CN103794682A - New cleaning technology - Google Patents
New cleaning technology Download PDFInfo
- Publication number
- CN103794682A CN103794682A CN201210423782.0A CN201210423782A CN103794682A CN 103794682 A CN103794682 A CN 103794682A CN 201210423782 A CN201210423782 A CN 201210423782A CN 103794682 A CN103794682 A CN 103794682A
- Authority
- CN
- China
- Prior art keywords
- decorated basket
- gaily decorated
- wafer carrier
- wafers
- beaker
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 13
- 238000005516 engineering process Methods 0.000 title abstract description 6
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 16
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000003814 drug Substances 0.000 claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 6
- 239000003292 glue Substances 0.000 claims abstract description 4
- 239000012530 fluid Substances 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 abstract 15
- 239000007788 liquid Substances 0.000 abstract 2
- 238000011010 flushing procedure Methods 0.000 abstract 1
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000002000 scavenging effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0095—Post-treatment of devices, e.g. annealing, recrystallisation or short-circuit elimination
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Detergent Compositions (AREA)
Abstract
The invention relates to a new cleaning technology. The steps of the technology are as follows: stripped wafers are put in a wafer carrier and placed in sequence; the wafer carrier is put in a 1# organic groove (a 3000 ml beaker, negative glue stripping liquid, 90 DEG C), timekeeping is started, the wafer carrier is taken out after 15 min and is put in acetone for rinsing for 3 min, and a medicament is replaced once for every 300 wafers; the abovementioned wafer carrier is put in a 2# organic groove (a 3000 ml beaker, acetone, 75 DEG C), timekeeping is started, the wafer carrier is taken out after 5 min and put in ethanol, and a medicament is replaced once for every 200 wafers; the wafer carrier is put in a 3# organic groove (a 3000 ml beaker, ethanol, 80 DEG C), timekeeping is started, the wafer carrier is taken out after 5 min, and a medicament is replaced once for every 200 wafers; and a spin-drying step is provided, conditions of a spin-drier are set, flushing time is 30 sec, the rotating speed in spin-drying is 1800 r/min, time is 180 sec, and the wafers are poured into a plug in sequence from the wafer carrier and put into the spin-drier for spin-drying. The new cleaning technology refines cleaning fluid and cleaning time, and can effectively clean stripping liquid on the wafers, thereby improving the electric leakage yield and the luminance of the wafers.
Description
Technical field
The present invention relates to a kind of new cleaning, belong to LED production field.
Background technology
After having peeled off, LED needs LED chip to clean, so that the stripper on removal chip, whether stripper can be removed totally, directly affects electric leakage yield and the luminosity of LED chip, therefore the cleaning after having peeled off seems very important in LED production process.
Summary of the invention
The present invention is directed to deficiency, a kind of new cleaning is provided.
The technical scheme that the present invention solves the problems of the technologies described above is as follows: a kind of new cleaning, it is characterized in that, and described processing step is as follows:
(1) wafer of having peeled off is put into the gaily decorated basket, put successively according to order;
(2) gaily decorated basket being put into 1# has trough (3000ml beaker, negative glue stripper, 90 ℃), starts timing, takes out the gaily decorated basket and put into acetone and float 3min after 15min, and every 300 replacings of medicament once;
(3) the above-mentioned gaily decorated basket being put into 2# has trough (3000ml beaker, acetone, 75 ℃), starts timing, takes out the gaily decorated basket and put into ethanol after 5min, and every 200 replacings of medicament once;
(4) gaily decorated basket being put into 3# has trough (3000ml beaker, ethanol, 80 ℃), starts timing, takes out the gaily decorated basket after 5min, and every 200 replacings of medicament once;
(5) dry: set drier condition: bath time 30sec; Drying rotating speed is 1800 to turn; Time is 180sec, and chip is poured in order jam and put drier into from the gaily decorated basket, dries.
The invention has the beneficial effects as follows: the present invention has carried out refinement to cleaning fluid and scavenging period, can effectively clean the stripper on chip, thereby improved electric leakage yield and the luminosity of chip.
Embodiment
Below principle of the present invention and feature are described, example, only for explaining the present invention, is not intended to limit scope of the present invention.
A new cleaning, is characterized in that, described processing step is as follows:
(1) wafer of having peeled off is put into the gaily decorated basket, put successively according to order;
(2) gaily decorated basket being put into 1# has trough (3000ml beaker, negative glue stripper, 90 ℃), starts timing, takes out the gaily decorated basket and put into acetone and float 3min after 15min, and every 300 replacings of medicament once;
(3) the above-mentioned gaily decorated basket being put into 2# has trough (3000ml beaker, acetone, 75 ℃), starts timing, takes out the gaily decorated basket and put into ethanol after 5min, and every 200 replacings of medicament once;
(4) gaily decorated basket being put into 3# has trough (3000ml beaker, ethanol, 80 ℃), starts timing, takes out the gaily decorated basket after 5min, and every 200 replacings of medicament once;
(5) dry: set drier condition: bath time 30sec; Drying rotating speed is 1800 to turn; Time is 180sec, and chip is poured in order jam and put drier into from the gaily decorated basket, dries.
The foregoing is only preferred embodiment of the present invention, in order to limit the present invention, within the spirit and principles in the present invention not all, any modification of doing, be equal to replacement, improvement etc., within all should being included in protection scope of the present invention.
Claims (1)
1. a new cleaning, is characterized in that, described processing step is as follows:
(1) wafer of having peeled off is put into the gaily decorated basket, put successively according to order;
(2) gaily decorated basket being put into 1# has trough (3000ml beaker, negative glue stripper, 90 ℃), starts timing, takes out the gaily decorated basket and put into acetone and float 3min after 15min, and every 300 replacings of medicament once;
(3) the above-mentioned gaily decorated basket being put into 2# has trough (3000ml beaker, acetone, 75 ℃), starts timing, takes out the gaily decorated basket and put into ethanol after 5min, and every 200 replacings of medicament once;
(4) gaily decorated basket being put into 3# has trough (3000ml beaker, ethanol, 80 ℃), starts timing, takes out the gaily decorated basket after 5min, and every 200 replacings of medicament once;
(5) dry: set drier condition: bath time 30sec; Drying rotating speed is 1800 to turn; Time is 180sec, and chip is poured in order jam and put drier into from the gaily decorated basket, dries.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210423782.0A CN103794682A (en) | 2012-10-30 | 2012-10-30 | New cleaning technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210423782.0A CN103794682A (en) | 2012-10-30 | 2012-10-30 | New cleaning technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103794682A true CN103794682A (en) | 2014-05-14 |
Family
ID=50670172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210423782.0A Pending CN103794682A (en) | 2012-10-30 | 2012-10-30 | New cleaning technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103794682A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105655239A (en) * | 2016-03-31 | 2016-06-08 | 苏州晶樱光电科技有限公司 | Silicon wafer cleaning technology |
-
2012
- 2012-10-30 CN CN201210423782.0A patent/CN103794682A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105655239A (en) * | 2016-03-31 | 2016-06-08 | 苏州晶樱光电科技有限公司 | Silicon wafer cleaning technology |
| CN105655239B (en) * | 2016-03-31 | 2018-05-25 | 苏州晶樱光电科技有限公司 | Silicon wafer cleaning |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140514 |