CN103786270A - Machining apparatus - Google Patents
Machining apparatus Download PDFInfo
- Publication number
- CN103786270A CN103786270A CN201310495079.5A CN201310495079A CN103786270A CN 103786270 A CN103786270 A CN 103786270A CN 201310495079 A CN201310495079 A CN 201310495079A CN 103786270 A CN103786270 A CN 103786270A
- Authority
- CN
- China
- Prior art keywords
- mentioned
- region
- holding table
- retaining
- attraction
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention provides a machining apparatus having a retaining component. The above retaining component has a light retaining workbench that is easy to dismount. The provided machining apparatus comprises the retaining component for holding a to-be-machined object; a machining component for machining the to-be-machined object held on the retaining component; and a machining feeding component for relatively machining and feeding the retaining component and the machining component in the machining and feeding direction. The retaining component is composed of a retaining workbench and a supporting pedestal. The retaining workbench has an attraction region for attracting and holding the to-be-machined object, and a periphery region surrounding the attraction region. The supporting pedestal supports the retaining workbench and enables the retaining workbench to be detachable, and attraction is transmitted to the above attraction region. The retaining workbench is formed by multi-porous ceramics, and a coating layer is applied to the region, except the attraction region, of the retaining workbench.
Description
Technical field
The present invention relates to the processing unit (plant)s such as topping machanism, laser processing device or grinding attachment for machined objects such as processed wafers.
Background technology
In semiconductor devices manufacturing process, mark off multiple regions by the preset lines of cutting apart that is called spacing track that is clathrate and arranges in the front of the semiconductor wafer of circular plate shape roughly, form IC(integrated circuit in the region that this marks off), LSI(large scale integrated circuit) etc. device.And, produce semiconductor devices one by one thereby carry out cutting semiconductor chip by the processing unit (plant) such as topping machanism or laser processing device along spacing track.In addition, in order to seek miniaturization and the lightweight of semiconductor devices, be divided into one by one device cutting off semiconductor wafer along spacing track before, by grinding attachment, grinding carried out in the back side of semiconductor wafer and be formed as predetermined thickness.
For example, the processing unit (plant)s such as topping machanism or laser processing device have: retaining member, and it has the holding table that keeps the machined objects such as wafer; Tool member, it implements processing to the machined object remaining on this retaining member; And processing feeding member, it relatively processes feeding to retaining member and tool member in processing direction of feed.Formation in such processing unit (plant) keeps the holding table of the retaining member of machined object to be made up of following part: retaining zone, and it is for attracting holding machined object; And framework, it has the outer regions around this retaining zone.
For by with form topping machanism cutting member cutting tool conduct to set origin position, the framework that forms the holding table forming like this forms (for example,, with reference to patent documentation 1) by stainless steel and other metal materials.
Existing patent documentation
Patent documentation 1: TOHKEMY 2005-142202 communique
But in recent years, in order to promote the productivity ratio of semiconductor devices in manufacturing, the diameter of wafer has from 300 millimeters of heavy calibers and turns to the trend of 450 millimeters, correspondingly, keeps the holding table of wafer also to need heavy caliber.The weight that is the holding table that the wafer of 300 millimeters is corresponding with diameter is 10 kilograms of left and right, and the weight that is the holding table that the wafer of 450 millimeters is corresponding with diameter is to exceed the component of 20 kilograms.In the time of processed wafer and the kind of wafer be replaced by accordingly optimal holding table, but as mentioned above, in the time that the weight of holding table exceedes 20 kilograms, there is following problem: a people is difficult to load and unload holding table.
Summary of the invention
The present invention is the invention completing in view of the above fact, and its main technical task is to provide a kind of processing unit (plant) with retaining member, and above-mentioned retaining member has light weight and handling are easy to holding table.
In order to solve above-mentioned main technical task, according to the present invention proposes such processing unit (plant), it has: retaining member, and it is for keeping machined object; Tool member, it is for implementing processing to the machined object remaining on above-mentioned retaining member; And processing feeding member, it is for above-mentioned retaining member and above-mentioned tool member are relatively processed to feeding processing direction of feed,
Above-mentioned processing unit (plant) is characterised in that,
Above-mentioned retaining member is made up of following part: holding table, and it has the attraction region of attracting holding machined object and the outer regions around above-mentioned attraction region; And supporting base, it supports above-mentioned holding table and above-mentioned holding table can be loaded and unloaded, and attraction is passed to above-mentioned attraction region,
Above-mentioned holding table is made up of porous ceramics, and is applied with coating in the region except above-mentioned attraction region.
From the upper surface that attracts region with predetermined step poor form the upper surface of above-mentioned outer regions, have and be equivalent to the poor thickness of above-mentioned ladder and be provided in outer regions with the becket that attracts the periphery in region to coordinate.
Invention effect
Because keeping the holding table of the retaining member of machined object, the formation based in processing unit (plant) of the present invention formed by porous ceramics, so compare very light with the stainless holding table using in the past, therefore, even if an operator also can easily be implemented handling operation.
In addition, because holding table is except attracting the region region to be formed with coating, so in the time that holding table is applied to topping machanism, can set and the origin position of electric energising of cutting tool that forms cutting member.
Accompanying drawing explanation
Fig. 1 is the stereogram of the topping machanism of the processing unit (plant) that forms according to the present invention based on conduct of the present invention.
Fig. 2 is the stereogram that exploded representation is equipped in the holding table of the retaining member in the topping machanism shown in Fig. 1.
Fig. 3 is the cutaway view that is equipped in the retaining member in the topping machanism shown in Fig. 1.
Fig. 4 is the key diagram that covers the method for coating in the region except attracting region of holding table, the retaining member shown in above-mentioned holding table pie graph 2 and Fig. 3.
Fig. 5 is the key diagram that is illustrated in the additive method of the region covering coating except attracting region of holding table, the retaining member shown in above-mentioned holding table pie graph 2 and Fig. 3.
Fig. 6 represents to paste the surperficial stereogram of cutting belt as the semiconductor wafer of machined object, and above-mentioned cutting belt is assemblied on ring-shaped frame.
Label declaration
2: stationary base
3: machined object maintaining body
4: retaining member
41: supporting base
42: holding table
5: holding table supporting mechanism
53: processing feeding member
6: main shaft support mechanism
63: index feed member
7: main axle unit
72: collar bush
73: rotary main shaft
74: cutting tool
77: shooting member
78: incision feeding member
10: semiconductor wafer
F: the framework of ring-type
T: cutting belt
The specific embodiment
Below, with reference to accompanying drawing, the preferred embodiment of the processing unit (plant) forming according to the present invention is elaborated.
Fig. 1 represents the stereogram as the topping machanism of the processing unit (plant) forming according to the present invention.
Topping machanism shown in Fig. 1 is equipped with following part: stationary base 2; Machined object maintaining body 3, it can be that the direction shown in arrow X is disposed in this stationary base 2 movably in processing direction of feed, and to keep machined object be wafer; Main shaft support mechanism 6, it can be that the direction shown in arrow Y (being the vertical direction of the direction shown in arrow X with processing direction of feed) is disposed in stationary base 2 movably in index feed direction; And as the main axle unit 7 of cutting member (tool member), it can be that the direction shown in arrow Z is disposed in this main shaft support mechanism 6 movably in incision direction of feed.
Above-mentioned machined object maintaining body 3 is made up of following part: retaining member 4, and it is for keeping the wafer as machined object; And holding table supporting mechanism 5, it supports this retaining member 4 and moves in the processing direction of feed shown in arrow X.In addition, in the back retaining member 4 is elaborated.
Go on to say with reference to Fig. 1, holding table supporting mechanism 5 has: pair of guide rails 51,51, and it is disposed in stationary base 2 abreast along the processing direction of feed shown in arrow X; Mobile foundation 52, it can be disposed on this guide rail 51,51 movably in the processing direction of feed shown in arrow X, and supports above-mentioned retaining member 4; And processing feeding member 53, it makes this mobile foundation 52 move along pair of guide rails 51,51.
Above-mentioned mobile foundation 52 is formed as rectangular shape, is formed with the directed groove 521,521 coordinating with above-mentioned pair of guide rails 51,51 at its lower surface.By this directed groove 521,521 is coordinated with pair of guide rails 51,51, mobile foundation 52 is arranged to can be along moving with pair of guide rails 51,51.
Above-mentioned processing feeding member 53 comprises: be disposed in abreast external thread rod 531 between above-mentioned pair of guide rails 51 and 51 and for rotariling actuate the drive sources such as the servo motor 532 of this external thread rod 531.One end rotation of external thread rod 531 is supported in the drive tab 533 fixing in above-mentioned stationary base 2 freely, and the other end of external thread rod 531 is connected with the output shaft of above-mentioned servo motor 532.In addition, external thread rod 531 screws togather with the internal thread 522 of the central portion that is formed at mobile foundation 52.Therefore,, by come forward and reversion driving external thread rod 531 by servo motor 532, mobile foundation 52 moves in the processing direction of feed shown in arrow X along guide rail 51,51.
Next, with reference to Fig. 2 to Fig. 3, above-mentioned retaining member 4 is described.
Retaining member 4 shown in Fig. 2 and Fig. 3, as shown in Figure 3, can be supported in support cylindrical shell 55 cylindraceous rotatably through bearing 56, and this support cylindrical shell 55 is disposed in the upper surface of mobile foundation 52.As shown in FIG. 2 and 3, can be supported on rotatably like this retaining member 4 that supports cylindrical shell 55 is made up of columned supporting base 41 and the holding table 42 that is disposed in these supporting base 41 upper surfaces.Supporting base 41 is formed by stainless steel and other metal materials, and surface is provided with circular cooperating recesses 411 thereon.As shown in Figure 3, be provided with the attraction path 413 at cooperating recesses 411 openings in this supporting base 41, this attraction path 413 is communicated with not shown attraction member.Therefore,, in the time making not shown attraction member work, negative pressure is by attracting path 413 to play a role.
Go on to say with reference to Fig. 2 to Fig. 3, the holding table 42 that forms retaining member 4 is formed as discoid as a whole, it has the attraction region 421 of attracting holding machined object and the outer regions 422 around this attraction region 421, and there is cylindrical base 423, this cylindrical base 423 is arranged on holding table 42 lower central downwards highlightedly, and coordinates with the cooperating recesses 411 that is arranged on above-mentioned supporting base 41.Be formed with access 424 in the cylindrical base 423 that forms this holding table 42, under the state coordinating with the cooperating recesses 411 that is arranged on above-mentioned supporting base 41 in cylindrical base 423, this access 424 is communicated with the attraction path 413 that is arranged on supporting base 41.In addition, holding table 42 has: radial attraction road 425, and it extends along radial direction, and one end is communicated with the access 424 that is formed at cylindrical base 423; And multiple circular attraction roads 426, it is formed as and attracts 413 one-tenth concentric circles of path, and is formed as intersecting with radial attraction road 425.
The holding table 42 forming is as described above that the porous ceramics that 10～30 μ m and the porosity are 40% forms by pore opening in the illustrated embodiment.As the preparation method of the holding table 42 being formed by this porous ceramics, can be by being that aluminium oxide ceramics, particle diameter that 30～60 μ m and volume ratio are 70% are that the organic adhesive that 5 μ m are following and volume ratio is 15% frit and volume ratio are 15% mixes aftershaping by particle diameter, and fire 5 hours and make with 1100 ℃.Because the holding table 42 forming like this consists of the little porous ceramics that is 40% by the porosity to 3.9 aluminium oxide ceramics of proportion of comparing with the stainless proportion 7 using in the past, so weight is 1/3 left and right of the holding table that formed by stainless steel.
At the holding table 42 being formed as described above, be applied with coating 427 in the region except above-mentioned attraction region 421.Here with reference to Fig. 4, the method that covers coating 427 in the region except attracting region 421 of holding table 42 is described.
As shown in Fig. 4 (b), the attraction region 421 that pastes the holding table 42 shown in (a) of Fig. 4 with 428 will be covered.At this moment the access 424 that is formed at above-mentioned cylindrical base 423 is also covered.By attracting the holding table 42 of region 421 and access 424 to implement electroless nickel plating to having covered like this, as shown in Fig. 4 (c), be formed with in the region except attracting region 421 coating 427 forming based on nickel.In addition, preferably, particularly, in outer regions 422, coating 427 soaks into 1 millimeter and forms.
Next,, with reference to Fig. 5, other embodiments of holding table 42 are described.
About the holding table 42 in the embodiment shown in Fig. 5, as shown in Fig. 5 (a), the upper surface of outer regions 422 than the upper surface that attracts region 421 with the poor 422a of predetermined step form.And, as shown in Fig. 5 (b), will cover and be with 428 to paste attraction region 421.At this moment, the access 424 that is formed at above-mentioned cylindrical base 423 is also covered.By attracting the holding table 42 of region 421 and access 424 to implement electroless nickel plating to having covered like this, as shown in Fig. 5 (c), be formed with in the region except attracting region 421 coating 427 forming based on nickel.And, as shown in Fig. 5 (c) and Fig. 5 (d), be equivalent to the thickness of the poor 422a of above-mentioned ladder and arrange outer regions 422 with the becket being formed by stainless steel etc. 429 that attracts the periphery in region to coordinate having.
The holding table 42 forming is as described above assemblied in supporting base 41 and forms retaining member 4, and this retaining member 4 is configured to: suitably rotate by not shown rotary actuation member.The base portion of 2 clamping devices 43 is installed by suitable fixed component at the peripheral part upper surface of supporting base 41 that forms retaining member 4 in addition.In addition, be equipped with cover platform 57 in the upper end that the supporting base 41 that forms retaining member 4 is supported for to the support cylindrical shell 55 that can rotate.
Return to Fig. 1 and go on to say, above-mentioned main shaft support mechanism 6 has along the index feed direction shown in arrow Y and is disposed in abreast the pair of guide rails 61,61 in stationary base 2 and can be disposed in movably the movable supporting base 62 on this guide rail 61,61 along the direction shown in arrow Y.This movable supporting base 62 is made up of following part: movable support portion 621, and it can be disposed on guide rail 61,61 movably; And department of assembly 622, it is installed on this movable support portion 621.Be formed with a pair of directed groove 621a, the 621a that coordinate with guide rail 61,61 at the lower surface of movable support portion 621, by this directed groove 621a, 621a are coordinated with guide rail 61,61, movable supporting base 62 is configured to and can moves along guide rail 61,61.In addition, department of assembly 622 a parallel sided be provided with the pair of guide rails 622a, the 622a that extend along direction shown in arrow Z.
Main shaft support mechanism 6 in illustrated embodiment has index feed member 63, and index feed member 63 is for making movable supporting base 62 move in the index feed direction shown in arrow Y along pair of guide rails 61,61.Index feed member 63 comprises: and above-mentioned pair of guide rails 61,61 is disposed in external thread rod 631 between above-mentioned pair of guide rails 61,61 abreast and for rotariling actuate the drive sources such as the impulse motor 632 of this external thread rod 631.One end rotation of external thread rod 631 is supported in not shown drive tab fixing in above-mentioned stationary base 2 freely, and the other end of external thread rod 631 is connected with the output shaft of above-mentioned impulse motor 632.In addition, external thread rod 631 screws togather with the internal thread hole that is formed at not shown internal thread piece, and above-mentioned internal thread piece is arranged on the central portion lower surface of the movable support portion 621 that forms movable supporting base 62 highlightedly.Therefore,, by come forward and reversion driving external thread rod 631 by impulse motor 632, can make movable supporting base 62 move in the index feed direction shown in arrow Y along guide rail 61,61.
Main axle unit 7 in illustrated embodiment has: unit rack 71, be arranged on the collar bush 72 of this said units support 71 and can be supported in rotatably the rotary main shaft 73 of this collar bush 72.Unit rack 71 is provided with a pair of directed groove 71a, 71a, a pair of directed groove 71a, 71a can coordinate with the pair of guide rails 622a, the 622a that arrange in above-mentioned department of assembly 622 slidably, by this directed groove 71a, 71a are coordinated with above-mentioned guide rail 622a, 622a, unit rack 71 is supported for and can moves in the incision direction of feed shown in arrow Z.Above-mentioned rotary main shaft 73 arranges highlightedly from the end of collar bush 72, is equipped with cutting tool 74 at the terminal part of this rotary main shaft 73.Cutting tool 74 has circular blade in the peripheral part side of the discoid pedestal being formed by aluminium, and this blade is by getting together diamond abrasive grain to form and thickness is formed as 15～30 μ m with nickel plating.The rotary main shaft 73 that has assembled this cutting tool 74 is rotarilyd actuate by servo motor 75 drive sources such as grade.In addition, be equipped with the cutting fluid supply nozzle 76 that cutting fluid is supplied to the cutting portion of cutting tool 74 in the both sides of cutting tool 74.Have shooting member 77 at the terminal part of above-mentioned collar bush 72, this shooting member 77, for the machined object remaining on above-mentioned chuck table 4 is taken, detects the region that be cut by above-mentioned cutting tool 74.This shooting member 77 is made up of optical components such as microscope and CCD cameras, and captured picture signal is flowed to not shown control member.
Form as described above the topping machanism in illustrated embodiment, below its effect is described.
Fig. 6 represents that as the machined object of the topping machanism machining by above-mentioned be the semiconductor wafer of wafer.Semiconductor wafer 10 shown in Fig. 6 is made up of silicon wafer, is formed with cancellate spacing track 101 at positive 10a, is formed with device 102 in the multiple regions that marked off by this cancellate spacing track 101.The back side 10b of the semiconductor wafer 10 forming like this sticks on the surface of cutting belt T, and this cutting belt T is assemblied in the framework F of ring-type.
In the time cutting above-mentioned semiconductor wafer 10 along spacing track 101, the holding table 42 of the machining of the semiconductor wafer 10 that selection is suitable for being made up of silicon wafer, and make as shown in Figure 3 cylindrical base 423 and be arranged on cooperating recesses 411 on supporting base 41 and coordinate and assemble.At this moment, because holding table 42 is formed by porous ceramics as described above, therefore, the weight of comparing with the stainless steel holding table using is in the past 1/3 left and right, therefore, even if an operator also can easily be implemented handling operation.
Like this, after the holding table of the machining of the semiconductor wafer that is suitable for being made up of silicon wafer 10 42 is assembled to supporting base 41, what be implemented as follows arranges operation: the origin position of setting cutting tool 74.This arranges in operation, and the holding table 42 that makes to form retaining member 4 moves to the machining region of cutting tool 74, and by the outer regions of holding table 42 422 navigate to cutting tool 74 under.And, make to cut feeding member 78 and work and cutting tool 74 is declined, and the periphery that detects the blade of cutting tool 74 touches the moment of the outer regions 422 of holding table 42, be initial point by the set positions of cutting tool at this moment 74.Now, owing to being formed with in the region except attracting region 421 coating 427 forming based on nickel in holding table 42, therefore, cutting tool 74 with cover the coating 427 of outer regions 422 and contact and connect detection electric current, therefore, can detect the upper surface of holding table 42 and contacting of cutting tool 74.
In addition, as shown in Figure 5, as holding table 42, with attract region 421 with the poor 422a of predetermined step form outer regions 422, and as mentioned above after the region except attracting region 421 has formed the coating 427 forming based on nickel, be equivalent to the thickness of the poor 422a of ladder and arrange outer regions 422 with the becket 429 that attracts the periphery in region to coordinate having, in such structure, can use chronically.
Next, the cutting belt T side that sticks on as shown in Figure 6 above the semiconductor wafer 10 on the cutting belt T of the framework F that is assemblied in ring-type is loaded on the holding table 42 that forms retaining member 4, and fixes the framework F of ring-type by clamping device 43.And, in the time making the work of not shown attraction member, the attraction path 413 of suction function in being arranged on supporting base 41 and be arranged on access 424, radial attraction road 425 and circular attraction road 426(in holding table 42 with reference to Fig. 3).Its result is, because holding table 42 is formed by porous ceramics as described above and is formed with in the region except attracting region 421 coating 427 forming based on nickel, attract region 421 so attraction acts on, thereby keep operation across cutting belt T attracting holding semiconductor wafer 10(wafer).
Having implemented after above-mentioned wafer keeps operation, make to process feeding member 53 is worked and by retaining member 4 move to shooting member 77 under.When retaining member 4 navigate to shooting member 77 under time, be implemented as follows calibrating operation: the machining area that should carry out machining that detects semiconductor wafer 10 by shooting member 77 and not shown control member.; shooting member 77 and not shown control member are carried out the image processing such as pattern match; thereby complete the calibration of machining area that should machining; the image such as described pattern match is processed for carrying out aiming at of spacing track 101 and the cutting tool 74 cutting along spacing track 101, and wherein above-mentioned spacing track 101 is formed at the predetermined direction of semiconductor wafer 10.In addition, extend spacing track 101 for what form at semiconductor wafer 10 along the direction vertical with above-mentioned predetermined direction, complete similarly the calibration (calibration procedure) of machining area that should machining.
Then, the below that retaining member 4 is moved to cutting tool 74 is machining region, and make cutting tool 74 to predetermined direction rotation, and at the direction incision feeding scheduled volume shown in arrow Z, by the position that navigates to bottom arrival cutting belt T of cutting tool 74.Then be, the direction shown in arrow X to be scheduled to cut the feed speed retaining member 4 of semiconductor wafer 10 that moved attracting holding in cutting direction of feed.Its result is, remains on semiconductor wafer 10 on the holding table 42 that forms retaining member 4 and is cut cutter 74 and cuts off (cutting process) along predetermined spacing track 101.In the time implementing this cutting process, spray the side of cutting fluid from cutting fluid supply nozzle 76 to cutting tool 74.
As mentioned above, after predetermined spacing track 101 cuts off semiconductor wafer 10, make the interval of retaining member 4 index feed spacing track 101 of the direction shown in arrow Y in Fig. 1, and implement above-mentioned cutting process.And, after having implemented cutting process along all spacing tracks that extend at the predetermined direction of semiconductor wafer 10, make retaining member 4 90-degree rotations, the spacing track 101 extending in the direction vertical with predetermined direction along semiconductor wafer 10 is carried out cutting process, thereby all spacing tracks 101 that cutting is clathrate and is formed at semiconductor wafer 10 are thus divided into device 102 one by one.In addition, the device one by one 102 being divided into does not have at random by the effect of cutting belt T, is maintaining the wafer state on the framework F that is supported on ring-type.Conveyance is to subsequent processing under the state that is pasted on cutting belt T for the semiconductor chip being one by one divided into like this, and above-mentioned cutting belt T is assemblied in the framework F of ring-type.
Above, describe the present invention according to illustrated embodiment, but the present invention is only defined in embodiment, within the scope of aim of the present invention, can carry out various distortion.For example, represented in the above-described embodiment the present invention to be applied to the topping machanism that cuts semiconductor wafer 10 along spacing track 101, but the present invention can be widely applied to the processing unit (plant) such as laser processing device or grinding attachment.
Claims (2)
1. a processing unit (plant), has: retaining member, and it is for keeping machined object; Tool member, it is for implementing processing to the machined object remaining on above-mentioned retaining member; And processing feeding member, it is for above-mentioned retaining member and above-mentioned tool member are relatively processed to feeding processing direction of feed,
Above-mentioned processing unit (plant) is characterised in that,
Above-mentioned retaining member is made up of following part: holding table, and it has the attraction region of attracting holding machined object and the outer regions around above-mentioned attraction region; And supporting base, it supports above-mentioned holding table and above-mentioned holding table can be loaded and unloaded, and attraction is passed to above-mentioned attraction region,
Above-mentioned holding table is made up of porous ceramics, and is applied with coating in the region except above-mentioned attraction region.
2. processing unit (plant) according to claim 1, wherein,
From the upper surface in above-mentioned attraction region with predetermined step poor form the upper surface of above-mentioned outer regions, there is the becket that is equivalent to the poor thickness of above-mentioned ladder and coordinate with the periphery in above-mentioned attraction region and be provided in above-mentioned outer regions.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2012239837A JP6078297B2 (en) | 2012-10-31 | 2012-10-31 | Processing equipment |
| JP2012-239837 | 2012-10-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103786270A true CN103786270A (en) | 2014-05-14 |
| CN103786270B CN103786270B (en) | 2017-08-11 |
Family
ID=50662543
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310495079.5A Active CN103786270B (en) | 2012-10-31 | 2013-10-21 | Processing unit (plant) |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP6078297B2 (en) |
| KR (1) | KR102034318B1 (en) |
| CN (1) | CN103786270B (en) |
| TW (1) | TWI599434B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2018022847A (en) * | 2016-08-05 | 2018-02-08 | 株式会社ディスコ | Chuck table |
| JP2018041776A (en) * | 2016-09-06 | 2018-03-15 | 株式会社ディスコ | Chuck table and transportation pad |
| JP6968501B2 (en) * | 2018-01-26 | 2021-11-17 | 株式会社ディスコ | How to set up the cutting equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2597198Y (en) * | 2003-01-14 | 2004-01-07 | 深圳市特种证件研究制作中心 | Automatic lamination cutting card-making device |
| CN200960613Y (en) * | 2006-10-13 | 2007-10-17 | 哈尔滨市华威电气有限公司 | Multi-winding ring type multi-pole electric magnetic chuck |
| JP2008062476A (en) * | 2006-09-06 | 2008-03-21 | Disco Abrasive Syst Ltd | Machining apparatus and chuck table |
| CN102335972A (en) * | 2011-10-24 | 2012-02-01 | 无锡绿波新能源设备有限公司 | Vacuum sucking disc |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2979194B2 (en) * | 1990-05-31 | 1999-11-15 | 京セラ株式会社 | Vacuum suction device |
| JPH0751221Y2 (en) * | 1990-07-31 | 1995-11-22 | 京セラ株式会社 | Vacuum chuck |
| JPH055352U (en) * | 1991-04-22 | 1993-01-26 | 住友金属工業株式会社 | Fixing structure of moving metal frame to ceramic surface plate |
| JP3865872B2 (en) * | 1997-06-26 | 2007-01-10 | 京セラ株式会社 | Vacuum suction holding device |
| JPH11254259A (en) * | 1998-03-13 | 1999-09-21 | Disco Abrasive Syst Ltd | Chuck table |
| JP2004153288A (en) * | 1999-08-23 | 2004-05-27 | Ibiden Co Ltd | Wafer prober device |
| JP4544706B2 (en) | 2000-06-29 | 2010-09-15 | 京セラ株式会社 | Board holder |
| JP4549654B2 (en) | 2003-11-04 | 2010-09-22 | 株式会社ディスコ | Cutting blade setup method |
| KR100753302B1 (en) * | 2004-03-25 | 2007-08-29 | 이비덴 가부시키가이샤 | Vacuum chuck, suction board, polishing device, and method for manufacturing of semiconductor wafer |
| JP4681255B2 (en) * | 2004-05-26 | 2011-05-11 | 株式会社タンケンシールセーコウ | Porous carbon |
| JP2008114336A (en) * | 2006-11-06 | 2008-05-22 | Disco Abrasive Syst Ltd | Self-grinding method for chuck table |
| JP2008254132A (en) * | 2007-04-05 | 2008-10-23 | Tokyo Seimitsu Co Ltd | Chuck table |
| JP2010278052A (en) * | 2009-05-26 | 2010-12-09 | Disco Abrasive Syst Ltd | Chuck table of cutting device |
| JP2011009423A (en) * | 2009-06-25 | 2011-01-13 | Disco Abrasive Syst Ltd | Holding table assembly and method of manufacturing holding table |
| US20110091700A1 (en) * | 2009-10-20 | 2011-04-21 | Saint-Gobain Ceramics & Plastics, Inc. | Microelectronic processing component having a corrosion-resistant layer, microelectronic workpiece processing apparatus incorporating same, and method of forming an article having the corrosion-resistant layer |
-
2012
- 2012-10-31 JP JP2012239837A patent/JP6078297B2/en active Active
-
2013
- 2013-09-03 TW TW102131651A patent/TWI599434B/en active
- 2013-09-30 KR KR1020130116275A patent/KR102034318B1/en active IP Right Grant
- 2013-10-21 CN CN201310495079.5A patent/CN103786270B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2597198Y (en) * | 2003-01-14 | 2004-01-07 | 深圳市特种证件研究制作中心 | Automatic lamination cutting card-making device |
| JP2008062476A (en) * | 2006-09-06 | 2008-03-21 | Disco Abrasive Syst Ltd | Machining apparatus and chuck table |
| CN200960613Y (en) * | 2006-10-13 | 2007-10-17 | 哈尔滨市华威电气有限公司 | Multi-winding ring type multi-pole electric magnetic chuck |
| CN102335972A (en) * | 2011-10-24 | 2012-02-01 | 无锡绿波新能源设备有限公司 | Vacuum sucking disc |
Non-Patent Citations (1)
| Title |
|---|
| 宾鸿赞等: "《先进加工工程技术》", 30 September 2009 * |
Also Published As
| Publication number | Publication date |
|---|---|
| JP6078297B2 (en) | 2017-02-08 |
| TWI599434B (en) | 2017-09-21 |
| KR102034318B1 (en) | 2019-10-18 |
| TW201416161A (en) | 2014-05-01 |
| CN103786270B (en) | 2017-08-11 |
| KR20140055984A (en) | 2014-05-09 |
| JP2014090105A (en) | 2014-05-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN107803604B (en) | Suction holding system | |
| CN106956370B (en) | Conveying mechanism of processing device | |
| US9396976B2 (en) | Cutting apparatus | |
| TWI430860B (en) | Cutting machine | |
| US11105752B2 (en) | Inspecting apparatus and processing apparatus including the same | |
| JP2017511754A (en) | System for drilling small holes, method for drilling holes, product for drilling, and method for further drilling | |
| JP2015170805A (en) | Processing method of plate-like material | |
| CN103786270A (en) | Machining apparatus | |
| JP2014237210A (en) | Grinding apparatus and grinding method | |
| CN107030902B (en) | Cutting device | |
| JP6491017B2 (en) | Workpiece transport tray | |
| JP2009289786A (en) | Cutting method of wafer | |
| JP2016219528A (en) | Processing device | |
| US20010049256A1 (en) | Semiconductor wafer assembly and machining apparatus having chuck tables for holding the same | |
| JP2010278052A (en) | Chuck table of cutting device | |
| JP5554601B2 (en) | Grinding equipment | |
| JP2015162555A (en) | Cutting device | |
| JP2011009652A (en) | Position-detecting method of cutting blade in cutting apparatus | |
| JP2009194217A (en) | Device for conveying plate-like object | |
| JP2017112227A (en) | Processing device | |
| CN112589540B (en) | Grinding method for plate-shaped workpiece | |
| CN116230510A (en) | Wafer manufacturing method and grinding device | |
| JP5638406B2 (en) | Grinding equipment | |
| JP2015079859A (en) | Workpiece holding mechanism | |
| JP2017079284A (en) | Laser beam machining device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |