CN103718052B - 具有用于容纳多个半导体封装尺寸的凹口的梭板 - Google Patents

具有用于容纳多个半导体封装尺寸的凹口的梭板 Download PDF

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Publication number
CN103718052B
CN103718052B CN201280037954.9A CN201280037954A CN103718052B CN 103718052 B CN103718052 B CN 103718052B CN 201280037954 A CN201280037954 A CN 201280037954A CN 103718052 B CN103718052 B CN 103718052B
Authority
CN
China
Prior art keywords
notch depth
semiconductor device
shuttle
encapsulation
package dimension
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201280037954.9A
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English (en)
Chinese (zh)
Other versions
CN103718052A (zh
Inventor
M·L·L·彭洪
J·K·G·塔法拉
R·G·阿格里斯
A·G·F·克维多
C·M·奎达图
A·H·S·巴塔-安
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of CN103718052A publication Critical patent/CN103718052A/zh
Application granted granted Critical
Publication of CN103718052B publication Critical patent/CN103718052B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67333—Trays for chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
CN201280037954.9A 2011-06-03 2012-06-04 具有用于容纳多个半导体封装尺寸的凹口的梭板 Active CN103718052B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/153,005 2011-06-03
US13/153,005 US8829939B2 (en) 2011-06-03 2011-06-03 Shuttle plate having pockets for accomodating multiple semiconductor package sizes
PCT/US2012/040722 WO2012167242A2 (en) 2011-06-03 2012-06-04 Shuttle plate having pockets for accommodating multiple semiconductor package sizes

Publications (2)

Publication Number Publication Date
CN103718052A CN103718052A (zh) 2014-04-09
CN103718052B true CN103718052B (zh) 2016-10-26

Family

ID=47260433

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201280037954.9A Active CN103718052B (zh) 2011-06-03 2012-06-04 具有用于容纳多个半导体封装尺寸的凹口的梭板

Country Status (4)

Country Link
US (1) US8829939B2 (cg-RX-API-DMAC7.html)
JP (1) JP6016900B2 (cg-RX-API-DMAC7.html)
CN (1) CN103718052B (cg-RX-API-DMAC7.html)
WO (1) WO2012167242A2 (cg-RX-API-DMAC7.html)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101677709B1 (ko) * 2015-08-31 2016-11-21 (주)마이크로컨텍솔루션 Ssd 테스트용 젠더 구조
TWI615342B (zh) * 2017-03-21 2018-02-21 德律科技股份有限公司 電路板測試系統、電路板測試方法及電路板安裝裝置
US10782341B2 (en) 2018-08-21 2020-09-22 Texas Instruments Incorporated Semiconductor device handler with a floating clamp
CN116577640A (zh) * 2023-06-08 2023-08-11 中山市博测达电子科技有限公司 数字载荷硬件自动测试系统及方法
US20250201607A1 (en) * 2023-12-18 2025-06-19 Taiwan Semiconductor Manufacturing Company Limited Package shuttle for enhanced package handling reliability and methods for forming the same

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4506213A (en) 1983-07-18 1985-03-19 Sym-Tek Systems, Inc. Electronic device handler
US5227717A (en) * 1991-12-03 1993-07-13 Sym-Tek Systems, Inc. Contact assembly for automatic test handler
JPH08179007A (ja) 1994-12-22 1996-07-12 Advantest Corp Ｉｃテスタ用ハンドラのチェンジキットの構造
JPH10227831A (ja) * 1997-02-17 1998-08-25 Advantest Corp Ｉｃ試験装置
KR100349942B1 (ko) * 1999-12-06 2002-08-24 삼성전자 주식회사 램버스 핸들러
US6718608B2 (en) 2002-01-22 2004-04-13 St Assembly Test Services Pte Ltd Multi-package conversion kit for a pick and place handler
AU2003227357A1 (en) 2003-04-23 2004-11-19 Advantest Corporation Insert and tray respectively for electronic component handling device and electronic component handling device
JP2005321242A (ja) * 2004-05-07 2005-11-17 Fujitsu Ltd Ｉｃの自動試験方法及びプログラム
KR100610778B1 (ko) 2004-12-03 2006-08-09 미래산업 주식회사 반도체 소자 테스트 핸들러용 캐리어 모듈
KR100817054B1 (ko) * 2006-07-13 2008-03-26 삼성전자주식회사 패키지 테스트용 소켓, 테스트 소켓용 러버 및 테스트소켓용 가이드
JP4967532B2 (ja) * 2006-08-25 2012-07-04 富士通セミコンダクター株式会社 半導体集積回路および半導体集積回路のテスト方法
JP2008192271A (ja) * 2007-02-08 2008-08-21 Nec Electronics Corp 半導体装置及びそのテスト方法
JP5282093B2 (ja) * 2008-07-08 2013-09-04 株式会社アドバンテスト 電子部品の試験方法及び電子部品試験システム
JP2010202392A (ja) * 2009-03-05 2010-09-16 Elpida Memory Inc Ｉｃオートハンドラ

Also Published As

Publication number Publication date
US20120306526A1 (en) 2012-12-06
JP2014519039A (ja) 2014-08-07
JP6016900B2 (ja) 2016-10-26
WO2012167242A2 (en) 2012-12-06
US8829939B2 (en) 2014-09-09
WO2012167242A3 (en) 2013-01-24
CN103718052A (zh) 2014-04-09

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