CN108511355A - Encapsulate aluminum wire bonding pressing claw mechanism and encapsulation aluminum wire bonding equipment - Google Patents
Encapsulate aluminum wire bonding pressing claw mechanism and encapsulation aluminum wire bonding equipment Download PDFInfo
- Publication number
- CN108511355A CN108511355A CN201710104202.4A CN201710104202A CN108511355A CN 108511355 A CN108511355 A CN 108511355A CN 201710104202 A CN201710104202 A CN 201710104202A CN 108511355 A CN108511355 A CN 108511355A
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- Prior art keywords
- claw
- pressing plate
- workpiece
- wire bonding
- aluminum wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/744—Apparatus for manufacturing strap connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The application provides a kind of encapsulation aluminum wire bonding pressing claw mechanism, including pressing plate and at least two is set to claw on the pressing plate；The pressing plate is equipped with window, and the position that the window is located on the pressing plate corresponds to workpiece to be processed；One end of the claw extends downwards across the window, and when the pressing plate moves down, one end of the claw with the workpiece for crimping.The application provides, and claw is arranged on pressing plate, drives claw to fix workpiece to be processed by pressing plate.The installation accuracy of claw can be improved in pressing plate, and the part that claw crimps workpiece to be processed is made to flush, and then makes claw while crimping workpiece to be processed, and provides uniform fixation pressure for workpiece to be processed.
Description
Technical field
This application involves field of semiconductor package more particularly to a kind of encapsulation aluminum wire bonding pressing claw mechanism and encapsulation aluminum steel keys
Close equipment.
Background technology
In aluminum wire bonding process, aluminum steel is welded to chip surface and lead frame or aluminium base by way of cold ultrasonic bond
Region bonding (Pad) of plate, to form circuit turn-on.To ensure cold ultrasonic bonding quality, lead frame or aluminum substrate must quilts
It is firmly pressed on bonding apparatus cushion block, to ensure that ultrasonic energy can act on aluminum steel and bonding region contact interface completely.It passes
System power device package aluminum wire bonding carrys out anchor leg frame using the mode that discrete claw presses, and claw is mounted on bonding apparatus
On the lifting base of track both sides, when lead frame reaches bond area, lifting base declines, and claw nib contacts lead frame is concurrent
Raw elastic deformation, to firmly be pressed in lead frame on bonding cushion block.
It is designed using existing claw, aluminum substrate pressure can be caused loosely, bonding quality declines；It is empty that claw limits welding head motion
Between, the aluminum steel close to claw position can not be bonded；The pressure connection terminal of claw is tip design, easily weighs aluminum substrate wounded.
Invention content
In view of this, a kind of encapsulation aluminum wire bonding pressing claw mechanism of the application offer and encapsulation aluminum wire bonding equipment.
Specifically, the application is achieved by the following technical solution：
A kind of encapsulation aluminum wire bonding pressing claw mechanism, including pressing plate and at least two are set to claw on the pressing plate；Institute
It states pressing plate and is equipped with window, the position that the window is located on the pressing plate corresponds to workpiece to be processed；It wears one end of the claw
It crosses the window to extend downwards, when the pressing plate moves down, one end of the claw with the workpiece for crimping.
Further, one end that the claw is crimped with the workpiece is plane.
Further, the claw is at Z-type.
Further, the claw position is adjustable is set on the pressing plate.
Further, the claw includes sequentially connected first fixed part, the first extension and the first pressure contact portion；Wherein
First fixed part position is adjustable to be set on the pressing plate, and first extension is set close to the boundary of the window
It sets, first pressure contact portion with the workpiece for crimping.
Further, further include the briquetting being set on the pressing plate, the briquetting position is adjustable to be arranged in the pressure
On plate；When the pressing plate moves down, the briquetting and the claw are respectively used to crimp the different sides of the workpiece.
Further, the end face of the pressing plate and the end face of the claw are crimped with the workpiece respectively, the pressing plate
End face and the end face of the claw are generally aligned in the same plane.
Further, the briquetting is at Z-type；The briquetting include sequentially connected second fixed part, the second extension and
Second pressure contact portion；Wherein second fixed part position is adjustable is set on the pressing plate, and second extension is close to institute
The boundary setting of window is stated, second pressure contact portion with the workpiece for crimping.
Further, the end face that the briquetting is crimped with the workpiece is bar shaped.
The application also provides a kind of encapsulation aluminum wire bonding equipment, including above-mentioned encapsulation aluminum wire bonding pressing claw mechanism, and
Pedestal for driving the encapsulation aluminum wire bonding pressing claw mechanism to lift.
Claw is arranged on pressing plate encapsulation aluminum wire bonding pressing claw mechanism provided by the present application, drives claw to consolidate by pressing plate
Fixed workpiece to be processed.The installation accuracy of claw can be improved in pressing plate, so that the part that claw crimps workpiece to be processed is flushed, in turn
Make claw while crimping workpiece to be processed.
For claw at Z-type, claw includes sequentially connected first fixed part, the first extension and the first pressure contact portion, middle part
Divide the first pressure contact portion for crimping workpiece, the first fixed part is fixed on pressing plate, and the first extension is close to pressing plate setting, releases
The working space of soldering tip.
It further includes the briquetting being used cooperatively with claw to encapsulate aluminum wire bonding pressing claw mechanism, and briquetting, which enhances, consolidates workpiece
It is fixed, and then bonding quality can be improved.
Description of the drawings
Fig. 1 is a kind of part-structure schematic diagram of encapsulation aluminum wire bonding equipment shown in the embodiment of the present application.
Fig. 2 is the structural schematic diagram of Fig. 1 other directions.
Fig. 3 is a kind of structural schematic diagram encapsulating claw in aluminum wire bonding equipment shown in Fig. 1.
Fig. 4 is the structural schematic diagram of Fig. 3 other directions.
Fig. 5 is a kind of structural schematic diagram encapsulating briquetting in aluminum wire bonding equipment shown in Fig. 1.
Specific implementation mode
Example embodiments are described in detail here, and the example is illustrated in the accompanying drawings.Following description is related to
When attached drawing, unless otherwise indicated, the same numbers in different drawings indicate the same or similar elements.Following exemplary embodiment
Described in embodiment do not represent all embodiments consistent with the application.On the contrary, they be only with it is such as appended
The example of consistent device and method of some aspects be described in detail in claims, the application.
It is the purpose only merely for description specific embodiment in term used in this application, is not intended to be limiting the application.
It is also intended to including majority in the application and "an" of singulative used in the attached claims, " described " and "the"
Form, unless context clearly shows that other meanings.It is also understood that term "and/or" used herein refers to and wraps
Containing one or more associated list items purposes, any or all may be combined.
It will be appreciated that though various information, but this may be described using term first, second, third, etc. in the application
A little information should not necessarily be limited by these terms.These terms are only used for same type of information being distinguished from each other out.For example, not departing from
In the case of the application range, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as
One information.Depending on context, word as used in this " if " can be construed to " ... when " or " when ...
When " or " in response to determination ".
As depicted in figs. 1 and 2, the application provides a kind of encapsulation aluminum wire bonding equipment, including encapsulation aluminum wire bonding claw machine
Structure, and the pedestal (not marking) for driving the encapsulation aluminum wire bonding pressing claw mechanism to lift.The wherein described encapsulation aluminum steel key
It includes the claw 2 that pressing plate 1 and at least two is set on the pressing plate 1 to close pressing claw mechanism.The pressing plate 1 is fixedly arranged at institute
It states on pedestal, and the pressing plate 1 is equipped with window 11, the position that the window 11 is located on the pressing plate 1 corresponds to work to be processed
Part.One end of the claw 2 extends downwards across the window 11, and when the pressing plate 1 moves down, one end of the claw 2 is used
It is crimped in the workpiece, to the fixation workpiece to be processed.
As shown in Figure 1, position is oppositely arranged four claws 2 of setting on the pressing plate 1 respectively.In such implementation
In mode, two claws 2 are arranged in 11 side of window of the pressing plate 1, other two described claw 2 is arranged in the pressure
11 other side of window of plate 1.In the both sides of the window 11, the claw 2 is facing each other to be set on the pressing plate 1.
One end that the claw 2 is crimped with the workpiece is plane 231.One end of the claw 2 be plane structure with
Claw is different from workpiece one end structure of crimping in the prior art.One end that claw in the prior art is crimped with workpiece is point
End, the tip of claw easily cause to damage when crimping workpiece to aluminum substrate, and it is insecure to crimp workpiece.It is provided by the present application described
One end of claw 2 is plane 231, can avoid the problem that causing damage to aluminum substrate when the claw 2 crimps workpiece, put down simultaneously
Face 231 can increase the frictional force of the claw 2 and workpiece to be processed, and then enhance the fixation to workpiece.
Further, as shown in Figure 3 and Figure 4, the claw 2 is at Z-type, 2 position of the claw is adjustable be set to it is described
On pressing plate 1.The space of soldering tip can be discharged by being designed by Z-type claw 2.In one embodiment, the claw 2 include according to
The first fixed part 21, the first extension 22 and the first pressure contact portion 23 of secondary connection.Wherein, 21 position of the first fixed part is adjustable
Be set on the pressing plate 1, first extension 22 close to the window 11 boundary be arranged, first pressure contact portion 23
For being crimped with the workpiece.
First fixed part 21 is fixed on the pressing plate 1, is not take up the working space of soldering tip.First extension
22 extend downwardly across the window 11 so that first extension 22 occupies 11 space of the window close to the pressing plate 1
Minimum, and it is not take up the working space of soldering tip.The only end of first pressure contact portion 23 is for being crimped on work in the claw 2
Part, the part other than the end of first pressure contact portion 23 is located at except the working space of soldering tip, thus the structure of the claw 2
The working space of releasable soldering tip.The oblique crimping workpiece of claw in the prior art, the most of of claw occupy soldering tip work sky
Between and crimp workpiece, compared with prior art, the claw 2 of the application is not take up the soldering tip working space above workpiece, energy
The space for enough releasing soldering tip has many advantages, such as that soldering tip moving process is not subject to collision.
As shown in figure 3, the part that first fixed part 21 extends to first extension 22, width gradually subtract
It is small.The width least part of first fixed part 21 is equal with the width of first extension 22.First extension
22 width is constant, the portion that first extension 22 extends to first pressure contact portion 23 and first pressure contact portion 23
Point, width is gradually reduced.Finally make the end that first extension 22 is crimped with workpiece that there is the plane 231, is ensureing
On the basis of stablizing crimping workpiece, not disfiguring workpiece, being crimped on workpiece with smaller size smaller of the first pressure contact portion 23, into one
The working space of step release soldering tip.
As depicted in figs. 1 and 2, it is set on the pressing plate 1 since 2 position of the claw is adjustable, the position of the claw 2
Setting can be adjusted according to operation requirement to adapt to production requirement.In Fig. 1 and embodiment shown in Fig. 2, the claw 2 uses
Lock screw 4 is fixed on the pressing plate 1, and first fixed part 21 is equipped with for adjusting 1 installation site of the pressing plate
The first sliding groove 24.Adjust elastic i.e. adjustable position of the claw 2 on the pressing plate 1 of the lock screw 4.Institute in figure
Show that claw 2 can be moved left and right relative to the pressing plate 1, in other embodiments, the claw 2 can also be relative to the pressure
Plate 1 moves up and down in illustrating direction.
When work, the pedestal can connect a driving mechanism, drive the pedestal to move up and down by the driving mechanism, institute
Stating pedestal drives the completion of pressing plate 1 to move up and down.When the pressing plate 1 moves down, the claw 2 on the pressing plate 1 can crimp institute
The aluminum substrate for stating workpiece makes the aluminum substrate fix.Soldering tip, which moves down, completes aluminum wire bonding process.Described in the driving mechanism driving
Pedestal moves up, and the pressing plate 1 drives the claw 2 to move up, and claw 2 is detached from the aluminum substrate of the workpiece.
Further, as shown in Figure 1, the encapsulation aluminum wire bonding pressing claw mechanism further includes being set on the pressing plate 1
Briquetting 3, when the pressing plate 1 moves down, the briquetting 3 and the claw 2 are respectively used to crimp the different sides of the workpiece.
In the embodiment shown in figure 1, a rectangular window 11 is set on the pressing plate 1, in two opposite sides of the window 11
A briquetting 3 is respectively set in side setting, and two claws 2 are respectively set in the another two side of the window 11.It will
The briquetting 3 is oppositely arranged, and the claw 2 is oppositely arranged, it is ensured that the crimping of claw 2 and the crimping workpiece of briquetting 3
Active force is symmetrical, so that claw 2 and briquetting 3 stablize crimping workpiece.On the basis of the claw 2 crimps workpiece,
The briquetting 3, which strengthens, fixes the workpiece, so that the workpiece is not subjected to displacement, and then bonding quality can be improved.The pressure
Block 3 and the claw 2 are realized by the pressing plate 1 and are lifted, and to crimp the workpiece simultaneously, can make the briquetting 3 and described
Claw 2 smoothly crimps the workpiece.
Really, in other implementations, several described claws can be set in the corresponding side of the window
On, to crimp workpiece.Such as in the directions Fig. 1, two claws are respectively set in described window or so side position, in the window
Front and back side two claws are respectively set.Eight claws are used to crimp workpiece, naturally it is also possible to using other numbers
The claw is arranged on pressing plate, to achieve the purpose that stablize crimping workpiece.
Alternatively, several described briquettings can be arranged on the side of the window, to crimp workpiece.Such as in the side Fig. 1
A briquetting is respectively set in the left-right and front-back side position of the window in Xiang Zhong.The briquetting is described when crimping workpiece
The length of briquetting crimping workpiece end is smaller than the length of the workpiece side.Such as four briquettings of setting are located at institute
Four sides of window are stated, 2/3rds of each briquetting crimping workpiece side edge length placed in the middle.Certainly the described briquetting crimping
The length of workpiece can also be adjusted to other ratios as needed.
Embodiment described above no longer can one by one be gone to live in the household of one's in-laws on getting married herein according to can and be easy embodiment shown in Fig. 1 to Fig. 5
It states, below for four claws 2 and two briquettings 3 are set, the application is further described.
As depicted in figs. 1 and 2, the end face of the briquetting 3 and the end face of the claw 2 are crimped with the workpiece respectively, institute
The end face of the end face and the claw 2 of stating briquetting 3 is generally aligned in the same plane.In such an embodiment, the briquetting 3 and described
Claw 2 has higher balance quality on the basis of the pressing plate 1, the crimping being evenly distributed so as to more accurate and pressure
The workpiece, and then improve bonding quality.To realize that the briquetting 3 preferably crimps the workpiece, the briquetting 3 and the work
The end face 331 of part crimping is bar shaped, to increase the contact area of the briquetting 3 and the workpiece, so that the briquetting 3 is easier solid
The fixed workpiece.
In embodiment shown in Fig. 5, for the briquetting 3 at Z-type, structure is similar to 2 structure of the claw.Specifically
, the briquetting 3 includes sequentially connected second fixed part 31, the second extension 32 and the second pressure contact portion 33.Wherein, described
Two fixed parts, 31 position is adjustable to be set on the pressing plate 1, and second extension 32 is set close to the boundary of the window 11
It sets, second pressure contact portion 33 with the workpiece for crimping.
Second fixed part 31 is fixed on the pressing plate 1, and second extension 32 is from second fixed part 31
It is extended downwardly across the window 11 so that second extension 32 occupies 11 space of the window most close to the pressing plate 1
It is small, and it is not take up the working space of soldering tip.Only described second pressure contact portion, the 33 only end crimps the workpiece, institute in the pressing plate 3
The soldering tip working space that the part other than 33 end of the second pressure contact portion is not take up above workpiece is stated, soldering tip moving process is not subject to
Collision.
In the embodiment shown in figure 1,3 position of the briquetting is adjustable is arranged on the pressing plate 1.The briquetting 3
It is fixed on the pressing plate 1 using lock screw 4, the briquetting 3 is equipped with second for adjusting 1 installation site of the pressing plate
Sliding slot 34.The second sliding slot 34 may be provided on second fixed part 31, as shown in figure 5, two are arranged on the briquetting 3
The second sliding slot 34.Adjust elastic i.e. adjustable position of the briquetting on the pressing plate 1 of the lock screw 4.Figure
Shown in briquetting 3 can be moved up and down relative to the pressing plate 1.
When work, the pedestal can connect a driving mechanism, drive the pedestal to move up and down by the driving mechanism, institute
Stating pedestal drives the completion of pressing plate 1 to move up and down.When the pressing plate 1 moves down, the claw 2 on the pressing plate 1 and described
Briquetting 3 crimps the aluminum substrate of the workpiece, and the aluminum substrate is made to fix.Soldering tip, which moves down, completes aluminum wire bonding process.Driving mechanism
The pedestal is driven to move up, the pressing plate drives the pressing plate 1 to move up, and claw 2 is detached from the aluminum substrate of the workpiece.
In conclusion the encapsulation aluminum wire bonding pressing claw mechanism, the claw 2 and the pressure are carried by the pressing plate 1
Block 3, the claw 2 and the briquetting 3 move down crimping workpiece with the pressing plate 1, make the claw 2 and the briquetting 3 have compared with
High balance quality.The briquetting 3 further secures the workpiece on the basis of claw 2, improves bonding matter
Amount.The space of soldering tip can be discharged using Z-type claw 2, also can avoid the damage to aluminum substrate.
The foregoing is merely the preferred embodiments of the application, not limiting the application, all essences in the application
With within principle, any modification, equivalent substitution, improvement and etc. done should be included within the scope of the application protection god.
Claims (10)
1. a kind of encapsulation aluminum wire bonding pressing claw mechanism, which is characterized in that be set on the pressing plate including pressing plate and at least two
Claw；The pressing plate is equipped with window, and the position that the window is located on the pressing plate corresponds to workpiece to be processed；The claw
One end extend downwards across the window, when the pressing plate moves down one end of the claw be used for and the workpiece pressure
It connects.
2. encapsulation aluminum wire bonding pressing claw mechanism according to claim 1, which is characterized in that the claw and the workpiece pressure
The one end connect is plane.
3. encapsulation aluminum wire bonding pressing claw mechanism according to claim 2, which is characterized in that the claw is at Z-type.
4. encapsulation aluminum wire bonding pressing claw mechanism according to claim 3, which is characterized in that the claw position is adjustable to be set
It is placed on the pressing plate.
5. encapsulation aluminum wire bonding pressing claw mechanism according to claim 4, which is characterized in that the claw includes being sequentially connected
The first fixed part, the first extension and the first pressure contact portion；Wherein first fixed part position is adjustable is set to the pressure
On plate, first extension is arranged close to the boundary of the window, and first pressure contact portion with the workpiece for crimping.
6. encapsulation aluminum wire bonding pressing claw mechanism according to claim 1, which is characterized in that further include being set to the pressing plate
On briquetting, the briquetting position is adjustable to be arranged on the pressing plate；When the pressing plate moves down, the briquetting and the pressure
Pawl is respectively used to crimp the different sides of the workpiece.
7. encapsulation aluminum wire bonding pressing claw mechanism according to claim 6, which is characterized in that the end face of the pressing plate and described
The end face of claw is crimped with the workpiece respectively, and the end face of the end face of the pressing plate and the claw is generally aligned in the same plane.
8. encapsulation aluminum wire bonding pressing claw mechanism according to claim 6, which is characterized in that the briquetting is at Z-type；The pressure
Block includes sequentially connected second fixed part, the second extension and the second pressure contact portion；Wherein second fixed part position is adjustable
Be set on the pressing plate, second extension close to the window boundary be arranged, second pressure contact portion be used for
The workpiece crimping.
9. encapsulation aluminum wire bonding pressing claw mechanism according to claim 6, which is characterized in that the briquetting and the workpiece pressure
The end face connect is bar shaped.
10. a kind of encapsulation aluminum wire bonding equipment, which is characterized in that encapsulate aluminum steel key including claim 1 to 9 any one of them
Close pressing claw mechanism, and the pedestal for driving the encapsulation aluminum wire bonding pressing claw mechanism to lift.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710104202.4A CN108511355A (en) | 2017-02-24 | 2017-02-24 | Encapsulate aluminum wire bonding pressing claw mechanism and encapsulation aluminum wire bonding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710104202.4A CN108511355A (en) | 2017-02-24 | 2017-02-24 | Encapsulate aluminum wire bonding pressing claw mechanism and encapsulation aluminum wire bonding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108511355A true CN108511355A (en) | 2018-09-07 |
Family
ID=63373901
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710104202.4A Pending CN108511355A (en) | 2017-02-24 | 2017-02-24 | Encapsulate aluminum wire bonding pressing claw mechanism and encapsulation aluminum wire bonding equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108511355A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112117213A (en) * | 2020-08-04 | 2020-12-22 | 株洲中车时代半导体有限公司 | Module bonding clamp plate structure and IGBT module |
| CN112242330A (en) * | 2020-10-14 | 2021-01-19 | 珠海格力新元电子有限公司 | Semiconductor die bonding pressing claw and packaging device |
| CN117637586A (en) * | 2023-11-20 | 2024-03-01 | 海信家电集团股份有限公司 | Bonding apparatus and control method of bonding apparatus |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201859856U (en) * | 2010-11-10 | 2011-06-08 | 南通富士通微电子股份有限公司 | Bonding press block device |
| CN202271100U (en) * | 2011-09-19 | 2012-06-13 | 杰群电子科技（东莞）有限公司 | Pressure claw capable of welding aluminium foil on DFN lead frame |
-
2017
- 2017-02-24 CN CN201710104202.4A patent/CN108511355A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201859856U (en) * | 2010-11-10 | 2011-06-08 | 南通富士通微电子股份有限公司 | Bonding press block device |
| CN202271100U (en) * | 2011-09-19 | 2012-06-13 | 杰群电子科技（东莞）有限公司 | Pressure claw capable of welding aluminium foil on DFN lead frame |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112117213A (en) * | 2020-08-04 | 2020-12-22 | 株洲中车时代半导体有限公司 | Module bonding clamp plate structure and IGBT module |
| CN112242330A (en) * | 2020-10-14 | 2021-01-19 | 珠海格力新元电子有限公司 | Semiconductor die bonding pressing claw and packaging device |
| CN117637586A (en) * | 2023-11-20 | 2024-03-01 | 海信家电集团股份有限公司 | Bonding apparatus and control method of bonding apparatus |
| CN117637586B (en) * | 2023-11-20 | 2024-06-11 | 海信家电集团股份有限公司 | Bonding apparatus and control method of bonding apparatus |
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Application publication date: 20180907 |
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