CN103805963A - Film forming apparatus - Google Patents
Film forming apparatus Download PDFInfo
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- CN103805963A CN103805963A CN201310424602.5A CN201310424602A CN103805963A CN 103805963 A CN103805963 A CN 103805963A CN 201310424602 A CN201310424602 A CN 201310424602A CN 103805963 A CN103805963 A CN 103805963A
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- 230000008021 deposition Effects 0.000 claims description 47
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- 238000012423 maintenance Methods 0.000 abstract description 8
- 238000000151 deposition Methods 0.000 description 41
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- 238000009792 diffusion process Methods 0.000 description 6
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02104—Forming layers
- H01L21/02365—Forming inorganic semiconducting materials on a substrate
- H01L21/02612—Formation types
- H01L21/02617—Deposition types
- H01L21/02631—Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Materials Engineering (AREA)
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- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
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Abstract
The invention provides a film forming apparatus. In a standing type film forming apparatus, the periphery of a main cylinder is preferably covered. According to the film forming apparatus (1) in the embodiments, the movement of an outer edge (31) in the horizontal direction is restricted by a support part (33). Therefore, the outer edge (31) is free of falling down and can maintain the support state supported by the support part (33). Moreover, the film forming apparatus can rotate by means of the outer edge (31) to enable the thickness of an attachment to be all over the entire periphery uniformly and generally. Therefore, the maintenance frequency can be greatly reduced.
Description
Technical field
The application advocates the right of priority of No. 2012-247563rd, Japanese patent application based on November 9th, 2012 application.The full content of this application is by reference to being applied in this specification sheets.
The present invention relates to a kind of film deposition system.
Background technology
In the film that is formed film by film forming matter surface, for example there is ion plating method.In ion plating method, make the film forming material of evaporation at vacuum vessel internal diffusion, and film forming material is attached to by film forming matter surface.For the film deposition system of ion plating method, exist the part in the film forming material of diffusion to rest near this film forming material, main cupola well and supporting electrode are ring oven cylinder and the situation of piling up to be attached to the main anode that is held in mould material.Along with the accumulating amount of film forming material increases, there is the situation of main cupola well and the short circuit of ring oven cylinder.
As the method for the above-mentioned necessity of reply, for example as described in Patent Document 1, known have a following method, between main cupola well and ring oven cylinder, configures the outer rim (cover) of multiple cover ring cupola wells, the outer rim of utilizing operating gear periodic replacement film forming material to pile up.
Patent documentation 1: TOHKEMY 2008-348318 communique
Wherein, the film deposition system of patent documentation 1 is to be become the roughly mode of vertical direction by film forming matter with the tabular thickness of slab direction by film forming matter to be disposed at the horizontal film deposition system of the what is called being transferred in vacuum vessel.Therefore, overlapping multiple outer rims around main cupola well, but do not fix outer rim and just placement, can utilize thus operating gear to change like a cork those outer rims.But, when this structure is applicable to vertical film formation apparatus that the mode to be become general horizontal direction by the thickness of slab direction of film forming matter carries, there is the problems such as loose outer rim drops, thereby cannot be suitable for.
Summary of the invention
Therefore, the object of the present invention is to provide a kind of film deposition system that can cover with optimal way main cupola well periphery in vertical film formation apparatus.
Film deposition system involved in the present invention is for to heat film forming material by beam-plasma, and the particle being gasified by film forming material is attached to by the film deposition system on film forming matter, this film deposition system possesses: as the main cupola well of main anode, it has the hole that along continuous straight runs runs through to be held in mould material, and import beam-plasma to film forming material, or be imported into beam-plasma; Outer rim, it surrounds main cupola well, and has tooth portion; Rotating part, it gives main cupola well revolving force around by engaging with the tooth portion of outer rim to outer rim; And support unit, it is arranged between main cupola well and outer rim, the movement in the horizontal direction of restriction outer rim, and outer rim is supported as rotating.
Film deposition system involved in the present invention, because it is the vertical film formation apparatus that main cupola well has the hole that along continuous straight runs runs through, the outer rim of therefore surrounding main cupola well becomes along continuous straight runs and extends and configure.For this configuration, limit the movement in the horizontal direction of outer rim by support unit.Therefore, outer rim can not drop and maintain the state being supported by support unit.And outer rim is endowed revolving force and can be rotated around main cupola well from rotating part via tooth portion.Therefore the film forming material, evaporating can not concentrate on a place with respect to outer rim and adhere to but spread all over complete cycle and adhere to equably.Therefore, the deposition efficiency of each outer rim can be improved, and frequency of maintenance can be significantly reduced.As more than, in vertical film formation apparatus, can cover main cupola well periphery with optimal way.
In film deposition system involved in the present invention, the blade of the dirt settling of the leading section of the main cupola well of cutting can be installed in outer rim.Thus, along with the rotation of outer rim, blade can cut main cupola well leading section dirt settling while rotate.Thus, can prevent that dirt settling is piled up in the leading section of main cupola well.
In film deposition system involved in the present invention, the leading section of outer rim can turn back towards inner circumferential side.According to this structure, even if dirt settling is stripped from outer rim, also can stop with the leading section being folded back.Thus, can prevent that dirt settling from dropping from outer rim.
In film deposition system involved in the present invention, support unit also can be made up of pottery.The thermotolerance of pottery is higher, and in the time that outer cause metallic substance forms, support unit can be made as the material different from the outer rim supporting, and therefore can prevent sintering etc.Therefore, can make outer rim rotate swimmingly.
Invention effect
In vertical film formation apparatus, can cover main cupola well periphery according to the present invention with optimal way.
Accompanying drawing explanation
Fig. 1 is the vertical view cutaway drawing that represents the structure of the related film deposition system of the 1st embodiment of the present invention.
Fig. 2 is the side view cutaway drawing of the structure of the main cupola well mechanism periphery in Watch with magnifier diagram 1.
Fig. 3 is main cupola well in Watch with magnifier diagram 2 and the side view cutaway drawing of outer rim.
Fig. 4 observes gear Fig. 3 and the figure of rotating part from X-axis negative direction.
Fig. 5 is the enlarged view of support unit peripheral structure.
Fig. 6 amplifies to represent the main cupola well of the related film deposition system of the 2nd embodiment of the present invention and the side view cutaway drawing of outer rim.
Fig. 7 is the figure that observes the outer rim shown in Fig. 6 from X-axis positive dirction.
Fig. 8 amplifies to represent the main cupola well of the related film deposition system of the 3rd embodiment of the present invention and the side view cutaway drawing of outer rim.
Fig. 9 observes gear Fig. 8 and the figure of rotating part from X-axis negative direction.
In figure: 1-film deposition system, the main cupola well of 21-, 31-outer rim, 33-support unit, 39,91-gear, 40,90-tooth portion, 71-rotating part, 81-blade, Ma-film forming material.
Embodiment
Below, with reference to accompanying drawing, the embodiment based on film deposition system of the present invention is elaborated.In addition, in accompanying drawing explanation, give same-sign to identical important document, and omit repeat specification.
[the 1st embodiment]
Fig. 1 is the vertical view cutaway drawing that represents the structure of an embodiment of film deposition system of the present invention.Fig. 2 is the side view cutaway drawing of the structure of the main cupola well mechanism periphery in Watch with magnifier diagram 1.The so-called ion plating apparatus of the film deposition system 1 of present embodiment for using in ion plating method.In addition, for convenience of description, the system of XYZ coordinate shown in Fig. 1.Y direction is that conveying is described later by the direction of film forming matter.X-direction is by the opposed direction of film forming matter and cupola well mechanism described later.Z-direction is and X-direction and the orthogonal direction of Y direction.
As shown in Figure 1, the film deposition system 1 of present embodiment is so-called vertical film formation apparatus, by film forming matter in the tabular mode that is become horizontal direction by the thickness of slab direction of film forming matter, with by state configuration upright by film forming matter or that tilt with the state from upright in vacuum vessel and be transferred.Now, X-direction is horizontal direction and for by the thickness of slab direction of film forming matter, Y direction is horizontal direction, and Z-direction becomes vertical direction.
The film deposition system 1 of present embodiment possesses cupola well mechanism 2, transfer mechanism 3, ring oven cylinder 6, plasma source 7, pressure regulation device 8 and vacuum vessel 10.
Transfer mechanism 3 along throughput direction A carry with the opposed state of film forming material Ma keep by film forming matter 11 by film forming matter holding member 16.Transfer mechanism 3 is made up of the multiple conveying rollers 15 that are arranged in conveying chamber 10a.Conveying roller 15 uniformly-spaced configures along throughput direction A, and supporting is by film forming matter holding member 16 time, and along throughput direction, A carries.In addition, for example used the plate-shaped member such as glass substrate or plastic base by film forming matter 11.
Plasma source 7 is pressure gradient type, its main part via be arranged on the 10b of filming chamber sidewall plasma mouth 10c and be connected in the 10b of filming chamber.The beam-plasma P generating at plasma source 7 penetrates in the 10b of filming chamber from plasma mouth 10c.The ejaculation direction of beam-plasma P is arranged at the coil (not shown) that turns to of plasma mouth 10c and controls.
As shown in Figure 2, main cupola well 21 have be filled with film forming material Ma the positive dirction along X-direction extend tubular filling part 21a and from the outstanding flange part 21b of filling part 21a.The earthing potential that main cupola well 21 has with respect to vacuum vessel 10 remains positive potential, therefore attracts beam-plasma P.On the filling part 21a of the main cupola well 21 of this beam-plasma P incident, be formed with the through hole 21c that along continuous straight runs (being X-direction) runs through, to be filled to mould material Ma.And the fore-end of film forming material Ma exposes to the 10b of filming chamber in one end of this through hole 21c.
Film forming material Ma can illustrate the insulated enclosure materials such as the transparent conductive material such as ITO and ZnO, SiON.When film forming material Ma is made up of insulativity material, if irradiate beam-plasma P to main cupola well 21, main cupola well 21 is by be heated from the electric current of beam-plasma P, and the fore-end of film forming material Ma evaporates, by the Ionized film forming material particle of beam-plasma P Mb to the 10b of filming chamber internal diffusion.And, when film forming material Ma is made up of conductive material, if irradiate beam-plasma P to main cupola well 21, beam-plasma P is directly incident on film forming material Ma, the fore-end of film forming material Ma is heated and evaporate, by the Ionized film forming material particle of beam-plasma P Mb to the 10b of filming chamber internal diffusion.Film forming material particle Mb to the 10b of filming chamber internal diffusion moves to the X-axis positive dirction of the 10b of filming chamber, in conveying chamber 10a, is attached to by the surface of film forming matter 11.In addition, film forming material Ma is the solids that is configured as the cylindrical shape of predetermined length, and multiple film forming material Ma are disposable to be filled in cupola well mechanism 2.And, according to the consumption of film forming material Ma, from the X-axis negative direction side film extrusion material Ma successively of cupola well mechanism 2, so that the fore-end of the film forming material Ma of side and the upper end of main cupola well 21 keep preposition relation foremost.As shown in Figure 2, be provided with introduction part 22 in the X-axis negative direction side of cupola well mechanism 2, this introduction part imports film forming material Ma from the device for supplying film forming material (not shown) in the outside that is arranged at vacuum vessel 10 to the filling part 21a of main cupola well 21.Introduction part 22 run through the 10d of wall portion of vacuum vessel 10 and extend to the X-axis negative direction of the filling part 21a of main cupola well 21 on the opposed position of leading section.Introduction part 22 has the through hole 22a that film forming material Ma is passed through along X-direction extension.And, in the through hole 22a of introduction part 22, be provided with the extrusion stem 23 for the filling part 21a film extrusion material Ma to main cupola well 21.
The cupola well mechanism 2 of the related film deposition system 1 of present embodiment possesses cover structure 30, and this cover structure is piled up in the main cupola well 21 that causes main cupola well 21 around and the short circuit of ring oven cylinder 6 for preventing because of film forming material Ma when the film forming.With reference to figure 2～Fig. 5, this cover structure 30 is elaborated.Fig. 3 is the enlarged view of the filling part 21a of the main cupola well 21 shown in Fig. 2 and the structure of outer rim 31 peripheries.Fig. 4 is the figure that observes gear 39 and rotating part 71 from X-axis negative direction.Fig. 5 is the enlarged view of support unit 33 peripheral structures.
As shown in Figures 2 and 3, cover structure 30 possesses: outer rim 31, and it surrounds the filling part 21a of main cupola well 21; Inner cover 32, it is more surrounding the filling part 21a of main cupola well 21 by inner circumferential side than outer rim 31; Support unit 33, it supports outer rim 31 for being rotated; And drives structure 34, it is for rotating outer rim 31.In addition, in the related film deposition system 1 of present embodiment, outer rim 31 is set to the filling part 21a bias with respect to main cupola well 21, though the central axis C L2 of the central axis C L1 of filling part 21a and outer rim 31 be parallel to each other, its setting position mutually internally inconsistent (with reference to figure 3 and Fig. 4).But the position relationship of central axis C L1 and central axis C L2 is not limited to shown in the accompanying drawing of present embodiment, can be also consistent with each other.
As shown in Figure 3, outer rim 31 is the cylindric end container that has.Outer rim 31 has: side wall portion 36, and it surrounds the filling part 21a of main cupola well 21; Bottom 37, it is arranged on the end of the side wall portion 36 of base end side (X-axis negative direction); Lid 38, it is arranged on bottom 37; And gear 39, it is provided with tooth portion 40.And, in outer rim 31, be formed with to insert and wear the filling part 21a of main cupola well 21 and the through hole 42 of inner cover 32.Observe from central axis CL2 direction, through hole 42 is the circle centered by this central axis C L2.
The side wall portion 36 of outer rim 31 is warpage at the 10b of filming chamber side opening gradually towards side., side wall portion 36 is along with expanding to outer circumferential side towards front (X-axis positive dirction).In present embodiment, side wall portion 36 has towards front successively from bottom 37 sides: horizontal part 36a, and it extends from bottom 37 along continuous straight runs; Rake 36b, it tilts with respect to central axis C L2 in the mode expanding towards front; Bend 36c, it is bent into from the front of rake 36b and further expands; Horizontal part 36d, its front end edge horizontal direction from bend 36c is extended; And leading section 36e, it turns back towards inner circumferential side in the mode substantially vertical with central axis C L2.So because leading section 36e turns back to inner circumferential side, and form spatial portion SP(Fig. 3 that section is U-shaped in the region being surrounded by this leading section 36e, bend 36c and horizontal part 36d in, possesses the part of pears skin pattern).When the film forming material D1 that is attached to the film forming material D2 of outer rim 31 or is attached to main cupola well 21 is stripped from, the leading section 36e of the film forming material D1 that can be stripped to turn back stops, and can lodge in spatial portion SP in order to avoid drop from outer rim 31.In addition, the shape of the side wall portion 36 of outer rim 31 is not limited to the shape of present embodiment, can adopt different shape.For example, also can with towards front gradually bending mode expand.And, although thereby in order to ensure the SP of larger space portion, horizontal part 36d being set makes section be U-shaped, and the shape of spatial portion SP does not limit.For example, also can horizontal part 36d be set and directly turn back from bend 36c or rake 36b.And, can also not turn back at leading section.
The end of bottom 37 base end sides from side wall portion 36 (X-axis negative direction) expands towards inner circumferential side to become substantially vertical mode with central axis C L2.Bottom 37 is circular consistent with central axis C L2 of its central axis.And bottom 37 has the inner peripheral surface 37c(of a part that forms through hole 42 with reference to figure 5).In addition, for the detailed construction of this through hole 42, will together carry out aftermentioned with the explanation of support unit 33.The end face of the end face 37a(X axle negative direction of bottom 37 base end side) on be formed with circular slot part 37b, so that lid 38 to be installed.On this slot part 37b, circular lid 38 is installed.The central axis of lid 38 is consistent with the central axis C L2 of outer rim 31.After assembling support unit 33, lid 38 is installed on bottom 37, thus, and as playing a role for preventing the lid that this support unit 33 departs from.Lid 38 has the inner peripheral surface 38c of a part that forms through hole 42.
At this, utilize Fig. 5 to be described in detail the structure of support unit 33 peripheries.As shown in Figure 5, on the surface of the through hole 42 of outer rim 31, be formed with the slot part 54 for holding support unit 33.And, on the periphery 49c of the flange part 49 of inner cover 32, be formed with the circular protuberance 56 side-prominent to periphery, on the periphery of this protuberance 56, be formed with the slot part 57 for holding support unit 33.The slot part 54 of outer rim 31 sides is formed on mutual opposed position with the slot part 57 of inner cover 32 sides, in the space being surrounded, is filled with multiple support units 33 by this slot part 54 and slot part 57.
Scarp 58,59,61,62 is supported by contact (allowing loosening a little) with support unit 33 respectively.According to this structure, with respect to the main cupola well 21 being fixed and inner cover 32, outer rim 31 can be rotated swimmingly, and restriction outer rim 31 vertical direction (Z-direction) on movement time, the also movement in limit levels direction (X-direction).In addition, the section shape of slot part 54,57 is not limited to V word shape described above, as long as limiting the shape of the movement in horizontal direction and the vertical direction of outer rim 31, just can adopt different shape.For example, can be also U-shaped or rectangular shape.
In addition, the protuberance 56 of inner cover 32 sides is formed on the position separating to base end side from the end face 49b of flange part 49, therefore between this end face 49b and protuberance 56, is formed with difference of height (jump).Towards this difference of height part, in outer rim 31, be formed with from inwardly all side-prominent protuberances 63 of inner peripheral surface 37c of the bottom 37 of this outer rim 31.The protuberance 63 of outer rim 31 sides configures in the mode mutually replacing with the protuberance 56 of inner cover 32 sides, and the section shape in the gap between outer rim 31 and inner cover 32 becomes the shape that is bent into crank-like on than the more forward distolateral region of support unit 33 thus.The particle of the film forming material that thus, can suppress to have evaporated enters near support unit 33.
Return to Fig. 2 and Fig. 3, the structure of drives structure 34 is described.As shown in Figures 2 and 3, drives structure has: rotating part 71, and it gives revolving force to outer rim 31; Axial region 72, its axle supports this rotating part 71; And driving part 73, it rotates axial region 72.Axial region 72 runs through the 10d of wall portion from the outside of vacuum vessel 10 and extends to the position of the tooth portion 40 of outer rim 31 along X-direction.Driving part 73 is arranged at the outside of vacuum vessel 10, and has the turning axle 73a extending along Z-direction.In order to transmit the revolving force of driving part 73 to axial region 72, on turning axle 73a, be provided with cone gear 74, on the end of axial region 72, be provided with the cone gear 76 engaging with this cone gear 74.Wherein, the transmission mechanism of the revolving force between driving part 73 and axial region 72 is not limited to this structure, can adopt various mechanisms.And at the arranged outside of the 10d of wall portion of vacuum vessel 10 fluid bearing 77 that is magnetic, axial region 72 is inserted this magnetic fluid bearing 77 and to the interior extension of vacuum vessel 10.Vacuum vessel 10 passes through magnetic fluid bearing 77 by vacuum-sealing.In addition, insulation shaft joint and mechanical shaft joint etc. can be set in the half-way of axial region 72, but omit diagram in figure.
As shown in Figures 3 and 4, rotating part 71 is made up of the gear with the tooth portion 78 engaging with the tooth portion 40 of the gear 39 of outer rim 31.The tooth portion 78 of rotating part 71 is uniformly-spaced arranged to engage with the tooth portion 40 of the gear 39 of outer rim 31 around axial region 72.And rotating part 71 is configured on the position that can engage with this tooth portion 40 at the outer circumferential side of the tooth portion 40 of outer rim 31.In addition, as long as can engage with tooth portion 40, rotating part 71 also can be configured on any position, and central axis C L2 position around is also not limited to the position shown in Fig. 4, also can be configured on any position.By this drives structure 34, outer rim 31 is preferably carried out the continuous low speed rotation of rotation in every 1 hour 1～10 circle left and right.
Then, effect, the effect of the related film deposition system 1 of present embodiment are described.
First,, in order to compare with the related film deposition system 1 of present embodiment, the structure of the outer rim to horizontal film deposition system in the past describes.In horizontal film deposition system, overlapping multiple outer rims around main cupola well, but do not fix outer rim and just just configuration, if film forming material has been piled up, take out successively outer rim from internal layer side and change.Wherein, in the time changing outer rim, staff carries out the replacing of outer rim by manual operation special operation device.Operating gear can be enumerated for example staff, from the outside of vacuum vessel, the bar that hangs out and hang in freely of extruding, stretching, rotation, outer rim be operated and hang over the device that outer rim is changed.Or, can enumerate from the telescopic operating gear of top manual operation of main cupola well and change the device of outer rim.When this outer rim structure is in the past applicable in vertical film formation apparatus, become and make the configuration of outer rim from configuration (bottom of outer rim is configured in the below of vertical direction) vertical tilt in the past, therefore exist outer rim along continuous straight runs to fall down and come off and the problem such as drop from main cupola well.There is the problem that cannot be applicable to well vertical film formation apparatus in the structure of outer rim so, in the past.
On the contrary, in the related film deposition system 1 of present embodiment, the movement in the horizontal direction of outer rim 31 is supported parts 33 and limits.Therefore, outer rim 31 can not drop and can maintain the state that parts 33 support that is supported.
At this, about vertical film formation apparatus, be made as the structure of the bottom of fixed support outer rim only during in order to prevent dropping of outer rim, have to remove this fixed support and carry out withdrawing device, therefore cannot carry out with operating gear in the past the replacing of outer rim, when maintenance cost, frequency of maintenance likely uprises.But in present embodiment, outer rim 31 can be endowed revolving force and rotate around the filling part 21a of main cupola well 21 from rotating part 71 via tooth portion 40.Thus, the film forming material having evaporated can not concentrate on a place with respect to outer rim 31 and adhere to, and adheres to equably but can spread all over complete cycle.For example, the dirt settling of film forming material D2 as shown in Figure 3 is not only grown in segment set shown in the figure, can make it spread all over complete cycle and adhere to.Therefore, can improve the deposition efficiency of each outer rim 31., while adopting the structure of fixed support outer rim only, if grow at a part of dirt settling of outer rim, even if do not grow and how much also need to be serviced at other part dirt settlings.And in the present embodiment, rotate and can spread all over complete cycle by outer rim 31 and make the thickness of dirt settling roughly even.Therefore, can significantly reduce frequency of maintenance.And, in present embodiment, when outer rim 31 is maximized, can further reduce frequency of maintenance.For example, when the diameter of outer rim 31 is made as to A times, the surface-area of outer rim 31 becomes A2 doubly, therefore sometimes also frequency of maintenance can be made as (power of 1/A).And in previous methods, service intervals is decided by the distance between main cupola well and outer rim, therefore can only be made as 1/A left and right.And, without overlapping multiple outer rims, can reduce outer rim according to present embodiment.According to more than, in vertical film formation apparatus, can cover main cupola well periphery with optimal way.
And, as horizontal film deposition system in the past, overlapping multiple outer rims while changing with manual operation by operating gear need to temporarily stop the irradiation of beam-plasma in operation process, owing to being manual working, therefore there is the problem of the operation factor decline of film deposition system in addition.But, in present embodiment, by the spinning movement freely of outer rim 31, can prevent the short circuit of main cupola well 21 and ring oven cylinder 6.And the deposition efficiency of outer rim 31 is higher, therefore in long-time without safeguarding, until can make film deposition system continuous operation without stopping the irradiation of beam-plasma during maintenance next time.Therefore,, compared with the structure of outer rim in the past, can improve the operation factor of film deposition system 1.
And in the related film deposition system 1 of present embodiment, the leading section 36e of outer rim 31 turns back towards inner circumferential side.According to this structure, can stop the dirt settling of wanting the film forming material dropping in outer rim 31 with the leading section 36e being folded back.The dirt settling that thus, can prevent film forming material drops from outer rim 31.
[the 2nd embodiment]
In the cover structure 130 of the related film deposition system of the 2nd embodiment shown in Fig. 6 and Fig. 7, be provided with near the removal structure 80 of blade 81 of the dirt settling of the film forming material leading section 21d with the main cupola well 21 of cutting, mainly in this, the cover structure 30 of the film deposition system 1 related from the 1st embodiment is different.
As shown in FIG. 6 and 7, the removal structure 80 of cover structure 130 forms by a pair of scraper 85 is set in outer rim 31.Each scraper 85 is arranged on respect to central axis C L2 and is on the position of 180 °.Wherein, number and the configuration of scraper 85 are not particularly limited, and can be 1, can be also more than 3.
According to said structure, along with the rotation of outer rim 31, the blade 81 of scraper 85 also, along the filling part 21a rotation of main cupola well 21, therefore can be wiped off and be attached to the leading section 21d of this filling part 21a and the dirt settling of periphery 21e.And, outer rim 31 is with respect to the filling part 21a bias of main cupola well 21, even if the distance between fixed part 83b and the filling part 21a of scraper 85 changes thus, because scraper 85 is for can utilize spring 84 to carry out flexible structure, therefore blade 81 is not subject to the variable effect of this distance and can wipes near dirt settling leading section 21d off.According to more than, can prevent that dirt settling from piling up near the leading section 21d of main cupola well 21.
[the 3rd embodiment]
In the cover structure 230 of the related film deposition system of the 3rd embodiment shown in Fig. 8 and Fig. 9, be suitable for the related gear of ring-type internal wheel 91 and replace the related gear of ring-type outer rotor 39, mainly in this, the cover structure 30 of the film deposition system 1 related from the 1st embodiment is different.
As shown in FIG. 6 and 7, outer rim 31 possesses the gear 91 in inner circumferential side with tooth portion 90.And drives structure 134 is set to rotating part 71 and is configured in the inner circumferential side of gear 91., the rotating part 71 of drives structure 134 and axial region 72 configure diametrically with the approaching position of the filling part 21a of main cupola well 21 on.And, with this, on the flange part 49 of inner cover 32 and the flange part 21b of main cupola well 21, be formed with through hole and the recess for configuring rotating part 71 and axial region 72.In addition, during to inner circumferential side configuration rotating part 71 and axial region 72, cause magnetic fluid bearing 77 and cone gear 76 etc. to produce and interfere (with reference to figure 2) with introduction part 22, therefore sometimes cannot adopt the structure that axial region 72 is directly extended to the outside of vacuum vessel 10.Now, by not shown revolving force transmission mechanism is set, transmit revolving force to axial region 72.
The present invention is not limited to above-mentioned embodiment.
For example, in above-mentioned embodiment, between main cupola well 21 and outer rim 31, be provided with inner cover 32, between outer rim 31 and inner cover 32, be provided with support unit 33, but also can omit inner cover 32.Now, the mounting groove of support unit 33 is set on main cupola well 21, between main cupola well 21 and outer rim 31, support unit 33 is set.
And, in above-mentioned embodiment, for tooth portion 40,90 is set in outer rim 31, and use and the gear 39,91 of bottom 37 splits, but also can not use this gear 39,91, and adopt in the periphery of bottom 37 and the structure of inner peripheral surface formation tooth portion 40,90 itself.
Claims (4)
1. a film deposition system, this film deposition system heats film forming material by beam-plasma, and the particle being gasified by described film forming material is attached to by film forming matter, and described film deposition system possesses:
As the main cupola well of main anode, it has the hole that along continuous straight runs runs through to keep described film forming material, and imports described beam-plasma to described film forming material, or is imported into described beam-plasma;
Outer rim, it surrounds described main cupola well, and has tooth portion;
Rotating part, it is by engaging to described outer rim and give described main cupola well revolving force around with the described tooth portion of described outer rim; And
Support unit, it is arranged between described main cupola well and described outer rim, limits the movement in the horizontal direction of described outer rim, and described outer rim is supported as rotating.
2. film deposition system according to claim 1, wherein,
The blade of the dirt settling of the leading section of the described main cupola well of cutting is installed in described outer rim.
3. film deposition system according to claim 1 and 2, wherein,
The leading section of described outer rim is folded back towards inner circumferential side.
4. film deposition system according to claim 1 and 2, wherein,
Described support unit is made up of pottery.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012247563A JP5832985B2 (en) | 2012-11-09 | 2012-11-09 | Deposition equipment |
| JP2012-247563 | 2012-11-09 |
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| CN103805963A true CN103805963A (en) | 2014-05-21 |
| CN103805963B CN103805963B (en) | 2017-01-04 |
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| CN201310424602.5A Active CN103805963B (en) | 2012-11-09 | 2013-09-17 | Film formation device |
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| JP (1) | JP5832985B2 (en) |
| KR (1) | KR101513192B1 (en) |
| CN (1) | CN103805963B (en) |
| TW (1) | TWI477627B (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006348318A (en) * | 2005-06-13 | 2006-12-28 | Sumitomo Heavy Ind Ltd | Hearth mechanism, handling mechanism and film-forming apparatus |
Family Cites Families (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5490912A (en) * | 1994-05-31 | 1996-02-13 | The Regents Of The University Of California | Apparatus for laser assisted thin film deposition |
| JP2001000854A (en) * | 1999-06-23 | 2001-01-09 | Sumitomo Heavy Ind Ltd | Device for removing deposit and vapor deposition system |
| EP1136587B1 (en) * | 2000-03-23 | 2013-05-15 | Hitachi Metals, Ltd. | Deposited-film forming apparatus |
| JP3732074B2 (en) | 2000-07-11 | 2006-01-05 | 住友重機械工業株式会社 | Deposition equipment |
| JP2002180240A (en) | 2000-12-20 | 2002-06-26 | Sumitomo Heavy Ind Ltd | Film forming apparatus |
| KR20050072946A (en) * | 2004-01-08 | 2005-07-13 | 삼성전자주식회사 | An apparatus for deposition with high uniformity |
| JP2006346765A (en) * | 2005-06-13 | 2006-12-28 | Sumitomo Heavy Ind Ltd | Handling device |
| JP2006348334A (en) | 2005-06-14 | 2006-12-28 | Sumitomo Heavy Ind Ltd | Hearth mechanism and hearth-replacing device |
| TWI364126B (en) * | 2007-11-23 | 2012-05-11 | Ind Tech Res Inst | Plasma assisted apparatus for forming organic film |
| JP2010013701A (en) * | 2008-07-03 | 2010-01-21 | Sanyo Shinku Kogyo Kk | Plasma generator and film deposition apparatus |
| JP2010126797A (en) * | 2008-11-28 | 2010-06-10 | Tokyo Electron Ltd | Film deposition system, semiconductor fabrication apparatus, susceptor for use in the same, program and computer readable storage medium |
| US9297072B2 (en) * | 2008-12-01 | 2016-03-29 | Tokyo Electron Limited | Film deposition apparatus |
| JP2013147677A (en) * | 2010-04-28 | 2013-08-01 | Ulvac Japan Ltd | Film deposition system |
| SG185413A1 (en) * | 2010-05-06 | 2012-12-28 | Univ Virginia Patent Found | Spotless arc directed vapor deposition (sa-dvd) and related method thereof |
| JP2012054508A (en) * | 2010-09-03 | 2012-03-15 | Tokyo Electron Ltd | Film deposition apparatus |
| JP2012140671A (en) * | 2010-12-28 | 2012-07-26 | Canon Tokki Corp | Film-forming apparatus |
| JP5456716B2 (en) * | 2011-03-30 | 2014-04-02 | 住友重機械工業株式会社 | Deposition equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006348318A (en) * | 2005-06-13 | 2006-12-28 | Sumitomo Heavy Ind Ltd | Hearth mechanism, handling mechanism and film-forming apparatus |
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| KR101513192B1 (en) | 2015-04-17 |
| TW201418492A (en) | 2014-05-16 |
| KR20140060221A (en) | 2014-05-19 |
| JP2014095125A (en) | 2014-05-22 |
| TWI477627B (en) | 2015-03-21 |
| JP5832985B2 (en) | 2015-12-16 |
| CN103805963B (en) | 2017-01-04 |
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