CN103809462A - 模拟方法及程序、模拟器、加工设备和制造半导体装置的方法 - Google Patents

模拟方法及程序、模拟器、加工设备和制造半导体装置的方法 Download PDF

Info

Publication number
CN103809462A
CN103809462A CN201310507750.3A CN201310507750A CN103809462A CN 103809462 A CN103809462 A CN 103809462A CN 201310507750 A CN201310507750 A CN 201310507750A CN 103809462 A CN103809462 A CN 103809462A
Authority
CN
China
Prior art keywords
flux
workpiece
processing
simulation
calculation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201310507750.3A
Other languages
English (en)
Chinese (zh)
Inventor
久保井信行
木下隆
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Publication of CN103809462A publication Critical patent/CN103809462A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/20—Design optimisation, verification or simulation
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2111/00—Details relating to CAD techniques
    • G06F2111/10—Numerical modelling

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Management, Administration, Business Operations System, And Electronic Commerce (AREA)
  • Drying Of Semiconductors (AREA)
CN201310507750.3A 2012-11-07 2013-10-24 模拟方法及程序、模拟器、加工设备和制造半导体装置的方法 Pending CN103809462A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2012245316A JP5974840B2 (ja) 2012-11-07 2012-11-07 シミュレーション方法、シミュレーションプログラム、シミュレータ、加工装置、半導体装置の製造方法
JP2012-245316 2012-11-07

Publications (1)

Publication Number Publication Date
CN103809462A true CN103809462A (zh) 2014-05-21

Family

ID=50623163

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201310507750.3A Pending CN103809462A (zh) 2012-11-07 2013-10-24 模拟方法及程序、模拟器、加工设备和制造半导体装置的方法

Country Status (3)

Country Link
US (1) US9881104B2 (enExample)
JP (1) JP5974840B2 (enExample)
CN (1) CN103809462A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108663990A (zh) * 2018-04-16 2018-10-16 华中科技大学 一种基于两级体素化模型的多轴加工干涉检测与处理方法
CN108932922A (zh) * 2018-07-03 2018-12-04 京东方科技集团股份有限公司 一种修复能力测试装置及方法
CN113420523A (zh) * 2016-06-21 2021-09-21 朗姆研究公司 经边缘放置误差预测的光致抗蚀剂设计布局图案邻近校正

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5685762B2 (ja) * 2011-03-07 2015-03-18 みずほ情報総研株式会社 プラズマ加工形状シミュレーション装置及びプログラム
US20170062286A1 (en) 2015-09-01 2017-03-02 Kabushiki Kaisha Toshiba Semiconductor manufacturing method and semiconductor manufacturing apparatus
US10599789B2 (en) * 2015-11-25 2020-03-24 Synopsys, Inc. Topography simulation of etching and/or deposition on a physical structure
JP2018067677A (ja) * 2016-10-21 2018-04-26 ソニーセミコンダクタソリューションズ株式会社 ダメージ予測方法、プログラム、および半導体加工システム
US10677586B2 (en) * 2018-07-27 2020-06-09 Kla-Tencor Corporation Phase revealing optical and X-ray semiconductor metrology
US11610297B2 (en) * 2019-12-02 2023-03-21 Kla Corporation Tomography based semiconductor measurements using simplified models

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2888240B1 (ja) * 1998-03-26 1999-05-10 日本電気株式会社 スパッタ形状シミュレーション方法
JP2002050553A (ja) 2000-07-31 2002-02-15 Toshiba Corp 形状シミュレーション方法および形状シミュレーションを行うプログラムを記憶したコンピュータ読み取り可能な記憶媒体
US9037445B2 (en) * 2007-07-10 2015-05-19 University of Pittsburgh—of the Commonwealth System of Higher Education Flux balance analysis with molecular crowding
JP5087386B2 (ja) * 2007-12-18 2012-12-05 オリンパス株式会社 顕微鏡
JP5428450B2 (ja) * 2009-03-30 2014-02-26 ソニー株式会社 イオン照射ダメージの予測方法とイオン照射ダメージのシミュレータ、およびイオン照射装置とイオン照射方法
EP2515168B1 (en) * 2011-03-23 2021-01-20 ASML Netherlands B.V. Methods and apparatus for calculating electromagnetic scattering properties of a structure and for reconstruction of approximate structures

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113420523A (zh) * 2016-06-21 2021-09-21 朗姆研究公司 经边缘放置误差预测的光致抗蚀剂设计布局图案邻近校正
CN108663990A (zh) * 2018-04-16 2018-10-16 华中科技大学 一种基于两级体素化模型的多轴加工干涉检测与处理方法
CN108663990B (zh) * 2018-04-16 2019-11-22 华中科技大学 一种基于两级体素化模型的多轴加工干涉检测与处理方法
CN108932922A (zh) * 2018-07-03 2018-12-04 京东方科技集团股份有限公司 一种修复能力测试装置及方法

Also Published As

Publication number Publication date
US20140129203A1 (en) 2014-05-08
US9881104B2 (en) 2018-01-30
JP5974840B2 (ja) 2016-08-23
JP2014096400A (ja) 2014-05-22

Similar Documents

Publication Publication Date Title
CN103809462A (zh) 模拟方法及程序、模拟器、加工设备和制造半导体装置的方法
JP6173889B2 (ja) シミュレーション方法、シミュレーションプログラム、加工制御システム、シミュレータ、プロセス設計方法およびマスク設計方法
JP5428450B2 (ja) イオン照射ダメージの予測方法とイオン照射ダメージのシミュレータ、およびイオン照射装置とイオン照射方法
JP6177671B2 (ja) シミュレーション方法、シミュレーションプログラムおよびシミュレータ
JP6065612B2 (ja) シミュレーション方法、シミュレーションプログラム、加工装置およびシミュレータ
JP5732843B2 (ja) シミュレータ、加工装置、ダメージ評価方法、及び、ダメージ評価プログラム
JP2019003651A (ja) 仮想半導体デバイス製作環境におけるキーパラメータ識別、プロセスモデル較正、及び変動性解析のためのシステムと方法
Reiter et al. Impact of plasma induced damage on the fabrication of 3D NAND flash memory
US10534355B2 (en) Information processing device, processing device, prediction method, and processing method
Guo et al. Optimizing plasma etching: Integrating precise three-dimensional etching simulation and machine learning for multi-objective optimization
Huang et al. Process optimization for shallow trench isolation etch using computational models
Ertl Numerical methods for topography simulation
US10403516B2 (en) Etching characteristic estimation method, program, information processing apparatus, processing apparatus, designing method, and production method
KR102495390B1 (ko) 데미지 예측 방법, 프로그램, 및 반도체 가공 시스템
Dunn et al. Guiding gate-etch process development using 3D surface reaction modeling for 7nm and beyond
Bobinac et al. Impact of mask tapering on SF6/O2 plasma etching
Ventzek et al. Etch aware computational patterning in the era of atomic precision processing
Reiter et al. Fast 3D Flux Calculation using Monte Carlo Ray Tracing on GPUs
Reiter et al. Impact of Ion Energy and Yield in Oblique Ion Beam Etching Process for Blazed Gratings
WO2020226064A1 (ja) 欠陥密度計算方法、欠陥密度計算プログラム、欠陥密度計算装置、熱処理制御システムおよび加工制御システム
CN120917549A (zh) 计算机程序、信息处理方法以及信息处理装置
CN119317733A (zh) 成膜模拟方法、成膜模拟程序、成膜模拟器和成膜装置

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C02 Deemed withdrawal of patent application after publication (patent law 2001)
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20140521