CN103762190A - 一种pcb自动上料方法 - Google Patents

一种pcb自动上料方法 Download PDF

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Publication number
CN103762190A
CN103762190A CN201410049560.6A CN201410049560A CN103762190A CN 103762190 A CN103762190 A CN 103762190A CN 201410049560 A CN201410049560 A CN 201410049560A CN 103762190 A CN103762190 A CN 103762190A
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CN
China
Prior art keywords
pcb
carrier
fixed
cover plate
alignment pin
Prior art date
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Pending
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CN201410049560.6A
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English (en)
Inventor
吕海波
赵凯
苏浩杰
宋福鑫
姚秋林
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Ailifa Automation Equipment (shanghai) Co Ltd
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Ailifa Automation Equipment (shanghai) Co Ltd
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Application filed by Ailifa Automation Equipment (shanghai) Co Ltd filed Critical Ailifa Automation Equipment (shanghai) Co Ltd
Priority to CN201410049560.6A priority Critical patent/CN103762190A/zh
Publication of CN103762190A publication Critical patent/CN103762190A/zh
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)

Abstract

本发明公开了一种PCB自动上料方法，将PCB载具固定，PCB的载具上具有多个定位销；将PCB放置到载具之上，PCB上具有多个PCB定位孔，该PCB定位孔的位置与PCB载具上的定位销对应，PCB固定在载具的定位销上；将盖板放置在PCB上，盖板具有多个盖板定位孔，该盖板定位孔的位置与PCB载具上的定位销对应，盖板被固定在载具的定位销上。在PCB载具的底部布设磁性块，盖板的材料采用磁性吸附材质，使得PCB固定在载具上。

Description

一种PCB自动上料方法
技术领域
本发明属于集成电路生产设备制造技术领域，特别涉及一种印刷线路板（Printed Circuit Board，PCB）自动上料方法。
背景技术
目前，半导体晶圆加工厂在生产芯片的第一道工序要把PCB固定到载具（carrier）上，而后才能进行下一步工序。通常，生产厂家在PCB的生产转送过程中，仍采用手工作业方式将电路板固定至载具（carrier）上，后加上盖板（cover）上。然而，这种手工作业方式劳动强度大、效率低，不能更好的满足生产需求。
发明内容
本发明的目的是提供一种PCB自动上料方法。
一种PCB自动上料方法，包括以下步骤：将PCB载具固定，PCB的载具上具有多个定位销；
将PCB放置到载具之上，PCB上具有多个PCB定位孔，该PCB定位孔的位置与PCB载具上的定位销对应，PCB固定在载具的定位销上；
将盖板放置在PCB上，盖板具有多个盖板定位孔，该盖板定位孔的位置与PCB载具上的定位销对应，盖板被固定在载具的定位销上。
还包括步骤，在PCB载具的底部布设磁性块，盖板的材料采用磁性吸附材质，使得PCB固定在载具上。
本发明现有的手工上料、半自动化上料，以及个别机器只能对应某一种单一PCB而言，采用全高精度伺服定位，实现了现有PCB品种的全覆盖，大大的提高了机器的利用率，降低来了成本。
附图说明
图1是本发明的工艺方法示意图。
图2是采用本发明方法的设备示意图。
其中，1——载具，101——定位销，2——PCB，201——PCB定位孔，3——盖板，301——盖板定位孔。
具体实施方式
如图1所示，结合图2的治具载具上料机，jig&carrier上料机示意图。将carrier固定，将PCB放置到carrier上，PCB的定位孔对应carrier的定位销（pin），以起到定位作用，再将cover放在PCB上，cover的定位孔同样固定到carrier的pin上。Carrier底部分布规律的小磁性块，cover是能用磁性吸附的材质，这样能很好的将PCB固定在carrier上。

Claims (2)

1.一种PCB自动上料方法，其特征在于，包括以下步骤：
将PCB载具固定，PCB的载具上具有多个定位销；
将PCB放置到载具之上，PCB上具有多个PCB定位孔，该PCB定位孔的位置与PCB载具上的定位销对应，PCB固定在载具的定位销上；
将盖板放置在PCB上，盖板具有多个盖板定位孔，该盖板定位孔的位置与PCB载具上的定位销对应，盖板被固定在载具的定位销上。
2.如权利要求1所述的PCB自动上料方法，其特征在于，还包括步骤，
在PCB载具的底部布设磁性块，盖板的材料采用磁性吸附材质，使得PCB固定在载具上。
CN201410049560.6A 2014-02-13 2014-02-13 一种pcb自动上料方法 Pending CN103762190A (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201410049560.6A CN103762190A (zh) 2014-02-13 2014-02-13 一种pcb自动上料方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201410049560.6A CN103762190A (zh) 2014-02-13 2014-02-13 一种pcb自动上料方法

Publications (1)

Publication Number Publication Date
CN103762190A true CN103762190A (zh) 2014-04-30

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CN (1) CN103762190A (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110267461A (zh) * 2019-06-04 2019-09-20 深圳市宏普欣电子科技有限公司 一种自锁压条载具结构

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07154065A (ja) * 1993-12-01 1995-06-16 Hitachi Ltd プリント基板矯正用治具
US6062799A (en) * 1998-06-23 2000-05-16 Samsung Electronics Co., Ltd. Apparatus and method for automatically loading or unloading printed circuit boards for semiconductor modules
CN1565785A (zh) * 2003-06-30 2005-01-19 健鼎科技股份有限公司 一种用于多片排印刷电路板排版内开槽后加斜边的处理方法及其铣刀结构
CN200983721Y (zh) * 2006-12-15 2007-11-28 捷营精密有限公司 Smd制程用载具
CN202721915U (zh) * 2012-08-17 2013-02-06 腾捷（厦门）电子有限公司 一种用于柔性电路板的磁性治具

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07154065A (ja) * 1993-12-01 1995-06-16 Hitachi Ltd プリント基板矯正用治具
US6062799A (en) * 1998-06-23 2000-05-16 Samsung Electronics Co., Ltd. Apparatus and method for automatically loading or unloading printed circuit boards for semiconductor modules
CN1565785A (zh) * 2003-06-30 2005-01-19 健鼎科技股份有限公司 一种用于多片排印刷电路板排版内开槽后加斜边的处理方法及其铣刀结构
CN200983721Y (zh) * 2006-12-15 2007-11-28 捷营精密有限公司 Smd制程用载具
CN202721915U (zh) * 2012-08-17 2013-02-06 腾捷（厦门）电子有限公司 一种用于柔性电路板的磁性治具

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110267461A (zh) * 2019-06-04 2019-09-20 深圳市宏普欣电子科技有限公司 一种自锁压条载具结构

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