CN103794696A - Light emitting diode packaging structure of multilayer curved surface textures - Google Patents
Light emitting diode packaging structure of multilayer curved surface textures Download PDFInfo
- Publication number
- CN103794696A CN103794696A CN201210422717.6A CN201210422717A CN103794696A CN 103794696 A CN103794696 A CN 103794696A CN 201210422717 A CN201210422717 A CN 201210422717A CN 103794696 A CN103794696 A CN 103794696A
- Authority
- CN
- China
- Prior art keywords
- curved surface
- multilayer
- chip
- circuit board
- emitting diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title abstract 4
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 8
- 239000003822 epoxy resin Substances 0.000 claims abstract description 7
- 238000005538 encapsulation Methods 0.000 claims description 12
- 239000004593 Epoxy Substances 0.000 claims description 5
- 238000010276 construction Methods 0.000 claims description 2
- 238000009826 distribution Methods 0.000 abstract description 3
- 238000004020 luminiscence type Methods 0.000 abstract description 2
- 239000003292 glue Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 7
- 238000003466 welding Methods 0.000 description 6
- 239000004568 cement Substances 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000005245 sintering Methods 0.000 description 5
- 229910000831 Steel Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000010959 steel Substances 0.000 description 3
- 229920001342 Bakelite® Polymers 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000004637 bakelite Substances 0.000 description 2
- 239000000084 colloidal system Substances 0.000 description 2
- 150000002118 epoxides Chemical class 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- -1 gold (aluminium) Chemical compound 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000386 microscopy Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 210000003205 muscle Anatomy 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The present invention discloses a light emitting diode packaging structure of multilayer curved surface textures. The light emitting diode packaging structure of the multilayer curved surface textures comprises a chip, an electrode, the curved surface textures, an epoxy resin package, and a circuit board base. The packaged chip is arranged in a groove at the central position of the circuit board base and is connected with the electrode, and the size of the chip is higher than the surface of the upper surface of the circuit board base. Multilayer epoxy resin structures are contained in the package, the lower surface of each layer of epoxy resin structure is designed into the curved surface texture, and the multilayer structures are orderly arranged on the circuit board base in which the chip is assembled. By the light emitting diode packaging structure of the multilayer curved surface textures disclosed by the present invention, the luminescence distribution uniformity is improved while the LED luminous efficacy loss is not influenced.
Description
Technical field
This product is a kind of LED(Light-Emitting Diode) design of encapsulating structure.The LED of this structure is applicable to the fields such as automobile instrument, automobile controller, steering wheel button, household electrical appliances, instrument, equipment.
Background technology
The main task of LED package is in order to protect luminescence chip and electric being connected, to guarantee normal output electrical signals at present, and protection chip is normally worked.LED encapsulates developable function in addition much in fact.For example, reasonably the unnecessary power consumption of the maximum reduction of encapsulation improves luminous efficiency, and luminous intensity increases; Use the encapsulation of unlike materials for different emission wavelengths, can improve the purity of luminescent spectrum, luminous wave-length coverage is dwindled etc.
Summary of the invention
The present invention utilizes the curved-surface structure encapsulation of multilayer lines to improve the rear light distribution characteristic of light-emitting diode energising.The Light-Emitting Diode of this kind of encapsulating structure can, directly perpendicular under needs lighting component, in the situation that not needing other leaded light products, make to need light-emitting zone distribution of light even.The timbering material of this kind of encapsulation uses the high plastic material of reflectivity, and colloid material is used the high epoxy resin of transmissivity.
Specific embodiments:
Chip inspection
Microscopy: whether whether material surface has mechanical damage and pit pockmark lockhill chip size and electrode size whether to meet technological requirement electrode pattern complete.
Spread sheet
Because LED product chips is still arranged close space length very little (about 0.1mm) after scribing, be unfavorable for the operation of rear operation.We adopt spread sheet machine to expand the film that coheres chip, are that the spacing of LED product chips is stretched to about 0.6mm.
Point glue
Elargol or insulating cement on 7 relevant position point.(for GaAs, SiC conductive substrates, there is ruddiness, gold-tinted, the yellowish green chip of backplate, adopt elargol.For blue light, the green light LED product chips of sapphire dielectric substrate, adopt insulating cement to fix chip, critical technological point is a control of glue amount, all there is detailed technological requirement in colloid height, some glue position, because elargol and insulating cement all have strict requirement storing and use, the awake material of elargol, stirring, service time are all the items must be noted that in technique.
Standby glue
Contrary with a glue, standby glue is first elargol to be coated on 3 with standby glue machine, then the LED product of back band elargol is arranged on 7, and the efficiency of standby glue is far above a glue, but not all product is all suitable for standby adhesive process.
Manual thorn sheet
Be placed on the fixture of thorn sheet platform 6,7 are placed under fixture, sting one by one on corresponding position under the microscope with pin by 6, and manual thorn sheet has been compared a benefit with automatically shelving, be convenient to change at any time different chips, be applicable to install the product of various chips.
Automatically shelve
Automatically shelve is to combine to be stained with glue (some glue) and 6 liang of large steps are installed in fact, first on 7, put elargol (insulating cement), then pick up shift position with vacuum slot by 6, be placed in again on corresponding backing positions, automatically shelve and in technique, mainly will be familiar with equipment operating programming, simultaneously to equipment be stained with glue and installation accuracy is adjusted.Select bakelite suction nozzle selecting of suction nozzle as far as possible, prevent the damage to LED product chips surface, what particularly blue, Green Chip must be with bakelite, because steel mouth can scratch the current-diffusion layer of chip surface.
Sintering
The object of sintering is that elargol is solidified, and sintering requires temperature to monitor, and prevents that batch property is bad, and the temperature general control of elargol sintering is at 150 ℃, sintering time 2 hours.Can adjust to 170 ℃ according to actual conditions, 1 hour, general 150 ℃ of insulating cement, 1 hour.
Pressure welding
The object of pressure welding is guided to electrode on 6, complete the connection work of outer lead in product, pressure welding is the key link in LED product encapsulation technology, what in technique, mainly need monitoring is pressure welding spun gold (aluminium wire) arch filament shape, solder joint shape, pulling force, relates to many-sided problem to the further investigation of bond technology, as gold (aluminium) wire material, ultrasonic power, pressure welding pressure, chopper (steel mouth) are selected, chopper (steel mouth) movement locus etc.
Point rubber seal dress
1. the making of embedding 2
The process of embedding is first in LED formed product die cavity, to inject liquid epoxy, then inserts the LED product shelves that pressure welding is good, put into baking oven by curable epoxide after, it is moulding that LED product is deviate from from die cavity.Mould need to be produced the requirement with 5 shapes in advance.
2. the making of embedding 1
After embedding 2, with reference to the manufacturing process of embedding 2.Select the mould of the shape need with 4.
Solidify with rear and solidify
Solidify and refer to solidifying of encapsulation epoxy, general curable epoxide condition is at 135 ℃, 1 hour.Mold pressing encapsulates generally at 150 ℃, 4 minutes.
Rear solidifying
Rear solidifying is in order to make epoxy fully curing, LED product to be carried out to heat ageing simultaneously.Rear curing extremely important for the adhesive strength that improves 1,2 and 7.General condition is 120 ℃, 4 hours.
Cut muscle and scribing
Because integral product is on a slice pcb board, need scribing machine to complete mask work.
Test
The photoelectric parameter of test LED product, check overall dimension, carry out sorting according to customer requirement to LED product product simultaneously.
Packing
Finished product is counted to sabot, packing.Product needed antistatic extra package.
The package structure for LED of multilayer curved surface lines comprises chip, electrode, curved surface lines, epoxy encapsulation, circuit board basic unit.The chip of described encapsulation is arranged in the groove of circuit board primary centre position and is connected with electrode, and chip size can be higher than the plane of circuit board basic unit upper surface.In encapsulation, comprise multilayer epoxy resin structural, the lower surface of every layer of structure is designed to curved surface lines, and sandwich construction is arranged in the circuit board basic unit that assembles chip successively.
Claims (4)
1. the package structure for LED of multilayer curved surface lines comprises chip, electrode, curved surface lines, epoxy encapsulation, circuit board basic unit; The chip of described encapsulation is arranged in the groove of circuit board primary centre position and is connected with electrode, and chip size can be higher than the plane of circuit board basic unit upper surface; In encapsulation, comprise multilayer epoxy resin structural, the lower surface of every layer of structure is designed to curved surface lines, and sandwich construction is arranged in the circuit board basic unit that assembles chip successively.
2. the LED package of multilayer curved surface lines according to claim 1, is characterized in that, multilayer epoxy resin center is coaxial with circuit board basic unit.
3. the LED package of multilayer curved surface lines according to claim 1, is characterized in that, the gross area numerical value of every layer of curved surface lines is more than or equal to the half of the square number product of chip and lines distance.
4. the LED package of multilayer curved surface lines according to claim 1, is characterized in that, lines fluting is greater than 30 degree with the angle of epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210422717.6A CN103794696A (en) | 2012-10-30 | 2012-10-30 | Light emitting diode packaging structure of multilayer curved surface textures |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210422717.6A CN103794696A (en) | 2012-10-30 | 2012-10-30 | Light emitting diode packaging structure of multilayer curved surface textures |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103794696A true CN103794696A (en) | 2014-05-14 |
Family
ID=50670184
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210422717.6A Pending CN103794696A (en) | 2012-10-30 | 2012-10-30 | Light emitting diode packaging structure of multilayer curved surface textures |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103794696A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430992A (en) * | 2016-01-11 | 2016-03-23 | 方新刚 | Communication device capable of automatically plugging/unplugging circuit board therein/therefrom |
| CN105636394A (en) * | 2016-01-11 | 2016-06-01 | 乐清市明祥电器厂 | Communication equipment with automatic circuit board plugging function and noise reduction function |
| CN105679917A (en) * | 2016-01-14 | 2016-06-15 | 中山芯达电子科技有限公司 | LED chip packaging process |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004235337A (en) * | 2003-01-29 | 2004-08-19 | Toyoda Gosei Co Ltd | Light emitting diode |
| JP2007088290A (en) * | 2005-09-22 | 2007-04-05 | Harison Toshiba Lighting Corp | Enclosure for light emitting element |
| CN102299232A (en) * | 2010-06-24 | 2011-12-28 | 鸿富锦精密工业（深圳）有限公司 | LED (light emitting diode) and light source module |
| CN203521457U (en) * | 2012-10-30 | 2014-04-02 | 南京灿华光电设备有限公司 | LED packaging structure with multi-layer cambered textures |
-
2012
- 2012-10-30 CN CN201210422717.6A patent/CN103794696A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004235337A (en) * | 2003-01-29 | 2004-08-19 | Toyoda Gosei Co Ltd | Light emitting diode |
| JP2007088290A (en) * | 2005-09-22 | 2007-04-05 | Harison Toshiba Lighting Corp | Enclosure for light emitting element |
| CN102299232A (en) * | 2010-06-24 | 2011-12-28 | 鸿富锦精密工业（深圳）有限公司 | LED (light emitting diode) and light source module |
| CN203521457U (en) * | 2012-10-30 | 2014-04-02 | 南京灿华光电设备有限公司 | LED packaging structure with multi-layer cambered textures |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105430992A (en) * | 2016-01-11 | 2016-03-23 | 方新刚 | Communication device capable of automatically plugging/unplugging circuit board therein/therefrom |
| CN105636394A (en) * | 2016-01-11 | 2016-06-01 | 乐清市明祥电器厂 | Communication equipment with automatic circuit board plugging function and noise reduction function |
| CN105636394B (en) * | 2016-01-11 | 2018-04-20 | 温岭市锦鹏日用品有限公司 | A kind of communication apparatus with circuit board automatic plug and energy noise reduction |
| CN105430992B (en) * | 2016-01-11 | 2018-11-16 | 宁波市达之丰工业产品设计有限公司 | A kind of communication apparatus with circuit board automatic plug function |
| CN105679917A (en) * | 2016-01-14 | 2016-06-15 | 中山芯达电子科技有限公司 | LED chip packaging process |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140514 |