate 205 and projection chip
Plane materiel material.
The course of work of second embodiment are as follows: heat radiates from projection chip 201 to be exported, and special-shaped water-cooled plate is directly over
205 shells pass to the coolant liquid in water-cooling system, and coolant temperature raising is taken away heat, is recycled at cold row, with environment sky
Gas carries out heat exchange and releases heat, and temperature is circulated again into water-cooled plate 205 and absorbs heat, loops back and forth like this to reach after reducing
The purpose to cool down to projection chip 201.Dehumidifier 210 sucks ambient air simultaneously, and the dry air after dehumidifying blows to
The low-temperature surfaces such as projection chip 201 and special-shaped water-cooled plate 205, form dry air atmosphere around these low-temperature surfaces.It is excellent
Point is in the intermediate link for eliminating TEC and two layers of heat-conducting interface material in this present embodiment, so that the heat of projection chip 201
Amount directly passes to the cooling medium in refrigeration system by water-cooled plate 205, to improve the efficiency of entire refrigeration system；Together
When the present embodiment in dehumidifier 210 and dehumidifier air duct and supporting element 209 may be implemented in projection chip 201, water-cooled plate 205
Low-temperature surface around form dry air atmosphere, prevent the generation of dew condensation phenomenon, and heat-conducting interface material can be quick
Transmitting heat to cooling medium, to reach the result of fast cooling.
Projection chip provided by the utility model, projection chip supporting element, TEC, soaking plate, water-cooled plate, refrigeration system,
Refrigeration system pipeline, projection chip radiating surface monitoring temperature point, dehumidifier, dehumidifier air duct and supporting element；Projection chip, projection
Wafer support part, TEC, soaking plate, water-cooled plate, refrigeration system, refrigeration system pipeline, projection chip radiating surface monitoring temperature point are equal
For existing independent structure, what installation form and connection structure were well known to the skilled person, therefore it is not complete
Concrete shape and connection structure between complete open separate part, the utility model using external active refrigeration equipment (cooling-water machine,
Fluorine cool equipment etc.), for refrigeration system to include pump, water tank, cold row and fan, the structure and connection type of application are existing
There is technology, be existing the open scope, be not the innovative point of the utility model, is operated for technical field described in the utility model
Personnel general form and structure, so the utility model does not disclose one by one.
The preferable specific embodiment of the above, only the utility model；But the protection scope of the utility model is not
It is confined to this.Anyone skilled in the art is within the technical scope disclosed by the utility model, practical according to this
Novel technical solution and its improvement design is subject to equivalent substitution or change, should all cover in the protection scope of the utility model
It is interior.
Claims (6)
1. the projection chip cooling system that one kind can be anti-condensation, including projection chip (201), the projection positioned at projection chip lower end
Wafer support part (202), refrigeration component, refrigeration system pipeline (206), refrigeration system (207) and projection chip radiating surface temperature
Monitoring point (208), the refrigeration component are located at the lower end of projection chip (201), and the refrigeration system (207) is located at refrigeration component
Downside, the refrigeration system pipeline (206) respectively will refrigeration component and the left end of refrigeration system (207) connected with right end
A loop is formed, the projection chip radiating surface monitoring temperature point (208) is located at the lower end of projection chip (201),
Be characterized in that: the projection chip cooling system that this can be anti-condensation further includes dehumidifier (210) and dehumidifier air duct and supporting element
(209), the dehumidifier air duct and supporting element (209) are located on the downside of refrigeration component, and the shells temperature such as projection chip (201) are lower than
In the mould group of environment temperature is wrapped in, the refrigeration system pipeline (206) is pierced by from its wall surface, dehumidifier (210) installation
At the lower ending opening of dehumidifier air duct and supporting element (209).
2. the projection chip cooling system that one kind according to claim 1 can be anti-condensation, it is characterised in that: the refrigeration structure
Part includes soaking plate (203), TEC (204) and water-cooled plate (205), and the soaking plate (203) is located under projection chip (201)
End, the TEC (204) are located at the lower end of soaking plate (203), and the water-cooled plate (205) is located at the lower end of TEC (204), and its
Left and right ends are connect with refrigeration system pipeline (206) respectively.
3. the projection chip cooling system that one kind according to claim 2 can be anti-condensation, it is characterised in that: the projection core
Heat-conducting interface material is filled between piece (201), soaking plate (203), TEC (204) and water-cooled plate (205) contact surface.
4. the projection chip cooling system that one kind according to claim 1 can be anti-condensation, it is characterised in that: the refrigeration structure
Part is the special-shaped water-cooled plate (205) directly contacted with projection chip lower end radiating surface, and its left and right ends is with refrigeration respectively
Road (206) connection under the overall leadership.
5. the projection chip cooling system that one kind according to claim 4 can be anti-condensation, it is characterised in that: the abnormal shape water
Heat-conducting interface material is filled between cold plate (205) and projection chip contact surface.
6. the projection chip cooling system that one kind according to claim 1 can be anti-condensation, it is characterised in that: the refrigeration system
It include pump, water tank, cold row and fan inside system (207).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920367077.0U CN209624965U (en) | 2019-03-21 | 2019-03-21 | A kind of projection chip cooling system that can be anti-condensation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920367077.0U CN209624965U (en) | 2019-03-21 | 2019-03-21 | A kind of projection chip cooling system that can be anti-condensation |
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| CN209624965U true CN209624965U (en) | 2019-11-12 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109901351A (en) * | 2019-03-21 | 2019-06-18 | 中影光峰激光影院技术（北京）有限公司 | A kind of projection chip cooling system that can be anti-condensation |
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- 2019-03-21 CN CN201920367077.0U patent/CN209624965U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109901351A (en) * | 2019-03-21 | 2019-06-18 | 中影光峰激光影院技术（北京）有限公司 | A kind of projection chip cooling system that can be anti-condensation |
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