CN103753382A - 一种抛光垫及其制备方法 - Google Patents
一种抛光垫及其制备方法 Download PDFInfo
- Publication number
- CN103753382A CN103753382A CN201410006771.1A CN201410006771A CN103753382A CN 103753382 A CN103753382 A CN 103753382A CN 201410006771 A CN201410006771 A CN 201410006771A CN 103753382 A CN103753382 A CN 103753382A
- Authority
- CN
- China
- Prior art keywords
- polyurethane
- polishing pad
- fiber
- base material
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/22—Lapping pads for working plane surfaces characterised by a multi-layered structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/11—Lapping tools
- B24B37/20—Lapping pads for working plane surfaces
- B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410006771.1A CN103753382B (zh) | 2014-01-06 | 2014-01-06 | 一种抛光垫及其制备方法 |
TW103208855U TWM506674U (zh) | 2014-01-06 | 2014-05-21 | 拋光墊 |
TW103117723A TWI633971B (zh) | 2014-01-06 | 2014-05-21 | Polishing pad and preparation method thereof |
PCT/CN2014/095804 WO2015101316A1 (zh) | 2014-01-06 | 2014-12-31 | 一种抛光垫及其制备方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201410006771.1A CN103753382B (zh) | 2014-01-06 | 2014-01-06 | 一种抛光垫及其制备方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103753382A true CN103753382A (zh) | 2014-04-30 |
CN103753382B CN103753382B (zh) | 2016-04-27 |
Family
ID=50520783
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410006771.1A Expired - Fee Related CN103753382B (zh) | 2014-01-06 | 2014-01-06 | 一种抛光垫及其制备方法 |
Country Status (2)
Country | Link |
---|---|
CN (1) | CN103753382B (zh) |
WO (1) | WO2015101316A1 (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015101316A1 (zh) * | 2014-01-06 | 2015-07-09 | 成都时代立夫科技有限公司 | 一种抛光垫及其制备方法 |
CN105729326A (zh) * | 2014-12-29 | 2016-07-06 | 罗门哈斯电子材料Cmp控股股份有限公司 | 制造化学机械抛光垫的方法 |
CN111867781A (zh) * | 2018-04-26 | 2020-10-30 | 丸石产业株式会社 | 研磨垫用的衬底及使用该衬底的研磨方法 |
CN112318363A (zh) * | 2020-11-06 | 2021-02-05 | 万华化学集团电子材料有限公司 | 一种化学机械抛光垫的抛光层及其制备方法 |
CN116967930A (zh) * | 2023-09-21 | 2023-10-31 | 上海芯谦集成电路有限公司 | 特殊热熔胶加工工艺的抛光垫及其制备方法 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050107007A1 (en) * | 2001-12-28 | 2005-05-19 | Shoichi Furukawa | Polishing pad process for producing the same and method of polishing |
CN102301455A (zh) * | 2009-01-27 | 2011-12-28 | 因诺派德公司 | 包含形成图案的结构区域的化学机械平坦化垫 |
US20120190281A1 (en) * | 2011-01-26 | 2012-07-26 | Allison William C | Polishing pad with concentric or approximately concentric polygon groove pattern |
US20130137349A1 (en) * | 2011-11-29 | 2013-05-30 | Paul Andre Lefevre | Polishing pad with grooved foundation layer and polishing surface layer |
CN203228105U (zh) * | 2013-04-28 | 2013-10-09 | 合肥宏光研磨科技有限公司 | 一种表面带沟槽的聚氨酯抛光垫 |
CN203680028U (zh) * | 2014-01-06 | 2014-07-02 | 成都时代立夫科技有限公司 | 一种抛光垫 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6656019B1 (en) * | 2000-06-29 | 2003-12-02 | International Business Machines Corporation | Grooved polishing pads and methods of use |
JP2003103470A (ja) * | 2001-09-28 | 2003-04-08 | Dainippon Printing Co Ltd | 研磨層に凹部を有する研磨シート |
AU2003217744A1 (en) * | 2002-03-01 | 2003-09-16 | Raytech Innovative Solutions, Inc. | Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same |
CN103753382B (zh) * | 2014-01-06 | 2016-04-27 | 成都时代立夫科技有限公司 | 一种抛光垫及其制备方法 |
-
2014
- 2014-01-06 CN CN201410006771.1A patent/CN103753382B/zh not_active Expired - Fee Related
- 2014-12-31 WO PCT/CN2014/095804 patent/WO2015101316A1/zh active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050107007A1 (en) * | 2001-12-28 | 2005-05-19 | Shoichi Furukawa | Polishing pad process for producing the same and method of polishing |
CN102301455A (zh) * | 2009-01-27 | 2011-12-28 | 因诺派德公司 | 包含形成图案的结构区域的化学机械平坦化垫 |
US20120190281A1 (en) * | 2011-01-26 | 2012-07-26 | Allison William C | Polishing pad with concentric or approximately concentric polygon groove pattern |
US20130137349A1 (en) * | 2011-11-29 | 2013-05-30 | Paul Andre Lefevre | Polishing pad with grooved foundation layer and polishing surface layer |
CN203228105U (zh) * | 2013-04-28 | 2013-10-09 | 合肥宏光研磨科技有限公司 | 一种表面带沟槽的聚氨酯抛光垫 |
CN203680028U (zh) * | 2014-01-06 | 2014-07-02 | 成都时代立夫科技有限公司 | 一种抛光垫 |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015101316A1 (zh) * | 2014-01-06 | 2015-07-09 | 成都时代立夫科技有限公司 | 一种抛光垫及其制备方法 |
CN105729326A (zh) * | 2014-12-29 | 2016-07-06 | 罗门哈斯电子材料Cmp控股股份有限公司 | 制造化学机械抛光垫的方法 |
CN105729326B (zh) * | 2014-12-29 | 2018-03-30 | 罗门哈斯电子材料Cmp控股股份有限公司 | 制造化学机械抛光垫的方法 |
CN111867781A (zh) * | 2018-04-26 | 2020-10-30 | 丸石产业株式会社 | 研磨垫用的衬底及使用该衬底的研磨方法 |
CN112318363A (zh) * | 2020-11-06 | 2021-02-05 | 万华化学集团电子材料有限公司 | 一种化学机械抛光垫的抛光层及其制备方法 |
CN112318363B (zh) * | 2020-11-06 | 2022-03-11 | 万华化学集团电子材料有限公司 | 一种化学机械抛光垫的抛光层及其制备方法 |
CN116967930A (zh) * | 2023-09-21 | 2023-10-31 | 上海芯谦集成电路有限公司 | 特殊热熔胶加工工艺的抛光垫及其制备方法 |
CN116967930B (zh) * | 2023-09-21 | 2024-01-02 | 上海芯谦集成电路有限公司 | 特殊热熔胶加工工艺的抛光垫及其制备方法 |
Also Published As
Publication number | Publication date |
---|---|
CN103753382B (zh) | 2016-04-27 |
WO2015101316A1 (zh) | 2015-07-09 |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200728 Address after: 430057 Room 411, East Jinghe Road, Wuhan economic and Technological Development Zone, Hubei, 411 Patentee after: HUBEI DINGHUI MICROELECTRONICS MATERIALS Co.,Ltd. Address before: 610207, No. 355, No. two, No. 4, Tengfei Road, Chengdu Southwest Economic Development Zone, Shuangliu, Sichuan, China Patentee before: Chengdu Times Live Science and Technology Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160427 Termination date: 20220106 |