CN216648232U - Chip bonding press-fit device - Google Patents
Chip bonding press-fit device Download PDFInfo
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- CN216648232U CN216648232U CN202122968445.7U CN202122968445U CN216648232U CN 216648232 U CN216648232 U CN 216648232U CN 202122968445 U CN202122968445 U CN 202122968445U CN 216648232 U CN216648232 U CN 216648232U
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- plate
- guide block
- chip
- pressing plate
- limiting pin
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Abstract
The utility model relates to a chip bonding and laminating device, which is characterized in that: comprises a heating cushion block, a pressing plate, a chip plate and a guide block; the guide block is arranged at the bottom end of the pressing plate and matched with the upper guide hole of the chip plate, the position of the guide block close to the bottom end is provided with the limiting pin piece, the limiting pin piece rotates out of the concave cavity of the guide block body under the action of the dead weight of the limiting pin piece, the top end of the limiting pin piece is arranged on the lower surface of the chip plate, the maximum ascending stroke of the pressing plate is controlled, the guide block is always ensured to be positioned in the guide hole of the chip plate, and the guide precision of the pressing plate in the vertical direction is met; avoid the actuating cylinder long-term connection to drive on the otic placode, lead to the condition that clamp plate pushing down the precision reduces.
Description
Technical Field
The utility model relates to the technical field of chip production and manufacturing, in particular to a chip bonding and laminating device.
Background
A semiconductor chip is a semiconductor device which is formed by etching, wiring, or the like on a semiconductor wafer and can realize a certain function. In the manufacturing process of semiconductor chips, after a wafer is cut into small chips, the chips need to be interconnected with pins to achieve the conduction function thereof, and also need to achieve mechanical support, protection and the like, so that the small chips need to be packaged.
The conventional chip packaging methods include a wire bonding method, a tape automated bonding technology, a flip chip technology, and the like. Wherein wire bonding is a process technique for connecting the semiconductor chip pads to the wiring pads on the frame using a metal filament. Before wire bonding, the frame must be pressed flat by a pressing plate above the frame and a heating pad below the frame.
However, the pressing plate is driven by the driving cylinder, and the problem that the position of a window on the pressing plate cannot be accurately superposed with the position of the chip often occurs, so that the pressing deviation exists.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is to provide a chip bonding and laminating device, which can solve the problem that when a common chip is bonded, a driving cylinder drives a pressing plate to be used for a long time, so that the reduction is caused, and a bonding window and the chip cannot be completely overlapped.
In order to solve the technical problems, the technical scheme of the utility model is as follows: a chip bonding and laminating device is characterized in that: comprises a heating cushion block, a pressing plate, a chip plate and a guide block;
the pressing plate is of a U-shaped structure, and the end part of the pressing plate is horizontally provided with an ear plate; the pressing plate comprises a bottom plate and side plates, and the side plates are provided with a pair of side edges which are vertically arranged at the bottom end; the bottom plate is provided with pressing and fixing windows matched with the chips in a rectangular array; the guide block is arranged on the lower surface of the pressing plate;
the chip plate is arranged below the pressing plate, and a gap for accommodating the chip to pass through is formed between the chip plate and the pressing plate; the chip plate is provided with a guide hole matched with the guide block at the bottom end of the pressure plate; the heating cushion block is arranged on the lower surface of the chip plate to heat the chip placed on the upper surface of the chip plate;
the four guide blocks are respectively arranged at the four end corner positions of the bottom end of the pressing plate; the guide block is in a trapezoidal structure and comprises a guide block body, a limiting pin piece and a hinge shaft; the guide block body is connected to the lower surface of the pressing plate, a concave cavity for accommodating the limiting pin piece is arranged at the position, close to the bottom end, of the guide block body, a hinge hole is horizontally formed in the guide block body at the position of the concave cavity, the hinge shaft is arranged in the hinge hole, and one end of the hinge shaft extends out of the guide block body to the concave cavity; the limiting pin piece is arranged in the concave cavity of the guide block body and is connected to the hinged shaft to rotate along with the hinged shaft; the center of gravity of the limiting pin piece is positioned above the hinged shaft and is deviated to the center of the pressing plate; the top end of the limiting pin piece naturally rotates out of the concave cavity of the guide block body under the action of gravity, and the bottom end of the limiting pin piece abuts against the side wall of the concave cavity of the guide block body.
Furthermore, the guiding hole on the chip plate is provided with an inclined plane attached to the guiding block body, so that accurate guiding when the guiding block is embedded in the guiding hole is realized.
Furthermore, a driving cylinder arranged along the vertical direction is connected to an ear plate at the end part of the pressing plate, and the pressing plate is driven to move along the vertical direction through the driving cylinder.
The utility model has the advantages that:
1) according to the utility model, the guide block is arranged at the bottom end of the pressing plate and matched with the upper guide hole of the chip plate, the position of the guide block close to the bottom end is provided with the limiting pin piece, the limiting pin piece rotates out of the concave cavity of the guide block body under the action of the dead weight of the limiting pin piece, the top end of the limiting pin piece is arranged on the lower surface of the chip plate, the maximum ascending stroke of the pressing plate is controlled, the guide block is always ensured to be positioned in the guide hole of the chip plate, and the guide precision of the pressing plate in the vertical direction is met; avoid the actuating cylinder long-term connection to drive on the otic placode, lead to the condition that clamp plate pushing down the precision reduces.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Fig. 1 is a schematic structural diagram of a chip bonding and laminating apparatus according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined or explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the device or element to which the description refers must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical" and the like do not imply that the components are required to be absolutely horizontal or pendant, but rather may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly stated or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The chip bonding and laminating device shown in fig. 1 comprises a heating cushion block 1, a pressing plate 2, a chip plate 3 and a guide block 4.
The pressing plate 2 is of a U-shaped structure, and the end part of the pressing plate 2 is horizontally provided with an ear plate 21; the pressing plate 2 comprises a bottom plate and a side plate, wherein the side plate is provided with a pair of side edges which are vertically arranged at the bottom end; the bottom plate is provided with pressing and fixing windows matched with the chips in a rectangular array; the guide block 4 is provided on the lower surface of the platen.
The chip plate 3 is arranged below the pressing plate, and a gap for accommodating the chip to pass through is formed between the chip plate 3 and the pressing plate 2; the chip plate 3 is provided with a guide hole matched with the guide block 4 at the bottom end of the pressure plate; the heating cushion block 1 is arranged on the lower surface of the chip plate 3 to heat the chip placed on the upper surface of the chip plate 3.
The four guide blocks 4 are respectively arranged at the four end corner positions of the bottom end of the pressing plate; the guide block 4 is in a trapezoidal structure, and the guide block 4 comprises a guide block body 41, a limiting pin sheet 42 and a hinge shaft 43; the guide block body 41 is connected to the lower surface of the pressure plate 2, a concave cavity for accommodating the limiting pin sheet is arranged at the position, close to the bottom end, of the guide block body 41, a hinge hole is horizontally formed in the guide block body 41 at the position of the concave cavity, the hinge shaft 43 is arranged in the hinge hole, and one end of the hinge shaft 43 extends out of the guide block body 41 to the concave cavity; the limiting pin piece 42 is arranged in the concave cavity of the guide block body 41 and is connected to the hinge shaft 43 to rotate along with the hinge shaft; the center of gravity of the limit pin sheet 42 is positioned above the hinge shaft and is deviated to the center of the pressure plate 2; the top end of the limit pin 42 naturally rotates out of the cavity of the guide block body 41 under the action of gravity, and the bottom end of the limit pin abuts against the side wall of the cavity of the guide block body 41.
The guiding hole on the chip plate 3 is provided with an inclined plane attached to the guiding block body, so that accurate guiding when the guiding block is embedded in the guiding hole is realized.
The ear plate 21 at the end of the pressure plate 2 is connected with a driving cylinder 22 arranged along the vertical direction, and the pressure plate 2 is driven to move along the vertical direction through the driving cylinder 22.
The working principle of the utility model is as follows: the guide block is arranged at the bottom end of the pressing plate and matched with the upper guide hole of the chip plate, the position of the guide block close to the bottom end is provided with the limiting pin piece, the limiting pin piece rotates out of the concave cavity of the guide block body under the action of the dead weight of the limiting pin piece, the top end of the limiting pin piece is arranged on the lower surface of the chip plate, the maximum ascending stroke of the pressing plate is controlled, the guide block is always ensured to be positioned in the guide hole of the chip plate, and the guide precision of the pressing plate in the vertical direction is met; avoid the actuating cylinder long-term connection to drive on the otic placode, lead to the condition that clamp plate pushing down the precision reduces.
It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (3)
1. A chip bonding compression fittings which characterized in that: comprises a heating cushion block, a pressing plate, a chip plate and a guide block;
the pressing plate is of a U-shaped structure, and the end part of the pressing plate is horizontally provided with an ear plate; the pressing plate comprises a bottom plate and side plates, and the side plates are provided with a pair of side edges which are vertically arranged at the bottom end; the bottom plate is provided with pressing windows matched with the chips in a rectangular array; the guide block is arranged on the lower surface of the pressing plate;
the chip plate is arranged below the pressing plate, and a gap for accommodating the chip to pass through is formed between the chip plate and the pressing plate; the chip plate is provided with a guide hole matched with the guide block at the bottom end of the pressure plate; the heating cushion block is arranged on the lower surface of the chip plate to heat the chip placed on the upper surface of the chip plate;
the four guide blocks are respectively arranged at the four end corner positions of the bottom end of the pressing plate; the guide block is in a trapezoidal structure and comprises a guide block body, a limiting pin piece and a hinge shaft; the guide block body is connected to the lower surface of the pressing plate, a concave cavity for accommodating the limiting pin piece is arranged at the position, close to the bottom end, of the guide block body, a hinge hole is horizontally formed in the guide block body at the position of the concave cavity, the hinge shaft is arranged in the hinge hole, and one end of the hinge shaft extends out of the guide block body to the concave cavity; the limiting pin piece is arranged in the concave cavity of the guide block body and is connected to the hinged shaft to rotate along with the hinged shaft; the center of gravity of the limiting pin piece is positioned above the hinged shaft and is deviated to the center direction of the pressing plate; the top end of the limiting pin piece naturally rotates out of the concave cavity of the guide block body under the action of gravity, and the bottom end of the limiting pin piece abuts against the side wall of the concave cavity of the guide block body.
2. The die bonding apparatus of claim 1, wherein: the guiding hole on the chip plate is provided with an inclined plane attached to the guiding block body, so that accurate guiding when the guiding block is embedded into the guiding hole is realized.
3. The die bonding apparatus of claim 1, wherein: the ear plate at the end part of the pressing plate is connected with a driving cylinder arranged along the vertical direction, and the pressing plate is driven to move along the vertical direction through the driving cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122968445.7U CN216648232U (en) | 2021-11-30 | 2021-11-30 | Chip bonding press-fit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122968445.7U CN216648232U (en) | 2021-11-30 | 2021-11-30 | Chip bonding press-fit device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216648232U true CN216648232U (en) | 2022-05-31 |
Family
ID=81737863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122968445.7U Active CN216648232U (en) | 2021-11-30 | 2021-11-30 | Chip bonding press-fit device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216648232U (en) |
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2021
- 2021-11-30 CN CN202122968445.7U patent/CN216648232U/en active Active
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