CN103687336A - Corrosion-resistant printed wiring board and manufacturing method thereof - Google Patents
Corrosion-resistant printed wiring board and manufacturing method thereof Download PDFInfo
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- CN103687336A CN103687336A CN201310674984.7A CN201310674984A CN103687336A CN 103687336 A CN103687336 A CN 103687336A CN 201310674984 A CN201310674984 A CN 201310674984A CN 103687336 A CN103687336 A CN 103687336A
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- printed wiring
- golden finger
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Abstract
The invention discloses a manufacturing method of a corrosion-resistant printed wiring board. An outer layer of the printed wiring board comprises a golden finger area and a wiring area. The manufacturing method includes the following steps of (1) electroplating the whole board, (2) manufacturing the golden finger area, (3) attaching a dry film to cover the golden finger area and then manufacturing the wiring area and carrying out post-process manufacturing to obtain the corrosion-resistant printed wiring board. Resin is adopted to replace ink in the prior art to serve as a solder mask bridge to be filled between golden fingers. Because the resin has good corrosion resistance and ageing resistance, corrosion-resistant performance of the printed wiring board is greatly improved.
Description
Technical field
The present invention relates to printed wiring board technical field, particularly relate to a kind of corrosion resistant printed wiring board and preparation method thereof.
Background technology
Along with golden finger welding resistance bridge development, this technique is also constantly used on the PCB product of Medical Instrument Sterilization.Yet along with continuing to optimize of sterilization technology, PCB product used on this bactericidal unit is also constantly challenged, wherein a difficult problem for current maximum is that ink between golden finger comes off.A little less than crosslinking degree due to ink, the strong oxidizer hydrogen peroxide of its unstable functional group easily and in disinfecting process reacts, and causes ageing-resistant performance to weaken, and ink comes off.Finding new material replaces the welding resistance bridge between golden finger to become a quantum jump point that solves the corrosion-resistant difficult problem of printed wiring board.
By exploring, macromolecular material becomes first-selection, large mainly due to the crosslinking degree of macromolecular material, ageing-resistant.And resin just belongs to macromolecular material, but also do not use resin to replace the manufacture craft of the welding resistance bridge between golden finger at present.
Summary of the invention
Based on this, the object of this invention is to provide a kind of preparation method of corrosion resistant printed wiring board.
Concrete technical scheme is as follows:
A preparation method for corrosion resistant printed wiring board, this printed wiring comprises golden finger region and circuit region, preparation method comprises the steps:
(1) whole plate is electroplated: the printed wiring board after front operation is processed is carried out to whole plate plating, make that copper is thick reaches designing requirement;
(2) golden finger region makes:
1. step (1) is obtained to printed wiring board and paste dry film, exposure imaging, etching operation, remove the copper between golden finger;
2. potting resin between golden finger, nog plate;
(3) paste dry film and cover golden finger region, then carry out according to a conventional method the making of circuit region and rear operation and make, obtain corrosion resistant printed wiring board.
Whole plate is electroplated and is made that the outer field copper of wiring board is thick reaches designing requirement, and can deepen between golden finger, for the height of potting resin, to be more conducive to wiring board anticorrosion; Golden finger region separates making with circuit region, can guarantee the quality of circuit region circuit, improves rate of finished products.
Therein in an embodiment, step 2. in, the technological parameter of potting resin is as follows: by resin deaeration 5-7min, concussion 10-15min, controlled pressure 0.3-0.5MPa during filling, consent head translational speed 3-5mm/s.
Therein in an embodiment, step 2. in, the technological parameter of nog plate is as follows: nog plate control rate 1.2-2.5m/min, electric current 0.5-2.5A.
In an embodiment, described resin is epoxy resin, phenolic resins or polyamide therein.
In an embodiment, in step (1), it is 20-75mm that whole plate is electroplated rear copper thick therein.
Another object of the present invention is to provide the corrosion-resistant printed wiring board that above-mentioned preparation method prepares.
Concrete technical scheme is as follows:
The printed wiring board that above-mentioned preparation method prepares.
Principle of the present invention and advantage:
The present invention adopts resin to replace the ink of prior art to be filled between golden finger as welding resistance bridge, due to resin (high molecular polymer, for example: epoxy resin, phenolic resins or polyamide) there is well corrosion-resistant ageing-resistant performance, the decay resistance of printed wiring is greatly improved.
Available technology adopting ink is as welding resistance bridge, in preparation technology, golden finger region and circuit region make simultaneously, do not need nog plate operation, and potting resin is during as welding resistance bridge, because the resin after filling can stick to whole plate face, need to carry out nog plate operation.If adopting existing preparation technology's golden finger region and circuit region is to make simultaneously, after nog plate operation in circuit region compared with thin copper wire possibly because the phenomenon of broken string appears in nog plate operation, and then cause scrappage raising.
For these reasons, preparation method of the present invention is the wiring board preparation method of the adaptation resin welding resistance bridge developed for new material.This preparation method is divided into golden finger region and circuit region by wiring board outer layer zone, first make golden finger region, in nog plate operation, can not produce any impact to circuit region, after golden finger region completes, carry out again the making in circuit region, can greatly guarantee the qualification rate of wiring board.
Accompanying drawing explanation
Fig. 1 is the profile that embodiment step (2) is pasted dry film, the rear printed wiring board of exposure imaging operation;
Fig. 2 is the profile of printed wiring board after embodiment step (2) etching operation;
Fig. 3 is the profile of embodiment step (3) final products;
Fig. 4 fills ink welding resistance printed wiring board corrosion resistance schematic diagram between golden finger;
Fig. 5 is potting resin welding resistance printed wiring board corrosion resistance schematic diagram between golden finger.
Description of reference numerals:
101, dry film; 102, golden finger; 103, resin; 104, the circuit in circuit region.
Embodiment
The resin that the embodiment of the present invention is used is epoxy resin, purchased from San Rong Chemical Co., Ltd..
Below in conjunction with drawings and Examples, the present invention is further elaborated.
A preparation method for corrosion resistant printed wiring board, this printed wiring board comprises golden finger region and circuit region, preparation method comprises the steps:
(1) whole plate is electroplated: the printed wiring board after front operation is processed is carried out to whole plate plating, make the thick 20-75mm(of reaching of copper by client's designing requirement);
(2) golden finger region makes (with reference to figure 1-Fig. 2):
1. step (1) is obtained to printed wiring board and paste dry film 101, exposure imaging, etching operation, remove the copper between golden finger;
2. filling epoxy resin 103 between golden finger, nog plate; First by resin deaeration 6min, concussion 12min, stops bubble, guarantees the adhesion of resin and base material; Next controlled pressure 0.4MPa when resin filling, consent head translational speed 4mm/s, makes the abundant golden finger of filling between golden finger; Nog plate control rate 1.2-2.5m/min, electric current 0.5-2.5A, golden finger length direction is vertical with polish-brush to be put into.
(3) paste dry film and cover golden finger region, then carry out according to a conventional method the making of circuit region and rear operation and make, obtain corrosion resistant printed wiring board (with reference to figure 3).
The corrosion resistant printed wiring board performance test data that the present embodiment prepares is as follows:
The corrosion resistant printed wiring panel products that the present embodiment is prepared is used to compare on Medical Instrument Sterilization and with existing ink welding resistance printed wiring board, by test in 1 month, use, there is obscission in the printed wiring welding resistance bridge (ink) of finding ink welding resistance, and the welding resistance bridge (epoxy resin) of corrosion-resistant printed wiring board of the present invention is without coming off.Because existing Medical Instrument Sterilization adopts H more
2o
2, it has strong oxidizing property, can react with ink (have unstable reproducibility functional group), and not with resin reaction.
As can be seen from Figure 4 and Figure 5: through strong oxidizer (H
2o
2) process, there is slight crack (as Fig. 4) in welding resistance ink and copper sheet interface, and the flawless generation of resin (as Fig. 5).
The above embodiment has only expressed several execution mode of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection range of patent of the present invention should be as the criterion with claims.
Claims (6)
1. a preparation method for corrosion resistant printed wiring board, is characterized in that, the skin of this printed wiring board comprises golden finger region and circuit region, and preparation method comprises the steps:
(1) whole plate is electroplated: the printed wiring board after front operation is processed is carried out to whole plate plating, make that copper is thick reaches designing requirement;
(2) golden finger region makes:
1. step (1) is obtained to printed wiring board and paste dry film, exposure imaging, etching operation, remove the copper between golden finger;
2. potting resin between golden finger, nog plate;
(3) paste dry film and cover golden finger region, then carry out the making of circuit region and rear operation and make, obtain described corrosion resistant printed wiring board.
2. the preparation method of corrosion resistant printed wiring board according to claim 1, is characterized in that, step 2. in, the technological parameter of potting resin is as follows: by resin deaeration 5-7min, concussion 10-15min, controlled pressure 0.3-0.5MPa during filling, consent head translational speed 3-5mm/s.
3. the preparation method of corrosion resistant printed wiring board according to claim 1, is characterized in that, step 2. in, the technological parameter of nog plate is as follows: nog plate control rate 1.2-2.5m/min, electric current 0.5-2.5A.
4. according to the preparation method of the corrosion resistant printed wiring board described in claim 1-3 any one, it is characterized in that, described resin is epoxy resin, phenolic resins or polyamide.
5. according to the preparation method of the corrosion resistant printed wiring board described in claim 1-3 any one, it is characterized in that, in step (1), it is 20-75mm that whole plate is electroplated rear copper thick.
6. the printed wiring board that the preparation method described in claim 1-5 any one prepares.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310674984.7A CN103687336B (en) | 2013-12-11 | 2013-12-11 | Corrosion resistant printed wiring board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310674984.7A CN103687336B (en) | 2013-12-11 | 2013-12-11 | Corrosion resistant printed wiring board and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103687336A true CN103687336A (en) | 2014-03-26 |
| CN103687336B CN103687336B (en) | 2016-08-17 |
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ID=50323216
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310674984.7A Expired - Fee Related CN103687336B (en) | 2013-12-11 | 2013-12-11 | Corrosion resistant printed wiring board and preparation method thereof |
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| Country | Link |
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| CN (1) | CN103687336B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112188732A (en) * | 2019-07-03 | 2021-01-05 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of medical instrument detection plate |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03256395A (en) * | 1990-03-06 | 1991-11-15 | Hitachi Ltd | Electronic device |
| JPH05175639A (en) * | 1991-12-24 | 1993-07-13 | Hitachi Chem Co Ltd | Manufacture of wiring board |
| CN103200777A (en) * | 2013-04-22 | 2013-07-10 | 景旺电子（深圳）有限公司 | Manufacture method of thick copper plate fine solder resist bridge |
-
2013
- 2013-12-11 CN CN201310674984.7A patent/CN103687336B/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03256395A (en) * | 1990-03-06 | 1991-11-15 | Hitachi Ltd | Electronic device |
| JPH05175639A (en) * | 1991-12-24 | 1993-07-13 | Hitachi Chem Co Ltd | Manufacture of wiring board |
| CN103200777A (en) * | 2013-04-22 | 2013-07-10 | 景旺电子（深圳）有限公司 | Manufacture method of thick copper plate fine solder resist bridge |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112188732A (en) * | 2019-07-03 | 2021-01-05 | 胜宏科技（惠州）股份有限公司 | Manufacturing method of medical instrument detection plate |
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|---|---|
| CN103687336B (en) | 2016-08-17 |
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Granted publication date: 20160817 Termination date: 20211211 |
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