CN201859856U - Bonding press block device - Google Patents
Bonding press block device Download PDFInfo
- Publication number
- CN201859856U CN201859856U CN2010205988310U CN201020598831U CN201859856U CN 201859856 U CN201859856 U CN 201859856U CN 2010205988310 U CN2010205988310 U CN 2010205988310U CN 201020598831 U CN201020598831 U CN 201020598831U CN 201859856 U CN201859856 U CN 201859856U
- Authority
- CN
- China
- Prior art keywords
- piston
- briquetting
- bonding
- spring
- press block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
The utility model relates to a bonding press block device, which comprises a press block, a movable press claw, a piston and a spring. The top end of the movable press claw is in a hook shape, and the middle of the movable press claw is provided with a joint. A piston cylinder body is arranged in the press block and matched with the piston mutually. The upper end of the piston is connected with the spring, and the other end of the spring is connected to the tail end of the movable press claw. The joint of the movable press claw is fixed at the front end of the press block. By the aid of the bonding press block device, the best vacuum absorption effect of a vacuum hole of a heating block can be realized, and accordingly the purpose of locking a frame is achieved.
Description
Technical field
The utility model relates to a kind of semiconductor packages bonding anchor clamps, particularly relates to the briquetting device in a kind of semiconductor packages bonding anchor clamps.
Background technology
Need to use the bonding grip device in the semiconductor packages bonding technology, traditional bonding grip device structure is comparatively simple, as shown in Figure 1, only comprises briquetting 1 and heat block 2 two parts.During work, briquetting 1 relies on the briquetting 1 and the platform of the clamping effect locking lead frame of heat block 2 to prop up part 5 to pressing down, and makes lead frame slide holder 4 press close to heat block; Heat block 2 is realized lead frame slide holder 4 is fixed on the heat block by the vacuum suction effect of vacuum hole 3, prevents that displacement from appearring in lead frame slide holder 4 in bonding process.But in the actual job process, there is certain deviation in lead frame structure itself.If when deviation is big, only rely on the clamping effect of briquetting 1 and heat block 2 that lead frame slide holder 4 is close on the heat block 2, cause 2 of lead frame slide holder 4 and heat blocks space 6 to occur; At this moment the vacuum suction effect of vacuum hole 3 reduces greatly, does not reach the purpose of latch frame, and then has influence on the bonding technology effect.
Summary of the invention
Technical problem to be solved in the utility model provides a kind of bonding briquetting device, makes the vacuum suction effect performance maximal efficiency of heat block vacuum hole, and then reaches the purpose of latch frame.
The technical scheme that its technical problem that solves the utility model adopts is: a kind of bonding briquetting device is provided, comprises briquetting, described bonding briquetting device also comprises movable paw, piston and spring; The top of described movable paw is that hook-shaped, centre is provided with the joint; Be provided with piston/cylinder in the described briquetting; Described piston/cylinder and described piston cooperatively interact; The upper end of described piston is connected with described spring; The other end of described spring links to each other with the end of described movable paw; The arthrodesis of described movable paw is at the front end of described briquetting.
Described briquetting is being provided with piston/cylinder apart from its front end 1/4th places.
Beneficial effect
Owing to adopted above-mentioned technical scheme, the utility model compared with prior art, have following advantage and good effect: the movable paw of the utility model by increasing, mechanically the framework slide holder is pressed on the heat block surface, thereby avoid occurring the phenomenon of framework " unsettled ", make the vacuum suction effect performance maximal efficiency of heat block vacuum hole, and then reach the purpose of latch frame; Simultaneously, this mechanical part has made full use of the machine power of bonding machine, and the motion generation power by briquetting does not need to increase other power set.
Description of drawings
Fig. 1 is a bonding briquetting device working state schematic representation in the prior art;
Fig. 2 is a structural representation of the present utility model;
Fig. 3 is the utility model working state schematic representation;
Fig. 4 is the utility model reset mode schematic diagram.
Embodiment
Below in conjunction with specific embodiment, further set forth the utility model.Should be understood that these embodiment only to be used to the utility model is described and be not used in the restriction scope of the present utility model.Should be understood that in addition those skilled in the art can make various changes or modifications the utility model after the content of having read the utility model instruction, these equivalent form of values fall within the application's appended claims institute restricted portion equally.
A kind of bonding briquetting device as shown in Figure 2, comprises briquetting 1, movable paw 7, piston 9 and spring 8.The top of described movable paw 7 is that hook-shaped, centre is provided with the joint.Described briquetting 1 is provided with piston/cylinder apart from its front end 1/4th places, and described piston/cylinder and described piston 9 cooperatively interact.The upper end of described piston 9 is connected with described spring 8, and the other end of described spring 8 links to each other with the end of described movable paw 7; The arthrodesis of described movable paw 7 is at the front end of briquetting 1.Its medi-spring 8 can play two effects: 1, and the deviation of framework itself is unfixing, can regulate the height that each movable paw 7 is depressed by spring 8, adapts to the framework of different deviations, makes it to have versatility; 2, it is excessive to avoid movable paw 7 to press down strength, weighs lead frame slide holder part wounded; Or, cause the other parts that briquetting 1 can't the compacting lead frame, thereby cause the generation of other problem because of movable paw 7 too early contact lead-wire framework slide holders.
As shown in Figure 3, when lead frame places on the heat block 2, briquetting 1 is done (promptly to heat block 2 directions) motion downwards, the platform that locks lead frames with heat block 2 props up part 5.Piston 9 stops because of lead frame, stop motion, and briquetting 1 continues to move downward, at this moment piston 9 can move upward by relative briquetting 1, and drive spring 8 moves upward, clockwise rotate around its joint thereby drive paw 7, thereby make the hook-shaped top of paw 7 press to framework slide holder 4, and then realize lead frame slide holder 4 is pressed on the surface of heat block 2.At this moment, vacuum plant acts on lead frame slide holder 4 by vacuum hole 3, thereby realizes the purpose of latch frame.After finishing the bonding operation, as shown in Figure 4, the bonding apparatus vacuum plant quits work, and vacuum hole 3 no longer includes the vacuum suction effect, briquetting 1 is moved upward (promptly deviating from heat block 2), the platform that unclamps lead frame props up part 5 under the action of gravity of piston 9, piston 9 moves downward, and moves downward by band spring 8, drives paw 7 once more and rotates counterclockwise around joint, make the hook-shaped top of paw 7 break away from slide holder 4 surfaces of lead frame, enter next duty cycle.
Be not difficult to find, the movable paw of the utility model by increasing is pressed on the heat block surface with the framework slide holder mechanically, thereby avoids occurring the phenomenon of framework " unsettled ", make the vacuum suction effect performance maximal efficiency of heat block vacuum hole, and then reach the purpose of latch frame; Simultaneously, this mechanical part has made full use of the machine power of bonding machine, and the motion generation power by briquetting does not need to increase other power set.
Claims (2)
1. a bonding briquetting device comprises briquetting (1), it is characterized in that, described bonding briquetting device also comprises movable paw (7), piston (9) and spring (8); The top of described movable paw (7) is that hook-shaped, centre is provided with the joint; Described briquetting is provided with piston/cylinder in (1); Described piston/cylinder and described piston (9) cooperatively interact; The upper end of described piston (9) is connected with described spring (8); The other end of described spring (8) links to each other with the end of described movable paw (7); The arthrodesis of described movable paw (7) is at the front end of described briquetting (1).
2. bonding briquetting device according to claim 1 is characterized in that, described briquetting (1) is being provided with piston/cylinder apart from its front end 1/4th places.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205988310U CN201859856U (en) | 2010-11-10 | 2010-11-10 | Bonding press block device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205988310U CN201859856U (en) | 2010-11-10 | 2010-11-10 | Bonding press block device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201859856U true CN201859856U (en) | 2011-06-08 |
Family
ID=44105657
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205988310U Expired - Lifetime CN201859856U (en) | 2010-11-10 | 2010-11-10 | Bonding press block device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201859856U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102310262A (en) * | 2011-08-23 | 2012-01-11 | 南通富士通微电子股份有限公司 | Heating block device |
| CN103681439A (en) * | 2012-09-04 | 2014-03-26 | 无锡华润安盛科技有限公司 | Semiconductor bonding equipment having improved fixture and packaging method thereof |
| CN108511355A (en) * | 2017-02-24 | 2018-09-07 | 无锡华润安盛科技有限公司 | Encapsulate aluminum wire bonding pressing claw mechanism and encapsulation aluminum wire bonding equipment |
| CN116292685A (en) * | 2023-05-17 | 2023-06-23 | 宁波尚进自动化科技有限公司 | Plane motion braking device and bonding equipment |
-
2010
- 2010-11-10 CN CN2010205988310U patent/CN201859856U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102310262A (en) * | 2011-08-23 | 2012-01-11 | 南通富士通微电子股份有限公司 | Heating block device |
| CN103681439A (en) * | 2012-09-04 | 2014-03-26 | 无锡华润安盛科技有限公司 | Semiconductor bonding equipment having improved fixture and packaging method thereof |
| CN103681439B (en) * | 2012-09-04 | 2016-06-15 | 无锡华润安盛科技有限公司 | There is the bonding semiconductor equipment and the method for packing thereof that improve fixture |
| CN108511355A (en) * | 2017-02-24 | 2018-09-07 | 无锡华润安盛科技有限公司 | Encapsulate aluminum wire bonding pressing claw mechanism and encapsulation aluminum wire bonding equipment |
| CN116292685A (en) * | 2023-05-17 | 2023-06-23 | 宁波尚进自动化科技有限公司 | Plane motion braking device and bonding equipment |
| CN116292685B (en) * | 2023-05-17 | 2023-08-29 | 宁波尚进自动化科技有限公司 | Plane motion braking device and bonding equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205771904U (en) | A kind of packaging bag handgrip | |
| CN201859856U (en) | Bonding press block device | |
| CN204471393U (en) | A kind of multi-purpose robot's grabbing device | |
| CN203780872U (en) | Paper packing device for automatic ceramic tile packing production line | |
| CN206690524U (en) | A kind of packaging mould of lithium ion battery | |
| CN217200563U (en) | Special general purpose anchor clamps of robot | |
| CN203652769U (en) | Adaptive carton gripper for household electrical appliance products | |
| CN204640228U (en) | Packaging bag high speed piling manipulator | |
| CN203232922U (en) | Leveling mechanism for tag of lithium battery | |
| CN107615547A (en) | Battery and riveting press equipment | |
| CN204391071U (en) | Double fastener pawl robot arm device | |
| CN207290092U (en) | A kind of square workpiece fixture | |
| CN203371235U (en) | Automatic charging and discharging transferring device | |
| CN208386320U (en) | A kind of motor fixing device with shock-absorbing function for artificial intelligence robot | |
| CN202585507U (en) | Charging box for automatic silicon-wafer inserting machine with flower basket box | |
| CN201732772U (en) | Heating block device | |
| CN206316721U (en) | Umbrella barrel bolt follows closely press-loading device | |
| CN206155888U (en) | Division sack device of automatic crimper of powder packaging bag | |
| CN205184594U (en) | Small -size domestic sewage treatment equipment goes up casing anchor clamps | |
| CN208263651U (en) | A kind of folder net device of screen-tensioning machine | |
| CN101882590B (en) | Heating block device | |
| CN209189534U (en) | Pressuring flat device is used in a kind of processing of aluminium alloy | |
| CN208528819U (en) | A kind of vertical type fast clamp row folding | |
| CN202895744U (en) | Hydraulic machine travelling table air source automatic docking device | |
| CN205087568U (en) | Modified pocket type tongs |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address |
Address after: Jiangsu province Nantong City Chongchuan road 226001 No. 288 Patentee after: Tongfu Microelectronics Co., Ltd. Address before: 226006 Jiangsu Province, Nantong City Chongchuan District Chongchuan Road No. 288 Patentee before: Fujitsu Microelectronics Co., Ltd., Nantong |
|
| CP03 | Change of name, title or address | ||
| CX01 | Expiry of patent term |
Granted publication date: 20110608 |
|
| CX01 | Expiry of patent term |