CN105990323B - A kind of semiconductor devices and its method of adjustment - Google Patents
A kind of semiconductor devices and its method of adjustment Download PDFInfo
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- CN105990323B CN105990323B CN201510064066.1A CN201510064066A CN105990323B CN 105990323 B CN105990323 B CN 105990323B CN 201510064066 A CN201510064066 A CN 201510064066A CN 105990323 B CN105990323 B CN 105990323B
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Abstract
The present invention relates to electronic technology fields, and in particular to a kind of semiconductor devices and its method of adjustment.A kind of semiconductor devices, including a packaging body, chip is set in packaging body, coil made of plain conductor coiling is connected on chip between two circuit connecting ends at least one predetermined position, coil generates unit in a packaging body external magnetic field and generates the lower generation induced current of electromagnetic coupling effect in magnetic field, and acts on the connection between the lower circuit connecting end for disconnecting coil both ends in induced current.The present invention facilitates change circuit configuration, and testing efficiency can be improved, reduce testing cost convenient for carrying out circuit performance adjustment during the test.
Description
Technical field
The present invention relates to electronic technology fields, and in particular to a kind of semiconductor devices and its method of adjustment.
Background technique
It is tested after chip package in technical field of semiconductors in order to guarantee that the semiconductor devices of factory meets design requirement
(Final test) is essential step, and the testing requirement according to semiconductor devices carries out a series of test items to ensure
The functional completeness of semiconductor devices；It is frequently necessary to the resistance according to actual test result adjustment circuit, electricity during the test
The connection relationship of the circuit devcies such as appearance, to change the electrical parameter of circuit；However, the encapsulating structure of the prior art is once fixed,
Circuit configuration is not easy to be modified, and when needing to be modified circuit configuration, needs such as to go to decore using complicated technique
Circuit connecting relation is modified with the mode of laser blown after piece encapsulating material, it is time-consuming and laborious and be not easy to implement.Meanwhile
Circuit structure is increasingly complex during existing method of adjustment can not meet semiconductor devices continuous development, and integrated level is higher
Demand for development.
Summary of the invention
The object of the present invention is to provide a kind of semiconductor devices, solve the above technical problem；
The present invention also aims to provide a kind of method of adjustment of semiconductor devices, solve the above technical problem.
Technical problem solved by the invention can be realized using following technical scheme:
A kind of semiconductor devices, wherein including a packaging body, chip is set, on the chip at least in the packaging body
Coil made of plain conductor coiling is connected between two circuit connecting ends in one predetermined position, the coil is in a packaging body
External magnetic filed generation unit generates the lower generation induced current of electromagnetic coupling effect in magnetic field, and under induced current effect
Disconnect the connection between the circuit connecting end at the coil both ends.
Semiconductor devices of the invention, the coil includes first and is connected to second of described first, described
Second diameter is less than described first.
Semiconductor devices of the invention, multiple coils that setting array structure is arranged on the chip are each described
Coil is for connecting two circuit connecting ends.
Semiconductor devices of the invention, the packaging body are described to draw using the encapsulating structure being mainly made of lead frame
The chip is placed on wire frame.
Semiconductor devices of the invention, described second uses metal fuse.
Semiconductor devices of the invention has pressure welding point on the chip, is formed with pin on the lead frame, described
Pressure welding point is connect by binding gold thread with the pin.
Semiconductor devices of the invention, the magnetic filed generation unit is mainly made of the circuit that external coil is constituted, described
External coil is controllably mobile in the upper face of the packaging body.
The present invention also provides a kind of methods of adjustment of semiconductor devices, for during the test to above-mentioned semiconductor device
Part carries out circuit performance adjustment, comprising the following steps:
Step 1, packaging body surface location corresponding to the coil between two circuit connecting ends to be adjusted is positioned；
Step 2, it controls the magnetic filed generation unit and generates induced magnetic field at the packaging body surface location；
Step 3, the coil generates an induced current by electromagnetic coupling, and fuses under the action of the induced current
To disconnect the circuit connection between two circuit connecting ends to be adjusted.
The method of adjustment of semiconductor devices of the invention, the magnetic filed generation unit includes external coil, by described
The electric current of predefined size is passed in external coil to generate the induced magnetic field.
The utility model has the advantages that due to using the technology described above, the present invention is convenient for carrying out circuit performance adjustment during the test,
Facilitate change circuit configuration, and testing efficiency can be improved, reduce testing cost.
Detailed description of the invention
Fig. 1 is the package structure diagram of semiconductor devices of the invention；
Fig. 2 is coil enlarged drawing of the invention；
Fig. 3 is the perspective view of semiconductor devices of the invention；
Fig. 4 is that implementation of the invention adjusts system schematic.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, those of ordinary skill in the art without creative labor it is obtained it is all its
His embodiment, shall fall within the protection scope of the present invention.
It should be noted that in the absence of conflict, the feature in embodiment and embodiment in the present invention can phase
Mutually combination.
The present invention will be further explained below with reference to the attached drawings and specific examples, but not as the limitation of the invention.
Referring to Fig.1, Fig. 2, Fig. 3, Fig. 4, a kind of semiconductor devices, wherein including a packaging body 1, core is set in packaging body 1
Piece 3 connects coil 4 made of plain conductor coiling, line on chip 3 between two circuit connecting ends at least one predetermined position
Magnetic filed generation unit 8 of the circle 4 outside a packaging body 1 generates the lower generation induced current of electromagnetic coupling effect in magnetic field, and in sense
Answer the connection between the circuit connecting end for disconnecting 4 both ends of coil under the function of current.
Coil 4 is arranged in present invention predetermined position on chip 3, and coil 4 can be acted on by the electromagnetic coupling in external magnetic field
Lower disconnection realizes circuit performance adjustment to change circuit configuration, is conducive to improve testing efficiency, reduces testing cost.
Semiconductor devices of the invention, referring to Fig. 2, coil 4 includes first 41 and is connected to second of first 41
42, second 42 diameter is less than first 41.First 41 and second 42 can be formed using same metal material coiling,
Use thinner plain conductor for second 42, it is preferred to use dedicated metal fuse or other skilled in the art are easy to select
Fuse.
Semiconductor devices of the invention, referring to Fig. 3, multiple coils 4 that setting array structure is arranged on chip 3, each line
Circle 4 is for connecting two circuit connecting ends.It can make a reservation for need to set between the circuit connecting end adjusted on chip 3 according to needs
Coil 4 is set, coil can be arranged at equal intervals in matrix form, be positioned convenient for packaging body outer surface to it.
Semiconductor devices of the invention, as shown in Figure 1, packaging body 1 can be using the encapsulation being mainly made of lead frame
Structure, chip placement 3 on lead frame.Semiconductor devices of the invention has pressure welding point on chip 3, is formed on lead frame
There is pin 7, pressure welding point is connect by binding gold thread 5 with pin.Chip 3 is fixed on the base of lead frame by adhesive film layer 6
On seat 2, packaging body 1 of the invention is not limited to above-mentioned packaging mechanism.
Semiconductor devices of the invention, magnetic filed generation unit 8 are mainly made of the circuit that external coil is constituted, external coil
It is controllably mobile in the upper face of packaging body 1, the electric current of predefined size is passed to generate induced magnetic field.
The present invention also provides a kind of methods of adjustment of semiconductor devices, for during the test to above-mentioned semiconductor device
Part carries out circuit performance adjustment, comprising the following steps:
Step 1, packaging body surface location corresponding to the coil 4 between two circuit connecting ends to be adjusted is positioned；
Step 2, control magnetic filed generation unit 8 generates induced magnetic field at 1 surface location of packaging body；
Step 3, coil 4 generates an induced current by electromagnetic coupling, and fuses under the action of induced current to disconnect
Circuit connection between two circuit connecting ends to be adjusted.
The method of adjustment of semiconductor devices of the invention, magnetic filed generation unit includes external coil 4, by external coil
The electric current of predefined size is passed in 4 to generate induced magnetic field.
Traditional testing and debugging process requirement opens encapsulating structure with the connection of break line, not only complicated for operation, test
Inefficiency, and chip can be injured, expendable destruction is caused, the present invention needs after chip package is good further according to test
It asks and is adjusted, as long as finding the position for needing to adjust accurately, external coil is directed at Inside coil, energy is provided by electromagnetic coupling,
Both it can make fuse failure.Convenient for carrying out circuit performance adjustment during the test, facilitate change circuit configuration, and can mention
High testing efficiency reduces testing cost.
The foregoing is merely preferred embodiments of the present invention, are not intended to limit embodiments of the present invention and protection model
It encloses, to those skilled in the art, should can appreciate that all with made by description of the invention and diagramatic content
Equivalent replacement and obviously change obtained scheme, should all be included within the scope of the present invention.
Claims (9)
1. a kind of semiconductor devices, which is characterized in that including a packaging body, be arranged chip in the packaging body, on the chip
Coil made of plain conductor coiling is connected between two circuit connecting ends at least one predetermined position, the coil is in an envelope
It fills the magnetic filed generation unit outside body and generates the lower generation induced current of electromagnetic coupling effect in magnetic field, and make in the induced current
With the connection between the lower circuit connecting end for disconnecting the coil both ends.
2. semiconductor devices according to claim 1, which is characterized in that the coil includes first and is connected to described
Second of first, second diameter are less than described first.
3. semiconductor devices according to claim 1, which is characterized in that the more of array structure arrangement are arranged on the chip
A coil, each coil is for connecting two circuit connecting ends.
4. semiconductor devices according to claim 1, which is characterized in that the packaging body is using mainly by lead frame framework
At encapsulating structure, place the chip on the lead frame.
5. semiconductor devices according to claim 2, which is characterized in that described second uses metal fuse.
6. semiconductor devices according to claim 4, which is characterized in that have pressure welding point, the lead on the chip
Pin is formed on frame, the pressure welding point is connect by binding gold thread with the pin.
7. semiconductor devices according to claim 1, which is characterized in that the magnetic filed generation unit is mainly by external coil
The circuit of composition forms, and the external coil is controllably mobile in the upper face of the packaging body.
8. a kind of method of adjustment of semiconductor devices, which is characterized in that for any to claim 1 to 7 during the test
Semiconductor devices described in one carries out circuit performance adjustment, comprising the following steps:
Step 1, packaging body surface location corresponding to the coil between two circuit connecting ends to be adjusted is positioned；
Step 2, it controls the magnetic filed generation unit and generates induced magnetic field at the packaging body surface location；
Step 3, the coil generates an induced current by electromagnetic coupling, and fuses under the action of the induced current with disconnected
Open the circuit connection between two circuit connecting ends to be adjusted.
9. the method for adjustment of semiconductor devices according to claim 8, which is characterized in that the magnetic filed generation unit includes
External coil, by passing to the electric current of predefined size in the external coil to generate the induced magnetic field.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510064066.1A CN105990323B (en) | 2015-02-06 | 2015-02-06 | A kind of semiconductor devices and its method of adjustment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510064066.1A CN105990323B (en) | 2015-02-06 | 2015-02-06 | A kind of semiconductor devices and its method of adjustment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105990323A CN105990323A (en) | 2016-10-05 |
| CN105990323B true CN105990323B (en) | 2019-01-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510064066.1A Active CN105990323B (en) | 2015-02-06 | 2015-02-06 | A kind of semiconductor devices and its method of adjustment |
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Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04184834A (en) * | 1990-11-16 | 1992-07-01 | Omron Corp | Switch |
| JP3781610B2 (en) * | 2000-06-28 | 2006-05-31 | 株式会社東芝 | Semiconductor device |
| JP4929857B2 (en) * | 2006-06-12 | 2012-05-09 | 株式会社日立製作所 | Semiconductor device |
| US8569861B2 (en) * | 2010-12-22 | 2013-10-29 | Analog Devices, Inc. | Vertically integrated systems |
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| CN105990323A (en) | 2016-10-05 |
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