CN1037475C - 硅片曝光设备自动装片台的支承单元 - Google Patents

硅片曝光设备自动装片台的支承单元 Download PDF

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CN1037475C
CN1037475C CN94191259A CN94191259A CN1037475C CN 1037475 C CN1037475 C CN 1037475C CN 94191259 A CN94191259 A CN 94191259A CN 94191259 A CN94191259 A CN 94191259A CN 1037475 C CN1037475 C CN 1037475C
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bearing unit
silicon chip
tray
external diameter
load
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CN1118200A (zh
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A·加基斯
R·布斯坎普
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Koninklijke Philips NV
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Philips Electronics NV
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Packaging Frangible Articles (AREA)

Abstract

硅片曝光设备的一种自动装片台(10)的支承单元，具有一个圆形托盘和一个与装片站的进入通道相匹配的第一外径，此外径小于硅片外径，其中，此支承单元(11)的圆形托盘(16)具有多个沿着平行于装片站的进入通道方向至少局部地扩大了的托块(17)，扩大了的托块具有第二外径，此外径约等于硅片(12)的直径，并且在垂直于进入通道方向的支承单元(11)的最大宽度相当于圆形托盘(16)的宽度。

Description

硅片曝光设备自动装片台的支承单元
本发明涉及一种硅片曝光设备自动装片台的支承单元，它有圆形托盘，其第一外径与装片站的进入通道相匹配，且少于硅片的直径。
已知一些曝光设备的自动装片台，如美国Ultratech公司的UT-stepper(UT-分步重复曝光机)，在装片台上有一个圆形托盘作为支承单元(chuck，吸盘)，其最大直径小于待曝光硅片的直径。该设备支承单元的最大宽度是受限制的，受到通入装片站内的进入槽宽度的限制，就是说在装片站内给装片台或者支承单元装上硅片一般是自动完成的。当硅片在装片台上定位以后，装片台移到曝光站下面，一般曝光站是由一个光源和一个光刻掩膜版组成的，曝光站在要曝光的硅片上产生一个清晰的图象。由于硅片伸出支承单元边缘之外，所以硅片在边缘区域的支承较差，从而使其整体产生弯曲，导致硅片边缘散焦约5至20μm。因此这种硅片曝光失效率达30％至40％，对制造工艺有很大影响。
本发明的目的是提供一种硅片曝光设备自动装片台的支承单元，使用这种支承单元可以用简单的方式并在使用常规曝光设备和装片站的情况下尽可能的避免了散焦现象。
按照本发明此目的是这样实现的，即支承单元的圆形托盘在其周围沿着平行于装片站的进入通道方向具有若干至少局部地放大的托块，放大的托块使圆形托盘有了第二外径，此外径约等于硅片的直径，并且在垂直于进入通道方向支承单元的最大宽度相当于圆形托盘的宽度。
令人感到惊喜的是，按照本发明，在外围几何尺寸受装片站和/或受曝光设备限制的装片台或其承托面，也就是其支承单元可以得到明显地改进，使由于硅片弯曲所造成的失效率由原来的约30％至40％减少到5％以下。
在此，按照本发明，装片台的支承单元不改变其宽度，而主要地只改变其长度，例如使一个现有的具有窄进入槽的装片站也可以使用本发明的支承单元，而且不会使此支承单元在装片站的进入槽中碰撞或倾斜。
平行于进入通道方向加大尺寸的装片台支承单元，令人惊异地可以用非常简单的方式予以扩大。实验证明，支承单元以及承托面的局部圆形区可以选择比硅片少一些的直径，只要在进入通道方向圆环形扇区把支承单元的承托面加大即可。其中环形扇区也可以沿圆周方向断开，此方案是本发明的一种特殊结构。
如多次实验所证实，此环形扇区对于支承单元承托面的侧向其它未支承的边缘部分也有良好的影响，从而使聚焦失效率降至5％以下。
在从属权利要求中给出了本发明其它优良结构。
下面借助附图进一步阐述本发明的一个实施例：
图1示出具有本发明支承单元的装片台侧视图，
图2示出图1所示本发明装片台支承单元的俯视图。
图1为配有支承单元11的装片台10的侧视图。在台上放置了一片理想的没有弯曲的硅片12。用虚线表示将被避免弯曲的硅片15，以便对本发明支承单元11的功能与当前的技术水平进行具体比较。
在硅片12上方一段距离内装有光刻掩膜版13，在其上方装有光源14，以便对具有在图中没有画出的绝缘层和光刻胶层的硅片12进行曝光。装片台10以指向进入画面方向的移动把硅片12移到掩膜版13下的正确位置，当然这种移动是在装片台10在画面内向一侧偏转并且也以指向进入画面的方向运动，移到图中没有进一步画出的装片站而且是在装上硅片12之后进行的。在硅片12曝光之后装片台10以相应的方式卸下硅片和重新装片。
如图1中虚线所示，在仅为圆形的支承单元上，即相当于在图2中的托盘16上，如由现有技术已知，硅片15具有半径为R的曲率，因为硅片伸到支承单元的托盘16的边缘之外，特别是在硅片15的边缘区域导致成象的散焦。本发明的支承单元11在圆形托盘16两侧有若干托块17，虽然这些托块把支承单元11沿着平行于进入通道方向延长，但在其垂直方向却不变宽。于是硅片12没有曲率R。
图2为本发明支承单元11的俯视图，例如沿箭头方向B，支承单元可以移到曝光设备的掩膜版13下方，也可以移入一个通常限制其宽度的、未画出的装片站的进入槽。为此本发明的支承单元具有一个位于中心的圆形托盘16，如当前技术所采用的，此盘的直径小于硅片12的直径。在箭头方向B，即平行于装片站或曝光设备的进入通道方向，按本发明支承单元11的承托面具有几块园环扇形托块17，这些托块17在箭头方向B把承托面加大到等于硅片12的直径。从而保证，按本发明制造的具有扩大了的承托面的支承单元11可以在通常的装片站和曝光站使用并且可同时支承硅片12的大部分边缘。
因此，在托块17的范围内硅片12根本就没有出现弯曲，而且令人惊喜的是在没有支承的边缘区域、即在图2中托盘16的左侧和右侧硅片也没有弯曲。如在图2的下半部所示、托块17也可以分成几部分。按照本发明制成的支承单元11的这种形状的承托面给出低于5％的失效率。图2中的虚线18表示硅片12的外边缘。
在以上所阐述的、在图1和图2以及在权利要求中所公开的本发明的特征，不仅是单个特征而且以其任意的组合，对于实现本发明的各种实施结构都可能是关键的。

Claims (4)

1.硅片曝光设备的一种自动装片台的支承单元，具有一个圆形托盘和一个与装片站的进入通道相匹配的第一外径，此外径小于硅片外径，其特征在于，此支承单元(11)的圆形托盘(16)具有沿着平行于装片站的进入通道方向至少局部地扩大了的多个托块(17)，扩大了的托块具有第二外径，此外径等于硅片(12)的直径，并且在垂直于进入通道方向的支承单元(11)最大宽度相当于圆形托盘(16)的宽度。
2.根据权利要求1所述支承单元，其特征在于，多个对位于中心的圆形托盘(16)起扩大作用的托决(17)构成圆环扇区。
3.根据权利要求2所述支承单元，其特征在于，这些圆环的扇区形托块(17)在圆周方向至少可再分一次。
4.根据权利要求1所述支承单元，其特征在于，由位于中心的托盘(16)和圆环的扇区形托块(17)组成的支承单元(11)的承托面是装片台(10)的一种可以后装的附件。
CN94191259A 1993-11-23 1994-11-23 硅片曝光设备自动装片台的支承单元 Expired - Fee Related CN1037475C (zh)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
DEP4339818.9 1993-11-23
DE4339818A DE4339818A1 (de) 1993-11-23 1993-11-23 Stützelement eines automatischen Ladetisches einer Belichtungseinheit für Siliziumwafer
EP94203385.3 1994-11-22
EP94203385A EP0654815B1 (de) 1993-11-23 1994-11-22 Stützelement eines automatischen Ladetisches einer Belichtungseinheit für Siliziumwafer

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CN1118200A CN1118200A (zh) 1996-03-06
CN1037475C true CN1037475C (zh) 1998-02-18

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CN94191259A Expired - Fee Related CN1037475C (zh) 1993-11-23 1994-11-23 硅片曝光设备自动装片台的支承单元

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US (1) US5572036A (zh)
EP (1) EP0654815B1 (zh)
JP (1) JPH07273019A (zh)
KR (1) KR960700526A (zh)
CN (1) CN1037475C (zh)
DE (2) DE4339818A1 (zh)
WO (1) WO1995015004A1 (zh)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5044752A (en) * 1989-06-30 1991-09-03 General Signal Corporation Apparatus and process for positioning wafers in receiving devices

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59161029A (ja) * 1983-03-03 1984-09-11 Nec Corp 半導体目合露光装置
KR960016175B1 (en) * 1987-08-28 1996-12-04 Tokyo Electron Ltd Exposing method and apparatus thereof
FR2656598B1 (fr) * 1989-12-29 1992-03-27 Commissariat Energie Atomique Dispositif de chargement et de dechargement d'objets plats dans une cassette de rangement.
EP0456426B1 (en) * 1990-05-07 2004-09-15 Canon Kabushiki Kaisha Vacuum type wafer holder

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5044752A (en) * 1989-06-30 1991-09-03 General Signal Corporation Apparatus and process for positioning wafers in receiving devices

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Publication number Publication date
DE59408309D1 (de) 1999-07-01
CN1118200A (zh) 1996-03-06
EP0654815A1 (de) 1995-05-24
KR960700526A (ko) 1996-01-20
US5572036A (en) 1996-11-05
EP0654815B1 (de) 1999-05-26
DE4339818A1 (de) 1995-05-24
JPH07273019A (ja) 1995-10-20
WO1995015004A1 (de) 1995-06-01

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