CN103787887A

CN103787887A - Polyvalent carboxylic acid, composition thereof, curable resin composition, cured product, and method for manufacturing a polyvalent carboxylic acid

Info

Publication number: CN103787887A
Application number: CN201310712032.XA
Authority: CN
Inventors: 中西政隆; 洼木健一; 宫川直房; 川田义浩; 佐佐木智江; 青木静; 铃木瑞观; 枪田正人; 小柳敬夫
Original assignee: Nippon Kayaku Co Ltd
Current assignee: Nippon Kayaku Co Ltd
Priority date: 2009-06-22
Filing date: 2010-06-22
Publication date: 2014-05-14
Anticipated expiration: 2030-06-22
Also published as: TWI491590B; KR101692450B1; WO2010150524A1; TW201120000A; CN102459144B; JPWO2010150524A1; CN102459144A; JP5713898B2; CN103787887B; KR20120030056A

Abstract

Provided are: a polyvalent carboxylic acid composition containing a polyvalent carboxylic acid represented by formula (1); an epoxy resin curing agent composition containing the polyvalent carboxylic acid composition; a curable resin composition containing said curing agent composition and an epoxy resin; a cured product thereof; and a novel polyvalent carboxylic acid. When said polyvalent carboxylic acid and a composition containing same are used as curing agents for an epoxy resin, the volatility of the curing agent when curing is low, and the obtained cured product has excellent optical properties and thermal endurance. In formula (1), each R independently represents a hydrogen atom, a C1-6 alkyl group or a carboxyl group, and P represents one of the bivalent cross-linking groups defined as follows: (a) a C6-20 alkyl chain having a branched structure, said alkyl chain having a C3-12 linear main chain and two to four side chains, at least one of said side chains having between two and ten carbon atoms.

Description

The manufacture method of polycarboxylic acid and composition thereof, curable resin composition, cured article and polycarboxylic acid

The application is to be that June 22, application number in 2010 are that 201080027952.2 (international application no is PCT/JP2010/004149), denomination of invention are the divisional application of the application for a patent for invention of " manufacture method of polycarboxylic acid and composition thereof, curable resin composition, cured article and polycarboxylic acid " applying date.

Technical field

The present invention relates to be particularly suitable for polycarboxylic acid, the polycarboxylic acid compositions of electric and electronic material applications and contain the curable epoxy resin composition of this polycarboxylic acid compositions as the solidifying agent of epoxy resin.In addition, this polycarboxylic acid compositions is using other field of polycarboxylic acid, also useful as raw material or the resin for toner etc. of the raw material of chip join resin, polyimide resin etc. for material of the sealing material use resin of coating, tackiness agent, products formed, semi-conductor, photosemiconductor, photosemiconductor or properties-correcting agent, softening agent, lube stock, medical agricultural chemicals intermediate product, coating resin.

Background technology

Polycarboxylic acid possesses high thermal stability, good electrical specification, good chemical-resistant and the sound response in the time forming condensation body etc., premium properties as linking agent, condensing agent etc.Therefore, to manufacture starting material as polymer in recent years very noticeable and be widely used for polycarboxylic acid.

In addition, known, the solidifying agent that polycarboxylic acid also can be used as epoxy resin uses.

The curable resin composition that contains epoxy resin, as the resin of excellent heat resistance, uses in the field such as building, building, automobile, aircraft.In recent years, particularly in semi-conductor association area, being flooded with notebook computer with the mobile telephone of photographic camera, ultrathin liquid crystal or plasma television, light weight etc. has take the electronics of light, thin, short, the little high characteristic as keyword.Accompany therewith, the material, the particularly packaged material take epoxy resin as representative that in these semi-conductor association areas, use start the very high characteristic of requirement.

In addition, in recent years, the utilization of epoxy resin in photoelectricity association area attracted attention.Particularly follow advanced IT application in recent years, in order successfully to transmit, process huge information, replace the signal transmission of being undertaken by electric wiring in the past, develop the technology conveying a message with optical signal and be used.In the field of the optics such as optical waveguides, blue led photoreactive semiconductor using at them, for the curable resin wherein using, requirement can provide the transparency and the good cured article of weather resistance.

The solidifying agent of the epoxy resin generally speaking, using in such field can be enumerated: the compound of anhydrides.Special use the acid anhydrides being formed by the polycarboxylic acid of annular aliphatic hydrocarbon and the cured article obtaining, because resistance to opticity is good, therefore often used this acid anhydrides.For example, generally use the ester ring type acid anhydrides such as methyl tetrahydrophthalic anhydride, hexahydrophthalic anhydride, Tetra Hydro Phthalic Anhydride.Wherein, due to processing ease, therefore mainly using under normal temperature is liquid methylhexahydrophthalic anhydride, methyl tetrahydrophthalic anhydride etc.

But, separately using above-mentioned ester ring type acid anhydrides during as solidifying agent, the part evaporation when curing because the vapour pressure of these solidifying agent is high, therefore has: by cured article, do not exist predetermined amount carboxylic acid anhydride (solidifying agent) thus the curing bad problem of the composition epoxy resin causing, with and characteristic significantly change the problem that is difficult to obtain the cured article with stable objects performance according to condition of cure.In addition, a large amount of while producing cured article in open system, these solidifying agent evaporate in atmosphere, thereby the problem also producing is: objectionable impurities the discharge into the atmosphere environmental pollution causing, detrimentally affect and the pollution of production line etc. to human body.

In addition, the cured article that uses solidifying agent in the past and obtain, when sealing LED, particularly SMD (Surface Mount Device: surface mount component), because the usage quantity of resin is few, therefore produce following problems: the above-mentioned curing bad and impact that cannot obtain stability significantly, due to the generation of pit etc. cause distribution expose or make sealing not exclusively, produce when the Reflow Soldering break and/or peel off etc., because long-term bright light makes the problems such as quality badness.

On the other hand, the polycarboxylic acid approximate with polycarboxylic acid of the present invention, known in patent documentation 4 and 5 etc. for purposes such as emulsifying agents.

Prior art document

Patent documentation

Patent documentation 1: TOHKEMY 2003-277473 communique

Patent documentation 2: TOHKEMY 2008-063333 communique

Patent documentation 3: No. 2813028 communiques of Japanese Patent

Patent documentation 4: No. 2915962 communiques of Japanese Patent

Patent documentation 5: Japanese kokai publication hei 3-26743 communique

Summary of the invention

The object of the present invention is to provide: while solidifying the volatilization of solidifying agent less and cured article can realize the cured article of the new polycarboxylic acid, the composition epoxy resin (curable resin composition) that comprises this polycarboxylic acid or curing agent composition and this composition epoxy resin (curable resin composition) that use in the solidifying agent, solidifying agent of stable target capabilities.And, provide for the composition of realizing the useful new polycarboxylic acid of the object of the invention and comprising this polycarboxylic acid.Particularly, the object of the present invention is to provide: the heat-resistant quality of cured article, particularly, the curable resin composition of the excellent optical characteristics such as the illumination conservation rate in conservation rate, the LED of optical transmission rate, and polycarboxylic acid compositions for realizing this target polycarboxylic acid and comprising this polycarboxylic acid.

The inventor has carried out research extensively and profoundly in view of above-mentioned present situation, and result has completed the present invention.

, the present invention relates to following invention.

1. a polycarboxylic acid compositions, it comprises the polycarboxylic acid being represented by following formula (1),

In formula, R represents alkyl or the carboxyl of hydrogen atom, carbonatoms 1 to 6 independently of one another; P represents the divalent linking group by following (a) or (b) defining:

(a) linking group, its chain-like alkyl chain with branched structure that is carbonatoms 6 to 20, this chain-like alkyl chain has main chain and 2 to 4 side chains of the straight chain of carbonatoms 3 to 12, and the carbonatoms of at least one this side chain is 2 to 10;

(b) divalent linking group, it is for having at least a kind of bridging methyl, tristane dimethanol or pentacyclopentadecandimethanol dimethanol remove the group that 2 hydroxyls after obtain in encircling glycol more on ring from being selected from,

But when P is (b), R represents the group beyond hydrogen atom.

2. the polycarboxylic acid compositions as described in above-mentioned 1, wherein, divalent linking group is the linking group by (a) definition, and is any one in the divalent group being represented by following formula (a1) by the linking group of (a) definition,

Formula (a1):

In formula, the * mark of the end of each group is illustrated in the Sauerstoffatom bonding of * mark place and adjacency.

3. the polycarboxylic acid compositions as described in above-mentioned 1 or 2, wherein, in linking group (a), main chain is the straight chain of carbonatoms 3 to 6, at least 2 side chains are the alkyl of carbonatoms 2 to 4.

4. the polycarboxylic acid compositions as described in any one in above-mentioned 1 to 3 wherein, is from 2,4-diethyl-1,5-PD, to remove the divalent group obtaining after 2 hydroxyls by the linking group of (a) definition.

5. the polycarboxylic acid compositions as described in above-mentioned 1, wherein, divalent linking group is the linking group by (b) definition, and is any one in the divalent group being represented by following formula (b1) by the linking group of (b) definition,

Formula (b1):

In formula, the multiple R that exist in each structural formula ²represent independently of one another hydrogen atom or methyl.

6. the polycarboxylic acid compositions as described in any one in above-mentioned 1 to 5, is characterized in that, comprises R ²be the polycarboxylic acid of hydrogen atom.

7. the polycarboxylic acid compositions as described in any one in above-mentioned 1 to 6, is characterized in that, comprising 50 % by mole of R in above formula (1) is the polycarboxylic acid of methyl and/or carboxyl.

8. the polycarboxylic acid compositions as described in any one in above-mentioned 1 to 7, wherein, the R in formula (1) is methyl or carboxyl.

9. the polycarboxylic acid compositions as described in above-mentioned 8, wherein, the group beyond hydrogen atom is methyl.

10. the polycarboxylic acid compositions as described in any one in above-mentioned 1 to 8, wherein, polycarboxylic acid compositions comprises: at least a kind of polycarboxylic acid being represented by formula (1) and can be by methyl substituted C ₄to C ₇ring-type two, three or tetracarboxylic anhydride.

11. polycarboxylic acid compositions as described in above-mentioned 10, wherein, can be by methyl substituted C ₄to C ₇ring-type two, three or tetracarboxylic anhydride, for can be by methyl substituted hexanaphthene two or tricarboxylic acid anhydride.

12. 1 kinds of hardener for epoxy resin, the polycarboxylic acid compositions described in the polycarboxylic acid of its contained (1) or above-mentioned 10 or 11.

13. hardener for epoxy resin as described in above-mentioned 12, it is for comprising:

Polycarboxylic acid, wherein, the divalent linking group being represented by P in formula (1) is the linking group by (a) definition, and is following (1) described divalent group by the linking group of (a) definition, and

Acid anhydrides, it is at least a kind in the choosing group that freely following (2) described acid anhydrides forms,

Polycarboxylic acid compositions,

(1) divalent group:

From 2,4-diethyl-1,5-PD, remove the divalent group obtaining after 2 hydroxyls;

(2) acid anhydrides:

Methylhexahydrophthalic anhydride and hexanaphthene-1,2,4-tricarboxylic acid-1,2-acid anhydride.

14. hardener for epoxy resin as described in above-mentioned 12, it is for comprising:

Polycarboxylic acid, wherein, the divalent linking group being represented by P in formula (1) is the linking group by (b) definition, and be any one in following (1) described divalent group being represented by formula (b1) by the linking group of (b) definition, and

Acid anhydrides, it is at least a kind in the choosing group that freely following (2) described acid anhydrides forms, polycarboxylic acid compositions,

(1) formula (b1):

In formula, the multiple R that exist in each structural formula ²represent independently of one another hydrogen atom or methyl;

(2) acid anhydrides:

15. 1 kinds of curable resin compositions, the curing agent composition in the polycarboxylic acid that it comprises the formula described in any one (1) in above-mentioned 1 to 7 or above-mentioned 12 to 14 described in any one, and epoxy resin.

16. curable resin compositions as described in above-mentioned 15, wherein, epoxy resin is alicyclic epoxy resin.

17. curable resin compositions as described in above-mentioned 16, wherein, curing agent composition is the curing agent composition described in above-mentioned 13.

18. curable resin compositions as described in above-mentioned 16, wherein, curing agent composition is the curing agent composition described in above-mentioned 14.

19. 1 kinds of cured articles, it is the cured article of the curable resin composition described in above-mentioned 15.

The manufacture method of the polycarboxylic acid being represented by formula (1) described in 20. 1 kinds above-mentioned 1, wherein, makes following (a) or dibasic alcohol (b) react with (c),

(a) the chain aliphatic dihydroxy alcohol with branched structure of carbonatoms 6 to 20, wherein, chain-like alkyl chain has main chain and 2 to 4 side chains of the straight chain of carbonatoms 3 to 12, and at least 1 alkyl that this side chain is carbonatoms 2 to 10;

(b) bridging encircles glycol more, its be selected from ring, can have methyl, tristane dimethanol or pentacyclopentadecandimethanol dimethanol at least a kind;

(c) acid anhydrides, it is for selecting free hexahydrophthalic anhydride, methylhexahydrophthalic anhydride and hexanaphthene-1,2, at least a kind of acid anhydrides in the group that 4-tricarboxylic acid anhydride forms, but (b) in the situation that, it is for comprising methylhexahydrophthalic anhydride or hexanaphthene-1, at least a kind of acid anhydrides of any one in 2,4-tricarboxylic acid anhydride.

The manufacture method of 21. polycarboxylic acids as described in above-mentioned 20, wherein, count the ratio of 0.001 to 2 equivalent with respect to anhydride group 1 equivalent with the hydroxyl equivalent of dibasic alcohol, at 40 to 150 ℃ of temperature of reaction, make (a) or dibasic alcohol (b) and anhydride reaction (c).

The manufacture method of 22. polycarboxylic acids as described in above-mentioned 21, wherein, acid anhydrides (c) is the mixture of hexahydrophthalic anhydride and methylhexahydrophthalic anhydride.

The manufacture method of 23. polycarboxylic acids as described in above-mentioned 21 or 22, wherein, dibasic alcohol is 2,4-diethyl-1,5-PD or 2-ethyl-2-butyl-1,3-PD.

The manufacture method of 24. polycarboxylic acids as described in above-mentioned 21, it comprises the step that 2,4-diethyl-1,5-PD is reacted with methylhexahydrophthalic anhydride.

The manufacture method of 25. polycarboxylic acids as described in above-mentioned 21, it comprises makes the step of reacting with methylhexahydrophthalic anhydride without the tristane dimethanol replacing or pentacyclopentadecandimethanol dimethanol.

26. 1 kinds of polycarboxylic acids that represented by following formula (1),

(a) linking group, its chain-like alkyl chain with branched structure that is carbonatoms 6 to 20, this chain-like alkyl chain has main chain and 2 to 4 side chains of the straight chain of carbonatoms 3 to 12, and the carbonatoms of at least one this side chain is 2 to 10; Or

But when P is (b), R represents the group beyond hydrogen atom.

27. polycarboxylic acids as described in above-mentioned 26, wherein, the serve as reasons divalent linking group of (a) definition of P, and for the carbonatoms of at least 2 side chains be 2 to 10 linking group.

28. polycarboxylic acids as described in above-mentioned 27 wherein, are from 2,4-diethyl-1,5-PD, to remove the alkylidene group obtaining after 2 hydroxyls by the divalent linking group of (a) definition.

29. polycarboxylic acids as described in above-mentioned 26, wherein, the serve as reasons divalent linking group of (b) definition of P.

30. polycarboxylic acids as described in above-mentioned 26, wherein, the R in formula (1) is methyl or carboxyl.

Invention effect

Polycarboxylic acid or the polycarboxylic acid compositions of formula of the present invention (1), have the ability to cure of good epoxy resin, useful as the solidifying agent of epoxy resin.And this polycarboxylic acid coordinating in epoxy resin or this polycarboxylic acid compositions, the volatilization in the temperature range that is generally used for making epoxy resin cure is few.As a result, processing ease also can be stablized the target capabilities that realizes cured article.Particularly, can obtain the epoxy resin cured product that transparency is high and heat durability is good.This heat durability particularly for example can be enumerated: the heat durability of the optical characteristics such as reflux-resisting welded property, optical transmission rate conservation rate and the LED illumination conservation rate under long-term bright light.

Embodiment

Polycarboxylic acid of the present invention is the polycarboxylic acid being represented by following formula (1), and polycarboxylic acid compositions of the present invention is characterised in that: comprise the polycarboxylic acid being represented by following formula (1),

(b) divalent linking group, it for having at least a kind of bridging methyl, tristane dimethanol or pentacyclopentadecandimethanol dimethanol and remove the group that 2 hydroxyls after obtain in encircling glycol more from being selected from ring.

More specifically, polycarboxylic acid of the present invention by formula (1) represent, at least 1 R is the compound of methyl or carboxyl, particularly more preferably 2 compounds that R is methyl or carboxyl.

Polycarboxylic acid compositions of the present invention, to comprise at least 2 kinds of compositions of compounds that represented by above formula (1), or comprise at least a kind of compound being represented by above formula (1) and have the acid anhydrides of saturated structures, preferably can be by methyl substituted C ₄to C ₇ring-type two, three or tetracarboxylic anhydride, more preferably can be by methyl substituted C ₄to C ₇the composition of ring-type two or tricarboxylic acid anhydride.

In described formula (1), the linking group being represented by P is by above-mentioned (a) or (b) the divalent linking group of definition, below they is specifically described.

By the divalent linking group of above-mentioned (a) definition, be from the alcohol (dibasic alcohol) of the divalent with branched structure of carbonatoms 6 to 20, to remove the divalent chain-like alkyl chain obtaining after hydroxyl, its structure having is that alkyl chain take 2 alcoholic extract hydroxyl group clampings by dibasic alcohol is as main chain and have the alkyl chain (being called side chain) from this alkyl chain branch.This side chain can, from forming any carbon atom branch of main chain, for example also comprise: from the situation of carbon atom (terminal carbon of the main chain) branch of alcoholic extract hydroxyl group institute bonding.As long as thering is the linking group of this structure, can be any linking group, the particular instantiation of such linking group is in following formula (a1).

Formula (a1)

In described formula, the Sauerstoffatom bonding of the both sides of the P in * mark place and formula (1).

By the alkylidene group linking group of above-mentioned (a) definition, as long as the structure with respect to main chain alkylidene group with alkyl branches (side chain) is not particularly limited, preferably main chain is that carbonatoms is more than 3 main chains and the linking group with at least 1 alkyl group side chain, and particularly preferably main chain is that carbonatoms is more than 3 main chains and the linking group with more than 2 alkyl group side chain.For example can enumerate as preferred linking group: there are main chain and 2 to 4 side chains of the straight chain of carbonatoms 3 to 12, and the carbonatoms of at least one this side chain is 2 to 10.Now, further preferably the carbonatoms of at least two side chains is 2 to 10.

As the linking group by above-mentioned (b) definition, can enumerate the divalent group being represented by following formula (b1).

Formula (b1):

Wherein, preferred R ²be the linking group of hydrogen atom.

Of the present invention by formula (1) represent polycarboxylic acid, can by make the diatomic alcohol compounds corresponding with the P of above formula (1), with can be by C ₁to C ₆the hexahydrophthalic anhydride of alkyl preferable methyl or carboxyl substituted carries out addition reaction and obtains.

In addition, polycarboxylic acid compositions of the present invention can obtain by following method for making.

In the present invention, as the method that obtains the polycarboxylic acid compositions that comprises at least 2 kinds of polycarboxylic acids that represented by above formula (1), there is following method: the method that at least 2 kinds of single polycarboxylic acids that represented by formula (1) that obtained by aforesaid method are mixed; Or, in the time of the synthetic above-mentioned polycarboxylic acid being represented by formula (1), use the mixture of at least 2 kinds or use 2 kinds of methods that above-mentioned dibasic alcohol carries out addition reaction as above-mentioned hexahydrophthalic anhydride.

In addition, in the present invention, as obtain comprising at least a kind of polycarboxylic acid being represented by above formula (1), with can be by methyl substituted C ₄to C ₇these two the method for polycarboxylic acid compositions of ring-type two, three or tetracarboxylic anhydride, can enumerate following method.

(1) by least a kind of single polycarboxylic acid being represented by formula (1) being obtained by aforesaid method, with can be by methyl substituted C ₄to C ₇the method that ring-type two, three or tetracarboxylic anhydride mix; Or

(2) in the time of the synthetic polycarboxylic acid being represented by formula (1), what use as one of raw material can be by the excessive use of the hexahydrophthalic anhydride of methyl or carboxyl substituted, in reacted reaction solution, the method by the polycarboxylic acid of formula (1) expression with the above-mentioned Tetra hydro Phthalic anhydride Coexistence mode using as raw material.

As the synthetic middle above-mentioned acid anhydrides using of the polycarboxylic acid being represented by formula (1), adducible polybasic acid anhydride is: have cyclohexane structure, on this cyclohexane ring, there are methyl substituted or carboxyl substituted or without replacement, and in molecule, there is more than 1 (preferably 1) with the anhydride group of cyclohexane ring bonding.Particularly, for example can enumerate: 1,2,4-hexanaphthene tricarboxylic acid-1,2-acid anhydride, 4-methylcyclohexane-1,2-dicarboxylic anhydride or hexanaphthene-1,2-dicarboxylic anhydride etc.

For the single compound of polycarboxylic acid that obtains being represented by formula (1), can use any one in above-mentioned acid anhydrides to react.

In addition, in order to obtain polycarboxylic acid compositions of the present invention, as mentioned above, use at least 2 kinds of these carboxylic acid anhydride to react, or preferred: with respect to described dibasic alcohol, at least a kind of excessive these carboxylic acids of use is reacted, thereby react the mode that contains acid anhydrides while end in reaction solution.

While at least using 2 kinds of these acid anhydrides, can be 2 kinds arbitrarily, in the present invention, consider from optical characteristics, preferably C ₁to C ₆alkyl preferable methyl is or/and the hexahydrophthalic anhydride of carboxyl substituted is preferably less than 50 % by weight without the hexahydrophthalic anhydride replacing, preferably below 40 % by weight, more preferably below 35 % by weight, further preferably below 30 % by weight at the most.

In this manual, below, if % is not particularly limited, be % by weight.

While at least using 2 kinds of acid anhydrides, methyl substituted or/and the hexahydrophthalic anhydride of carboxyl substituted in whole acid anhydrides, be preferably more than 65%, more preferably more than 85%, particularly preferably more than 90%.

As the above-mentioned raw materials dibasic alcohol using in the polycarboxylic acid being represented by formula (1) synthetic, can enumerate the dibasic alcohol with hydroxyl at two ends of linking group P.

Particularly, be the dibasic alcohol in the linking group by (a) definition with the chain-like alkyl chain with branched structure of total carbon atom number 6 to 20.More specifically, adducible dibasic alcohol is: two ends at the main chain of carbonatoms 3 to 12 have hydroxyl, have 2 to 4 side chains, and the carbonatoms of at least 1 this side chain (preferably at least 2) are 2 to 10 on this main chain.

As compound more specifically, can enumerate: on the position of the * mark in the linking group of recording in described formula (a1), bonding has the compound of hydroxyl.

In the dibasic alcohol using as raw material, preferred dibasic alcohol is: at least have at least 2 side chains for carbonatoms 2 to 4 in 2 side chains and this side chain.

In such skeleton, can enumerate as particularly preferred dibasic alcohol: 2,4-diethyl-1,5-PD, 2-ethyl-2-butyl-1,3-PD, 2-ethyl-1,3-hexylene glycol etc., particularly preferably 2,4-diethyl-1,5-PD.

In addition, encircle glycol as the bridging during by the linking group of described (b) definition in formula (1), be the glycols using tristane structure, pentacyclopentadecandimethanol structure as main skeleton more, represented by following formula (b2).

In formula, R ²exist multiplely, represent independently of one another hydrogen atom or methyl.

Particularly, can enumerate: tristane dimethanol, methyl tristane dimethanol, pentacyclopentadecandimethanol dimethanol etc.

As reacting of acid anhydrides and dibasic alcohol, be generally speaking the addition reaction using acid or alkali as catalyzer, still, in the present invention particularly preferably in the reaction of carrying out in the situation of catalyst-free.

While using catalyzer, as operable catalyzer, for example can enumerate: the acidic cpds such as hydrochloric acid, sulfuric acid, methylsulfonic acid, trifluoromethanesulfonic acid, tosic acid, nitric acid, trifluoroacetic acid, trichoroacetic acid(TCA); The metal hydroxidess such as sodium hydroxide, potassium hydroxide, calcium hydroxide, magnesium hydroxide; The amine compound such as triethylamine, tripropyl amine, Tributylamine; Pyridine, Dimethylamino pyridine, 1, the hetero ring type compounds such as 8-diazabicylo [5.4.0] 11 carbon-7-alkene, imidazoles, triazole, tetrazolium; The quaternary ammonium salts such as Tetramethylammonium hydroxide, tetraethyl ammonium hydroxide, TPAOH, TBAH, trimethylammonium ethyl ammonium hydroxide, trimethylammonium propyl group ammonium hydroxide, trimethylammonium butyl ammonium hydroxide, trimethylammonium hexadecyl ammonium hydroxide, trioctylphosphine ammonium hydroxide, tetramethyl ammonium chloride, 4 bromide, Tetramethylammonium iodide, tetramethyl ammonium acetate, trioctylphosphine methyl acetic acid ammonium etc.These catalyzer can use a kind or by two or more mix use.Wherein, preferred triethylamine, pyridine, Dimethylamino pyridine.

The usage quantity of catalyzer is not particularly limited, and with respect to total amount 100 weight parts of raw material, it is preferred conventionally using as required 0.001 to 5 weight part.

In this reaction, preferably under condition of no solvent, react, but also can be with an organic solvent.The usage quantity of organic solvent, with respect to 1 part of the total amount of the described acid anhydrides as reaction substrate and described dibasic alcohol, counts 0.005 to 1 part with weight ratio, and preferably 0.005 to 0.7 part, more preferably 0.005 to 0.5 part (below 50 % by weight).When the usage quantity of organic solvent exceedes 1 part with respect to above-mentioned reaction substrate 1 weight part in weight ratio, become very slow due to what react, therefore not preferred.As the concrete example of operable organic solvent, can use: the alkanes such as hexane, hexanaphthene, heptane; The aromatic hydrocarbon compound such as toluene, dimethylbenzene; The ketones such as methylethylketone, mibk, cyclopentanone, pimelinketone; The ethers such as ether, tetrahydrofuran (THF), dioxane; The ester cpds such as ethyl acetate, butylacetate, methyl-formiate etc.

Even if this reaction also can be reacted fully at the temperature of approximately 20 ℃.Consider preferably 30 to 200 ℃ of temperature of reaction, more preferably 40 to 200 ℃, particularly preferably 40 to 150 ℃ from the viewpoint in reaction times.While particularly carrying out this reaction under condition of no solvent, owing to there being the volatilization of acid anhydrides, therefore preferably 100 ℃ of following reactions, the particularly preferably reaction of 30 to 100 ℃ or 40 to 100 ℃.

The reactive ratio of described acid anhydrides and described dibasic alcohol, in theory preferably in the reaction waiting under molar conditions, but can change as required., as described below, in the polycarboxylic acid compositions of the present invention using as hardener for epoxy resin composition of the present invention, in the polycarboxylic acid of contained (1) using as liquid solidifying agent and the situation of the composition of described acid anhydrides, particularly in the polycarboxylic acid of formula (1) synthetic the acid anhydrides of use identical with the acid anhydrides coordinating in this polycarboxylic acid compositions, during fabrication, in the described acid anhydrides excessive with respect to described dibasic alcohol, react, the moment finishing with reacting of this dibasic alcohol at this acid anhydrides, can obtain the mixture (liquid curing agent composition) of the polycarboxylic acid of this acid anhydrides and described formula (1).

While reaction, the interpolation ratio of concrete the two is, in their functional group's equivalent, with respect to this anhydride group 1 equivalent, in preferably 0.001 to 2 equivalent of hydroxyl equivalent of this dibasic alcohol, more preferably 0.01 to 1.5 equivalent, further preferably the ratio of 0.01 to 1.1 equivalent adds this dibasic alcohol.While as mentioned above manufacturing curing agent composition, in the hydroxyl equivalent of this dibasic alcohol, conventionally at 0.01 to 0.7 equivalent, preferably use this dibasic alcohol in the scope of 0.01 to 0.5 equivalent.

Reaction times, also according to temperature of reaction, catalytic amount etc. and different, considers from industrial viewpoint, and reaction can consume great energy for a long time, therefore not preferred.In addition, the too short reaction times means that it reacts sharply, considers not preferred from the viewpoint of security.Preferred scope is approximately 1 to approximately 48 hour, preferably approximately 1 to approximately 36 hour, and more preferably from about 1 to approximately 24 hour, further preferred approximately 2 to approximately 10 hours.

After reaction finishes, using catalyzer in the situation that, remove catalyzer via neutralization, washing, absorption etc. respectively, and remove solvent by distillation and obtain target polycarboxylic acid.In addition, in the reaction of catalyst-free, can distill as required removal solvent, in addition, the in the situation that of solvent-free, catalyst-free, can directly take out product and obtain goods.

As optimal manufacture method, be under catalyst-free, solvent-free condition, at 40 to 150 ℃, to make described acid anhydrides, described diol reaction, after reaction finishes, the method for directly taking out product.

The polycarboxylic acid being represented by described formula (1) obtaining like this or the composition that comprises this polycarboxylic acid, normally present colourless to flaxen solid-state arborescens or liquid state (crystallization sometimes).

Conventionally,, when the linking group P in formula (1) is the alkylidene group with side chain being defined by (a), present colourless to flaxen solid-state arborescens.When linking group P in formula (1) is the divalent linking group obtaining remove hydroxyl from encircle glycol by the bridging of (a) definition after more, and be by the linking group of (a) definition and while reacting in excessive acid anhydrides, the shape of resultant of reaction presents liquid state conventionally.

Linking group P in formula (1) is during by the linking group of (b) definition, and the polycarboxylic acid that substituent R is hydrogen atom can be seen painted when curing, also improper aspect strict especially optical applications.The compound that is methyl or carboxyl at R, such is painted few, and its optical characteristics improves.

In the compound with the linking group being defined by (a) of above formula (1), the compound that is methyl or carboxyl at R, its optical characteristics improves, therefore preferred.

,, as polycarboxylic acid compositions of the present invention, preferred composition comprises: preferably R has the polycarboxylic acid of methyl or carboxyl or the formula of the two (1).In the time that polycarboxylic acid compositions comprises two or more this polycarboxylic acid, with respect to the total amount of polycarboxylic acid, preferably comprising 50 % by mole of above at least R is not the composition of the polycarboxylic acid (R is the polycarboxylic acid of described alkyl preferable methyl or carboxyl) of the formula (1) of hydrogen atom.More preferably comprise that 70 % by mole above, most preferably more than 90 % by mole R is not the polycarboxylic acid compositions of the polycarboxylic acid of the formula (1) of hydrogen atom.All the other are that R is the polycarboxylic acid of the formula (1) of hydrogen atom.

The polycarboxylic acid being represented by formula (1) of the present invention, preferably R is the group beyond hydrogen atom, more preferably R is the polycarboxylic acid of methyl or carboxyl, or the polycarboxylic acid compositions of the present invention that comprises this polycarboxylic acid, its transparency is good, as the solidifying agent of epoxy resin, coating, tackiness agent, products formed, semi-conductor, the sealing material use resin of photosemiconductor, the chip join material resin of photosemiconductor, polyamide resin, the raw material of polyimide resin etc. or properties-correcting agent, softening agent and lube stock, medicine agricultural chemicals intermediate product, the raw material of coating resin, resin for toner is useful.Particularly, in the time that the solidifying agent using polycarboxylic acid compositions of the present invention as epoxy resin uses, curing performance is good, and the transparency of its cured article is good.Therefore, the polycarboxylic acid compositions utmost point of the present invention is suitable as the hardener for epoxy resin using in the White LED of high brightness and the sealing of other photosemiconductor.

Below, the polycarboxylic acid of contained (1) and the polycarboxylic acid compositions of the present invention of acid anhydrides when using as LCM in polycarboxylic acid compositions of the present invention describes.

Preferred this polycarboxylic acid compositions, the polycarboxylic acid of contained (1) and can be by methyl substituted C ₄to C ₇ring-type two, three or tetracarboxylic anhydride, the ratio of the two is that with respect to polycarboxylic acid 1 weight part of formula (1), the ratio of this acid anhydrides is 0.1 to 10 weight part, preferably 0.5 to 8 weight part, more preferably 1 to 8 weight part.

In this polycarboxylic acid compositions, when contained above-mentioned acid anhydrides is identical with the acid anhydrides using when the polycarboxylic acid of manufacture formula (1), described above, in the time of the polycarboxylic acid of manufacture formula (1), by using the acid anhydrides using as raw material with respect to the dibasic alcohol using as raw material so that the excessive use of mode that after reaction, residual acid anhydrides reaches above-mentioned scope manufacture, the reaction solution obtaining thus can directly use as polycarboxylic acid compositions of the present invention, therefore preferred.

As other manufacture method of this polycarboxylic acid compositions, can by by the polycarboxylic acid of formula obtained above (1) and above-mentioned can be by methyl substituted C ₄to C ₇ring-type two, three or tetracarboxylic anhydride dissolve and are obtained by mixing equably with above-mentioned ratio.

As the polycarboxylic acid of formula contained in this polycarboxylic acid compositions (1), can be a kind, can be also of more than two kinds multiple.When the polycarboxylic acid of contained formula (1) is a kind, the polycarboxylic acid of formula (1) is as mentioned above, and preferably R is the compound of methyl or carboxyl.In addition, in the time of the polycarboxylic acid that comprises multiple formula (1), with respect to the total amount of this polycarboxylic acid, the R in formula (1) is that the polycarboxylic acid of methyl or carboxyl preferably contains more than 50 % by mole, more preferably more than 65 % by mole.

As above-mentioned can be by methyl substituted C ₄to C ₇ring-type two, three or tetracarboxylic anhydride, as long as C ₄to C ₇on ring, there is 2 to 4, the preferred acid anhydrides of the polycarboxylic acid of 2 to 3 carboxyls, be not particularly limited.Particularly, can enumerate: hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, butane tetracarboxylic acid anhydrides, dicyclo [2.2.1] heptane-2,3-dicarboxylic anhydride, methyl bicycle [2.2.1] heptane-2,3-dicarboxylic anhydride, hexanaphthene-1,2,4-tricarboxylic acid-1,2-acid anhydride etc.Preferably can be by the cyclohexane dicarboxylic acid acid anhydride of methyl or carboxyl substituted (can by the hexahydrophthalic anhydride of methyl or carboxyl substituted).As their example, for example can enumerate: hexahydrophthalic anhydride, methylhexahydrophthalic anhydride or hexanaphthene-1,2,4-tricarboxylic acid-1,2-acid anhydride etc.

In this polycarboxylic acid compositions, the shared preferred proportion of polycarboxylic acid of formula (1), with respect to the gross weight of described acid anhydrides and this polycarboxylic acid, is 20 to 80 % by weight, more preferably 30 to 75 % by weight.

Below, describe for hardener for epoxy resin of the present invention.

Hardener for epoxy resin of the present invention is the polycarboxylic acid of contained (1) or the solidifying agent that comprises this polycarboxylic acid and acid anhydrides.As the preferred polycarboxylic acid of formula (1), can enumerate: R is the polycarboxylic acid beyond hydrogen atom, and more preferably R is the polycarboxylic acid of methyl or carboxyl, and particularly all R are the polycarboxylic acid of methyl or carboxyl.

Solidifying agent using the polycarboxylic acid of formula (1) as epoxy resin, while particularly use as LCM, preferably the acid anhydrides of mixes liquid is as the polycarboxylic acid compositions of the present invention of liquid state.This liquid composition can be suitable as hardener for epoxy resin composition of the present invention and use.As the acid anhydrides of operable liquid state, preferably in its structure, do not there is aromatic nucleus and there is the acid anhydrides of saturated rings structure.Particularly, can be cited acid anhydrides in the polycarboxylic acid compositions explanation of the invention described above.In addition, the illustrated scope that also preferably exists together such as mixing ratio.Therefore, the polycarboxylic acid compositions of the present invention of the polycarboxylic acid of above-mentioned contained (1) and acid anhydrides, can directly use as hardener for epoxy resin composition of the present invention.

In this solidifying agent, also can comprise following recorded curing catalysts, additive, inorganic filling material etc. simultaneously.

Below record the polycarboxylic acid of contained (1) or the curable resin composition of the present invention of hardener for epoxy resin of the present invention.

Curable resin composition of the present invention comprises the epoxy resin as neccessary composition.

As the epoxy resin that can use in curable resin composition of the present invention, can enumerate: phenolic resin varnish type epoxy resin, bisphenol A type epoxy resin, biphenyl type epoxy resin, tritane type epoxy resin, phenol aralkyl-type epoxy resin etc.Particularly, can enumerate: dihydroxyphenyl propane, bisphenol S, sulphur diphenol, bis-phenol Fluorene, terpene diphenol, 4, 4'-bis-phenol, 2, 2'-bis-phenol, 3, 3', 5, 5'-tetramethyl--[1, 1'-xenyl]-4, 4'-glycol, Resorcinol, Resorcinol, naphthalene glycol, three (4-hydroxyphenyl) methane, 1, 1, 2, 2-tetra-(4-hydroxyphenyl) ethane, phenols (phenol, the phenol that alkyl replaces, naphthols, the naphthols that alkyl replaces, dihydroxy-benzene, dihydroxy naphthlene etc.) and formaldehyde, acetaldehyde, phenyl aldehyde, p-Hydroxybenzaldehyde, salicylaldhyde, parahydroxyacet-ophenone, o-hydroxyacetophenone, dicyclopentadiene, furfural, 4, 4'-bis-(chloromethyl)-1, 1'-biphenyl, 4, 4'-bis-(methoxymethyl)-1, 1'-biphenyl, 1, 4-bis-(chloromethyl) benzene, 1, the polycondensate of 4-bis-(methoxymethyl) benzene etc. and their modifier, the halogenation bisphenols of tetrabromo-bisphenol etc., the glycidyl ether compound being derived by alcohols, the epoxy resin of alicyclic epoxy resin, Racemic glycidol amine epoxy resin, glycidyl ester based epoxy resin, silsesquioxane alkanes is (in chain, ring-type, scalariform, or in the siloxane structure of the mixed structure at least of more than two kinds in them, there is the epoxy resin of glycidyl and/or epoxy-cyclohexane structure) etc. solid-state or liquid epoxy resin, but be not limited to these.

While particularly curable resin composition of the present invention being used for to optical applications, as epoxy resin, preferably alicyclic epoxy resin is or/and the polyorganosiloxane resin (the preferably epoxy resin of silsesquioxane alkyl structure) that contains epoxy group(ing), being particularly preferably used in combination of the two.During in particular for alicyclic epoxy resin, preferably in skeleton, there is the compound of epoxy-cyclohexane structure, the epoxy resin particularly preferably obtaining by thering is the oxidizing reaction of compound of cyclohexene.

As these alicyclic epoxy resins, can enumerate: can be by the esterification of the esterification of cyclohexene carboxylate and alcohols or tetrahydrobenzene methyl alcohol and carboxylic-acid (Tetrahedron the 36th the 2409th page of volume (1980), the method that Tetrahedron Letter the 4475th page (1980) etc. records), or the Tischenko reaction of hexamethylene olefine aldehydr (Tischenko reaction) (TOHKEMY 2003-170059 communique, the method that TOHKEMY 2004-262871 communique etc. is recorded), and the compound that the transesterification reaction of cyclohexene carboxylate ester (method that TOHKEMY 2006-052187 communique etc. is recorded) is manufactured is oxidized and the product that obtains etc.

As alcohols, as long as thering is the compound of alcoholic extract hydroxyl group, be not particularly limited, can enumerate: ethylene glycol, propylene glycol, 1,3-PD, 1,2-butyleneglycol, BDO, 1,5-PD, 1, the glycolss such as 6-hexylene glycol, cyclohexanedimethanol; Three alcohols such as glycerol, trimethylolethane, TriMethylolPropane(TMP), tri hydroxy methyl butane, 2-methylol BDO; The tetrol classes such as tetramethylolmethane etc.In addition, as carboxylic-acid, can enumerate: succinic acid, maleic acid, FUMARIC ACID TECH GRADE, phthalic acid, m-phthalic acid, hexanodioic acid, cyclohexane dicarboxylic acid etc., but be not limited to these.

In addition, can enumerate the acetal compound that tetrahydrobenzene aldehyde derivatives and alcohol obtain by aldolization.As reaction method, can be by the general acetalation manufacture of application, for example open: to use toluene, dimethylbenzene equal solvent as reaction medium, azeotropic dehydration on one side, the method (No. 2945008 communique of United States Patent (USP)) of reacting on one side; Polyvalent alcohol is dissolved in after concentrated hydrochloric acid, adds lentamente aldehydes, the method (Japanese kokai publication sho 48-96590 communique) of reacting on one side on one side; Make the method (United States Patent (USP) No. 3092640 communique) of water as reaction medium; With an organic solvent as the method (Japanese kokai publication hei 7-215979 communique) of reaction medium; Use the method (TOHKEMY 2007-230992 communique) of solid acid catalyst etc.Consider from the stability of structure, preferably cyclic acetal structure.

In addition, can enumerate: by polynary olefin oxidations of ester ring type such as vinyl cyclohexene or limonene, dicyclopentadiene, three cyclopentadiene, methyl dicyclopentadiene, two tetrahydrobenzene, octadienes and product obtaining etc.

As the concrete example of these epoxy resin, can enumerate: ERL-4221, ERL-4299 (are all trade(brand)name, being Dow Chemical manufactures), EPOLEAD GT401, EHPE3150, EHPE3150CE (be all trade(brand)name, being Daicel chemical industrial manufactures) and dicyclopentadiene diepoxide etc., but be not limited to these (reference: Gross is said エ Port キシ Trees fat (epoxy resin introduction) basis piece of writing I 76-85 page).They can use separately also and two or more can be used in combination.

As preferred alicyclic epoxy resin, the epoxy group(ing) cyclohexyl preferably can with methyl is for example with-COO-CH ₂-,-COO-(C ₃to C ₈divalent representative examples of saturated aliphatic base)-COO-,-CH ₂-COO-(C ₃to C ₈divalent representative examples of saturated aliphatic base)-COO-or-CH ₂-COO-(C ₃to C ₈divalent representative examples of saturated aliphatic base)-COO-CH ₂-wait the difunctional epoxy resin of linking group bonding.

As the polyorganosiloxane resin that contains epoxy group(ing), the preferably epoxy resin of silsesquioxane alkyl structure.As the epoxy resin of silsesquioxane alkyl structure, preferably there is the organopolysiloxane of epoxy-cyclohexane structure.More preferably weight-average molecular weight be more than 1000 and 20,000 following, preferably the polyorganosiloxane resin that contains epoxy group(ing) more than 1000 and below 10,000, further preferably there is the organopolysiloxane of epoxy-cyclohexane structure.

In the present invention, can enumerate especially: there is by use the compound that the organoalkoxysilane of epoxy group(ing) cyclohexyl obtains as the sol gel reaction of raw material (Sol-Gel Reaction).

Particularly, can enumerate: TOHKEMY 2004-256609 communique, TOHKEMY 2004-346144 communique, No. 2004/072150th, International Publication, TOHKEMY 2006-8747 communique, No. 2006/003990th, International Publication, TOHKEMY 2006-104248 communique, No. 2007/135909th, International Publication, TOHKEMY 2004-10849 communique, TOHKEMY 2004-359933 communique, No. 2005/100445th, International Publication, the organopolysiloxane of the silsesquioxane type with the areolation being distributed in three-dimensional space of the records such as TOHKEMY 2008-174640 communique.

For silsesquioxane alkyl structure, be not particularly limited, but because the silicone compounds of simple three-dimensional eyed structure is really up to the mark, therefore expect to relax the structure of hardness.

In the present invention, particularly preferably in 1 molecule, there is the block structure body of polysiloxane segment and the described silsesquioxane alkyl structure that obtains by sol gel reaction.As the manufacturing process of such compound, can enumerate: manufacture method and structure that International Publication is recorded for No. 2010/026714.

In curable resin composition of the present invention, the polycarboxylic acid (or curing agent composition) of formula (1) can be used in combination with other solidifying agent.While being used in combination, the polycarboxylic acid of formula (1) is more than in whole solidifying agent, shared ratio is preferably 20 % by weight, particularly preferably more than 30 % by weight.

As the solidifying agent that can be used in combination with the polycarboxylic acid of formula (1), for example can enumerate: aminated compounds, the anhydrides compound with unsaturated ring structure, amides, phenolic compound, carboxylic acid compound etc.As the concrete example of operable solidifying agent, can enumerate: diaminodiphenyl-methane, diethylenetriamine, Triethylenetetramine (TETA), diamino diphenyl sulfone, isophorone diamine, Dyhard RU 100, by linolenic dipolymer and the synthetic polyamide resin of quadrol, Tetra hydro Phthalic anhydride, trimellitic acid 1,2-anhydride, PMA, maleic anhydride, Tetra Hydro Phthalic Anhydride, methyl tetrahydrophthalic anhydride, methyl carbic anhydride, carbic anhydride, hexahydrophthalic anhydride, methylhexahydrophthalic anhydride, butane tetracarboxylic acid anhydrides, two ring [2.2.1] heptane-2,3-dicarboxylic anhydride, methyl bicyclic [2.2.1] heptane-2,3-dicarboxylic anhydride, hexanaphthene-1,3,4-tricarboxylic acid-3,4-acid anhydride, dihydroxyphenyl propane, Bisphenol F, bisphenol S, bis-phenol Fluorene, terpene diphenol, 4,4'-bis-phenol, 2,2'-bis-phenol, 3,3', 5,5'-tetramethyl--[1,1'-xenyl]-4,4'-glycol, Resorcinol, Resorcinol, naphthalene glycol, three (4-hydroxyphenyl) methane, 1,1,2,2-tetra-(4-hydroxyphenyl) ethane, phenols (phenol, the phenol that alkyl replaces, naphthols, the naphthols that alkyl replaces, dihydroxy-benzene, dihydroxy naphthlene etc.) and formaldehyde, acetaldehyde, phenyl aldehyde, p-Hydroxybenzaldehyde, salicylaldhyde, parahydroxyacet-ophenone, o-hydroxyacetophenone, dicyclopentadiene, furfural, 4,4 '-bis-(chloromethyl)-1,1 '-biphenyl, 4,4 '-bis-(methoxymethyl)-1,1 '-biphenyl, Isosorbide-5-Nitrae '-bis-(chloromethyl) benzene, the polycondensate of Isosorbide-5-Nitrae '-bis-(methoxymethyl) benzene etc. and their modifier, the halogenation bisphenols such as tetrabromo-bisphenol, the condenses of imidazoles, boron trifluoride-ammonium complex compound, guanidine derivative, terpene and phenols etc., but be not limited to these.They can use separately, also can use two or more.

In curable resin composition of the present invention, the ratio of solidifying agent and epoxy resin, with respect to epoxy group(ing) 1 equivalent of whole epoxy resin, preferably 0.5 to 1.5 equivalent (thinking the carboxylic acid of 1 official's energy, the acid anhydrides of 1 official's energy), particularly preferably 0.5 to 1.2 equivalent.With respect to epoxy group(ing) 1 equivalent, if less than 0.5 equivalent or while exceeding 1.5 equivalent all likely cannot solidify fully and cannot obtain good curing physical property.

In curable resin composition of the present invention, also can be used in combination curing catalyst together with solidifying agent.As the concrete example of operable curing catalyst, can enumerate: glyoxal ethyline, 2-phenylimidazole, 2-undecyl imidazole, 2-heptadecyl imidazoles, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1 benzyl 2 methyl imidazole, 1-cyano ethyl-glyoxal ethyline, 1-cyano ethyl-2-phenylimidazole, 1-cyano ethyl-2-undecyl imidazole, 2,4-diamino-6 (2'-Methylimidazole (1 ')) ethyl s-triazine, 2,4-diamino-6 (2 '-undecyl imidazole (1 ')) ethyl s-triazine, 2,4-diamino-6 (2 '-ethyl, 4-methylimidazole (1 ')) ethyl s-triazine, 2,4-diamino-6 (2 '-Methylimidazole (1 ')) ethyl s-triazine-isocyanuric acid affixture, the 2:3 affixture of glyoxal ethyline isocyanuric acid, 2-phenylimidazole isocyanuric acid affixture, 2-phenyl-3,5-hydroxymethyl-imidazole, 2-phenyl-4-methylol-5-Methylimidazole, 1-cyano ethyl-2-phenyl-3, the various imidazoles that 5-dicyano ethoxyl methyl imidazoles is such, and, the salt of the polycarboxylic acids such as these imidazoles and phthalic acid, m-phthalic acid, terephthalic acid, trimellitic acid, pyromellitic acid, naphthalene dicarboxylic acids, toxilic acid, oxalic acid, the amidess such as Dyhard RU 100, the salt of the diaza compounds such as 1,8-, bis-a word used for translation dicyclo [5.4.0] 11-7-alkene and their tetraphenyl borate, phenol phenolic varnish etc., salt with described polycarboxylic acid class or phosphonic acid based, quaternary ammonium salt (the preferably C of bromination tetrabutylammonium, cetyl trimethylammonium bromide, trioctylphosphine methyl brometo de amonio, cetyltrimethylammonium hydroxide etc. ₁to C ₂₀alkylammonium salt), triphenylphosphine, three (toluyl) phosphine, tetraphenylphosphonibromide bromide

tetraphenyl the phosphonic acid based such as tetraphenyl borate salts or compound, the phenols such as 2,4,6-triamino sylvan, amine additives, the metallic compounds such as stannous octoate etc., and by microcapsule-type curing catalyst obtaining after these curing catalyst micro encapsulations etc.In these curing catalysts wish use any, be for example suitably to select according to the transparency, curing speed, the so desired characteristic of the transparent resin composition obtaining of operating condition.In the present invention, preferably can enumerate:

compound (more preferably season

salt) or quaternary ammonium salt.

Curing catalyst is with respect to epoxy resin 100 weight parts, conventionally 0.001 to 15 weight part, preferably 0.01 to 5 weight part, more preferably in the scope of 0.05 to 1 weight part, use.

In curable resin composition of the present invention, also can comprise the P contained compound of giving composition as flame retardant resistance.P contained compound can be response type can be also addition type.As the concrete example of P contained compound, can enumerate: trimethyl phosphite 99, triethyl phosphate, Tritolyl Phosphate, tricresyl phosphate (xylyl) ester, cresyl phosphate diphenyl ester, cresyl phosphate-2,6-bis-(xylylene) ester, 1,3-phenylene two (two (xylylene) phosphoric acid ester), 1,4-phenylene two (two (xylylene) phosphoric acid ester), 4, the phosphoric acid esters such as 4 '-biphenyl (two (xylylene) phosphoric acid ester); The phosphorus hydrogen types such as 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10 (2,5-dihydroxyphenyl)-10H-9-oxa--10-phospho hetero phenanthrene 10-oxide compound; Phosphorous epoxy compounds, red phosphorus etc. that the reactive with active hydrogen of epoxy resin and described phosphorus hydrogen type obtains, preferably phosphoric acid ester class, phosphorus hydrogen type or phosphorous epoxy compounds, particularly preferably 1,3-phenylene two (two (xylylene) phosphoric acid ester), 1,4-phenylene two (two (xylylene) phosphoric acid ester), 4,4 '-biphenyl (two (xylylene) phosphoric acid ester), 4,4 '-butylidene two (3-methyl-6-tert butyl phenyl-bis--tridecyl phosphorous acid ester) or phosphorous epoxy compoundss.The content of P contained compound take epoxy resin=0.1 of P contained compound/all to 0.6 (weight ratio) for preferred.Below 0.1 time, flame retardant resistance is insufficient, and 0.6 when above, likely the water absorbability of cured article, dielectric property are adversely affected.

In addition, in curable resin composition of the present invention, can add as required antioxidant.As operable antioxidant, can enumerate: phenol antioxidant, sulphur-containing antioxidant, phosphorous antioxidant etc.Antioxidant may be used singly or in combination of two or more kinds.With respect to resinous principle 100 weight parts in curable resin composition of the present invention, the usage quantity of antioxidant is generally 0.008 to 1 weight part, preferably 0.01 to 0.5 weight part.

As antioxidant, for example can enumerate: phenol antioxidant, sulphur-containing antioxidant, phosphorous antioxidant etc.As the concrete example of phenol antioxidant, can illustrate: 2,6-ditertbutylparacresol, butylated hydroxy anisole (BHA), 2,6-di-t-butyl is to diethylstilbestrol, β-(3,5-di-tert-butyl-hydroxy phenyl) propionic acid stearyl ester, 3-(3,5-di-tert-butyl-hydroxy phenyl) the different monooctyl ester of propionic acid, 2, two (just pungent sulfenyl)-6-(4-hydroxyl-3 of 4-, 5-di-tert-butyl aniline)-1,3,5-triazine, 2, the monobasic phenols such as two [(pungent sulfenyl) methyl] ortho-cresols of 4-, 2, 2 '-methylene-bis (4-methyl-6-tert butyl phenol), 2, 2 '-methylene-bis (4-ethyl-6-tert-butyl phenol), 4, 4 '-thiobis (3-methyl-6-tert butyl phenol), 4, 4 '-butylidene two (3-methyl-6-tert butyl phenol), triethylene glycol-bis-[3-(the 3-tertiary butyl-5-methyl-4-hydroxy phenyl) propionic ester], 1, 6-hexylene glycol-bis-[3-(3, 5-di-tert-butyl-hydroxy phenyl) propionic ester], N, N '-hexa-methylene two (3, 5-di-t-butyl-4-hydroxyl-hydrogen base cinnamide), 2, 2-sulfenyl-di ethylene bis [3-(3, 5-di-tert-butyl-hydroxy phenyl) propionic ester], 3, 5-di-tert-butyl-4-hydroxyl benzyl diethyl phosphonate, 3, 9-two [1, 1-dimethyl-2-{ β-(3-tertiary butyl-4-hydroxy-5-aminomethyl phenyl) propionyloxy } ethyl]-2, 4, 8, 10-tetra-oxaspiros [5.5] undecane, two (3, 5-di-tert-butyl-4-hydroxyl benzyl sulfonic acid ethyl ester) bisphenols such as calcium, 1, 1, 3-tri-(2-methyl-4-hydroxyl-5-tert-butyl-phenyl) butane, 1, 3, 5-trimethylammonium-2, 4, 6-tri-(3, 5-di-tert-butyl-4-hydroxyl benzyl) benzene, four-(methylene radical-3-(3 ', 5 '-di-t-butyl-4 '-hydroxy phenyl) propionic ester) methane, two [3, 3 '-bis--(4 '-hydroxyl-3 '-tert-butyl-phenyl) butyric acid] glyceryl ester, three-(3, 5-di-tert-butyl-4-hydroxyl benzyl)-isocyanuric acid ester, 1, 3, 5-tri-(3 ', 5 '-di-t-butyl-4 '-hydroxybenzyl)-guanamine, 4, 6-(1H, 3H, 5H) triketone, the polymer phenols such as tocopherol.

As the concrete example of sulphur-containing antioxidant, can illustrate: dilauryl-3,3 '-thiodipropionate, myristyl-3,3 '-thiodipropionate, distearyl-3,3 '-thiodipropionate etc.

As the concrete example of phosphorous antioxidant, can illustrate: triphenyl phosphite, diphenyl phosphite isodecyl ester, phenyl-phosphite two isodecyl esters, three (nonyl phenyl) phosphorous acid ester, diiso decyl pentaerythritol phosphite, three (2, 4-di-tert-butyl-phenyl) phosphorous acid ester, two (octadecyl) phosphorous acid esters of ring-type neopentane four bases, ring-type neopentane four bases two (2, 4-di-tert-butyl-phenyl) phosphorous acid ester, ring-type neopentane four bases two (2, 4-di-t-butyl-4-aminomethyl phenyl) phosphorous acid ester, the phosphorous acid esters such as two [the 2-tertiary butyl-6-methyl-4-{2-(octadecane oxygen base carbonyl) ethyl } phenyl] H-Phosphonate, 9, mix-10-phospho hetero phenanthrene-10-oxide compound of 10-dihydro-9-oxy, 10-(3,5-di-tert-butyl-4-hydroxyl benzyl)-9, the oxa-phospho hetero phenanthrenes such as mix-10-phospho hetero phenanthrene-10-oxide compound of 10-dihydro-9-oxy, 10-oxygen in last of the ten Heavenly stems base-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide are oxide-based etc.

These antioxidants can use separately separately, also two or more can be used in combination.Particularly preferred phosphorous antioxidant in the present invention.

In addition, in curable resin composition of the present invention, can add as required photostabilizer.

As photostabilizer, hindered amine light stabilizer, particularly steric hindrance amine photostabilizer (HALS) are applicable to.As HALS, be not particularly limited, typical example can be enumerated: dibutylamine-1, 3, 5-triazine-N, N '-bis-(2, 2, 6, 6-tetramethyl--4-piperidyl-1, 6-six methylene diamines and N-(2, 2, 6, 6-tetramethyl--4-piperidyl) polycondensate of butylamine, Succinic acid dimethylester-1-(2-hydroxyethyl)-4-hydroxyl-2, 2, 6, 6-tetramethyl piperidine polycondensate, poly-[{ 6-(1, 1, 3, 3-tetramethyl butyl) amino-1, 3, 5-triazine-2, 4-bis-bases } { (2, 2, 6, 6-tetramethyl--4-piperidyl) imino-} hexa-methylene { (2, 2, 6, 6-tetramethyl--4-piperidyl) imino-}], two (1, 2, 2, 6, 6-pentamethyl--4-piperidyl) [[3, 5-two (1, 1-dimethyl ethyl)-4-hydroxy phenyl] methyl] butyl malonic acid ester, two (2, 2, 6, 6-tetramethyl--4-piperidyl) sebate (aftermentioned L1), two (1, 2, 2, 6, 6-pentamethyl--4-piperidyl) sebate, two (1-octyloxy-2, 2, 6, 6-tetramethyl--4-piperidyl) sebate, 2-(3, 5-di-tert-butyl-4-hydroxyl benzyl)-2-n-butylmalonic acid two (1, 2, 2, 6, 6-pentamethyl--4-piperidyl) etc., HALS can only use a kind, also can be used in combination two or more.

In addition, in curable resin composition of the present invention, also can coordinate as required resin glue.Resin glue can be enumerated: butyral resinoid, acetal-based resin, acrylic resin, epoxy-nylon-based resin, NBR-phenolic resinoid, epoxy-NBR resinoid, polyamide-based resin, polyimide based resin, polysiloxane resinoid etc., but be not limited to these.The use level of resin glue is preferably added not damaging in the flame retardant resistance of cured article, stable on heating scope, with respect to resinous principle 100 weight parts, conventionally can use as required 0.05 to 50 weight part, preferred 0.05 to 20 weight part.

In curable resin composition of the present invention, can add as required inorganic filler.Inorganic filler can be enumerated: powders such as crystalline silica, melting silicon oxide, aluminum oxide, zircon, Calucium Silicate powder, calcium carbonate, silicon carbide, silicon nitride, boron nitride, zirconium white, forsterite, steatite, spinel, titanium oxide, talcum or by the microballon obtaining after their ball-types etc., but be not limited in these.They may be used singly or in combination of two or more.The content of these inorganic fillers can occupy 0 to 95 % by weight in curable resin composition of the present invention.

In addition, in curable resin composition of the present invention, can add: the releasing agents such as silane coupling agent, stearic acid, palmitinic acid, Zinic stearas, calcium stearate; Various Synergist S-421 95s, the various heat-curing resins such as zn cpds (metallic soap), tensio-active agent, dyestuff, pigment, UV light absorber such as zinc carbonate (2 ethyl hexanoic acid zinc, Zinic stearas, docosoic zinc, Zinc tetradecanoate) or phosphoric acid ester zinc (octyl group zinc phosphate, stearyl zinc phosphate etc.).

As preferred curable resin composition, can enumerate following resin combination.

(i) a kind of composition, it comprises: the epoxy resin that comprises 10 to 90 % by weight with respect to the total amount of curable resin composition, with respect to epoxy group(ing) 1 equivalent of this epoxy resin, in functional group's equivalent of curing agent composition, the curing agent composition that comprises 0.5 to 1.5 equivalent.This resin combination can also comprise curing catalyst with the ratio of 0.01 to 15 weight part with respect to epoxy resin 100 weight parts.Conventionally preferably comprise this curing catalyst.

(ii) curable resin composition as described in above-mentioned (i), wherein, epoxy resin is that (preferable weight-average molecular weight is approximately 1000 to approximately 20 for described alicyclic epoxy resin or the organopolysiloxane with epoxy-cyclohexane structure, 000,1000 to approximately 10,000 epoxy group(ing) organopolysiloxane more preferably from about).

(iii) curable resin composition as above-mentioned (i) or (ii), wherein, alicyclic epoxy resin is the alicyclic epoxy compound with epoxy-cyclohexane structure.

(iv) curable resin composition as above-mentioned (ii) or (iii), wherein, alicyclic epoxy resin be can there is methyl epoxy group(ing) cyclohexyl for example with-COO-CH ₂-,-COO-(C ₃to C ₈divalent representative examples of saturated aliphatic base)-COO-,-CH ₂-COO-(C ₃to C ₈divalent representative examples of saturated aliphatic base)-COO-or-CH ₂-COO-(C ₃to C ₈divalent representative examples of saturated aliphatic base)-COO-CH ₂-wait the difunctional epoxy resin of linking group bonding.

(v) curable resin composition as described in any one in above-mentioned (i) to (iv), wherein, solidifying agent is the polycarboxylic acid compositions described in the polycarboxylic acid or described 1, described 10 of formula (1).

(vi) curable resin composition as described in any one in above-mentioned (i) to (iv), wherein, solidifying agent is the solidifying agent of the polycarboxylic acid compositions described in the polycarboxylic acid or described 11 of contained (1).

(vii) curable resin composition as described in any one in above-mentioned (i) to (v), wherein, curing agent composition is the polycarboxylic acid compositions described in described 11.

(viii) curable resin composition as described in any one in above-mentioned (i) to (vi), wherein, curing agent composition is the curing agent composition described in described 13.

(ix) curable resin composition as described in any one in above-mentioned (i) to (viii), wherein, the polycarboxylic acid of solidifying agent contained (1) or comprise the solidifying agent described in described 14.

(x) curable resin composition as described in any one in above-mentioned (i) to (ix), wherein, this curing catalyst is

compound (more preferably season

salt) or quaternary ammonium salt.

(xi) curable resin composition as described in any one in above-mentioned (i) to (ix), wherein, the R in formula (1) is methyl or carboxyl.

When curable resin composition of the present invention uses in photosemiconductor encapsulant, can add as required fluor.The effect that fluor has is: the blue light for example being sent by blue-led element by absorption portion also sends the sodium yellow of wavelength through conversion, forms thus white light.In advance fluor is dispersed in curable resin composition, then photosemiconductor is sealed.Fluor is not particularly limited, and can use known fluor in the past, can illustrate as the aluminate of: rare earth element, sulfo-gallate, orthosilicate etc.More specifically, can enumerate: the fluor such as YAG fluor, TAG fluor, orthosilicate fluor, sulfo-gallate fluor, sulphide phosphor, can illustrate: YAlO ₃: Ce, Y ₃al ₅o ₁₂: Ce, Y ₄al ₂o ₉: Ce, Y ₂o ₂s:Eu, Sr ₅(PO ₄) ₃cl:Eu, (SrEu) OAl ₂o ₃deng.The particle diameter of this fluor can use at particle diameter well known in the art, and median size is 1 to 250 μ m preferably, more preferably 2 to 50 μ m.Using when these fluor, its addition is with respect to these resinous principle 100 weight parts, preferably 1 to 80 weight part, more preferably 5 to 60 weight parts.

Curable resin composition of the present invention can be by being obtained by mixing each composition equably.Curable resin composition of the present invention can be by with known method same procedure in the past and easily obtain its cured article.The method that can enumerate is for example: by epoxy resin of the present invention and solidifying agent and curing catalyst as required, P contained compound, resin glue, inorganic fill material and Synergist S-421 95, after using as required forcing machine, kneader, roller etc. to be mixed to fully evenly, obtain curable resin composition, when this curable resin composition is liquid, embedding, curtain coating, be infiltrated up in base material, curable resin composition is poured in mould, then heat curing thus method; When solid-state if, cast or use transfer formation machine etc. to carry out moulding after melting, then heat curing thus method.Solidification value, time are to carry out 2 to 10 hours at 80 to 200 ℃.As curing, at high temperature disposal solidifying, but preferably heat up to be step by step cured reaction.Particularly, between 80 to 150 ℃, carry out initial cure, then carry out after fixing between 100 ℃ to 200 ℃.Cure stage is preferably divided into 2 to 8 stages and heats up, more preferably 2 to 4 stages.

Curable resin composition of the present invention is dissolved in toluene, dimethylbenzene, acetone, methylethylketone, mibk, dimethyl formamide, N,N-DIMETHYLACETAMIDE, N-methylpyrrole pyridine ketone equal solvent and obtains curable resin composition varnish, this varnish is infiltrated up in the base materials such as glass fibre, carbon fiber, trevira, tynex, sapphire whisker and paper and heat drying obtains prepreg, by this prepreg by hot-forming, thereby can obtain the cured article of curable resin composition A of the present invention.Solvent now, in the mixture of curable resin composition of the present invention and this solvent, uses 10 to 70 % by weight, the preferred amount of 15 to 70 % by weight conventionally.In addition, also can directly fluid composition be obtained to the epoxy resin cured product that contains carbon fiber by RTM mode.

In addition, curable resin composition of the present invention also can be used as the properties-correcting agent use of film-type composition.Particularly, can be for improving flexible etc. in B stage (B-ステージ).Such pellicular resin composition can be coated on stripping film by curable resin composition A of the present invention is made to described curable resin composition varnish, goes down to desolventize at heating condition, then carries out the B stage, obtains thus the tackiness agent of sheet.The interlayer insulating film that this sheet tackiness agent can be used as in multilager base plate etc. uses.

Below, be elaborated as the sealing material of photosemiconductor or the situation of chip join materials'use for composition epoxy resin of the present invention.

Composition epoxy resin of the present invention is in the time of the sealing material of the photosemiconductor as high brightness White LED etc. or chip join materials'use, by the additive of the solidifying agent of the polycarboxylic acid of contained (1) (curing agent composition) and epoxy resin and curing catalyst, coupling agent material, antioxidant, photostabilizer etc. is mixed fully and prepares composition epoxy resin to use as sealing material, or as chip join material and sealing material both sides use.Blending means is used kneader, three beaming rollers, universal mixer, planetary stirrer, clarifixator, homogenous disperse machine, ball mill etc. to mix at normal temperature or in heating.

The photosemiconductors such as high brightness White LED, generally, by by being layered in the semi-conductor chips such as GaAs, GaP on the substrates such as sapphire, spinel, SiC, Si, ZnO, GaAlAs, GaAsP, AlGa, InP, GaN, InN, AlN, InGaN, be adhesive on lead frame, heating panel or encapsulant and form with tackiness agent (chip join material).Also there is the type that connects the bonding wires such as gold solder line in order to make current flowing.In order to prevent heat or moisture and in order to realize the effect of lens function, the sealing materials such as this semi-conductor chip epoxy resin to be sealed.Composition epoxy resin of the present invention can be used as sealing material or chip join materials'use.From the viewpoint of operation, curable resin composition of the present invention is all suitable in the time using as chip join material and sealing material both sides.

The method that uses curable resin composition of the present invention that semi-conductor chip is adhesive on substrate can be: after composition epoxy resin of the present invention is coated with by dispensing (ディスペンサー), embedding, silk screen printing, mounting semi-conductor chip is also heating and curing, thereby can gluing semi-conductor chip.

Heating can be used the methods such as heated air circulation type, infrared rays, high frequency.Heating condition preference 80 to approximately 230 ℃, approximately 1 minute to approximately 24 hours according to appointment.The internal stress producing while being heating and curing in order to reduce, for example, can, 80 to 120 ℃ of Procuring 30 minutes to 5 hours, then carry out after fixing with the condition of 120 to 180 ℃, 30 minutes to 10 hours.

The molding mode of sealing material can use as mentioned above: to injecting sealing material in the frame mould packing into after the substrate that is fixed with semi-conductor chip, be then heating and curing and the injection mode of moulding; Injecting sealing material in mould in advance, then dipping is fixed on semi-conductor chip on substrate therein, then after being heating and curing from the compressed moulding mode of mold releasability etc.

Method for implanting can be enumerated such as dispensing, transfer formation, injection molding etc.

Heating can be used the methods such as heated air circulation type, infrared rays and high frequency.

Heating condition preference 80 to approximately 230 ℃, approximately 1 minute to approximately 24 hours according to appointment.The internal stress producing while being heating and curing in order to reduce, for example, can, 80 to 120 ℃ of Procuring 30 minutes to 5 hours, then carry out after fixing with the condition of 120 to 180 ℃, 30 minutes to 10 hours.

In addition, curable resin composition of the present invention can be for using the general use of the heat-curing resins such as epoxy resin, particularly, can enumerate: cyanate resin composition that tackiness agent, coating, coating agent, formed material (comprising sheet, film, FRP etc.), insulating material (comprising printing plate, coating electric wire etc.), sealing material and sealing material, substrate are used, as the acrylic resin of resist solidifying agent etc., other is to the additive adding in resin etc. etc.

As tackiness agent, except building is with, for building, automobile, general affairs, therapeutic medical tackiness agent, can also enumerate the tackiness agent that electronic material is used.Wherein, electronic material sticks with glue agent and can enumerate: the folded interlaminated adhesive that increases the multilager base plates such as (Build-Up) substrate; The adhesive for semiconductor such as chip join agent, bottom weighting agent; BGA enhancing sticks with glue agent etc. with installations such as bottom weighting agent, anisotropic conductive film (ACF), anisotropic conductive pastes (ACP).

Sealing agent can be enumerated: embedding, dipping, the transfer formation sealing agent of the use such as electrical condenser, transistor, diode, photodiode, IC, LSI; The so-called embedding sealing agent of the use such as COB, COF, TAB of IC, LSI class; Sealing agent (comprise to strengthen and use bottom weighting agent) when the IC encapsulation classes such as the bottom weighting agent of the use such as flip-chip, QFP, BGA, CSP are installed etc.

Curable resin composition of the present invention can be for the various uses take optics material as representative through solidifying the cured article of the present invention obtaining.Optics generally represents to make the material using in the purposes of light by this material such as visible ray, infrared rays, ultraviolet ray, X ray, laser with material.More specifically say, except the LED such as lamp type, SMD type are with sealing material, can also enumerate routine the following stated.The liquid crystal indicator peripheral material of film etc. for the liquid crystal such as baseplate material in field of liquid crystal, light guiding plate, prismatic lens, polaroid, polarizer, viewing angle compensation film, tackiness agent, polaroid protective film.In addition, the sealing material of the color PDP (plasma display) of being expected as flat-panel monitor of future generation, antireflective film, optical compensating film, case material, the protective film of front glass, front glass equivalent material, tackiness agent, or the moulding material of the LED using in LED display unit, the sealing material of LED, the protective film of front glass, front glass equivalent material, tackiness agent, or the baseplate material in plasma addressed liquid (PALC) indicating meter, light guiding plate, prismatic lens, polaroid, polarizer, viewing angle compensation film, tackiness agent, polarizer protective film, or the protective film of the front glass in organic EL (electroluminescent) indicating meter, front glass equivalent material, tackiness agent, or the various film substrates in Field Emission Display (FED), the protective film of front glass, front glass equivalent material, tackiness agent.In optical recording field, there are CD substrate material that VD (optic disk), CD/CD-ROM, CD-R/RW, DVD-R/DVD-RAM, MO/MD, PD (phase transition optical disk), light-card use, pickup lens, protective film, sealing material, tackiness agent etc.

In optical device field, there is material, range finder prism, target prism, view finder cover, the optical receiving sensor portion for camera lens of still camera.In addition, there are taking lens, the view finder of pick up camera.In addition, there are the projection lens, protective film, sealing material, tackiness agent etc. of projecting television set.Material, sealing material, tackiness agent, the film etc. for camera lens of lighting apparatus.In optics field, there are filamentary material, lens, the waveguide of the optical switch periphery in optical communication system, sealing material, the tackiness agent etc. of element.The fiber optic materials of optical conenctor periphery, lasso, sealing material, tackiness agent etc.In passive optical parts, optical circuit parts, there are the sealing material of lens, waveguide, LED, sealing material, the tackiness agent etc. of CCD.Sealing material, the tackiness agent etc. of the peripheral baseplate material of optoelectronic integrated circuit (OEIC), filamentary material, element.In field fiber, there is digital equipment in sensor class, demonstration/mark class etc. and communications infrastructure use and the family of decorating indicating meter illumination/photoconduction etc., industrial use to connect the optical fiber of use.In semiconductor integrated circuit peripheral material, the anticorrosive additive material that the microlithography that has LSI, super LSI material to use is used.In automobile, conveyor field, the lamp reflector, retainer, gear parts, anti-corrosion coating, switch sections, headlight, engine interior part, electric component, various inside and outsides parts, driving engine, braking fuel tank, Rustproof Steel Plate, trim panel, interior material, the protection/tie up with wire harness, fuel hose, auto lamp, glass substitute for automobile that have automobile to use.In addition, the multiple glazing that has rail vehicle to use.In addition, there are toughner, engine peripheral member, the protection/tie up with wire harness, anti-corrosion coating of the structured material of aircraft.In building field, have interior packing/factorial lumber material, electrical equipment cover (Electricity mood カバー), sheet material (シート), middle membrane of glass, glass substitute, solar cell peripheral material.In agricultural use, there is plastic house film.As follow-on optoelectronic function organic materials, there are baseplate material, the filamentary material of organic EL peripheral material, organic photorefractive element, light amplification element as light-light-switching device, optical operation element, organic solar batteries periphery, sealing material, the tackiness agent etc. of element.

Sealing agent for example can be enumerated: embedding, dipping, the transfer molding sealing agent of the use such as electrical condenser, transistor, diode, photodiode, IC, LSI; The embedding sealing agent of the use such as COB, COF, TAB of IC, LSI class; Sealing agent (comprise to strengthen and use bottom weighting agent) when the IC such as bottom weighting agent, BGA, the CSP encapsulation class of the use such as flip-chip is installed etc.

Other purposes of material for optics, can enumerate the general use that uses curable resin composition A or curable resin composition B, for example can enumerate: tackiness agent, coating, coating agent, formed material (comprising sheet, film, FRP etc.), insulating material (comprising printed base plate, coating electric wire etc.), sealing agent and other additive to middle interpolations such as resins etc.As tackiness agent, can enumerate the tackiness agent that building, for building, automobile, general affairs, therapeutic medical tackiness agent and electronic material are used.Wherein, electronic material sticks with glue agent and can enumerate: the folded interlaminated adhesive that increases the multilager base plates such as substrate; The adhesive for semiconductor such as chip join agent, bottom weighting agent; BGA enhancing sticks with glue agent etc. with installations such as bottom weighting agent, anisotropic conductive film (ACF), anisotropic conductive pastes (ACP).

Embodiment

Below, be described more specifically the present invention by embodiment, below, in explanation, if not otherwise specified, " part " refers to weight part.In addition, the invention is not restricted to these embodiment.In addition, in the present invention, the condition determination of gel permeation chromatography (hereinafter referred to as GPC) is as described below.Pillar uses Shode × SYSTEM-21 post (KF-803L, KF-802.5 (× 2), KF-802), elutriant is tetrahydrofuran (THF), flow velocity is 1ml/ minute, column temperature is 40 ℃, in addition, detect and use RI (reflectivity) to carry out, the polystyrene standard that typical curve uses Shodex to manufacture.In addition, functional group's equivalent is calculated by the ratio of trying to achieve by GPC, and obtains the value while respectively carboxylic acid, acid anhydrides being made as to 1 equivalent.

Embodiment 1 (polycarboxylic acid compositions A1)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 10 parts of toluene, 2, (Kyowa Yuka Kk manufactures 4-diethyl-1,5-PD; キョウワジオー Le PD9) (new Japanese physics and chemistry (Co., Ltd.) is manufactured for the mixture of 80 parts, methylhexahydrophthalic anhydride and hexahydrophthalic anhydride; Rikacid MH700 ratio 7:3, hereinafter referred to as acid anhydrides H1) 168 parts, carry out 4 hours heated and stirred at 100 ℃.Carve at this moment, confirm that by GPC rear end of disappearance (1 area % is following) of raw material reacts.Finish, after reaction, to use Rotary Evaporators, residual solvent is distilled to removal and obtains 246 parts of polycarboxylic acid compositions of the present invention (A1).Gains are colourless solid resin, and the polycarboxylic acid content of measuring by GPC is 97 area %.In addition, functional group's equivalent (being only called below functional group's equivalent) that carboxyl and acid anhydrides are added together is 245g/eq..In addition, though shape is solid-state, but there is a little mobility, at room temperature Slow Deformation and have and approach semi-solid shape.

Embodiment 2 (curing agent composition B1)

With respect to 25 parts of the polycarboxylic acid compositions obtaining in embodiment 1 (A1), add acid anhydrides (H1) 75 parts and make its uniform dissolution, obtain curing agent composition of the present invention (B1).Viscosity at 50 ℃ is 450mPas (E type viscometer).

Embodiment 3 (curing agent composition B2)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add (Kyowa Yuka Kk's manufacture of 2,4-diethyl-1,5-PD; キョウワジオー Le PD9) 100 parts of 20 parts, acid anhydrides (H1), carry out 4 hours heated and stirred at 60 ℃.Confirm that by GPC 2,4-diethyl-1,5-PD is below 1 area %.Obtain 120 parts of the curing agent compositions that comprises polycarboxylic acid compositions of the present invention (B2).The resultant of reaction obtaining is colorless liquid resin.The proportion of composing of measuring by GPC is: polycarboxylic acid (A1) is that the total amount of 52 area %, methylhexahydrophthalic anhydride and hexahydrophthalic anhydride is 48 area %.In addition, functional group's equivalent is 197g/eq..Viscosity at 50 ℃ is that 1340mPas (is 19700mPas at 25 ℃; E type viscometer).

Embodiment 4,5 (curable resin composition)

Solidifying agent uses respectively the curing agent composition B1 of the present invention that obtained by embodiment 2 and 3 and B2, epoxy resin to use 3,4-epoxy group(ing) cyclohexyl methyl-3, and (Dow Chemical manufactures 4-epoxy group(ing) cyclohexane carboxylic acid ester; UVR-6105, hereinafter referred to as epoxy resin (EP-1)), curing catalyst use cetyltrimethylammonium hydroxide (Tokyo HuaCheng Industry Co., Ltd manufacture; 25% methanol solution, hereinafter referred to as C1), coordinate with the mixing ratio (weight part) shown in following table 1, carry out, after the deaeration of 20 minutes, obtaining curable resin composition of the present invention.

Comparative example 1 (relatively using curable resin composition)

In above-described embodiment 4 and 5, except solidifying agent being changed to acid anhydrides (H1), carry out same operation with embodiment 4 and 5, obtain the relatively curable resin composition of use.

The curable resin composition that use obtains, with the main points shown in following volatilize test and LED test, and by their table 1 that the results are shown in.In addition, condition of cure is after the Procuring of 120 ℃ × 2 hours 150 ℃ × 5 hours.

Volatilization test:

The curable resin composition that embodiment 4,5 and comparative example 1 are obtained was implemented vacuum defoamation after 20 minutes, is poured into lentamente and in the cofferdam made from heat resistant adhesive tape, obtains 30mm × 20mm × height 1mm on glass substrate.Measure exactly after the weight resin of cast, with described condition, this cast thing is solidified.

Measure the weight of the cured article obtaining like this, the weight while confirming to solidify reduces.In addition, any one in embodiment 4,5 and comparative example 1 is all similarly cured under same baking oven.

LED test:

Each curable resin composition that embodiment 4,5 and comparative example 1 are obtained carried out vacuum defoamation after 20 minutes, was filled in respectively in barrel.Use accurate discharger to be poured into respectively in surface installing type (the SMD type 3mm φ) LED of the luminous element that is respectively equipped with emission wavelength 465nm.Then, they are solidified under above-mentioned condition of cure, obtain test LED.

Assessment item and metewand:

(a) volatility: whether have pit and evaluate with the cured article surface after visual observation sealing.Metewand in table is as described below.

Zero: do not observe pit;

△: observe a small amount of pit;

×: observe a large amount of pits (occurring that bonding wire exposes).

(b) Reflow Soldering test: the test obtaining is carried out after moisture absorption under condition at 30 ℃, 70% × 72 hour with LED, used high temperature observing device (SMT Scope SK-5000; Adret Jinggong Co., Ltd manufactures), confirm that LED has crack-free to produce under following Reflow Soldering condition.Test is carried out under n=3 condition, evaluates with (OK number)/(test number).In addition, above-mentioned (OK number) refers to and do not observe the passing number that breaks and produce.

Condition is: be warming up to 150 ℃ by 25 ℃ with 2 ℃/sec, then at 150 ℃, keep 2 minutes, then 2 ℃/sec are warming up to 260 ℃ and keep, after 10 seconds, being cooled to room temperature with 1.3 ℃/sec.

Table 1

Embodiment 4,5 and comparative example 1 are compared, and the volatile quantity of curable resin composition of the present invention is few, even if also can not produce the problems such as bonding wire exposes in the time of sealing LED.In addition, in the time of Reflow Soldering, also can't see the generation of breaking.From the above results, by the curing agent composition of the present invention that comprises polycarboxylic acid compositions of the present invention and acid anhydrides is used as solidifying agent, can obtain providing the curable resin composition of volatility resistance and the reflux-resisting welded good cured article that breaks.

Embodiment 6 (curing agent composition B3)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add (Kyowa Yuka Kk's manufacture of 2,4-diethyl-1,5-PD; キョウワジオー Le PD9) 73 parts of 12 parts, acid anhydrides (H1), 1,2,4-hexanaphthene tricarboxylic acid-1,2-acid anhydride (manufacture by H-TMAn Mitsubishi gas chemistry; Hereinafter referred to as H2) 15 parts, carry out 4 hours heated and stirred at 60 ℃.Confirm that by GPC 2,4-diethyl-1,5-PD is that 1 area % finishes reaction after following.

Obtain 100 parts of the polycarboxylic acid of contained (1) and the curing agent compositions of the present invention (B3) of acid anhydrides.Gains are colourless liquid resin.Functional group's equivalent is 183g/eq..Viscosity at 50 ℃ is 1010mPas.

Embodiment 7 (curing agent composition B4)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add (Kyowa Yuka Kk's manufacture of 2,4-diethyl-1,5-PD; キョウワジオー Le PD9) 20 parts, (the new Japanese physics and chemistry manufacture of 4-methylcyclohexane dicarboxylic anhydride; Rikacid MH H3) 100 parts, carry out 4 hours heated and stirred at 60 ℃.Confirm that by GPC 2,4-diethyl-1,5-PD is below 1 area %.Obtain 120 parts of the polycarboxylic acid of contained (1) and the curing agent compositions of acid anhydrides (B4).Functional group's equivalent is 201g/eq..Viscosity at 50 ℃ is that 1100mPas (is 16200mPas at 25 ℃; E type viscometer).

Embodiment 7a

Use Rotary Evaporators, at 100 to 150 ℃, the methylhexahydrophthalic anhydride of excessive existence is removed (the moment of no longer flowing out from methylhexahydrophthalic anhydride from 50 parts of curing agent compositions (B4), under heating reduced pressure, directly pass into nitrogen 40 minutes, can remove fully acid anhydrides), take out thus 25 parts of polycarboxylic acid compositions of the present invention (B4a).Be shaped as colourless semi-solid-state to solid-state resin.

The softening temperature (according to JIS K-7234) of gained resin is 58.9 ℃, and the melt viscosity at 150 ℃ is 0.08Pas.

Embodiment 8 (curing agent composition B5)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add (Kyowa Yuka Kk's manufacture of 2,4-diethyl-1,5-PD; キョウワジオー Le PD9) 12 parts, 73 parts, acid anhydrides (H3), 15 parts, acid anhydrides (H2), carry out 4 hours heated and stirred at 60 ℃.Confirm that by GPC 2,4-diethyl-1,5-PD is below 1 area %.Obtain 100 parts of the polycarboxylic acid of contained (1) and the curing agent compositions of acid anhydrides (B5).Gains are colourless liquid resin.Functional group's equivalent is 186g/eq..Viscosity at 50 ℃ is 1050mPas.

Embodiment 9 (curing agent composition B6)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add (Kyowa Yuka Kk's manufacture of 2,4-diethyl-1,5-PD; キョウワジオー Le PD9) 100 parts of 20 parts, cyclohexane dicarboxylic acid acid anhydride, carry out 4 hours heated and stirred at 60 ℃.Confirm that by GPC 2,4-diethyl-1,5-PD is below 1 area %.Obtain 120 parts of the polycarboxylic acid of contained (1) and the curing agent compositions of acid anhydrides (B6).Functional group's equivalent is 188g/eq..Viscosity at 50 ℃ is 1200mPas (E type viscometer).

Synthesis example 1 (relatively using curing agent composition B7)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 1,4 cyclohexane dimethanol (new Japanese physics and chemistry manufacture; SKY-CDM) 100 parts of 20 parts, acid anhydrides (H1), carry out 4 hours heated and stirred at 60 ℃.Obtain 120 parts of the curing agent compositions that comprises polycarboxylic acid and acid anhydrides (B7) that comparative example uses.In addition, functional group's equivalent is 171g/eq..Viscosity at 25 ℃ is 18900mPas (E type viscometer).

Synthesis example 2 (relatively using curing agent composition B8)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 20 parts of neopentyl glycol, 100 parts, acid anhydrides (H1), carry out 4 hours heated and stirred at 60 ℃.Obtain 120 parts of the curing agent compositions that comprises polycarboxylic acid and acid anhydrides (B8) that comparative example uses.Functional group's equivalent is 197g/eq..Viscosity at 25 ℃ is 23800mPas (E type viscometer).

Synthesis example 3 (relatively using curing agent composition B9)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 20 parts of 1,6-hexylene glycols, 100 parts, acid anhydrides (H1), carry out 4 hours heated and stirred at 60 ℃.Obtain 120 parts of the curing agent compositions that comprises polycarboxylic acid and acid anhydrides (B9) that comparative example uses.In addition, functional group's equivalent is 197g/eq..Viscosity at 25 ℃ is 15600mPas (E type viscometer).

Synthesis example 4 (epoxy resin-2)

In reaction vessel, add β-(3,4-epoxy group(ing) cyclohexyl) 18 parts of 234 parts of the silanol stopped methyl phenyl silicone oils (silanol equivalent 850, calculate according to 1/2 of the weight-average molecular weight that uses GPC to measure) of 106 parts of ethyl trimethoxy silanes, weight-average molecular weight 1700 (GPC measured value) and 0.5% potassium hydroxide (KOH) methanol solutions, bath temperature is set in to 75 ℃ and heat up.After intensification, under refluxing, react 8 hours.

Then, append after 305 parts of methyl alcohol, with 86.4 parts of methanol solutions (concentration is 50 % by weight) that drip distilled water for 60 minutes, under refluxing, at 75 ℃, react 8 hours.Reaction finish after, with in 5% biphosphate sodium water solution and after, at the methyl alcohol of 80 ℃ of Distillation recoveries approximately 90%.Add 380 parts of mibks, and repeat 3 washings with the water of 200 parts.Then,, by using Rotary Evaporators by organic phase solvent under reduced pressure, remove at 100 ℃, obtain thus having 300 parts of the epoxy resin (EP-2) of siloxane structure.The epoxide equivalent of gained compound is that 729g/eq, weight-average molecular weight are 2200, and outward appearance is water white transparency.

Synthesis example 5 (the starting compound D-1 of epoxy resin)

Possessing in the flask of agitator, reflux condensing tube, whipping appts and Dean-Stark (Dean-stark) pipe, in carrying out nitrogen purging, add (this manufacture of rock ancient tile of Isosorbide-5-Nitrae-cyclohexane dicarboxylic acid dimethyl ester; DMCD-p) 140 parts, 314 parts of tetrahydrobenzene-4-methyl alcohol, 0.07 part of four titanium butoxide, react with 120 ℃ 1 hour, 150 ℃ 1 hour, 170 ℃ 1 hour, 190 ℃ for 12 hours, removes the methyl alcohol generating in reaction simultaneously.By gas-chromatography (GC) confirm raw material crest be 1 area % following after, be cooled to 50 ℃.

After cooling end, add the toluene of 347 parts and make it even, then, reaction soln being carried out to 3 washings with 80 parts of the aqueous sodium hydroxide solutions of 10 % by weight, then repeatedly washing until waste water becomes neutrality with the water of 100 parts/time.Use Rotary Evaporators under heating decompression, toluene and unreacted 3-tetrahydrobenzene-1-methyl alcohol are removed in distillation.Obtain take two (3-cyclohexenyl methyl)-Isosorbide-5-Nitrae-cyclohexane dicarboxylic acid as principal constituent, under normal temperature as 240 parts of liquid compounds (D-1).

Synthesis example 6 (epoxy resin-3)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 118 parts of the compounds (D-1) that 15 parts, water, 0.95 part of 12-tungstophosphoric acid, 0.78 part of Sodium phosphate dibasic, 2.7 parts of 50% xylene solutions of trioctylphosphine ammonium acetate, 180 parts of toluene and synthesis example 5 obtain.This solution is warming up to 60 ℃, when carrying out fierce stirring, adds 70 parts of 35 % by weight aqueous hydrogen peroxide solutions with 1 hour, former state stirs 13 hours at 60 ℃.Confirm that by gas-chromatography it is below 1 area % that reaction proceeds to raw material crest.

Then, with in 1 % by weight aqueous sodium hydroxide solution and after, add 25 parts of 20 % by weight sodium thiosulfate solutions to stir after 30 minutes and leave standstill.After being separated into 2 layers, take out organic layer, (aginomoto fine chemistry is manufactured to add therein activated carbon; CP1) 20 parts, wilkinite (ホージュ Application are manufactured ベ Application ゲ Le SH) 20 parts, at room temperature stir after 1 hour and filter.With 100 parts of water, gained filtrate is carried out to 3 times and wash, and remove toluene from the organic layer distillation obtaining, obtaining thus under normal temperature is 119 parts of liquid epoxy resin (EP-3).The epoxide equivalent of gained epoxy resin is 217g/eq..Viscosity at 25 ℃ is 9200mPas (E type viscometer).

Synthesis example 7 (the raw material diolefin compound D-2 of epoxy resin)

With reference to PCT/JP2009/067432, possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 150 parts, water, 55.1 parts, 3-tetrahydrobenzene formaldehyde, 62.6 parts, two (trishydroxymethyl) propane, 7.3 parts of concentrated hydrochloric acids, at 60 ℃, react 10 hours.After reaction finishes, in reaction solution, add 10 parts, water, 30 parts of 3% aqueous sodium hydroxide solutions, then, this reaction solution is neutralized with sodium hydrogen phosphate.Add wherein 200 parts of mibks, carry out, after 3 washings, distilling and removing solvent etc. with 100 parts of water, obtain thus 101 parts of diolefin compounds (D-2).

Synthesis example 8 (epoxy resin-4)

With reference to PCT/JP2009/067432, possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 54 parts of the compounds (D-2) that obtain in 15 parts, water, 0.47 part of 12-tungstophosphoric acid, 0.39 part of Sodium phosphate dibasic, 1.4 parts of 50% xylene solutions of trioctylphosphine ammonium acetate, 90 parts of toluene and synthesis example 7.This solution is warming up to 60 ℃, when carrying out fierce stirring, added 35 parts of 35 % by weight aqueous hydrogen peroxide solutions with 1 hour, former state stirs 13 hours at 60 ℃.Confirm that by gas-chromatography it is below 1 area % that reaction proceeds to raw material crest.

Then, with in 1 % by weight aqueous sodium hydroxide solution and after, add 12 parts of 20 % by weight sodium thiosulfate solutions, stirs after 30 minutes standing.Taking-up is separated into the organic layer after 2 layers, and (aginomoto fine chemistry is manufactured to add therein activated carbon; CP1) 10 parts, montmorillonite (Network ニミネ industry manufacture; Network ニピア F) 10 parts, at room temperature stir after 3 hours and filter.With 100 parts of water, gained filtrate is carried out to 3 times and wash, and remove toluene from the organic layer distillation obtaining.Obtain under normal temperature is 49 parts of liquid epoxy resin (EP-4).The epoxide equivalent of gained epoxy resin is 262g/eq..Viscosity at 25 ℃ is 230000mPas (E type viscometer).

Embodiment 10 (curable resin composition)

Epoxy resin uses epoxy resin (EP2), the solidifying agent that synthesis example 4 obtains to use curing agent composition (B2), the curing catalyst that embodiment 3 obtains to use season

salt (Japan Chemical Industry manufacture; ヒシコーリ Application PX4MP, hereinafter referred to as C2), additive uses two (2,2,6,6-tetramethyl--4-piperidyl) sebates (Japanese vapour bar manufactured; TINUVIN770DF, hereinafter referred to as L1) and P contained compound use 4, (ADEKA manufactures 4 '-butylidene two (3-methyl-6-tert butyl phenyl-bis--tridecyl phosphoric acid ester); アデカスタ Block 260, hereinafter referred to as M1), coordinate with the mixing ratio (weight part) shown in following table 2, carry out, after the deaeration of 20 minutes, obtaining curable resin composition of the present invention.To carry out time limit of service (pot-life) testing with aftermentioned method for gained curable resin composition.By result and remember in following table 2.

By gained curable resin composition injection test sheet die for molding lentamente, this cast thing is solidified and obtain the cured article of various test use with the condition of 150 ℃ × 1 hour after the Procuring of 120 ℃ × 3 hours.For gained cured article, carry out the following test of heat durability transmissivity, LED bright light according to the condition of following record and test and evaluate.Result is illustrated in to following table 2 together.

Can time limit of service

Viscosity while at room temperature placement after making for curable resin composition changes, and after 3 hours with after 6 hours, measures.Then, (%) evaluate with its viscosity rise rate (in time through viscosity/initial stage viscosity × 100 later).

The test of heat durability transmissivity

Oven test condition: place 96 hours in 150 ℃ of baking ovens

Test film size: thickness 1mm

Appreciation condition: the transmissivity that uses spectrophotometric determination 400nm.And calculate its velocity of variation.

The test of LED bright light

The square surface mounting LED of external diameter 5mm that gained curable resin composition is filled in barrel and use accurate discharger to be poured into the chip of the luminous ripple 465nm in the center of being equipped with encapsulates in (internal diameter 4.4mm, outer wall height 1.25mm).This cast thing is put into process furnace, carry out 120 ℃, 1 hour, the solidification treatment of then 150 ℃, 3 hours, obtains LED encapsulation.After LED is installed, make to measure illumination after LED bright light with following condition, the results are shown in table 2.

Bright light detailed conditions

Emission wavelength: 465nm

Type of drive: constant current mode, 60mA (luminous element scheduled current is 30mA)

Drive environment: 85 ℃, 85%

Driving time: 200 hours, 400 hours

Evaluate: the illumination conservation rate after bright light

Comparative example 2,3,4

In above-described embodiment 10, except solidifying agent being changed to curing agent composition B7, the B8 or B9 that synthesis example 1,2 or 3 obtains, operation, obtains the relatively curable resin composition of use similarly to Example 10.For each curable resin composition obtaining, carrying out similarly to Example 10 can life test.Result is recorded in following table 2.

In addition, by the relatively curable resin composition of use of above-mentioned gained, be cured similarly to Example 10, for gained cured article, carry out the following test of heat durability transmissivity, LED bright light according to the condition of following record and test and evaluate.Result is illustrated in to following table 2 together.

Table 2

From above result, the viscosity rise rate of curable resin composition of the present invention is low, have longer can time limit of service.In addition we know, use polycarboxylic acid compositions of the present invention and the cured article that obtains, compared with the cured article obtaining with using other skeleton, the good and excellent optical characteristics of illumination conservation rate in LED situation.

Embodiment 11,12 (curable resin composition)

Epoxy resin uses the epoxy resin (EP-3, EP-4), the solidifying agent that in synthesis example 6,8, obtain to use the curing agent composition (B4), the curing catalyst that in embodiment 7, obtain to use season

salt (Japan Chemical Industry manufacture; ヒシコーリ Application ^rTMpX4MP, hereinafter referred to as C2), additive uses two (2,2,6,6-tetramethyl--4-piperidyl) sebates (Japanese vapour bar manufactured; TINUVIN770DF, hereinafter referred to as L1) and P contained compound use 4, (ADEKA manufactures 4 '-butylidene two (3-methyl-6-tert butyl phenyl-bis--tridecyl phosphoric acid ester); アデカスタ Block 260, hereinafter referred to as M1), coordinate with the mixing ratio (weight part) shown in following table 3, carry out, after the deaeration of 20 minutes, obtaining curable resin composition of the present invention.

Gained curable resin composition is poured into test film lentamente with in mould, this cast thing is solidified and obtain the cured article of various test use with the condition of 150 ℃ × 1 hour after the Procuring of 120 ℃ × 3 hours.For gained cured article, carry out following LED bright light according to the condition of following record and test and evaluate.Result is illustrated in to following table 3 together.

The test of LED bright light

The square surface mounting LED of external diameter 5mm that gained curable resin composition is filled in barrel and use accurate discharger to be poured into the chip of the luminous ripple 465nm in the center of being equipped with encapsulates in (internal diameter 4.4mm, outer wall height 1.25mm).This cast thing is put into process furnace, carry out 120 ℃, 1 hour, the solidification treatment of then 150 ℃, 3 hours, obtains LED encapsulation.By after LED encapsulation, make to measure illumination after LED bright light with following condition, show the result in table 3.

Bright light detailed conditions

Emission wavelength: 465nm

Drive environment: 85 ℃, 85%

Driving time: 200 hours

Evaluate: the illumination conservation rate of bright light after 200 hours

Table 3

Embodiment 13,14,15 (curable resin composition)

Epoxy resin uses epoxy resin (EP-1, EP-3), solidifying agent use the curing agent composition (B2, B4, B6) obtaining in embodiment and use curing catalyst (C2), coordinate with the mixing ratio (weight part) shown in following table 4, carry out, after the deaeration of 20 minutes, obtaining curable resin composition of the present invention.

Gained curable resin composition is poured into test film lentamente with in mould, this cast thing is solidified and obtain the cured article of various test use with the condition of 150 ℃ × 1 hour after the Procuring of 110 ℃ × 3 hours.For gained cured article, carry out following LED bright light according to the condition of following record and test and evaluate.Result is illustrated in to following table 4 together.

The test of LED bright light

The square surface mounting LED of external diameter 5mm that gained curable resin composition is filled in barrel and use accurate discharger to be poured into the chip of the luminous ripple 465nm in the center of being equipped with encapsulates in (internal diameter 4.4mm, outer wall height 1.25mm).This cast thing is put into process furnace, carry out 120 ℃, 1 hour, the solidification treatment of then 150 ℃, 3 hours, obtains LED encapsulation.By after LED encapsulation, make to measure illumination after LED bright light with following condition, show the result in table 4.

Bright light detailed conditions

Emission wavelength: 465nm

Drive environment: 85 ℃, 85%

Driving time: 200 hours

Evaluate: the illumination conservation rate of bright light after 200 hours

Table 4

Embodiment 16,17,18 (curable resin composition)

Epoxy resin uses epoxy resin (EP-1, EP-3), solidifying agent use the curing agent composition (B3, B5) obtaining in acid anhydrides (H1, H2) embodiment and use curing catalyst (C2), coordinate with the mixing ratio (weight part) shown in following table 5, carry out, after the deaeration of 20 minutes, obtaining curable resin composition of the present invention.

Gained curable resin composition is poured into test film lentamente with in mould, this cast thing is solidified and obtain the cured article of various test use with the condition of 150 ℃ × 1 hour after the Procuring of 110 ℃ × 3 hours.For gained cured article, carry out following LED bright light according to the condition of following record and test and evaluate.Result is illustrated in to following table 5 together.

The test of LED bright light

Bright light detailed conditions

Emission wavelength: 465nm

Drive environment: 85 ℃, 85%

Driving time: 200 hours

Evaluate: the illumination conservation rate of bright light after 200 hours

Comparative example 5,6 (the relatively curable resin composition of use)

In above-described embodiment 15,16 and 17, except solidifying agent is changed to acid anhydrides H1 or H2, operate equally, obtain the relatively curable resin composition of use.In addition, with above-described embodiment 15,16 and 17 same operations, be cured, for each cured article obtaining, also similarly carry out the test of LED bright light with this embodiment.Result is illustrated in to following table 5 together.

Table 5

Embodiment b1 (polycarboxylic acid compositions Ab1)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 10 parts of toluene, (the OXEA manufacture of tristane dimethanol; The mixture (7:3) of TCD-AlcholDM) 98 parts, methylhexahydrophthalic anhydride and hexahydrophthalic anhydride (manufacture by new Japanese physics and chemistry (Co., Ltd.); Rikacid MH700, hereinafter referred to as acid anhydrides H1) 168 parts, carry out 15 minutes, 100 ℃ at 80 ℃ and carry out the heated and stirred of 4 hours.Confirm that by GPC raw material is below 1 area %.Finish, after reaction, to use Rotary Evaporators, residual solvent distillation is removed.Obtain polycarboxylic acid compositions (Ab1 of the present invention; The mixture of the structural formula of following formula (3)) 246 parts.Gains are colourless solid resin, and softening temperature is 74 ℃.In addition, melt viscosity is 0.22PaS at 150 ℃.The purity of measuring by GPC is 99 area %.In addition, functional group's equivalent is 266g/eq..

Formula (3):

R=CH ₃or H

Embodiment b2 (curing agent composition Bb1)

With respect to 25 parts of the polycarboxylic acid compositions obtaining in embodiment b1 (Ab1: the mixture of the structural formula of formula (3)), add 75 parts, acid anhydrides (H1) and make its uniform dissolution, obtaining thus curing agent composition of the present invention (Bb1).

Embodiment b3 (curing agent composition Bb2)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 20 parts of tristane dimethanols, 100 parts, acid anhydrides (H1), carry out the heated and stirred of 4 hours at 50 ℃.Confirm that by GPC tristane dimethanol is below 1 area %.Obtain 120 parts of the curing agent compositions that comprises polycarboxylic acid compositions of the present invention (Bb2).Gains are colourless liquid resin, in the purity of measuring by GPC, and polycarboxylic acid compositions (Ab2; The mixture of the structural formula of formula (3)) structure be that the total amount of 43 area %, methylhexahydrophthalic anhydride and hexahydrophthalic anhydride is 57 area %.In addition, functional group's equivalent is 199g/eq..

Embodiment b4, b5 (curable resin composition), comparative example b1 (relatively using curable resin composition)

Curing agent composition of the present invention (Bb1), (Bb2) that solidifying agent uses embodiment b2, b3 to obtain, and the acid anhydrides of comparative example (H1); Epoxy resin uses 3,4-epoxy group(ing) cyclohexyl methyl-3, and (Dow Chemical manufactures 4-epoxy group(ing) cyclohexane carboxylic acid ester; UVR-6105, hereinafter referred to as epoxy resin (EP-1)); Curing catalyst uses cetyltrimethylammonium hydroxide, and (Tokyo HuaCheng Industry Co., Ltd manufactures; 25% methanol solution, hereinafter referred to as C1), coordinate with the mixing ratio (weight part) shown in following table b1, carry out after the deaeration of 20 minutes, obtain the present invention or the curable resin composition of use relatively.

The curable resin composition that use obtains, with the main points shown in following volatilize test, LED seal test, and shows the result in table b1.In addition, condition of cure is after the Procuring of 120 ℃ × 2 hours 150 ℃ × 5 hours.

Volatilization test:

The curable resin composition obtaining in embodiment and comparative example is through implementing vacuum defoamation after 20 minutes, is poured into lentamente and in the cofferdam made from heat resistant adhesive tape, obtains 30mm × 20mm × height 1mm on glass substrate.Measure exactly after the weight resin of cast, with described condition, this cast thing is solidified.

Measure the weight of the cured article obtaining like this, the weight while confirming to solidify reduces.(being solidificated under same baking oven of embodiment, comparative example is similarly cured).

LED test:

The curable resin composition that embodiment and comparative example are obtained carried out vacuum defoamation after 20 minutes, be filled in barrel, use accurate discharger to be poured in surface installing type (the SMD type 3mm φ) LED of the luminous element that is equipped with emission wavelength 465nm.Then, they are solidified under predetermined condition of cure, obtain test LED.

Assessment item:

(a) volatility: whether have pit and evaluate with the cured article surface after visual observation sealing.In table, zero: do not observe pit; △: observe a small amount of pit; ×: observe a large amount of pits (occurring that bonding wire exposes).

(b) Reflow Soldering test: the test obtaining is carried out after moisture absorption under condition at 30 ℃, 70% × 72 hour with LED, used high temperature observing device (SMT Scope SK-5000; Adret Jinggong Co., Ltd manufactures), confirm that LED has crack-free to produce under following Reflow Soldering condition.Test is carried out under n=3 condition, evaluates with (OK number)/(test number).Condition is: be warming up to 150 ℃ by 25 ℃ with 2 ℃/sec, then at 150 ℃, keep 2 minutes, then 2 ℃/sec are warming up to 260 ℃ and keep, after 10 seconds, being cooled to room temperature with 1.3 ℃/sec.

Table b1

Embodiment b4, b5 and comparative example b1 are compared, and the volatile quantity of curable resin composition of the present invention is few, even if also do not produced the problems such as bonding wire exposes in the time of sealing LED.In addition, breaking when Reflow Soldering also can be reduced.From the above results, polycarboxylic acid compositions of the present invention and the curing agent composition that comprises polycarboxylic acid compositions can provide for volatility resistance, the reflux-resisting welded effective curable resin composition that breaks.

Embodiment b6 (curing agent composition Bb3)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 20 parts of tristane dimethanols, methylhexahydrophthalic anhydride (new Japanese physics and chemistry (Co., Ltd.) manufacture; Rikacid MH, hereinafter referred to as acid anhydrides H3) 100 parts, 40 ℃ of reactions were carried out the heated and stirred of 1 hour at 70 ℃ after 3 hours.Confirm that by GPC tristane dimethanol is below 1 area %.Obtain 120 parts of the curing agent compositions that comprises polycarboxylic acid compositions of the present invention (Bb3).Gains are colourless liquid resin, in the purity of measuring by GPC, and polycarboxylic acid compositions (Ab2; Following formula (4)) be that 49 area %, methylhexahydrophthalic anhydride are 51 area %.In addition, functional group's equivalent is 201g/eq..

Formula (4):

Use Rotary Evaporators, at 100 to 150 ℃, the methylhexahydrophthalic anhydride of excessive existence is removed from 50 parts of curing agent compositions (Bb3).This removal is, the moment of no longer flowing out from methylhexahydrophthalic anhydride, passes into nitrogen 40 minutes, under heating reduced pressure, directly removes fully acid anhydrides.Consequently, take out 25 parts of the polycarboxylic acids (Bb3a) of formula of the present invention (1).

Be shaped as colourless semi-solid-state to solid-state resin.

The softening temperature (according to JIS K-7234) of gained resin is 77.0 ℃, and the melt viscosity at 150 ℃ is 0.24Pas.

Embodiment b7 (curing agent composition Bb4)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 15 parts of tristane dimethanols, methylhexahydrophthalic anhydride (new Japanese physics and chemistry (Co., Ltd.) manufacture; Rikacid MH, hereinafter referred to as acid anhydrides H3) 70 parts, hexanaphthene-1,2,4-tricarboxylic acid-1,2-acid anhydride (manufacture by Mitsubishi's gas chemistry; H-TMAn) 15 parts, 40 ℃ of reactions were carried out the heated and stirred of 1 hour at 70 ℃ after 3 hours.Confirm that by GPC tristane dimethanol is below 1 area %.Obtain 100 parts of the curing agent compositions that comprises polycarboxylic acid compositions of the present invention (Bb4).Gains are colourless liquid resin, in the purity of measuring by GPC, and polycarboxylic acid compositions (Ab3; Following formula (5)) be 37 area %, hexanaphthene-1,2,4-tricarboxylic acid-1,2-acid anhydride is that 11 area %, methylhexahydrophthalic anhydride are 52 area %.In addition, functional group's equivalent is 171g/eq..

Formula (5):

R=CH ₃or COOH

Embodiment b8 (curing agent composition Bb5)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 50 parts of the curing agent compositions (Bb3), hexanaphthene-1 that in embodiment 6, obtain, 2,4-tricarboxylic acid-1,2-acid anhydride (manufacture by Mitsubishi's gas chemistry; H-TMAn-S) 5 parts, carry out the stirring of 2 hours at 100 ℃, obtain curing agent composition of the present invention (Bb5).The composition obtaining is colourless fluid composition.

Embodiment b9 (curing agent composition Bb6)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 100 parts, 20 parts of pentacyclopentadecandimethanol dimethanols and acid anhydrides (H3), 40 ℃ of reactions were carried out the heated and stirred of 1 hour at 70 ℃ after 3 hours.Confirm that by GPC pentacyclopentadecandimethanol dimethanol is below 1 area %.Obtain 110 parts of the curing agent compositions that comprises polycarboxylic acid compositions of the present invention (Bb6).The curing agent composition of gained is colourless fluid composition, in the purity of measuring by GPC, and polycarboxylic acid compositions (Ab4; Following formula (6)) be that 40 area %, methylhexahydrophthalic anhydride are 60 area %.In addition, functional group's equivalent is 201g/eq..

Formula (6):

Embodiment b10 (curing agent composition Bb7)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 100 parts, 10 parts of tristane dimethanols and acid anhydrides (H1), 50 ℃ are carried out the heated and stirred (confirming that by GPC tristane dimethanol is that 1 area % is following) of 3 hours.Obtain 110 parts of the curing agent compositions that comprises polycarboxylic acid compositions of the present invention (Bb7).Gains are colourless liquid resin, in the purity of measuring by GPC, and polycarboxylic acid compositions (Ab1; Following formula (3)) be that 27 area %, methylhexahydrophthalic anhydride are 73 area %.In addition, functional group's equivalent is 185g/eq..

Synthesis example b1 (relatively using curing agent composition Bb8)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add (new Japanese physics and chemistry (Co., Ltd.) manufacture of 20 parts of tristane dimethanols and hexahydrophthalic anhydride; Rikacid HH) 100 parts, 50 ℃ are carried out the heated and stirred of 3 hours, confirm that by GPC tristane dimethanol is below 1 area %.Obtain 120 parts of the curing agent compositions that comprises polycarboxylic acid compositions (Bb8) of use relatively.Gained curing agent composition is colourless fluid composition, in the purity of measuring by GPC, and polycarboxylic acid compositions (A5; Following formula 7) be that 48 area %, methylhexahydrophthalic anhydride are 52 area %.In addition, functional group's equivalent is 200g/eq..

Formula (7):

Synthesis example b2 (relatively using curing agent composition Bb9)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 100 parts, 10 parts of ethylene glycol and acid anhydrides (H1), 40 ℃ are carried out after the reaction of 3 hours carrying out the heated and stirred of 1 hour at 70 ℃.Confirm that by GPC raw material is below 1 area %.Obtain 110 parts of the curing agent compositions that comprises polycarboxylic acid compositions (Bb9) of use relatively.Gained curing agent composition is colourless fluid composition, in the purity of measuring by GPC, and polycarboxylic acid compositions (Ab6; Following formula (8)) be that the total amount of 25 area %, methylhexahydrophthalic anhydride and hexahydrophthalic anhydride is 75 area %.In addition, functional group's equivalent is 185g/eq..

Formula (8):

R=H or CH ₃

Synthesis example b3 (relatively using curing agent composition Bb10)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 1,100 parts, 20 parts of 4-cyclohexanedimethanols and acid anhydrides (H1), 40 ℃ are carried out after the reaction of 3 hours carrying out the heated and stirred of 1 hour at 70 ℃.Confirm that by GPC raw material is below 1 area %.Obtain 120 parts of the curing agent compositions that comprises polycarboxylic acid compositions (Bb10) of use relatively.Gained curing agent composition is colourless fluid composition, in the purity of measuring by GPC, and polycarboxylic acid compositions (Ab7; Following formula 8) be that the total amount of 53 area %, methylhexahydrophthalic anhydride and hexahydrophthalic anhydride is 47 area %.In addition, functional group's equivalent is 200g/eq..

Formula (9):

R=H or CH ₃

Synthesis example b4 (relatively using curing agent composition Bb11)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 100 parts, 20 parts of 1,6-hexylene glycols and acid anhydrides (H1), 40 ℃ are carried out after the reaction of 3 hours carrying out the heated and stirred of 1 hour at 70 ℃.Confirm that by GPC raw material is below 1 area %.Obtain 120 parts of the curing agent compositions that comprises polycarboxylic acid compositions (Bb11) of use relatively.Gains are colourless liquid resin, in the purity of measuring by GPC, and polycarboxylic acid compositions (Ab8; Following formula 10) be that the total amount of 65 area %, methylhexahydrophthalic anhydride and hexahydrophthalic anhydride is 35 area %.In addition, functional group's equivalent is 200g/eq..

Formula (10):

R=H or CH ₃

Synthesis example b5 (epoxy resin synthesis material diolefine)

Possessing in the flask of agitator, reflux condensing tube, whipping appts and Dean-Stark pipe, in carrying out nitrogen purging, add 1,172 parts of 4-cyclohexane dicarboxylic acids, 448 parts of 3-tetrahydrobenzene-1-methyl alcohol, 600 parts of toluene, 4 parts of tosic acid, to remove the water generating, carry out the reaction of 12 hours with the degree of decompression in the mode regulation system of 45 ℃ of backflows simultaneously.After reaction finishes, reaction soln is carried out to 3 washings with 120 parts of 10 % by weight aqueous sodium hydroxide solutions, then repeatedly wash until waste water becomes neutrality with the water of 70 parts/time, use Rotary Evaporators under heating decompression, toluene and unreacted 3-tetrahydrobenzene-1-methyl alcohol are removed in distillation, and obtaining thus under normal temperature is 343 parts of liquid diolefin compounds.

Synthesis example b6 (epoxy resin-b2)

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 15 parts, water, 0.95 part of 12-tungstophosphoric acid, 0.78 part of Sodium phosphate dibasic, 2.7 parts of (ライオ Application ア Network ゾ manufactures of two tallow alkyl dimethyl acetic acid ammoniums; 50 % by weight hexane solutions, アカー De 2HT アセテート), 118 parts of the diolefin compounds that obtain in 180 parts of toluene and synthesis example b5, and then stir, obtain thus the liquid of emulsion state.This solution is warming up to 50 ℃, carries out fierce stirring, add 70 parts of 35 % by weight aqueous hydrogen peroxide solutions simultaneously with 1 hour, former state stirs 13 hours at 50 ℃.Confirm that by gas-chromatography reaction proceeds to raw material crest and disappears.

Then, with in 1 % by weight aqueous sodium hydroxide solution and after, add 25 parts of 20 % by weight sodium thiosulfate solutions, stirs after 30 minutes standing.After being separated into 2 layers, take out organic layer, add therein silica gel (ワコーゲ Le C-300) 10 parts, (NORIT manufactures activated carbon, CAPSUPER) 20 parts, the manufacture of wilkinite (ホージュ Application, ベ Application ゲ Le SH) 20 parts, at room temperature stir after 1 hour and filter.With 100 parts of water, gained filtrate is carried out to 3 times and wash, and remove toluene from the organic layer distillation obtaining.Obtain under normal temperature is 119 parts of the liquid epoxy resin (EP-b2) take following formula (11) as principal constituent.The epoxide equivalent of gained epoxy resin is 217g/eq..

Formula (11):

Embodiment b11, b12 (curable resin composition), comparative example b2 (relatively using curable resin composition)

Solidifying agent uses the curing agent composition of the present invention (Bb2), (Bb3) that obtain in embodiment 3,6, and in synthesis example b1, obtain relatively use curing agent composition (Bb8); Epoxy resin uses epoxy resin (EP-1); And use curing catalyst (C1), and coordinate with the mixing ratio (weight part) shown in following table b2, carry out after the deaeration of 20 minutes, obtain the present invention or the curable resin composition of use relatively.

The test of LED bright light

The curable resin composition obtaining in embodiment b11, b12 and comparative example 2 is implemented to vacuum defoamation and after 20 minutes, be filled in barrel, use accurate discharger to be poured into surface mounting LED (the SMD type 5mm φ of the luminous element that is equipped with emission wavelength 465nm; Scheduled current is 30mA) in.Then, be cured with the condition of cure of being scheduled to, obtain thus bright light test LED.Bright light test is to carry out under the electric current of 2 times of scheduled current 30mA.Detailed conditions is as follows.As mensuration project, use integrating sphere to measure the bright light forward and backward illumination of 200 hours, and calculate the conservation rate of the illumination of test LED.Show the result in table b2.

Bright light detailed conditions

Emission wavelength: center emission wavelength, 465nm

Type of drive: 3 while bright lights of constant current mode, 60mA (luminous element scheduled current is 30mA) series connection

Drive environment: the bright light in 85 ℃, 85% damp and hot machine

Evaluate: illumination and its illumination conservation rate after bright light 200 hours, and the painted * of chip

(* evaluates, caused when deteriorated by bright light test with visual observation, produces paintedly on chip, has thus the decline tendency of aggravation of illumination.)

Table b2

Can be clear and definite by the above results, in the polycarboxylic acid compositions of relatively using curing agent composition (Bb8) to comprise, only comprise the compound that R in above formula (1) is hydrogen atom, relatively use for curing agent composition (Bb8) for such, illumination keeps rate variance, can see the painted of chip.On the other hand, in the polycarboxylic acid compositions that curable resin composition of the present invention comprises, be included in the upper compound that has methyl of introducing of R, for such curable resin composition of the present invention, illumination after initial stage illumination and bright light test is all good, painted also few on chip, thereby can obtain the cured article that resistance to deterioration is strong, therefore can manufacture the LED that is applicable to industry purposes.

Embodiment b13, b14, b15, b16, b17, comparative example b3, b4, b5

Solidifying agent uses the curing agent composition (Bb9), (Bb10), (Bb11) that in the curing agent composition of the present invention (Bb3), (Bb4), (Bb5), (Bb6), (Bb7) and synthesis example b2, the b3 that obtain in embodiment b6, b7, b8, b9, b10, b4, obtain; Epoxy resin uses the epoxy resin (EP-b2) obtaining in epoxy resin (EP-1), synthesis example b6; And use curing catalyst (Japanese synthetic chemistry manufacture; ヒシコーリ Application PX4MP), coordinate with the mixing ratio (weight part) shown in following table 3, carry out after the deaeration of 20 minutes, obtain the present invention or the curable resin composition of use relatively.

(thermal endurance test)

The curable resin composition obtaining in embodiment b13 to b17, comparative example b3 to b5 was implemented to vacuum defoamation after 20 minutes, be poured into lentamente and in the cofferdam made from heat resistant adhesive tape, obtain 30mm × 20mm × height 1mm on glass substrate, this cast thing is solidified and obtain the transmissivity test film of thickness 1mm with the condition of 150 ℃ × 1 hour after the Procuring of 120 ℃ × 3 hours.

Use these test films, in the baking oven of 150 ℃, place 96 hours forward and backward transmissivities (measuring wavelength: 400nm) by spectrophotometric determination, and calculate the conservation rate of transmissivity.Show the result in table b3.

Table b3

From the above results, the curable resin composition that comprises polycarboxylic acid compositions of the present invention, has patience and its conservation rate to thermal degradation when high, therefore can be suitable for optical applications.

Embodiment a

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 1,3,4-hexanaphthene tricarboxylic acid-3,4-acid anhydride (H-TMA, Mitsubishi's gas chemistry is manufactured; H2) 118.9 parts, methylhexahydrophthalic anhydride (new Japanese physics and chemistry (Co., Ltd.) manufacture; Rikacid MH H3) 349.9 parts of 403.2 parts, methylethylketone, in stirring, be warming up to after 40 ℃, with 294.4 parts of tristane dimethanols that add pre-temperature to 70 ℃ for 30 minutes, at 40 ℃, stir 30 minutes, then at 70 ℃, stir 4 hours.Use Rotary Evaporators, at 100 to 150 ℃, from gained reaction solution, remove solvent, obtain 816 parts of polycarboxylic acid compositions of the present invention (x).Be shaped as colourless solid resin.Functional group's equivalent is 272g/eq..

The softening temperature (according to JIS K-7234) of gained resin is 99.8 ℃, and the melt viscosity at 150 ℃ is 0.92Pas.

* melt viscosity

Melt viscosity in cone-plate method at 150 ℃

Measure machinery: cone-plate (ICI) high temperature viscosimeter

(RESEARCH EQUIPMENT (LONDON) LTD. manufacture)

Tapered number: 3 (measurement range 0 is to 2.00Pas)

Below, measure with similarity condition.

Embodiment b

Use Rotary Evaporators, at 100 to 150 ℃, the methylhexahydrophthalic anhydride of excessive existence is removed (the moment of no longer flowing out from methylhexahydrophthalic anhydride from 50 parts of curing agent compositions (B4), under heating reduced pressure, directly pass into nitrogen 40 minutes, can remove fully acid anhydrides), take out thus 24 parts of polycarboxylic acid compositions of the present invention (x2).Be shaped as colourless solid resin.

The softening temperature (according to JIS K-7234) of gained resin is 72.4 ℃, and the melt viscosity at 150 ℃ is 0.38Pas.

Embodiment c

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 1,3,4-hexanaphthene tricarboxylic acid-3,4-acid anhydride (H-TMA, Mitsubishi's gas chemistry is manufactured; H2) 162 parts, methylhexahydrophthalic anhydride (new Japanese physics and chemistry (Co., Ltd.) manufacture; Rikacid MH H3) 400 parts of 787 parts, methylethylketone, in stirring, be warming up to after 40 ℃, with 540 parts of tristane dimethanols that add pre-temperature to 70 ℃ for 30 minutes, stir 30 minutes, then 70 ℃ of stirrings 4 hours at 40 ℃.Use Rotary Evaporators, at 100 to 150 ℃, from gained reaction solution, remove solvent, obtain thus 1489 parts of polycarboxylic acid compositions of the present invention (x3).Be shaped as colourless solid resin.Functional group's equivalent is 271g/eq..

The softening temperature (according to JIS K-7234) of gained resin is 80.6 ℃, and the melt viscosity at 150 ℃ is 0.43Pas.

Synthesis example A

Possessing in the flask of agitator, reflux condensing tube and whipping appts, in carrying out nitrogen purging, add 10 parts, water, 110 parts of cyclohexenyl tetrahydrotoluene carboxylicesterss, 140 parts of toluene, 1 part of 12-tungstophosphoric acid, 1.5 parts of sodium wolframates, 1.5 parts of Sodium phosphate dibasics, 1.5 parts of trioctylphosphine ammonium acetate 50% xylene solutions, this solution is warming up to 45 ℃, with within 20 minutes, adding 110 parts of 35 % by weight aqueous hydrogen peroxide solutions, then, remain on 45 ± 5 ℃ and stir 12 hours.

Then, with in 1 % by weight aqueous sodium hydroxide solution and after, add 25 parts of 20 % by weight sodium thiosulfate solutions to stir after 30 minutes and leave standstill.After being separated into 2 layers, take out organic layer, (aginomoto fine chemistry is manufactured to add therein activated carbon; CP2) 5 parts, montmorillonite (Network ニミネ industry manufacture; Network ニピア F) 5 parts, at room temperature stir after 3 hours and filter.Gained filtrate is carried out to 3 washings with 100 parts of water, and remove toluene from the organic layer distillation obtaining, obtain with 3,4-epoxy group(ing) cyclohexyl methyl-3 111 parts of the epoxy resin (EP5) that 4-epoxy group(ing) cyclohexane carboxylic acid ester is principal constituent.The epoxide equivalent of gained epoxy resin is 130g/eq..Viscosity at 25 ℃ is 211mPas (E type viscometer).

Embodiment A, B, C, D, E, F, G, H, I, J, K, L

Epoxy resin uses epoxy resin (EP2), epoxy resin (EP5); Solidifying agent uses curing agent composition (Bb3, Bb4, Bb5, x1, x3), acid anhydrides (H3); Curing catalyst uses season

salt (C2); Additive use (L1) (M1), (ADEKA manufactures photostabilizer; LA-62, hereinafter referred to as L2); Phosphorus compound uses tricresyl phosphite alkane ester, and (ADEKA manufactures; アデカスタ Block 3010, hereinafter referred to as M2), alkylphosphonic acid carboxylic acid zinc (King Industries manufacture; XC-9206, hereinafter referred to as M3), coordinate with the mixing ratio (weight part) shown in following Table A, carry out after the deaeration of 20 minutes, obtain the present invention or the curable resin composition of use relatively.The curable resin composition obtaining carries out following test.Result is illustrated in to following Table A together.

(Reflow Soldering, the test of LED bright light)

The square surface mounting LED of external diameter 5mm that the curable resin composition obtaining in embodiment and comparative example is filled in barrel and use accurate discharger to be poured into the chip of the luminous ripple 465nm in the center of being equipped with encapsulates in (internal diameter 4.4mm, outer wall height 1.25mm).This cast thing is put into process furnace, carry out 120 ℃, 1 hour, the solidification treatment of then 150 ℃, 3 hours, obtains LED encapsulation.For gained LED, use photo detector to measure simply the illumination before and after Reflow Soldering.(under shading, make it luminous with the electric current of scheduled current 30mA the LED obtaining, with photo detector (visible ray photorectifier (photodiode visible light), BS500B シャープ manufactures) be subject to light, using at this mobile current value the yardstick as illumination).Mensuration is that the illumination after just sealing of LED and after Reflow Soldering test is measured, and confirms its difference.Show the result in Table A.

In addition, Reflow Soldering test is used high temperature observing device, imitates in analog Reflow Soldering.Device, condition is as described below.

Device: high temperature observing device (SMT Scope SK-5000; Adret Jinggong Co., Ltd manufactures)

Temperature condition: be warming up to 150 ℃ by 25 ℃ with 2 ℃/sec, then keep at 150 ℃ 2 minutes, then 2 ℃/sec are warming up to 260 ℃ and keep, after 10 seconds, being cooled to room temperature with 1.3 ℃/sec.

Table A

From above result, there is the curing agent composition of polycarboxylic acid compositions of the present invention, even also can keep illumination with high conservation rate in the high temperature while being exposed to Reflow Soldering, there is high optical characteristics.

Industrial applicability

Polycarboxylic acid compositions of the present invention is good to the ability to cure of epoxy resin, can be suitable as the solidifying agent of epoxy resin.In addition, this polycarboxylic acid compositions coordinating in epoxy resin, volatilization in the temperature range that is generally used for cured epoxy resin is few, can stably realize the target capabilities of cured article, such as high transparency and heat durability (for example: illumination conservation rate, optical transmission rate conservation rate etc. in the long-term bright light of reflux-resisting welded property, LED), therefore extremely useful at the seal aspect of LED.

Claims

In formula, R represents the alkyl of carbonatoms 1 to 6 independently of one another; P represents the divalent linking group by following (a) definition:

(a) linking group, its chain-like alkyl chain with branched structure that is carbonatoms 6 to 20, this chain-like alkyl chain has main chain and 2 to 4 side chains of the straight chain of carbonatoms 3 to 6, and at least two alkyl that this side chain is carbonatoms 2 to 4.

2. polycarboxylic acid compositions as claimed in claim 1 wherein, is from 2,4-diethyl-1,5-PD, to remove the divalent group obtaining after 2 hydroxyls by the linking group of (a) definition.

3. polycarboxylic acid compositions as claimed in claim 1, wherein, the R in formula (1) is methyl.

4. polycarboxylic acid compositions as claimed in claim 1, wherein, polycarboxylic acid compositions comprises: at least a kind by formula (1) represent polycarboxylic acid and can be by methyl substituted C ₄to C ₇ring-type two, three or tetracarboxylic anhydride.

5. polycarboxylic acid compositions as claimed in claim 4, wherein, can be by methyl substituted C ₄to C ₇ring-type two, three or tetracarboxylic anhydride, for can be by methyl substituted hexanaphthene two or tricarboxylic acid anhydride.

6. a hardener for epoxy resin, the polycarboxylic acid that it comprises formula claimed in claim 1 (1) or polycarboxylic acid compositions claimed in claim 4.

7. hardener for epoxy resin as claimed in claim 6, it is for comprising:

Polycarboxylic acid, wherein, the divalent linking group being represented by P in formula (1) is that the linking group being defined by (a) and the linking group being defined by (a) they are following (1) described divalent groups, and

Polycarboxylic acid compositions,

(1) divalent group:

From 2,4-diethyl-1,5-PD, remove the divalent group obtaining after 2 hydroxyls;

(2) acid anhydrides:

8. a curable resin composition, it comprises polycarboxylic acid compositions claimed in claim 1 or solidifying agent claimed in claim 6, and epoxy resin.

9. curable resin composition as claimed in claim 8, wherein, epoxy resin is alicyclic epoxy resin.

10. curable resin composition as claimed in claim 9, wherein, solidifying agent is solidifying agent claimed in claim 7.

11. 1 kinds of cured articles, its cured article that is curable resin composition claimed in claim 8.

The manufacture method of the polycarboxylic acid being represented by formula (1) described in 12. 1 kinds of claims 1, wherein, makes the dibasic alcohol of following (a) react with (c),

(a) the chain aliphatic dihydroxy alcohol with branched structure of carbonatoms 6 to 20, wherein, chain-like alkyl chain has main chain and 2 to 4 side chains of the straight chain of carbonatoms 3 to 6, and at least two alkyl that this side chain is carbonatoms 2 to 4;

(c) acid anhydrides, it is for selecting free hexahydrophthalic anhydride, methylhexahydrophthalic anhydride and hexanaphthene-1, at least a kind of acid anhydrides in the group that 2,4-tricarboxylic acid anhydride forms.

The manufacture method of 13. polycarboxylic acids as claimed in claim 12, wherein, count the ratio of 0.001 to 2 equivalent with respect to anhydride group 1 equivalent with the hydroxyl equivalent of dibasic alcohol, at 40 to 150 ℃ of temperature of reaction, make the dibasic alcohol of (a) and anhydride reaction (c).

The manufacture method of 14. polycarboxylic acids as claimed in claim 13, wherein, acid anhydrides (c) is the mixture of hexahydrophthalic anhydride and methylhexahydrophthalic anhydride.

The manufacture method of 15. polycarboxylic acids as claimed in claim 13, wherein, dibasic alcohol is 2,4-diethyl-1,5-PD or 2-ethyl-2-butyl-1,3-PD.

The manufacture method of 16. polycarboxylic acids as claimed in claim 13, it comprises the step that 2,4-diethyl-1,5-PD is reacted with methylhexahydrophthalic anhydride.

17. 1 kinds of polycarboxylic acids that represented by following formula (1),

18. polycarboxylic acids as claimed in claim 17 wherein, are from 2,4-diethyl-1,5-PD, to remove the alkylidene group obtaining after 2 hydroxyls by the divalent linking group of (a) definition.

19. polycarboxylic acids as claimed in claim 17, wherein, the R in formula (1) is methyl.