CN103681370A - 一种贴片二极管裁料工装 - Google Patents
一种贴片二极管裁料工装 Download PDFInfo
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- CN103681370A CN103681370A CN201310677425.1A CN201310677425A CN103681370A CN 103681370 A CN103681370 A CN 103681370A CN 201310677425 A CN201310677425 A CN 201310677425A CN 103681370 A CN103681370 A CN 103681370A
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- 239000000463 material Substances 0.000 title claims abstract description 139
- 238000000034 method Methods 0.000 abstract description 5
- 230000000670 limiting effect Effects 0.000 abstract 1
- 239000011265 semifinished product Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- Condensed Matter Physics & Semiconductors (AREA)
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- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
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Claims (1)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201310677425.1A CN103681370B (zh) | 2013-12-13 | 2013-12-13 | 一种贴片二极管裁料工装 |
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CN201310677425.1A CN103681370B (zh) | 2013-12-13 | 2013-12-13 | 一种贴片二极管裁料工装 |
Publications (2)
Publication Number | Publication Date |
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CN103681370A true CN103681370A (zh) | 2014-03-26 |
CN103681370B CN103681370B (zh) | 2016-04-20 |
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CN201310677425.1A Active CN103681370B (zh) | 2013-12-13 | 2013-12-13 | 一种贴片二极管裁料工装 |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007105811A (ja) * | 2005-10-11 | 2007-04-26 | Matsushita Electric Ind Co Ltd | 刃物固定治具ならびにそれを用いたフィルム切断方法 |
CN201466022U (zh) * | 2009-04-27 | 2010-05-12 | 绍兴旭昌科技企业有限公司 | 微型贴片二极管封装的引线框架与芯片连接结构 |
CN202111068U (zh) * | 2011-06-17 | 2012-01-11 | 如皋市易达电子有限责任公司 | 贴片二极管去废边模具 |
CN202106496U (zh) * | 2011-06-17 | 2012-01-11 | 如皋市易达电子有限责任公司 | 一种贴片二极管去废边模具 |
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2013
- 2013-12-13 CN CN201310677425.1A patent/CN103681370B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007105811A (ja) * | 2005-10-11 | 2007-04-26 | Matsushita Electric Ind Co Ltd | 刃物固定治具ならびにそれを用いたフィルム切断方法 |
CN201466022U (zh) * | 2009-04-27 | 2010-05-12 | 绍兴旭昌科技企业有限公司 | 微型贴片二极管封装的引线框架与芯片连接结构 |
CN202111068U (zh) * | 2011-06-17 | 2012-01-11 | 如皋市易达电子有限责任公司 | 贴片二极管去废边模具 |
CN202106496U (zh) * | 2011-06-17 | 2012-01-11 | 如皋市易达电子有限责任公司 | 一种贴片二极管去废边模具 |
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Publication number | Publication date |
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CN103681370B (zh) | 2016-04-20 |
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PB01 | Publication | ||
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C14 | Grant of patent or utility model | ||
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Effective date of registration: 20191119 Address after: 239400 No. 99 Qicang Road, Mingguang Industrial Park, Chuzhou City, Anhui Province Patentee after: ANHUI CHUANGXIAN ELECTRONIC TECHNOLOGY Co.,Ltd. Address before: 226500, Jiangsu Province, Nantong City, Rugao moved by the town group shore village 7 groups Patentee before: RUGAO EADA ELECTRONICS Co.,Ltd. |
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TR01 | Transfer of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A cutting tool for SMD diode Effective date of registration: 20200817 Granted publication date: 20160420 Pledgee: Chuzhou financing Company limited by guarantee Pledgor: ANHUI CHUANGXIAN ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2020980005057 |
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Date of cancellation: 20211101 Granted publication date: 20160420 Pledgee: Chuzhou financing Company limited by guarantee Pledgor: ANHUI CHUANGXIAN ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2020980005057 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A cutting fixture for SMD diodes Effective date of registration: 20231020 Granted publication date: 20160420 Pledgee: Mingguang Company limited by guarantee financing Pledgor: ANHUI CHUANGXIAN ELECTRONIC TECHNOLOGY Co.,Ltd. Registration number: Y2023980062089 |