CN103681439B - There is the bonding semiconductor equipment and the method for packing thereof that improve fixture - Google Patents
There is the bonding semiconductor equipment and the method for packing thereof that improve fixture Download PDFInfo
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- CN103681439B CN103681439B CN201210321721.3A CN201210321721A CN103681439B CN 103681439 B CN103681439 B CN 103681439B CN 201210321721 A CN201210321721 A CN 201210321721A CN 103681439 B CN103681439 B CN 103681439B
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- metallic rod
- fixture
- paw
- installation portion
- base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
The invention provides a kind of have the bonding semiconductor equipment and the method for packing thereof that improve fixture, wherein this fixture comprises pedestal and is installed on the paw on pedestal, wherein said paw comprises some hinges that paw is fixed on to the fixed part on pedestal, some metallic rod and some metallic rod are connected one by one, in described some metallic rod, one of them is immobilizated on described fixed part, regulates position and the height of the adjustable paw of described hinge. Paw structure of the present invention is less, can reduce the puzzlement of bonding winding displacement. Meanwhile, use the design of adjustable-height, direction, can extend the service life of a set of paw, reduce costs.
Description
[technical field]
The invention relates to semiconductor packages field, particularly about the improvement of the encapsulation fixture of power model andIts method.
[background technology]
(IntelligentPowerModule is called for short IPM to SPM in semi-conductor discrete deviceModule), not only device for power switching and drive circuit are integrated. But also in keep overvoltage, mistakeElectric current and the failure detector circuit such as overheated, and detection signal can be delivered to CPU. It is by the tube core of high-speed low-power-consumptionForm with the gate drive circuit of optimizing and fast protection circuit. Even if there is load accident situation or improper use,Also can ensure that IPM self is not damaged. IPM is with its high reliability, easy to usely wins increasing city, be particularly suitable for frequency converter and the various inverter of drive motors, be frequency control, metallurgical machinery,Electric propulsion, servo-drive, a kind of ideal power electronic devices of frequency-conversion domestic electric appliances.
The packaging technology of IPM module is generally by multiple different chip module bondings by chip bonding processOn framework, and be connected with aluminum wire bonding and realize product circuit function by gold thread respectively, finally pass through plastic packagingWith cut muscle and the pin product that has been shaped.
, in the time that multiple different chip modules are bonded on framework, be wherein by a kind of clamp clamps chipAnd framework, by heating mode by chip bonding to framework. Chinese patent application the 201020598831.0thNumber disclosed so a kind of fixture, as shown in Figure 1, early stage fixture conventionally only includes briquetting 100 and addsHot piece 200 two parts, only depend on the clamping effect of briquetting 100 and heat block 200 cannot make framework slide holder 300Be close on heat block 200, as shown in Figure 2, Chinese patent application proposes one No. 201020598831.0Plant the fixture with elasticity paw 400, by increasing movable paw 400, framework slide holder 300 is compressedOn heat block 200 surfaces.
IPM module also needs to realize by Bonding the electricity of product after chip module is bonded on frameworkRoad function, but existing this fixture, the volume of paw is larger, takies bonding region many, draws to bondingThe more puzzlement of line precocity, same wire diameter, due to the spatial limitation of fixture, cannot be complete on a soldering tip stationBecome bonding. Existing product needed completes leaded bonding with two soldering tips.
In addition, although existing this paw can height up and down, paw can not left and right adjusting, andAnd necessary integral replacing after paw wearing and tearing, cost is higher.
Therefore, be necessary the fixture of existing IPM module package to improve, to overcome prior artAforementioned disadvantages.
[summary of the invention]
The object of the present invention is to provide a kind of semiconductor packages fixture.
Another object of the present invention is to provide a kind of semiconductor packages key that improves semiconductor packages fixture that hasClose equipment.
A further object of the present invention is to provide a kind of semiconductor packages that adopts improved semiconductor packages fixtureMethod.
For reaching aforementioned object, a kind of semiconductor packages fixture of the present invention, it comprises pedestal and is fixed on basePaw on seat, wherein said paw comprise by paw be fixed on the fixed part on pedestal, some metallic rod withAnd some hinges that some metallic rod are connected one by one, described in described some metallic rod, one of them is immobilizated inOn fixed part, regulate position and the height of the adjustable paw of described hinge.
According to one embodiment of present invention, described metallic rod than described hinge many.
According to one embodiment of present invention, described hinge is spherical, and it comprises the hemispherical metallic rod of epimereThe hemispherical metallic rod installation portion of the patty connecting portion in installation portion, stage casing and hypomere.
According to one embodiment of present invention, in the hemispherical metallic rod installation portion of described upper and lower section, be equipped withRun through the accepting hole of whole hemispherical metallic rod installation portion from spherical top.
According to one embodiment of present invention, described patty connecting portion is provided with and runs through whole patty connecting portionAnd the axle extending up and down respectively, the two ends up and down of described axle are contained in respectively the hemisphere of described upper and lower sectionIn the accepting hole of shape metallic rod installation portion, the hemispherical metallic rod installation portion of described upper and lower section all can cakeThe axle of shape connecting portion carries out clockwise or is rotated counterclockwise.
According to one embodiment of present invention, the two ends of described axle are respectively equipped with a holding apparatus, when regulatingWhen the hemispherical metallic rod installation portion of upper and lower section and the position relationship of patty connecting portion, can establish by fixingFor the hemispherical metallic rod installation portion of upper and lower section and patty connecting portion are fixed together.
According to one embodiment of present invention, described hemispherical metallic rod installation portion is provided with one perpendicular to instituteState the support slot of accepting hole, described metallic rod is fastened in described support slot and is fixed on described hemispherical metalOn bar installation portion.
According to one embodiment of present invention, the cross section of described support slot is circular, square or triangle, instituteState the cross section of metallic rod corresponding be also circular, square or triangle.
For reaching aforementioned another object, a kind of semiconductor chip bonding apparatus of the present invention, it comprises aforementionedly partly leadsBody encapsulation fixture and base, described fixture is positioned at the top of base, and described base comprises substrate and base plate; EnvelopeWhen dress bonding, chip module is placed on the base plate of base, described paw is pressed on the upper table of chip moduleFace is fixed on chip module at described the end.
For reaching an aforementioned object again, a kind of method for packaging semiconductor of the present invention, it comprises:
By chip bonding process, multiple different chip modules are bonded on framework, incite somebody to action by bonding apparatusChip module is bonded on framework, and described bonding apparatus comprises aforesaid semiconductor encapsulation fixture and base, described inFixture is positioned at the top of base, and described base comprises substrate and base plate, when encapsulation bonding, chip module is pacifiedBe placed on the base plate of described base, chip module is fixed on institute by the upper surface that described paw is pushed down chip moduleState on base;
By gold thread or aluminum wire bonding, the circuit tie point in chip module is connected mutually, realize productCircuit function;
By plastic packaging with cut muscle and the pin product that has been shaped.
Compared with prior art, because paw of the present invention is made up of hinged metallic rod, its areaLess, can reduce the puzzlement of bonding wire. Meanwhile, use the design of adjustable-height, direction, when respectivelyWhen paw uses appearance highly inconsistent for a long time, can go wrong by adjusting paw height comeAdjust the coplane degree of whole paw, can extend the service life of a set of paw, and in the time that wearing and tearing appear in paw,The metallic rod that only needs to change wearing and tearing, can effectively reduce costs.
[brief description of the drawings]
Fig. 1 is the structural representation of existing fixture.
Fig. 2 is the structural representation of existing another kind of fixture.
Fig. 3 is the flow chart of semiconductor die package technique of the present invention.
Fig. 4 is the structural representation of semiconductor die package equipment of the present invention.
Fig. 5 is the structural representation of the fixture of semiconductor die package equipment of the present invention
Fig. 6 a is the structural representation of the hinge of the fixture of semiconductor die package equipment of the present invention.
Fig. 6 b is a metal of first half plant of the hinge of the fixture of semiconductor die package equipment of the present inventionDecomposed structural representation after bar rotation.
Fig. 7 a is the front view of the metallic rod installation portion of the hinge of fixture of the present invention.
Fig. 7 b is the metallic rod installation portion of hinge and the top view of a metallic rod of fixture of the present invention.
Fig. 8 a is the front view of the patty connecting portion of the hinge of fixture of the present invention.
Fig. 8 b is the top view of the patty connecting portion of the hinge of fixture of the present invention.
Fig. 9 a and Fig. 9 b are the rotatable schematic diagrames of metallic rod installation portion of fixture of the present invention.
[detailed description of the invention]
Alleged " embodiment " or " embodiment " refer to and can be contained at least one reality of the present invention hereinSpecial characteristic, structure or characteristic in existing mode. Different local in this manual occur " a realityExecute in example " not all refer to same embodiment, neither be independent or optionally mutual with other embodimentThe embodiment repelling.
The packaged type of semiconductor chip, different according to the structure of its chip and requirement, can have variousPackaged type. Wherein there is a kind of chip, the integrated many logics of inner meeting, control, detection and holding circuitEtc. independent functional circuit, these independent functional circuits itself form a chip that piece is little, by theseLittle integrated chip is encapsulated and can one of formation can realizes the more chip of Premium Features. For example semiconductor dividesSPM (IntelligentPowerModule is called for short IPM module) in vertical device, not onlyDevice for power switching and drive circuit are integrated. But also in keep overvoltage, overcurrent and overheatedDeng failure detector circuit etc. The packaging technology of this class chip is generally by multiple differences by chip bonding processChip module (aforementioned) be bonded on framework, and be connected with aluminum wire bonding by gold thread respectively realize produceProduct circuit function, finally by plastic packaging with cut muscle and the pin product that has been shaped.
Below only as an example of IPM chip example, the encapsulation to this chip describes, but packaging technology of the present inventionNot be defined in IPM chip, can be applied to and there is similar structures and need to adopt other of same sealed in unitChip.
Refer to shown in Fig. 3, chip packaging method of the present invention comprises:
Step S1: multiple different chip modules are bonded on framework by chip bonding process. Wherein existWhen being bonded on framework, chip module can adopt a kind of clamping device to clamp chip module and framework, thenBy heating or other modes, chip module is bonded on framework.
Step S2: by gold thread or aluminum wire bonding, the circuit tie point in chip module is connected mutually respectivelyConnect, realize the circuit function of product. About concrete technology and the equipment of Bonding, can adopt existingLead key closing process, the present invention no longer specifically describes in detail.
Step S3: by plastic packaging with cut muscle and the pin product that has been shaped. About plastic packaging, cut muscle and pipeConcrete technology and equipment that pin is shaped, can adopt existing technology and equipment, and therefore the present invention also no longerConcrete detailed description in detail.
Refer to shown in Fig. 4, it shows the knot of the bonding apparatus using in chip package process of the present inventionStructure schematic diagram. As shown in Figure 4, semiconductor packages bonding apparatus 10 of the present invention, basic structure comprisesThe fixture 1 of top and the base 2 of below, wherein fixture 1 comprises pedestal 11 and is fixed on pedestal 11Paw 12, base 2 comprises substrate 21 and base plate 22, described chip module 3 comprises wafer 31 and substrate 32.In encapsulation bonding process, chip module 3 is placed on the base plate 22 of base 2, and paw 12 is pushed down chipThe upper surface of module 3, makes the wafer 31 and substrate 32 close contacts of chip module 3, adds by base 2Heat is bonded to the wafer of chip module 31 on substrate 32.
Refer to shown in Fig. 5, it shows the overlooking of fixture 1 of semiconductor packages bonding apparatus 10 of the present inventionFigure, as shown in Figure 5, the fixture 1 of semiconductor packages bonding apparatus 10 of the present invention comprises pedestal 11 and solidPaw 12 on pedestal 11, described pedestal 11 is rectangle shaped as frame, its two of left and right frame is fixing respectivelyMultiple paws 12.
Shown in Fig. 4 and Fig. 5, the paw 12 of semiconductor packages fixture 1 of the present invention comprises pressurePawl body 120 and paw body 120 is fixed on to the fixed part 123 on paw pedestal 11, wherein saidPaw body 120 comprises some cylindrical metal bars 121 and by some cylindrical metal bars 121 phase one by oneThe some hinges 122 that connect, one of them metallic rod 121 of paw 12 is immobilizated on described fixed part 123.Wherein the length of metallic rod 121 and quantity can arrange according to the chip for package of reality, differenceThe chip length of metallic rod 121 and the quantity that need may be different, the quantity of described hinge 122 compares metalFew 1 of the quantity of bar 121. And the hinge 122 of connection metal bar 121 was movable before unfixing,Can adjust in advance the position of metallic rod 121, in the time that the position of metallic rod 121 reaches pre-provisioning request position againFix hinge 122, so just can adjust in advance position and the height of whole paw 12.
Refer to shown in Fig. 6 a, in one embodiment of the invention, described hinge 122 is spherical linkage.As shown in Figure 6, of being made up of three sections of upper, middle and lowers of described spherical linkage 122 is spherical, and it comprisesHemispherical metallic rod installation portion 1221, the patty connecting portion 1224 in stage casing and the hemispherical gold of hypomere of sectionBelong to bar installation portion 1221. In the hemispherical metallic rod installation portion 1221 of described upper and lower section, be equipped with from domeThe accepting hole 1222 of whole hemispherical metallic rod installation portion 1221 is run through in portion, described patty connecting portion 1224Be provided with the axle 1225 that runs through whole patty connecting portion 1224 and extend up and down respectively, described axle 1225Two ends be up and down fastened in respectively the accepting hole 1222 of the hemispherical metallic rod installation portion 1221 of described upper and lower sectionIn, between described axle 1225 and described accepting hole 1222, there is frictional force. The hemispherical of described upper and lower sectionMetallic rod installation portion 1221 all can patty connecting portion 1224 axle 1225 carry out entering clockwise or counterclockwiseRow rotation. The two ends of described axle 1225 are respectively equipped with a holding apparatus (not shown), upper and lower when regulatingWhen the hemispherical metallic rod installation portion 1221 of section and the position relationship of patty connecting portion 1224, can be by solidHolding equipment is fixed on one by the hemispherical metallic rod installation portion of upper and lower section 1221 and patty connecting portion 1224Rise.
Refer to shown in Fig. 7 a and Fig. 7 b, it shows the spherical linkage of semiconductor encapsulation device of the present inventionHemispherical metallic rod installation portion 1221 structural representations of epimere and hypomere. Because whole spherical linkage 122The structure of the hemispherical metallic rod installation portion of epimere and hypomere is identical, only one of them metallic rod is installed hereinPortion 1221 describes. Wherein Fig. 7 a is the front view of hemispherical metallic rod installation portion 1221, and Fig. 7 b isThe top view of hemispherical metallic rod installation portion 1221, as shown in Fig. 7 a and Fig. 7 b, spherical linkage of the present invention122 metallic rod installation portion 1221 is a spherical level 2/3rds rear remaining hemisphericals of pruning, closeHemispherical bottom edge forms a support slot 1223 perpendicular to described accepting hole 1222, described support slot1223 cross section is circular. Described metallic rod 121 is fastened in described support slot 1223, described metallic rod121 cross section is also circular, and the cross section of described metallic rod 121 is slightly larger than the cross section of support slot 1223,Therefore described metallic rod 121 is fixed on described hemispherical metallic rod installation portion 1221. In other embodiments,The cross section of described support slot 1223 can be also square, triangle or other shapes, corresponding metallic rodCross section can be also square, triangle or other shapes, being advisable by fixing metal bar 121. Fig. 7 a and figureShown in 7b pass through support slot 1223 fixing metal bars 121 be of the present invention one of them specifically implementExample, also can be fixed on metallic rod 121 by welding or the scheme such as one-body molded in other embodimentsOn hemispherical metallic rod installation portion 1221.
Refer to shown in Fig. 8 a and Fig. 8 b, it shows the spherical linkage 122 of semiconductor encapsulation device of the present inventionThe structural representation of stage casing patty connecting portion 1224, wherein Fig. 8 a is the master of patty connecting portion 1224View, Fig. 8 b is the top view of patty connecting portion 1224. As shown in Fig. 8 a and Fig. 8 b, of the present inventionPatty connecting portion 1224 be remaining after spherical epimere 1/3rd and a hypomere 1/3rd of pruning inBetween part, wherein the circular central of patty connecting portion 1224 extend to form upwards, downwards respectively one straightFootpath is slightly less than the axle 1225 of the accepting hole 1222 of hemispherical metallic rod fixed part.
Refer to shown in Fig. 9 a and Fig. 9 b, not with holding apparatus by the metallic rod installation portion 1221 of upper-lower sectionWhile fixing with the patty connecting portion 1224 in stage casing, the metallic rod installation portion 1221 of upper-lower section is can be around connectingConnect that the axle 1225 of portion 1224 is rotated, can adjust the position of metallic rod 121 by such rotation,After having adjusted, again the metallic rod installation portion 1221 of upper-lower section is connected with the patty in stage casing by holding apparatusPortion 1224 is fixing. Like this by adjust position that the position of metallic rod 121 is the whole paw 12 of capable of regulating andHighly.
Shown in Fig. 4, by chip bonding process, multiple different chip modules are bonded on frameworkStep in, be to adopt clamping device of the present invention to clamp chip module 3 and framework 4, and folder of the present inventionThe metallic rod 121 that the paw 12 of tool 2 is connected by multiple spherical linkages 122 forms. Cut with scissors by rotary sphericalThe metallic rod installation portion 1221 of chain 122, the position of adjustment metallic rod 121, can adjust encapsulation fixture in advanceThe position of paw 12, make paw 12 can closely push down wafer and the substrate of chip module. And ifThere are wearing and tearing in long-time paw, only need to change one of them metallic rod, can save cost.
Be more than a specific embodiment of the present invention, the shape of described hinge also can in other embodimentsTo be not spherical but other any type of hinges, as long as technical scheme of the present invention is connected through the hingeThe mode of several metallic rod forms paw, and hinge is movable adjustable, like this position of metallic rod withAdjustable highly in advance.
Paw of the present invention is made up of hinged metallic rod, and its area is less, can reduce bonding and drawThe puzzlement of line. Meanwhile, use the design of adjustable-height, direction, when each paw uses appearance high for a long timeSpend when inconsistent, can go wrong by adjusting the height of paw adjust the coplane degree of whole paw,Can extend the service life of a set of paw, and in the time that wearing and tearing appear in paw, only need to change the metal of wearing and tearingBar, can effectively reduce costs.
Above-mentioned explanation has fully disclosed the specific embodiment of the present invention. It is pointed out that and be familiar with being somebody's turn to doAny change that the technical staff in field does the specific embodiment of the present invention does not all depart from power of the present inventionThe scope of profit claim. Correspondingly, the scope of claim of the present invention is also not limited only to aforementioned toolBody embodiment.
Claims (9)
1. a semiconductor packages fixture, is characterized in that: described fixture comprises pedestal and is fixed on pedestalOn paw, if described paw comprises, paw is fixed on to the fixed part on pedestal, some metallic rod and willSome hinges that dry metallic rod is connected one by one, in described some metallic rod, one of them is immobilizated in described fixed partUpper, regulate position and the height of the adjustable paw of described hinge, described hinge is spherical, it comprises epimereThe hemispherical metallic rod installation portion of the patty connecting portion in hemispherical metallic rod installation portion, stage casing and hypomere.
2. semiconductor packages fixture as claimed in claim 1, is characterized in that: described in described metallic rod ratioMany one of hinge.
3. semiconductor packages fixture as claimed in claim 1, is characterized in that: described upper and lower section halfIn spherical metal bar installation portion, be equipped with from spherical top and run through accommodating of whole hemispherical metallic rod installation portionHole.
4. semiconductor packages fixture as claimed in claim 3, is characterized in that: described patty connecting portionBe provided with the axle that runs through whole patty connecting portion and extend up and down respectively, the two ends up and down of described axle respectivelyBe contained in the accepting hole of hemispherical metallic rod installation portion of described upper and lower section the hemisphere of described upper and lower sectionShape metallic rod installation portion all can patty connecting portion axle carry out clockwise or be rotated counterclockwise.
5. semiconductor packages fixture as claimed in claim 4, is characterized in that: the two ends of described axle respectivelyBe provided with a holding apparatus, when regulating the hemispherical metallic rod installation portion of upper and lower section and patty connecting portionWhen position relationship, can the hemispherical metallic rod installation portion of upper and lower section be connected with patty by holding apparatusPortion is fixed together.
6. semiconductor packages fixture as claimed in claim 5, is characterized in that: described hemispherical metallic rodInstallation portion is provided with a support slot perpendicular to described accepting hole, and described metallic rod is fastened in described support slotIn and be fixed on described hemispherical metallic rod installation portion.
7. semiconductor packages fixture as claimed in claim 6, is characterized in that: the cross section of described support slotFor circular, square or triangle, what the cross section of described metallic rod was corresponding is also circular, square or triangle.
8. a semiconductor chip bonding apparatus, is characterized in that, it comprises as any in claim 1-7Semiconductor packages fixture and base described in one, described fixture is positioned at the top of base, and described base comprisesSubstrate and base plate; When encapsulation bonding, chip module is placed on the base plate of base, described paw is pressed onThe upper surface of chip module is fixed on chip module on described base plate.
9. a method for packaging semiconductor, it comprises:
By chip bonding process, multiple different chip modules are bonded on framework, incite somebody to action by bonding apparatusChip module is bonded on framework, and described bonding apparatus comprises as described in any one in claim 1-7Semiconductor packages fixture and base, described fixture is positioned at the top of base, and described base comprises substrate and base plate,Encapsulation when bonding, is placed in chip module on the base plate of described base, and described paw is pushed down chip moduleUpper surface is fixed on chip module on described base;
By gold thread or aluminum wire bonding, the circuit tie point in chip module is connected mutually, realize productCircuit function;
By plastic packaging with cut muscle and the pin product that has been shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210321721.3A CN103681439B (en) | 2012-09-04 | 2012-09-04 | There is the bonding semiconductor equipment and the method for packing thereof that improve fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210321721.3A CN103681439B (en) | 2012-09-04 | 2012-09-04 | There is the bonding semiconductor equipment and the method for packing thereof that improve fixture |
Publications (2)
| Publication Number | Publication Date |
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| CN103681439A CN103681439A (en) | 2014-03-26 |
| CN103681439B true CN103681439B (en) | 2016-06-15 |
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| CN201210321721.3A Active CN103681439B (en) | 2012-09-04 | 2012-09-04 | There is the bonding semiconductor equipment and the method for packing thereof that improve fixture |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107301958A (en) * | 2017-06-07 | 2017-10-27 | 杭州暖芯迦电子科技有限公司 | A kind of wire bonding apparatus and bonding method of implanted microelectronic product |
| CN109390249A (en) * | 2017-08-10 | 2019-02-26 | 上海微电子装备（集团）股份有限公司 | Semiconductor manufacturing apparatus |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101084471A (en) * | 2004-12-23 | 2007-12-05 | Asml荷兰有限公司 | Support structure and lithographic apparatus |
| WO2009154578A1 (en) * | 2008-06-18 | 2009-12-23 | Manufacturing Integration Technology Ltd | Adaptive clamp width adjusting device |
| CN201859856U (en) * | 2010-11-10 | 2011-06-08 | 南通富士通微电子股份有限公司 | Bonding press block device |
-
2012
- 2012-09-04 CN CN201210321721.3A patent/CN103681439B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101084471A (en) * | 2004-12-23 | 2007-12-05 | Asml荷兰有限公司 | Support structure and lithographic apparatus |
| WO2009154578A1 (en) * | 2008-06-18 | 2009-12-23 | Manufacturing Integration Technology Ltd | Adaptive clamp width adjusting device |
| CN201859856U (en) * | 2010-11-10 | 2011-06-08 | 南通富士通微电子股份有限公司 | Bonding press block device |
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| CN103681439A (en) | 2014-03-26 |
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