CN103681987A - Method for blending fluorescent adhesive for LED - Google Patents
Method for blending fluorescent adhesive for LED Download PDFInfo
- Publication number
- CN103681987A CN103681987A CN201310648618.4A CN201310648618A CN103681987A CN 103681987 A CN103681987 A CN 103681987A CN 201310648618 A CN201310648618 A CN 201310648618A CN 103681987 A CN103681987 A CN 103681987A
- Authority
- CN
- China
- Prior art keywords
- led
- glue
- fluorescent material
- chip
- fluorescent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 12
- 238000002156 mixing Methods 0.000 title abstract description 4
- 239000000853 adhesive Substances 0.000 title abstract 5
- 230000001070 adhesive effect Effects 0.000 title abstract 5
- 229920005989 resin Polymers 0.000 claims abstract description 4
- 239000011347 resin Substances 0.000 claims abstract description 4
- 239000003292 glue Substances 0.000 claims description 28
- 239000000463 material Substances 0.000 claims description 28
- 239000000203 mixture Substances 0.000 claims description 4
- 239000000843 powder Substances 0.000 abstract description 5
- 230000005284 excitation Effects 0.000 abstract 1
- 238000005538 encapsulation Methods 0.000 description 16
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 14
- 239000000741 silica gel Substances 0.000 description 14
- 229910002027 silica gel Inorganic materials 0.000 description 14
- 238000005266 casting Methods 0.000 description 9
- 230000035882 stress Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 3
- 238000000748 compression moulding Methods 0.000 description 3
- 230000004907 flux Effects 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000006798 recombination Effects 0.000 description 3
- 238000005215 recombination Methods 0.000 description 3
- 230000032683 aging Effects 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a method for blending a fluorescent adhesive for an LED. The fluorescent adhesive consists of fluorescent powder and a resin adhesive. The method is characterized in that the weight ratio of the YAG fluorescent powder to the AB adhesive is 1:6-12. The method has the advantages of being scientific and reasonable in design, good in effective excitation reliability, low in cost and the like.
Description
Technical field
The invention belongs to a kind of decorating lighting lamp, relate to a kind of high-power LED light source energy-saving lamp.
Background technology
LED encapsulation is that outer lead is connected on the electrode of LED chip, so that be connected with other devices.It not only will be connected to the electrode on chip on package casing, to realize being connected of chip and external circuit with wire, and chip is fixed and sealed, and to protect chip circuit not to be subject to the erosion of the materials such as water, air, causes electric property to reduce.In addition, encapsulation can also improve the light extraction efficiency of LED chip, and provides convenience for application installation and the transportation of downstream industry.Therefore, encapsulation technology plays an important role to the Performance And Reliability of LED.LED encapsulation technology; fluorescent material and the LED casting glue in LED encapsulation thereof; it is a kind of auxiliary material of LED encapsulation; there is high index of refraction and high transmission rate; can play protection LED chip increases the luminous flux of LED, and viscosity is little, easily deaeration; be applicable to embedding and compression molding, make LED have good durability and reliability.In LED use procedure, the loss that the photon that radiation recombination produces produces when outwards launching.The fluorescent material of each model all needs to arrange in pairs or groups and is applicable to the blue led wafer of fluorescent material, effectively excitated fluorescent powder and mix comparatively suitable white light.
Summary of the invention
Because all needing to arrange in pairs or groups, the fluorescent material of each model is applicable to the blue led wafer of fluorescent material, effectively excitated fluorescent powder and mix comparatively suitable white light.
The object of the invention is, for the deficiencies in the prior art, proposes the concocting method of fluorescent glue for a kind of LED.
The concocting method of fluorescent glue for LED of the present invention, comprises that fluorescent material, resin glue form, and is characterized in that: by weight, and YAG fluorescent material: AB glue=1: 6-12.
LED encapsulation technology; fluorescent material and the LED casting glue in LED encapsulation thereof; it is a kind of auxiliary material of LED encapsulation; there is high index of refraction and high transmission rate; can play protection LED chip increases the luminous flux of LED, and viscosity is little, easily deaeration; be applicable to embedding and compression molding, make LED have good durability and reliability.In LED use procedure, the loss that the photon that radiation recombination produces produces when outwards launching, mainly comprises three aspects: the absorption of chip internal structure defect and material; The reflection loss that photon causes due to refringence at outgoing interface; And because incidence angle is greater than the total reflection loss that the cirtical angle of total reflection causes.Therefore, a lot of light cannot shine outside from chip.By applying the relatively high substratum transparent of one deck refractive index at chip surface---
lED silica gel, because this glue-line is between chip and air, thereby effectively reduced the loss of photon at interface, improved and got optical efficiency.In addition, the effect of casting glue also comprises carries out mechanical protection to chip, Stress Release, and as a kind of guide structure.Therefore, require its light transmittance high, refractive index is high, Heat stability is good, and good fluidity, is easy to spraying.For improving
lED encapsulationreliability, also require casting glue to there is agent of low hygroscopicity, low stress, the characteristic such as ageing-resistant.Conventional casting glue comprises epoxy resin and silica gel at present.Silica gel is high owing to having light transmittance, and refractive index is large, Heat stability is good, and the feature such as stress is little, and moisture absorption is low, is obviously better than epoxy resin, be used widely, but cost is higher in high-power LED encapsulation.Research shows, improves silica gel refractive index and can effectively reduce the photon loss that refractive index physical barriers brings, and improve external quantum efficiency, but silica gel performance is influenced by environmental temperature.Along with temperature raises, the thermal stress of silica gel inside strengthens, and causes the refractive index of silica gel to reduce, thereby affects LED light efficiency and light distribution.
The present invention's beneficial effect compared with prior art: there is design science, reasonable, effectively excite reliability strong, low cost and other advantages.
Embodiment
The concocting method of fluorescent glue for LED of the present invention, comprises that fluorescent material, resin glue form, and is characterized in that: by weight, and YAG fluorescent material: AB glue=1: 6-12.
The YAG fluorescent material of each model all needs to arrange in pairs or groups and is applicable to the blue led wafer of fluorescent material, effectively excitated fluorescent powder and mix comparatively suitable white light.The ratio reference formula (weight ratio) of YAG fluorescent material and AB glue is YAG fluorescent material: AB glue=1: 6-12 formula is explained: when YAG fluorescent material is 1 gram, AB glue is 6 grams～12 grams, as for AB glue, should be how many weight between 6 grams～12 grams, must look the watt level adjustment of blue wafer: the large person of wafer power, under fluorescent material weight immobilizes, AB glue weight should less (example 1: 8); B, the little person of wafer power, AB glue weight should more (example 1: 12).Because YAG fluorescent material is mineral-type fluorescent material, proportion is heavier, therefore easily produces precipitation.Deployed fluorescent glue is finished using in the time limit one hour term of validity.For fluorescent material and AB glue are fully mixed, please slowly stir.While mixing, do not add defoamer, after mixing, do not use the vacuum separation machine bubble of bleeding.LED encapsulation technology; fluorescent material and the LED casting glue in LED encapsulation thereof; it is a kind of auxiliary material of LED encapsulation; there is high index of refraction and high transmission rate; can play protection LED chip increases the luminous flux of LED, and viscosity is little, easily deaeration; be applicable to embedding and compression molding, make LED have good durability and reliability.In LED use procedure, the loss that the photon that radiation recombination produces produces when outwards launching, mainly comprises three aspects: the absorption of chip internal structure defect and material; The reflection loss that photon causes due to refringence at outgoing interface; And because incidence angle is greater than the total reflection loss that the cirtical angle of total reflection causes.Therefore, a lot of light cannot shine outside from chip.By applying the relatively high substratum transparent of one deck refractive index at chip surface---
lED silica gel, because this glue-line is between chip and air, thereby effectively reduced the loss of photon at interface, improved and got optical efficiency.In addition, the effect of casting glue also comprises carries out mechanical protection to chip, Stress Release, and as a kind of guide structure.Therefore, require its light transmittance high, refractive index is high, Heat stability is good, and good fluidity, is easy to spraying.For improving
lED encapsulationreliability, also require casting glue to there is agent of low hygroscopicity, low stress, the characteristic such as ageing-resistant.Conventional casting glue comprises epoxy resin and silica gel at present.Silica gel is high owing to having light transmittance, and refractive index is large, Heat stability is good, and the feature such as stress is little, and moisture absorption is low, is obviously better than epoxy resin, be used widely, but cost is higher in high-power LED encapsulation.Research shows, improves silica gel refractive index and can effectively reduce the photon loss that refractive index physical barriers brings, and improve external quantum efficiency, but silica gel performance is influenced by environmental temperature.Along with temperature raises, the thermal stress of silica gel inside strengthens, and causes the refractive index of silica gel to reduce, thereby affects LED light efficiency and light distribution.
Claims (1)
1. a concocting method for fluorescent glue for LED, comprises fluorescent material, resin glue composition, it is characterized in that: by weight, and YAG fluorescent material: AB glue=1: 6-12.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310648618.4A CN103681987A (en) | 2013-12-04 | 2013-12-04 | Method for blending fluorescent adhesive for LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310648618.4A CN103681987A (en) | 2013-12-04 | 2013-12-04 | Method for blending fluorescent adhesive for LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103681987A true CN103681987A (en) | 2014-03-26 |
Family
ID=50318895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310648618.4A Pending CN103681987A (en) | 2013-12-04 | 2013-12-04 | Method for blending fluorescent adhesive for LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103681987A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030124246A1 (en) * | 2001-12-31 | 2003-07-03 | Solidlite Corporation | White light LED production method |
| CN102637806A (en) * | 2012-04-13 | 2012-08-15 | 厦门多彩光电子科技有限公司 | Dispensing method applicable to flip chip |
| CN104253195A (en) * | 2013-06-27 | 2014-12-31 | 凌敬平 | Method for making white light LED |
-
2013
- 2013-12-04 CN CN201310648618.4A patent/CN103681987A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030124246A1 (en) * | 2001-12-31 | 2003-07-03 | Solidlite Corporation | White light LED production method |
| CN102637806A (en) * | 2012-04-13 | 2012-08-15 | 厦门多彩光电子科技有限公司 | Dispensing method applicable to flip chip |
| CN104253195A (en) * | 2013-06-27 | 2014-12-31 | 凌敬平 | Method for making white light LED |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140326 |
|
| RJ01 | Rejection of invention patent application after publication |