CN103718668A - Component mounting method and component mounting device - Google Patents
Component mounting method and component mounting device Download PDFInfo
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- CN103718668A CN103718668A CN201280036845.5A CN201280036845A CN103718668A CN 103718668 A CN103718668 A CN 103718668A CN 201280036845 A CN201280036845 A CN 201280036845A CN 103718668 A CN103718668 A CN 103718668A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/08—Monitoring manufacture of assemblages
- H05K13/089—Calibration, teaching or correction of mechanical systems, e.g. of the mounting head
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Abstract
The invention addresses the problem of providing a component mounting method and component mounting device that even when having a press process, are resistant to falling component attachment precision. The component mounting method executes an attachment process multiple times, said attachment process attaching a component (C) to a board (Bf). The component mounting method is characterized by executing a press process that presses the attached component (C), and a check process that checks for position drift of the board (Bf) caused by the pressing of the component (C), after the Nth (where N is a natural number) attachment process and before the (N + 1)th attachment process.
Description
Technical field
The present invention relates to a kind of elements such as housing by electronic component, overlay electronic element and be installed to component mounting method and the component mounter on substrate.
Background technology
Such as on the substrate at smart mobile phone etc., the electronic component with housing being installed sometimes.Housing carries out pawl with electronic component and engages.This housing is installed after electronic component is installed on substrate.Particularly, first, in the mode of overlay electronic element, (mounting) housing is installed.Then, from top, press housing, thereby housing is engaged with electronic component.
In addition, contact pin grid array packages) etc. single in-line packages), PGA(Pin Grid Array dual in-line package), SIP(Single Inline Package DIP(Dual Inline Package::: carried out in the situation with leaded electronic component of through hole installation, also be after temporarily electronic component being installed on substrate, for lead-in wire is inserted in the through hole of substrate, and need to press electronic component from top.
Patent documentation 1: TOHKEMY 2011-18816 communique
Summary of the invention
Yet, when element is installed, element need to be installed on the regulation coordinate of substrate exactly.Therefore, before installing, element carries out in advance the location of substrate.
But as shown in above-mentioned housing, the element that operation that need to press from top presses operation is installed in the situation substrate continuously, exist the press load that imposes on substrate when pressing operation to make the situation of the position generation deviation of substrate.In this case, cause this to press the operation installation coordinate generation deviation of the element of installation later.Therefore, for example element is in the situation of housing, and housing is difficult to engage with electronic component.In addition, for example element is in the situation with leaded electronic component, and lead-in wire is difficult to enter through hole.So, the installation accuracy of element can reduce.
Square Flat type packaged) etc. ball array encapsulation) or QFP(Quad Flat Package in patent documentation 1, disclose by such as BGA(Ball Grid Array:: near the installation method of the electronic component that large-scale electronic component is taken to this coordinate before being installed on the regulation coordinate of substrate.But this shooting is in order to check near foreign matter coordinate and to adhere to or scolder figure being damaged etc. is performed.In the document, do not have hint to press the record of the confirmation of substrate position deviation that operation causes and position deviation.
Component mounting method of the present invention and component mounter complete in view of above-mentioned technical problem.Even if the object of the present invention is to provide, be a kind ofly also difficult to the component mounting method and the component mounter that reduce thering is the installation accuracy of element press operation in the situation that.
(1) for solving the problems of the technologies described above, in component mounting method of the present invention, repeatedly carry out the installation procedure of installation elements on substrate, it is characterized in that, after the N time above-mentioned installation procedure, before the N+1 time this installation procedure, carry out following operation: press operation, press installed said elements; And confirmation operation, confirm that wherein, N is natural number because pressing the position deviation of this substrate that this element causes.
Herein, so-called " installation elements on substrate " is included in the situation of direct installation elements on substrate naturally, but is also contained in the situation (that is, the situation of indirect installation elements on substrate) of installation elements on the element being installed on substrate.
In component mounting method of the present invention, after pressing operation, carry out and confirm operation.Therefore, even in the situation that produce the position deviation of substrate because pressing operation, also can be by confirming that operation confirm this position deviation.In addition, in the situation of location deviation, can revise this position deviation.Therefore,, in upper once installation procedure, can precision well element be installed on the regulation coordinate of substrate.So,, according to component mounting method of the present invention, even in the situation that having the operation of pressing, the installation accuracy of element is also difficult to reduce.
(1-1) be preferably, form aforesaid substrate and be configured in the structure on transportation tray.According to this structure, the transportation tray that maintains substrate is handled upside down on production line.In the situation of installation elements, first, by component mounter, transportation tray is fixed on assigned position.Then, to remaining on the substrate installation elements on transportation tray.
So, substrate remains in the situation on transportation tray, when pressing operation, exists because press load makes substrate and with respect to transportation tray, produces the possibility of deviation.In addition, exist transportation tray with respect to component mounter, to produce the possibility of deviation.Therefore, situation about being directly handled upside down on production line with substrate is compared, and it is large that the position deviation of substrate more easily becomes.About this point, according to the component mounting method of present embodiment and component mounter, even if substrate remains on transportation tray, the installation accuracy of element is also difficult to reduce.
(2) be preferably, on the basis of the structure of above-mentioned (1), form and repeatedly carry out above-mentioned installation procedure, above-mentioned structure of pressing operation and above-mentioned confirmation operation.According to this structure, when pressing operation, execution can both carry out confirmation operation.Therefore, the installation accuracy of element is difficult to reduce.
(3) be preferably, on the basis of the structure of above-mentioned (1) or (2), form following structure: in above-mentioned confirmation operation, based on being configured in aforesaid substrate and being installed on the position deviation that reference mark at least one party in the said elements on this substrate is confirmed this substrate.
Before installing, element use in advance reference mark to carry out the location of substrate.According to this structure, the processing method when by this location is converted to be confirmed in operation, thereby can confirm simply and correction position deviation.
(4) in order to solve the problems of the technologies described above, component mounter of the present invention possesses: suction nozzle, is installed to element on substrate; Press element, presses this installed element; And control device, repeatedly carry out and use this suction nozzle that this element is installed to the installation procedure on this substrate, it is characterized in that, above-mentioned control device is carried out following operation after the N time above-mentioned installation procedure, before the N+1 time this installation procedure: press operation, with above-mentioned pressing component, press installed said elements; And confirmation operation, confirm that wherein, N is natural number because pressing the position deviation of this substrate that this element causes.
Herein, so-called " installation elements on substrate " is included in the situation of direct installation elements on substrate naturally, but is also contained in the situation (that is, the situation of indirect installation elements on substrate) of installation elements on the element being installed on substrate.
The control device of component mounter of the present invention is carried out and is confirmed operation after pressing operation.Therefore, even in the situation that produce the position deviation of substrate because pressing operation, also can be by confirming that operation confirm this position deviation.In addition, in the situation of location deviation, can revise this position deviation.Therefore,, in upper once installation procedure, can precision well element be installed on the regulation coordinate of substrate.So,, according to component mounter of the present invention, even in the situation that having the operation of pressing, the installation accuracy of element is also difficult to reduce.
(4-1) be preferably, form aforesaid substrate and be configured in the structure on transportation tray.According to this structure, the transportation tray that maintains substrate is handled upside down on production line.In the situation of installation elements, first, by component mounter, transportation tray is fixed on assigned position.Then, to remaining on the substrate installation elements on transportation tray.
So, substrate remains in the situation on transportation tray, when pressing operation, exists because press load makes substrate and with respect to transportation tray, produces the possibility of deviation.In addition, exist transportation tray with respect to component mounter, to produce the possibility of deviation.Therefore, situation about being directly handled upside down on production line with substrate is compared, and it is large that the position deviation of substrate more easily becomes.About this point, according to this structure, even if substrate remains on transportation tray, the installation accuracy of element is also difficult to reduce.
(5) be preferably, on the basis of the structure of above-mentioned (4), form above-mentioned control device and repeatedly carry out above-mentioned installation procedure, above-mentioned structure of pressing operation and above-mentioned confirmation operation.According to this structure, when pressing operation, execution can both carry out confirmation operation.Therefore, the installation accuracy of element is difficult to reduce.
(6) be preferably, on the basis of the structure of above-mentioned (4) or (5), form following structure: this component mounter possesses camera head, this camera head is taken the reference mark that is configured in aforesaid substrate and be installed at least one party in the said elements on this substrate, and above-mentioned control device is confirmed the position deviation of this substrate in above-mentioned confirmation operation based on this reference mark.
Before installing, element use in advance the reference mark of being taken by camera head to carry out the location of substrate.According to this structure, the processing method when by this location is converted to be confirmed in operation, thereby can confirm simply and correction position deviation.
Invention effect
According to the present invention, even if can provide the installation accuracy of element in a kind of situation with the operation of pressing to be also difficult to the component mounting method and the component mounter that reduce.
Accompanying drawing explanation
Fig. 1 is the vertical view of production line that possesses the component mounter of one embodiment of the present invention.
Fig. 2 is the stereogram of said elements fitting machine.
Fig. 3 is the vertical view of said elements fitting machine.
Fig. 4 is the right side view of said elements fitting machine.
Fig. 5 is the block diagram of said elements fitting machine.
Fig. 6 is the enlarged drawing in the frame VI of Fig. 4.
Fig. 7 is the perspective elevation of the mounting head of said elements fitting machine.
Fig. 8 is the vertical view of transportation tray.
Fig. 9 is the exploded perspective view of electronic component and housing.
Figure 10 is the local right side view in operation of moving into of said elements fitting machine.
Figure 11 is the front local right side view of confirming operation leading portion of the installation of said elements fitting machine.
Figure 12 is the front local right side view of confirming operation back segment of the installation of said elements fitting machine.
Figure 13 is the local right side view of adsorption operation of the installation procedure for the first time of said elements fitting machine.
Figure 14 is that the housing of the installation procedure for the first time of said elements fitting machine is taken the local right side view of operation.
Figure 15 is the local right side view of mounting operation of the installation procedure for the first time of said elements fitting machine.
Figure 16 is the local right side view of first positioning operation of pressing operation of said elements fitting machine.
Figure 17 is the local right side view that first of operation is pressed operation of pressing of said elements fitting machine.
Figure 18 is the local right side view of second positioning operation of pressing operation of said elements fitting machine.
Figure 19 is the local right side view that second of operation is pressed operation of pressing of said elements fitting machine.
Figure 20 is the local right side view of the confirmation operation leading portion of said elements fitting machine.
Figure 21 is the local right side view of the confirmation operation back segment of said elements fitting machine.
Figure 22 is installation procedure and presses the schematic diagram of the load change that substrate is applied of operation.
Description of reference numerals:
1: component mounter; 2: base; 3 modules; 5 charging tray feeders; 6: image processing apparatus; 7: control device; 8f: transportation tray; 8r: transportation tray; 9: production line.
30: substrate transfer apparatus; 31:XY manipulator; 32: mounting head; 33: mark camera (camera head); 34: part camera; 35: substrate lifting device; 36f: suction nozzle; 36r: suction nozzle; 37: casing; 38: equipment workbench; 50: supply tray; 53L: conveyer belt; 53R: conveyer belt; 54: casing; 55L: arm; 55R: arm; 56: chassis; 70: computer; 80f: accommodate recess; 90: component mounter; 91: reflow ovens.
300: fixation wall; 301f: the first movable wall; 301r: the second movable wall; 302f: carrying motor; 302r: carrying motor; 303L: guide rail; 303R: guide rail; 304f: conveyer belt; 304r: conveyer belt; 305: base portion; 306f: connecting plate; 306r: connecting plate; 310:Y axle sliding part; 310a:Y axle motor; 311:X axle sliding part; 311a:X axle motor; 312:Y axle downslide moving part; 313:X axle downslide moving part; 320f:Z axle motor; 320r:Z axle motor; 321f: θ axle motor; 321r: θ axle motor; 322f: elevating lever; 322fa: be held sheet; 323f: retainer; 323r: retainer; 324f: ball-screw portion; 324fa: main shaft; 324fb: nut; 324fc: holding piece; 327f: mouth lifting unit; 327r: mouth lifting unit; 350f: back up platform; 350r: back up platform; 351f: back up pin; 351r: back up pin; 352f: lift motor; 352r: lift motor; 361f: press section; 361r: press section; 700: input/output interface; 701: operational part; 702: storage part.
Bf: substrate; Br: substrate; C: housing (element); C1: claw; D1: very big portion; D2: very big portion; F: floor; M: reference mark; Pa1: electronic component; Pa1a: recess; Pa2: electronic component; Pb～Pe: electronic component.
Embodiment
Below, the execution mode of component mounting method of the present invention and component mounter is described.
The configuration of < component mounter and mechanical structure >
First, the configuration about the component mounter of present embodiment describes.Fig. 1 represents to possess the vertical view of production line of the component mounter of present embodiment.As shown in Figure 1, on production line 9, along left and right directions (the carrying direction of substrate), there are side by side a plurality of component mounters 90, reflow ovens 91 and component mounter 1.As shown in Fig. 1 hatching, the component mounter 1 of present embodiment is configured in the downstream of reflow ovens 91.
Then, the mechanical structure about the component mounter of present embodiment describes.Fig. 2 represents the stereogram of the component mounter of present embodiment.Fig. 3 represents the vertical view of said elements fitting machine.Fig. 4 represents the right side view of said elements fitting machine.Fig. 5 represents the block diagram of said elements fitting machine.
The casing 37 that sees through base 2, module 3 in Fig. 2 represents.In Fig. 3, omitting casing 37 represents.The casing 37 that sees through module 3 in Fig. 4 represents.In addition, the arm 55R on the right side of omission charging tray feeder 5 represents.In addition, with section, represent transportation tray 8f, 8r.
As shown in Fig. 2～Fig. 5, component mounter 1 possesses base 2, module 3, charging tray feeder 5, image processing apparatus 6 and control device 7.
[base 2, module 3]
(casing 37, equipment workbench 38, substrate transfer apparatus 30, part camera 34)
Pair of right and left guide rail 303L, 303R are configured in the upper surface of base portion 305.Pair of right and left guide rail 303L, 303R extend upward in front and back.
The vertical front end of being located at the upper surface of base portion 305 of fixation wall 300.The first movable wall 301f is configured in the rear of fixation wall 300.The second movable wall 301r is configured in the rear of the first movable wall 301f.The first movable wall 301f, the second movable wall 301r engage with pair of right and left guide rail 303L, 303R in the mode that can move respectively.
The a pair of conveyer belt 304f in front and back is configured on the rear surface of fixation wall 300 and the front surface of the first movable wall 301f.The a pair of conveyer belt 304f in front and back extends upward at right and left.Between a pair of conveyer belt 304f in front and back, set up transportation tray 8f.A pair of conveyer belt 304f before and after carrying motor 302f rotarilys actuate.By a pair of conveyer belt 304f before and after making, rotate, thereby can carry transportation tray 8f.By the first movable wall 301f is moved along pair of right and left guide rail 303L, 303R, thus the carrying width between a pair of conveyer belt 304f before and after can expanding or dwindle.
The a pair of conveyer belt 304r in front and back is configured on the rear surface of the first movable wall 301f and the front surface of the second movable wall 301r.The a pair of conveyer belt 304r in front and back extends upward at right and left.Between a pair of conveyer belt 304r in front and back, set up transportation tray 8r.A pair of conveyer belt 304r before and after carrying motor 302r rotarilys actuate.By a pair of conveyer belt 304r before and after making, rotate, thereby can carry transportation tray 8r.By the second movable wall 301r is moved along pair of right and left guide rail 303L, 303R, thus the carrying width between a pair of conveyer belt 304r before and after can expanding or dwindle.
The a pair of connecting plate 306f in front and back is configured on the upper surface of fixation wall 300 and the upper surface of the first movable wall 301f.The a pair of connecting plate 306r in front and back is configured on the upper surface of the first movable wall 301f and the upper surface of the second movable wall 301r.As shown in Figure 4, when element is installed, a pair of connecting plate 306f in front and back, a pair of connecting plate 306r in front and back press left and right two edge of the upper surface of transportation tray 8f, 8r from top.In addition, the structure about transportation tray 8r, 8r, is elaborated in the back.
(substrate lifting device 35)
Back up platform 350f is configured between fixation wall 300 and the first movable wall 301f.A plurality of back up pin 351f are configured in the upper surface of back up platform 350f.Lift motor 352f drives back up platform 350f on above-below direction.
Back up platform 350r is configured between the first movable wall 301f and the second movable wall 301r.A plurality of back up pin 351r are configured in the upper surface of back up platform 350r.Lift motor 352r drives back up platform 350r on above-below direction.
As shown in Figure 4, when element is installed, a plurality of back up pin 351f, 351r press the lower surface of transportation tray 8f, 8r from below.That is,, when element is installed, transportation tray 8f, 8r are gripped from top from below and by a pair of connecting plate 306f in front and back, a pair of connecting plate 306r in front and back by a plurality of back up pin 351f, 351r.
(XY manipulator 31)
Directions X is corresponding with left and right directions, and Y-direction is corresponding with fore-and-aft direction, and Z direction is corresponding with above-below direction.XY manipulator 31 possesses X-axis motor 311a(with reference to Fig. 5), Y-axis motor 310a(is with reference to Fig. 5), Y-axis sliding part 310, X-axis sliding part 311, pair of right and left Y-axis downslide moving part 312 and upper and lower a pair of X-axis downslide moving part 313.
Pair of right and left Y-axis downslide moving part 312 is configured in the upper wall lower surface of casing 37.Y-axis sliding part 310 is arranged on pair of right and left Y-axis downslide moving part 312.Y-axis sliding part 310 can move up in front and back by the Y-axis motor 310a shown in Fig. 5.Upper and lower a pair of X-axis downslide moving part 313 is configured in the front surface of Y-axis sliding part 310.X-axis sliding part 311 is arranged on upper and lower a pair of X-axis downslide moving part 313.X-axis sliding part 311 can move up at right and left by the X-axis motor 311a shown in Fig. 5.
(mounting head 32, suction nozzle 36f, 36r, mark camera 33)
Enlarged drawing in the frame VI of Fig. 6 presentation graphs 4.Fig. 7 represents the perspective elevation of mounting head of the component mounter of present embodiment.As shown in Figure 6, Figure 7, mounting head 32 is arranged on X-axis sliding part 311.Therefore, mounting head 32 can by XY manipulator 31, all around, side moves up.
Mounting head 32 possesses Z axis motor 320f, 320r, θ axle motor 321f, 321r(with reference to Fig. 5) and mouth lifting unit 327f, 327r.The structure of mouth lifting unit 327f, 327r is identical.Below, take the structure of mouth lifting unit 327f describes as representative.
When the rotating shaft of Z axis motor 320f rotates, main shaft 324fa pivots, and nut 324fb moves at above-below direction.Being held sheet 322fa is clamped from above-below direction by a pair of holding piece 324fc.Therefore, elevating lever 322f is that retainer 323f moves up at upper and lower together with nut 324fb.θ axle motor 321f pivots and drives retainer 323f.
Similarly, retainer 323r drives on above-below direction by Z axis motor 320r and mouth lifting unit 327r respectively, and by θ axle motor, 321r drives in direction of rotation.That is, retainer 323f, 323r can move respectively independently in above-below direction, direction of rotation.
It is upper that suction nozzle 36f is arranged on retainer 323f in the mode that can change, and suction nozzle 36r is arranged on retainer 323r in the mode that can change.Therefore, suction nozzle 36f, 36r can move up at upper and lower by Z axis motor 320f, 320r, can in direction of rotation, move by θ axle motor 321f, 321r.Via pipe arrangement (figure slightly), suction nozzle 36f, 36r are supplied with to negative pressure or malleation.Suction nozzle 36f, 36r utilize negative-pressure adsorption element.In addition, suction nozzle 36f, 36r utilize malleation to discharge the element adsorbing.
In the lower end of suction nozzle 36f, 36r, dispose discoideus press section 361f, 361r.The lower surface of press section 361f, 361r is plane.Press section 361f, 361r press element.
[charging tray feeder 5]
Charging tray feeder 5 is configured in the place ahead of equipment workbench 38.Charging tray feeder 5 possesses supply tray 50, pair of right and left conveyer belt 53L, 53R, casing 54 and pair of right and left arm 55L, 55R.Casing 54 is equipped on chassis 56.Pair of right and left arm 55L, 55R are from rear wall rear surface outstanding setting towards rear of casing 54.The rear end of pair of right and left arm 55L, 55R is arranged on the upper surface of equipment workbench 38.
The structure > of < transportation tray 8f, 8r
Then, the structure of the transportation tray of the component mounter installation housing by present embodiment is described.The structure of transportation tray 8f, 8r is identical.Below, take the structure of transportation tray 8f describes as representative.
Fig. 8 represents the vertical view of transportation tray.As shown in Figure 8, at the upper surface of transportation tray 8f, be hollowly provided with four and accommodate recess 80f.In four are accommodated recess 80f, contain respectively substrate Bf.In component mounter 1, on substrate Bf, be mounted with electronic component Pa1, Pa2～Pe.That is, as shown in Figure 1, electronic component Pa1, Pa2～Pe are installed on substrate Bf by a plurality of component mounters 90 that are configured in the upstream side of reflow ovens 91.In addition, electronic component Pa1, Pa2～Pe are fixed on substrate Bf by reflow ovens 91.On the left-front corner of substrate Bf, right back angle, dispose respectively circular reference mark M.That is, the cutaway view of transportation tray 8f, the 8r shown in Fig. 4 is corresponding with the IV-IV direction cutaway view shown in Fig. 8.
The exploded perspective view that represents electronic component and housing in Fig. 9.As shown in Figure 9, in component mounting method described later, housing C is installed on electronic component Pa1.That is, housing C is the rectangle case shape in lower opening.On the antetheca rear surface of housing C, rear wall front surface, be provided with highlightedly respectively claw C1.Electronic component Pa1 is rectangle tabular.On the two sides, front and back of electronic component Pa1, be hollowly provided with respectively recess Pa1a.In component mounting method described later, a pair of claw C1 in front and back of housing C is engaged with a pair of recess Pa1a of electronic component Pa1.
The electrical structure > of < component mounter
Then, the electrical structure of the component mounter of present embodiment is described.
[image processing apparatus 6]
Image processing apparatus 6 is housed on base 2.As shown in Figure 5, image processing apparatus 6 is connected with mark camera 33, part camera 34.6 pairs of view data that are taken into by mark camera 33, part camera 33 of image processing apparatus are processed.
[control device 7]
Control device is housed on base 2.Control device 7 possesses computer 70 and a plurality of drive circuit.Computer 70 possesses input/output interface 700, operational part 701 and storage part 702.Pre-stored in storage part 702 have data relevant with the relative position of the installation coordinate of reference mark M and housing C etc.
Input/output interface 700 via drive circuit respectively with carrying motor 302f, the 302r of substrate transfer apparatus 30, Z axis motor 320f, the 320r of the X-axis motor 311a of lift motor 352f, the 352r of substrate lifting device 35, XY manipulator 31, Y-axis motor 310a, mounting head 32, θ axle motor 321f, 321r, mark camera 33, part camera 34 be connected.In addition, input/output interface 700 is connected with image processing apparatus 6.
< component mounting method >
Then, the component mounting method of present embodiment is described.Component mounting method is general in substrate Bf, Br.Below, take the component mounting method of substrate Bf is described as representative.
The component mounting method of present embodiment comprise move into operation, fastening operation, confirm operation before installing, for the first time installation procedure, press operation, confirm operation, installation procedure, fastening releasing operation and take out of operation for the second time.
[moving into operation]
In this operation, transportation tray 8f is moved into component mounter 1.In Figure 10, represent present embodiment component mounter move into the local right side view in operation.In addition, Figure 10 is corresponding with Fig. 6.As shown in Fig. 1～Fig. 5, Figure 10, in this operation, control device 7 drives carrying motor 302f.And a pair of conveyer belt 304f moves into transportation tray 8f to component mounter 1 by front and back.
[fastening operation]
In this operation, be the fixing transportation tray 8f of the installation of carrying out housing C.As shown in Fig. 1～Fig. 6, in this operation, control device 7 drives lift motor 352f.And from front and back, a pair of conveyer belt 304f lifts transportation tray 8f by a plurality of back up pin 351f.A plurality of back up pins 351 lift transportation tray 8f, until with front and back a pair of connecting plate 306f butt.Transportation tray 8f is gripped from top from below and by a pair of connecting plate 306f in front and back by a plurality of back up pin 351f.
[before installing, confirming operation]
In this operation, for carrying out the installation of housing C, confirm the position of substrate Bf.Figure 11 represents the front local right side view of confirming in operation leading portion of installation of the component mounter of present embodiment.Figure 12 represents the front local right side view of confirming in operation back segment of the installation of said elements fitting machine.In addition, Figure 11, Figure 12 are corresponding with Fig. 6.
As shown in Fig. 5, Fig. 8, Figure 11, first, control device 7 drives X-axis motor 311
a, Y-axis motor 310a.And, mark camera 33 is configured in reference mark M(Figure 11, the Figure 12 at right back angle of substrate Bf and is represented by " ") directly over.Then, control device 7 drives mark camera 33.Then, take reference mark M.
Similarly, as shown in Fig. 5, Fig. 8, Figure 12, control device 7 drives X-axis motor 311a, Y-axis motor 310a, mark camera 33 successively, in reference mark M(Figure 11, Figure 12 of the left-front corner of shooting substrate Bf, by " ", is represented).
The photographed data of two reference mark M sends respectively image processing apparatus 6 to.6 pairs of two photographed datas of image processing apparatus carry out image processing, send image deal with data to control device 7.Pre-stored in the storage part 702 of control device 7 have data relevant with the relative position of the installation coordinate of two reference mark M and housing C.The image deal with data of the operational part 701 of control device 7 based on sending from image deal with data 6 differentiated the coordinate of two captured reference mark M, determines the installation coordinate of housing C based on this coordinate.
[installation procedure for the first time]
In this operation, housing C is loaded in the upper surface of first electronic component Pa1.Figure 13 represents the local right side view in the adsorption operation of installation procedure for the first time of component mounter of present embodiment.Figure 14 represents that the housing of the installation procedure for the first time of said elements fitting machine takes the local right side view in operation.Figure 15 represents the local right side view in the mounting operation of installation procedure for the first time of said elements fitting machine.In addition, Figure 13～Figure 15 is corresponding with Fig. 6.
As shown in Fig. 5, Figure 13, first, control device 7 suitably drives X-axis motor 311a, Y-axis motor 310a, Z axis motor 320f, θ axle motor 321f.And, make the upper surface butt of the lower surface of suction nozzle 36f and the housing C of the regulation on supply tray 50.Then, 7 couples of suction nozzle 36f of control device supply with negative pressure, make suction nozzle absorption housing C.
As shown in Fig. 5, Figure 14, then, control device 7 suitably drives X-axis motor 311a, Y-axis motor 310a, Z axis motor 320f.And, by be adsorbed on housing C on suction nozzle 36f be configured in part camera 34 directly over.Then, control device 7 drives part camera 34.And, take housing C.
With install before confirm operation reference mark M situation similarly, photographed data is transmitted to image processing apparatus 6.6 pairs of photographed datas of image processing apparatus carry out image processing, send image deal with data to control device 7.The image deal with data of the operational part 701 of control device 7 based on sending from image processing apparatus 6 confirmed the adsorbed state of housing C.The result of confirming is in the poor situation of adsorbed state, revises adsorbed state (for example drive θ axle motor 321f, make housing C rotation).
As shown in Fig. 5, Figure 15, then, control device 7 suitably drives X-axis motor 311a, Y-axis motor 310a, Z axis motor 320f, θ axle motor 321f.And, make the upper surface butt of the lower surface of housing C and the electronic component Pa1 of the regulation on substrate Bf.Then, 7 couples of suction nozzle 36f of control device supply with malleation, discharge housing C.That is, housing C is loaded in the upper surface of electronic component pa1.When loading, as shown in Figure 9, make a pair of claw C1 in front and back of housing C and a pair of recess Pa1a in front and back of electronic component Pa1 opposed on above-below direction.
[pressing operation]
In this operation, housing C is fixed on first electronic component Pa1.Figure 16 represents the local right side view in first positioning operation of pressing operation of component mounter of present embodiment.Figure 17 represents that first of the operation of pressing of said elements fitting machine presses the local right side view in operation.In Figure 18, represent the local right side view in second positioning operation of pressing operation of said elements fitting machine.Figure 19 represents that second of the operation of pressing of said elements fitting machine presses the local right side view in operation.In addition, Figure 16～Figure 19 is corresponding with Fig. 6.
As shown in Fig. 5, Figure 16, first, control device 7 suitably drives X-axis motor 311a, Y-axis motor 310a, Z axis motor 320f.And, directly over the recess Pa1a in the place ahead of electronic component Pa1, configure the press section 361f of suction nozzle 36f.
As shown in Fig. 5, Figure 17, then, control device 7 drives Z axis motor 320f.And, by the press section 361f of suction nozzle 36f, from top, press housing C.As shown in emphasizing in Figure 17, the claw C1 in the place ahead of housing C engages with the recess Pa1a in the place ahead of electronic component Pa1 by press load.
As shown in Fig. 5, Figure 18, then, control device 7 suitably drives X-axis motor 311a, Y-axis motor 310a, Z axis motor 320f.And, directly over the recess Pa1a at the rear of electronic component Pa1, configure the press section 361r of suction nozzle 36r.
As shown in Fig. 5, Figure 19, then, control device 7 drives Z axis motor 320f.And, by the press section 361r of suction nozzle 36r, from top, press housing C.The claw C1 at the rear of housing C is engaged with the recess Pa1a at the rear of electronic component Pa1 by press load.So,, in this operation, by pawl, engage housing C is fixed on electronic component Pa1.
[confirmation operation]
In this operation, the press load of the suction nozzle 36r when pressing operation, confirms whether produced position deviation on substrate Bf.Figure 20 represents the local right side view in the confirmation operation leading portion of component mounter of present embodiment.Figure 21 represents the local right side view in the confirmation operation back segment of said elements fitting machine.In addition, Figure 20, Figure 21 are corresponding with Fig. 6.
As shown in Fig. 5, Figure 20, Figure 21, in this operation, by the operation same with front confirmation operation is installed, differentiate the coordinate of two reference mark M of substrate Bf.Herein, the coordinate of two reference mark M in this operation produces in the situation of deviation with respect to the coordinate of confirming two reference mark M in operation before installing, and operational part 701 is calculated departure.And, the installation coordinate based on this departure correction housing C.
[installation procedure for the second time]
In this operation, by the operation with installation procedure is identical for the first time, via part camera 34, housing C is carried to substrate Bf from supply tray 50.And, housing C is loaded in the upper surface of electronic component Pa2.
Afterwards, carry out and press for the second time operation, housing C is fixed on electronic component Pa2.Afterwards, carry out and confirm for the second time operation, confirm whether to have produced position deviation on substrate Bf.When having produced in the situation of position deviation, revise the installation coordinate of housing C next time.So, electronic component pa1, the Pa2(of housing C need to press the electronic component of operation as required) number repeatedly carry out installation procedure, press operation and confirm operation.
[fastening releasing operation, take out of operation]
In fastening releasing operation, remove the fixing of transportation tray 8f.That is,, as shown in Fig. 1～Fig. 6, in this operation, control device 7 drives lift motor 352f.And, a plurality of back up pin 351f are declined, transportation tray 8f is loaded on a pair of conveyer belt 304f in front and back.
In taking out of operation, transportation tray 8f is taken out of from component mounter 1.That is,, as shown in Fig. 1～Fig. 5, Figure 10, in this operation, control device 7 drives carrying motor 302f.And a pair of conveyer belt 304f takes out of transportation tray 8f from component mounter 1 by front and back.
< action effect >
Then, the action effect of the component mounting method of present embodiment and component mounter is described.According to the component mounting method of present embodiment and component mounter 1, control device 7 is carried out afterwards and is confirmed operation (Figure 20, Figure 21) pressing operation (Figure 16～Figure 19).Therefore, even if produce because pressing operation in the situation of position deviation of substrate Bf, also can be by confirming that operation confirm this position deviation and revise.Therefore,, in upper once installation procedure, can precision housing C be installed on the regulation coordinate of substrate Bf well.So,, according to the component mounting method of present embodiment and component mounter 1, even in the situation that having the operation of pressing, the installation accuracy of housing C is also difficult to reduce.
In addition, substrate Bf remains in the situation on transportation tray 8f, when pressing operation, exists because press load makes substrate Bf and with respect to transportation tray 8f, produces the possibility of deviation.In addition, exist transportation tray 8f with respect to component mounter 1, to produce the possibility of deviation.Therefore, compare with the situation that substrate Bf is directly handled upside down on production line 9, it is large that the position deviation of substrate Bf more easily becomes.About this point, according to the component mounting method of present embodiment and component mounter 1, even if substrate Bf remains on transportation tray 8, the installation accuracy of housing C is also difficult to reduce.
In addition, according to the component mounting method of present embodiment and component mounter 1, when pressing operation, execution all carries out confirmation operation.Therefore, the installation accuracy of housing C is difficult to reduce.
In addition, according to the component mounting method of present embodiment and component mounter 1, can be when confirming operation before installing position deviation confirmation method that carry out, that use the substrate Bf of reference mark M be converted to and confirm in operation.Therefore, can confirm simply position deviation.
Other > of <
Above, the execution mode of component mounting method of the present invention and component mounter is illustrated.But execution mode is without particular limitation of in aforesaid way.Various modes of texturing, the mode of ameliorating that also can likely carry out with those skilled in the art are implemented.
As shown in Figure 8, in the above-described embodiment, the transportation tray 8f that substrate Bf is installed is circulated on production line 9, also can make directly circulation on production line 9 of substrate Bf.Configurable number without particular limitation of the substrate Bf on transportation tray 8f.Shape, configurable number, position without particular limitation of the reference mark M of substrate Bf.In addition, reference mark M also can be configured in the not upper surface of electronic component Pb～Pe of mounting cover cover C.
As shown in Figure 16～Figure 19, in the above-described embodiment, in pressing operation, housing C has been carried out pressing for twice, but without particular limitation of compression number.In addition, without particular limitation of pressing position.In addition, without particular limitation of press load.
In addition, also can carry out continuously the mounting operation of the installation procedure shown in Figure 15 and first of the operation of pressing shown in Figure 17 and press operation.Figure 22 represents installation procedure and presses the schematic diagram of the load change that substrate is applied of operation.In the situation of present embodiment, as shown in Figure 15～Figure 17, after installation procedure, make suction nozzle 36f temporarily from housing C, leave.Therefore,, as shown in Figure 22 solid line, curve of load during installation procedure and the curve of load while pressing operation separate.
With respect to this, in the situation that the mounting operation of the installation procedure shown in continuous execution Figure 15 and first of the operation of pressing shown in Figure 17 are pressed operation (not making suction nozzle 36f leave from housing C), as shown in Figure 22 dotted line, the curve of load of curve of load during installation procedure when pressing operation is connected.That is, carry out continuously the assembling operation of installation procedure and press first of operation and press in the situation of operation, from 32 pairs of continuous applied thrusts of suction nozzle 36f of mounting head.In addition, on suction nozzle 36f, be provided with can be flexible on above-below direction spring, make it possible to the installing force on strict control above-below direction.Due to these reasons, as shown in Figure 22 dotted line, the curve of load of the curve of load while causing installation procedure when pressing operation is connected.
Wherein, curve is shaped as " the bimodal shape " with the very big D1 of portion of installed load and the very big D2 of portion of press load.Greatly between the D1 of portion, D2, exist load value than the very big D1 of portion, region that D2 is little.So,, even in the situation that not making suction nozzle 36f leave from housing C, also can carry out the installation procedure of component mounting method of the present invention and press operation.
As shown in Figure 9, without particular limitation of the clamping method of housing C and electronic component Pa1.So long as can be by pressing the clamping method of installing.In addition, without particular limitation of engaging count, clamped position.In addition, also can make housing C engage with substrate Bf rather than engage with electronic component Pa1.
As shown in Figure 1, in the component mounter 90 of the upstream side of reflow ovens 91, also can carry out the component mounting method of present embodiment.For example, can to DIP, SIP, PGA etc. carried out through hole installation with leaded electronic component executive component installation method.
In this case, can the electronic component (for example connector) that does not need to press the electronic component (for example square chip) of operation and need to press operation be installed on substrate by identical component mounter.
For example, square chip # 1～#4 and connector # 1, #2 are installed in the situation on substrate, as Installation Modes A, can be according to the order of installation procedure (square chip #1) → installation procedure (square chip #2) → installation procedure (connector #1) → press operation (connector #1) → confirmation operation → installation procedure (connector #2) → press operation (connector #2) → confirmation operation → installation procedure (square chip #3) → installation procedure (square chip #4) successively installation elements.
In addition, as Installation Modes B, can be according to the order of installation procedure (square chip #1) → installation procedure (square chip #2) → installation procedure (connector #1) → press operation (connector #1) → installation procedure (connector #2) → press operation (connector #2) → confirmation operation → installation procedure (square chip #3) → installation procedure (square chip #4) successively installation elements.That is,, with respect to Installation Modes A, can omit the confirmation operation of pressing after operation (connector # 1).So, production efficiency improves.In addition, can improve installation accuracy when square chip # 3, #4 are installed.
Installation Modes B can adopt following in the situation that.That is, as shown in Figure 9, in the situation that housing C engages with electronic component Pa1 pawl, in the lower edge of housing C (engaging direction leading section), sometimes dispose the downward taper processing department of expansion.In this case, even there are some deviations in the relative level direction position relationship of electronic component Pa1 and housing C before installing, while the guiding function of taper processing department that also can be by housing C and absorb this deviation housing C is installed on electronic component Pa1.In such situation, can omit confirmation operation.
In addition, in the situation with leaded electronic component, at the direction of insertion leading section going between, sometimes dispose the taper processing department coming to a point towards front end.In addition, the direction leading section that is inserted at through hole disposes the taper processing department towards front end expansion sometimes.In this case, even lead-in wire exists some deviations with the relative level direction position relationship of through hole before installing, while also can absorb this deviation by the guiding function of taper processing department, lead-in wire is inserted in through hole.In such situation, can omit confirmation operation.
So, if omit, confirm operation, can enhance productivity.But, owing to repeatedly pressing operation, substrate is applied to press load repeatedly.Therefore, there is the possibility of the fixed position generation deviation of substrate.Therefore, according to installation procedure (connector #1), press operation (connector #1), installation procedure (connector #2), the reiteration of pressing operation (connector #2) carries out installation procedure, carry out in the situation of common installation procedure (direction chip #3) after pressing operation, at installation procedure (square chip #3), confirms before operation.Can confirm that operation is confirmed whether that the press load when repeatedly pressing operation has produced position deviation on substrate Bf by this.
In addition, as Installation Modes C, can be according to the order of installation procedure (square chip #1) → installation procedure (square chip #2) → installation procedure (connector #1) → press operation (connector #1) → confirmation operation → installation procedure (connector #2) → press operation (connector #2) → installation procedure (square chip #3) → installation procedure (square chip #4) successively installation elements.That is,, with respect to Installation Modes A, can omit the confirmation operation of pressing after operation (connector # 2).Thus, production efficiency improves.So, even if reducing also, installation accuracy can omit without the confirmation operation before the installation procedure of the electronic component (square chip # 3, #4) affecting.
; can implement with following execution mode: before requiring the installation procedure of the electronic component of high installation accuracy (such as the electronic component with leaded, connector etc.), confirm operation, before not requiring the installation procedure of the electronic component of high installation accuracy (such as surface mounted electronic elements, square chip etc.), do not confirm operation.
In addition, in the above-described embodiment, when confirming operation, based on departure correction the installation coordinate of housing C.That is, revised the amount of movement of the XY manipulator 31 shown in Fig. 5.But, also can revise the position of substrate Bf.That is, can make substrate Bf revert to position when installation is front confirms operation.
In addition, in the above-described embodiment, in mounting head 32, configured two suction nozzles (pressing component) 36f, 36r, but without particular limitation of the configurable number of suction nozzle 36f, 36r.In addition, can be configured respectively suction nozzle 36f, 36r and pressing component.In addition, without particular limitation of the kind of mark camera 33, part camera 34.Also can be CMOS(Complementary Metal-Oxide Semiconductor: complementary metal oxide semiconductors (CMOS)) imageing sensor.
Claims (6)
1. a component mounting method, repeatedly carries out the installation procedure of installation elements on substrate, it is characterized in that:
After the described installation procedure of the N time, before the described installation procedure of the N+1 time, carry out following operation:
Press operation, press installed described element; And
Confirm operation, confirm because pressing the position deviation of the described substrate that described element causes,
Wherein, N is natural number.
2. component mounting method according to claim 1, wherein,
Described component mounting method repeatedly carry out described installation procedure, described in press operation and described confirmation operation.
3. component mounting method according to claim 1 and 2, wherein,
In described confirmation operation, based on being configured in described substrate and being installed on the position deviation that reference mark at least one party in the described element on described substrate is confirmed described substrate.
4. a component mounter, possesses:
Suction nozzle, is installed to element on substrate;
Pressing component, presses installed described element; And
Control device, repeatedly carries out and utilizes described suction nozzle that described element is installed to the installation procedure on described substrate,
Described component mounter is characterised in that,
Described control device is carried out following operation after the described installation procedure of the N time, before the described installation procedure of the N+1 time:
Press operation, utilize described pressing component to press installed described element; And
Confirm operation, confirm because pressing the position deviation of the described substrate that described element causes,
Wherein, N is natural number.
5. component mounter according to claim 4, wherein,
Described control device repeatedly carry out described installation procedure, described in press operation and described confirmation operation.
6. according to the component mounter described in claim 4 or 5, wherein,
Described component mounter possesses camera head, and described camera head is taken the reference mark that is configured in described substrate and be installed at least one party in the described element on described substrate,
Described control device is confirmed the position deviation of described substrate in described confirmation operation based on described reference mark.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-172597 | 2011-08-08 | ||
| JP2011172597A JP5711074B2 (en) | 2011-08-08 | 2011-08-08 | Component mounting method and component mounting machine |
| PCT/JP2012/069580 WO2013021892A1 (en) | 2011-08-08 | 2012-08-01 | Component mounting method and component mounting device |
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| Publication Number | Publication Date |
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| CN103718668A true CN103718668A (en) | 2014-04-09 |
| CN103718668B CN103718668B (en) | 2016-05-25 |
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| JP (1) | JP5711074B2 (en) |
| CN (1) | CN103718668B (en) |
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| US10426070B2 (en) * | 2013-07-12 | 2019-09-24 | Fuji Corporation | Method of mounting component on to substrate in component mounting device and component mounting device |
| WO2015015578A1 (en) * | 2013-07-31 | 2015-02-05 | 富士機械製造株式会社 | Electronic component mounting device and mounting method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002205224A (en) * | 2001-01-12 | 2002-07-23 | Matsushita Electric Ind Co Ltd | Part inserting device |
| JP2004103650A (en) * | 2002-09-05 | 2004-04-02 | Ckd Corp | Component mounting device and air-bearing cylinder |
| JP2005123636A (en) * | 2004-11-01 | 2005-05-12 | Matsushita Electric Ind Co Ltd | Support jig for board, and apparatus and method for manufacturing circuit board |
| CN1713811A (en) * | 2004-06-15 | 2005-12-28 | 株式会社日立高新技术仪器 | Electronic component mounting apparatus and electronic component mounting method |
| CN101107898A (en) * | 2005-01-21 | 2008-01-16 | 松下电器产业株式会社 | Electronic component mounting system and electronic component mounting method |
-
2011
- 2011-08-08 JP JP2011172597A patent/JP5711074B2/en active Active
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2012
- 2012-08-01 WO PCT/JP2012/069580 patent/WO2013021892A1/en active Application Filing
- 2012-08-01 CN CN201280036845.5A patent/CN103718668B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002205224A (en) * | 2001-01-12 | 2002-07-23 | Matsushita Electric Ind Co Ltd | Part inserting device |
| JP2004103650A (en) * | 2002-09-05 | 2004-04-02 | Ckd Corp | Component mounting device and air-bearing cylinder |
| CN1713811A (en) * | 2004-06-15 | 2005-12-28 | 株式会社日立高新技术仪器 | Electronic component mounting apparatus and electronic component mounting method |
| JP2005123636A (en) * | 2004-11-01 | 2005-05-12 | Matsushita Electric Ind Co Ltd | Support jig for board, and apparatus and method for manufacturing circuit board |
| CN101107898A (en) * | 2005-01-21 | 2008-01-16 | 松下电器产业株式会社 | Electronic component mounting system and electronic component mounting method |
Also Published As
| Publication number | Publication date |
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| CN103718668B (en) | 2016-05-25 |
| WO2013021892A1 (en) | 2013-02-14 |
| JP2013038198A (en) | 2013-02-21 |
| JP5711074B2 (en) | 2015-04-30 |
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