CN103675595A - Short circuit detecting method for inner-layer circuit and outer-layer circuit of circuit board - Google Patents
Short circuit detecting method for inner-layer circuit and outer-layer circuit of circuit board Download PDFInfo
- Publication number
- CN103675595A CN103675595A CN201310674800.7A CN201310674800A CN103675595A CN 103675595 A CN103675595 A CN 103675595A CN 201310674800 A CN201310674800 A CN 201310674800A CN 103675595 A CN103675595 A CN 103675595A
- Authority
- CN
- China
- Prior art keywords
- circuit
- short
- layer circuit
- wiring board
- detection method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Investigating Or Analyzing Materials Using Thermal Means (AREA)
Abstract
The invention discloses a short circuit detecting method for an inner-layer circuit and an outer-layer circuit of a circuit board. The method comprises the following steps that a direct-current power source is loaded between the inner-layer circuit and the outer-layer circuit of the circuit board, wherein a short circuit occurs between the inner-layer circuit and the outer-layer circuit, so that a loop between the inner-layer circuit and the outer-layer circuit is powered on and emits heat; an infrared detector is used for detecting the surface of the circuit board, the position of the highest heat-emitting point is found by the infrared detector, and the position of the highest heat-emitting point is the position of the short circuit between the inner-layer circuit and the outer-layer circuit. The short circuit detecting method can detect the position of the short circuit between the inner-layer circuit and the outer-layer circuit of the circuit board rapidly and accurately, and bring great convenience to maintenance or production.
Description
Technical field
The present invention relates to a kind of short circuit detection method, relate in particular to a kind of short circuit detection method of wiring board ectonexine circuit.
Background technology
Along with printed wiring board live width and spacing more and more less, between two adjacent networks, more and more easily there is the phenomenon of short circuit.In the manufacture process of printed wiring board, the short circuit between heterogeneous networks is unallowed, when being short-circuited defect, just need to analyze producing the reason of short circuit.
In multilayer printed wiring board, short dot likely occurs on outer-layer circuit or internal layer circuit.Although this circuit defect major part the operation of on off test can the place of being detected out, break-make detects between the network that is merely able to judge not conducting mutually whether short circuit, and can not determine the position of concrete short dot.The short dot of outer-layer circuit is due to surface coverage solder mask, on complicated circuit, be difficult to make with the naked eye or microscope distinguishes, and the short dot of internal layer circuit None-identified especially, the dropping cut slice of polishing after now wiring board must being destroyed is investigated one by one to all positions on wiring board, not only waste time and energy, and in cutting the process of sample, be easy to short dot to destroy and cause finally can not find problem points.
Summary of the invention
Based on this, the invention reside in the defect that overcomes prior art, a kind of short circuit detection method of wiring board ectonexine circuit is provided, and the method can detect the location of short circuit between wiring board internal layer circuit and outer-layer circuit rapidly and accurately, gives maintenance or produces and bring compared with convenience.
Its technical scheme is as follows:
A short circuit detection method for wiring board ectonexine circuit, the method comprises the following steps:
Between the internal layer circuit being short-circuited in the circuit board and outer-layer circuit, load direct supply, make the loop heating power between internal layer circuit and outer-layer circuit;
With infrared detecting set, survey PCB surface, and find the position of high heat generating spot by this infrared detecting set, this is the short dot position between internal layer circuit and outer-layer circuit in position of high heat generating spot.
Preferably, the output current of described direct supply regulates according to the shown heating power situation of high heat generating spot of described infrared detecting set, and the scope of this output current is between 1A-3A.In this range of current, can guarantee not because of the All other routes on the excessive damaged line plate of electric current, can reach again and described loop heating power be occurred to the object of high heat generating spot.
The time range of preferably, switching on the loop between described internal layer circuit and outer-layer circuit is 30s-2min.Thereby, in this time range, both can avoid occurring the unconspicuous situation of heating cause because conduction time is too short, can avoid again the situation of the excessive heating damaged line that causes because conduction time is long.
Preferably, when loading direct supply, the both positive and negative polarity of direct supply is welded on respectively on two pads that are short-circuited.
Preferably, described infrared detecting set is thermal camera, when finding the position of the highest heat generating spot, first use thermal camera trace wiring plate surface, obtain the infrared image of reflection PCB surface temperature distribution state, in this infrared image, temperature peak is the highest heat generating spot, determines according to this location of short circuit between internal layer circuit and outer-layer circuit.
Preferably, the method is further comprising the steps of: temperature peak relevant position in the circuit board in described infrared image is indicated, and carry out recently confirming described location of short circuit with the designed lines of wiring board.
Below the advantage of aforementioned techniques scheme or principle are described:
1, according to physical ABC, the cross-sectional area of conductor is less, and resistance is larger, and the heat that steady current produces by the large conductor of resistance is larger.When electric current is during by a strip material is identical, thickness is different conductor, compared with thick part, because cross-sectional area is large, resistance is less, and the heat of generation is relatively little; And compared with thin part because cross-sectional area is little, resistance is larger, the heat of generation is also relatively large.Therefore on the conductor that, same thickness is different, produced heat difference.For wiring board, general line thickness is that location of short circuit contact area is little, so resistance is larger uniformly, and while loading direct current in the loop between internal layer circuit and outer-layer circuit, the thermal value of location of short circuit is also large than other positions.The present invention is by loading direct supply between two networks that are short-circuited, and impels the short dot that resistance is larger to produce larger heat, and then uses infrared detecting set to survey on wiring board the position of high heat generating spot, thereby determines the position of short circuit.
2, the short circuit detection method of described wiring board ectonexine circuit can detect the location of short circuit between wiring board internal layer circuit and outer-layer circuit rapidly and accurately, gives maintenance or produces and bring compared with convenience.
3, described short circuit detection method equipment needed thereby equipment is simple, processing ease.
4, described short circuit detection method can detect hiding short dot under the prerequisite of damaged line plate not, can accomplish lossless detection.
Accompanying drawing explanation
Fig. 1 is the principle of work schematic diagram of the short circuit detection method of the wiring board ectonexine circuit described in the embodiment of the present invention.
Description of reference numerals:
10, rectifier, 20, wiring board, 21, internal layer circuit, 22, outer-layer circuit, 23, short dot, 30, thermal camera, 40, infrared image, 41, temperature peak.
Embodiment
Below embodiments of the invention are elaborated:
The present embodiment provides a kind of short circuit detection method of wiring board ectonexine circuit, and the method comprises the following steps:
Use electric soldering iron that the positive and negative electrode of direct supply is welded on respectively on two pads that are short-circuited on wiring board 20, make between the internal layer circuit 21 being short-circuited and outer-layer circuit 22, loading direct supply;
Above-mentioned direct supply is connected, regulated the size of the output current of direct supply, make the loop heating power between internal layer circuit 21 and outer-layer circuit 22;
With thermal camera 30 trace wiring plate 20 surfaces, obtain the infrared image 40 of reflection wiring board 20 surface temperature distribution situations, and this infrared image 40 is input on the display of computing machine;
The relevant position of temperature peak 41 on wiring board 20 in described infrared image 40 marked, and contrast with the designed lines of wiring board 20, can confirm short dot 23 positions between internal layer circuit 21 and outer-layer circuit 22.
Wherein, the position of described temperature peak 41 in infrared image is mutually corresponding in the position of wiring board with short dot.
The output current of described direct supply regulates according to the shown heating power situation of high heat generating spot of described infrared detecting set, and the scope of this output current is between 1A-3A.In this range of current, can guarantee not because of the All other routes on the excessive damaged line plate 20 of electric current, can reach again and described loop heating power be occurred to the object of high heat generating spot.
The time range of switching on the loop between described internal layer circuit 21 and outer-layer circuit 22 is 30s-2mi n.Thereby, in this time range, both can avoid occurring the unconspicuous situation of heating cause because conduction time is too short, can avoid again the situation of the excessive heating damaged line that causes because conduction time is long.
In addition, above-mentioned direct supply can connect rectifier 10 acquisitions by industrial alternating current or family expenses alternating current.Certainly, also can adopt other infrared detecting sets to survey the temperature of PCB surface.
The present embodiment has the following advantages or principle:
1, according to physical ABC, the cross-sectional area of conductor is less, and resistance is larger, and the heat that steady current produces by the large conductor of resistance is larger.When electric current is during by a strip material is identical, thickness is different conductor, compared with thick part, because cross-sectional area is large, resistance is less, and the heat of generation is relatively little; And compared with thin part because cross-sectional area is little, resistance is larger, the heat of generation is also relatively large.Therefore on the conductor that, same thickness is different, produced heat difference.For wiring board 20, general line thickness is that location of short circuit contact area is little, so resistance is larger uniformly, and while loading direct current in the loop between internal layer circuit 21 and outer-layer circuit 22, the thermal value of location of short circuit is also large than other positions.The present embodiment is by loading direct supply between two networks that are short-circuited, and impels the short dot 23 that resistance is larger to produce larger heat, and then uses infrared detecting set to survey on wiring board 20 the position of high heat generating spot, thereby determines the position of short circuit.
2, the short circuit detection method of described wiring board ectonexine circuit can detect the location of short circuit between wiring board 20 internal layer circuits 21 and outer-layer circuit 22 rapidly and accurately, gives maintenance or produces and bring compared with convenience.
3, described short circuit detection method equipment needed thereby equipment is simple, processing ease.
4, described short circuit detection method can detect hiding short dot 23 under the prerequisite of damaged line plate 20 not, can accomplish lossless detection.
The above embodiment has only expressed the specific embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be interpreted as the restriction to the scope of the claims of the present invention.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.
Claims (6)
1. a short circuit detection method for wiring board ectonexine circuit, is characterized in that, the method comprises the following steps:
Between the internal layer circuit being short-circuited in the circuit board and outer-layer circuit, load direct supply, make the loop heating power between ectonexine circuit;
With infrared detecting set, survey PCB surface, and find the position of high heat generating spot by this infrared detecting set, this is the short dot position between internal layer circuit and outer-layer circuit in position of high heat generating spot.
2. the short circuit detection method of wiring board ectonexine circuit according to claim 1, it is characterized in that, the output current of described direct supply regulates according to the shown heating power situation of high heat generating spot of described infrared detecting set, and the scope of this output current is between 1A-3A.
3. the short circuit detection method of wiring board ectonexine circuit according to claim 1, is characterized in that, the time range of switching on the loop between described internal layer circuit and outer-layer circuit is 30s-2min.
4. the short circuit detection method of wiring board ectonexine circuit according to claim 1, is characterized in that, when loading direct supply, the both positive and negative polarity of direct supply is welded on respectively on two pads that are short-circuited.
5. according to the short circuit detection method of the wiring board ectonexine circuit described in claim 1 to 4 any one, it is characterized in that, described infrared detecting set is thermal camera, when finding the position of the highest heat generating spot, first use thermal camera trace wiring plate surface, the infrared image that obtains reflection PCB surface temperature distribution state, in this infrared image, temperature peak is the highest heat generating spot, determines according to this short dot position between internal layer circuit and outer-layer circuit.
6. the short circuit detection method of wiring board ectonexine circuit according to claim 5, it is characterized in that, the method is further comprising the steps of: temperature peak relevant position in the circuit board in described infrared image is indicated, and carry out recently confirming described short dot position with the designed lines of wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310674800.7A CN103675595A (en) | 2013-12-11 | 2013-12-11 | Short circuit detecting method for inner-layer circuit and outer-layer circuit of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310674800.7A CN103675595A (en) | 2013-12-11 | 2013-12-11 | Short circuit detecting method for inner-layer circuit and outer-layer circuit of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103675595A true CN103675595A (en) | 2014-03-26 |
Family
ID=50313754
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310674800.7A Pending CN103675595A (en) | 2013-12-11 | 2013-12-11 | Short circuit detecting method for inner-layer circuit and outer-layer circuit of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103675595A (en) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105158678A (en) * | 2015-10-23 | 2015-12-16 | 湖北三江航天万峰科技发展有限公司 | Printed circuit board short-circuit fault rapid detection device |
| CN105203897A (en) * | 2014-06-23 | 2015-12-30 | 展讯通信（上海）有限公司 | Method for detecting short-circuited device on circuit board |
| CN105445649A (en) * | 2015-12-30 | 2016-03-30 | 深圳市创科自动化控制技术有限公司 | Equipment and method for detecting circuit board and device on circuit board |
| CN106908713A (en) * | 2017-02-23 | 2017-06-30 | 深圳崇达多层线路板有限公司 | A kind of decision method of wiring board internal layer circuit short circuit reason |
| CN109975686A (en) * | 2019-03-06 | 2019-07-05 | 哈工大机器人（山东）智能装备研究院 | A kind of circuit board short circuit automatic identifying method based on infrared image processing |
| CN105445649B (en) * | 2015-12-30 | 2019-07-16 | 深圳市创科自动化控制技术有限公司 | A kind of detection method based on the equipment of device in detection circuit board and its plate |
| CN110554302A (en) * | 2019-09-10 | 2019-12-10 | 北京理工大学 | device for rapidly and automatically detecting circuit board fault |
| CN110940729A (en) * | 2019-12-20 | 2020-03-31 | 广东海外建设咨询有限公司 | Distribution line laying quality supervision method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101136346A (en) * | 2007-08-31 | 2008-03-05 | 中山大学 | Chip welding spot on-line detecting, defect identification device and chip packaging device |
| CN201226020Y (en) * | 2008-06-19 | 2009-04-22 | 孙黎新 | System for on-line monitoring transmission and distribution line operation |
| CN102610541A (en) * | 2012-04-20 | 2012-07-25 | 郑海鹏 | Location method for defect points of integrated circuit |
| WO2012147807A1 (en) * | 2011-04-25 | 2012-11-01 | シャープ株式会社 | Wiring defect inspecting method, wiring defect inspecting apparatus, and method for manufacturing semiconductor substrate |
| CN102956844A (en) * | 2011-08-22 | 2013-03-06 | 三星显示有限公司 | Method of repairing display panel and apparatus for performing the same |
| WO2013046859A1 (en) * | 2011-09-27 | 2013-04-04 | シャープ株式会社 | Wiring inspecting method, wiring inspecting apparatus, wiring inspecting program, and recording medium |
| CN103399248A (en) * | 2013-07-18 | 2013-11-20 | 江苏物联网研究发展中心 | PCB (printed circuit board) defect mass detection system and method |
-
2013
- 2013-12-11 CN CN201310674800.7A patent/CN103675595A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101136346A (en) * | 2007-08-31 | 2008-03-05 | 中山大学 | Chip welding spot on-line detecting, defect identification device and chip packaging device |
| CN201226020Y (en) * | 2008-06-19 | 2009-04-22 | 孙黎新 | System for on-line monitoring transmission and distribution line operation |
| WO2012147807A1 (en) * | 2011-04-25 | 2012-11-01 | シャープ株式会社 | Wiring defect inspecting method, wiring defect inspecting apparatus, and method for manufacturing semiconductor substrate |
| CN102956844A (en) * | 2011-08-22 | 2013-03-06 | 三星显示有限公司 | Method of repairing display panel and apparatus for performing the same |
| WO2013046859A1 (en) * | 2011-09-27 | 2013-04-04 | シャープ株式会社 | Wiring inspecting method, wiring inspecting apparatus, wiring inspecting program, and recording medium |
| CN102610541A (en) * | 2012-04-20 | 2012-07-25 | 郑海鹏 | Location method for defect points of integrated circuit |
| CN103399248A (en) * | 2013-07-18 | 2013-11-20 | 江苏物联网研究发展中心 | PCB (printed circuit board) defect mass detection system and method |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105203897A (en) * | 2014-06-23 | 2015-12-30 | 展讯通信（上海）有限公司 | Method for detecting short-circuited device on circuit board |
| CN105158678A (en) * | 2015-10-23 | 2015-12-16 | 湖北三江航天万峰科技发展有限公司 | Printed circuit board short-circuit fault rapid detection device |
| CN105445649A (en) * | 2015-12-30 | 2016-03-30 | 深圳市创科自动化控制技术有限公司 | Equipment and method for detecting circuit board and device on circuit board |
| CN105445649B (en) * | 2015-12-30 | 2019-07-16 | 深圳市创科自动化控制技术有限公司 | A kind of detection method based on the equipment of device in detection circuit board and its plate |
| CN106908713A (en) * | 2017-02-23 | 2017-06-30 | 深圳崇达多层线路板有限公司 | A kind of decision method of wiring board internal layer circuit short circuit reason |
| CN106908713B (en) * | 2017-02-23 | 2019-10-22 | 深圳崇达多层线路板有限公司 | A kind of determination method of wiring board internal layer circuit short circuit reason |
| CN109975686A (en) * | 2019-03-06 | 2019-07-05 | 哈工大机器人（山东）智能装备研究院 | A kind of circuit board short circuit automatic identifying method based on infrared image processing |
| CN109975686B (en) * | 2019-03-06 | 2021-04-06 | 哈工大机器人（山东）智能装备研究院 | Circuit board short circuit automatic identification method based on infrared image processing |
| CN110554302A (en) * | 2019-09-10 | 2019-12-10 | 北京理工大学 | device for rapidly and automatically detecting circuit board fault |
| CN110554302B (en) * | 2019-09-10 | 2020-07-28 | 北京理工大学 | Device for rapidly and automatically detecting circuit board fault |
| CN110940729A (en) * | 2019-12-20 | 2020-03-31 | 广东海外建设咨询有限公司 | Distribution line laying quality supervision method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103675595A (en) | Short circuit detecting method for inner-layer circuit and outer-layer circuit of circuit board | |
| CN102183545B (en) | Infrared temperature measurement detection method for detecting solder joint reliability of circuit board | |
| CN203259621U (en) | Layer offset test device of multi-layer circuit board | |
| CN102812787B (en) | Method for manufacturing printed wiring board | |
| CN105899062A (en) | Automatic production technology with wired charger | |
| WO2014184102A3 (en) | Method for depositing thick copper layers onto sintered materials | |
| CN204536491U (en) | A kind of PCB of being used for detects through hole low-resistance proving installation | |
| Gupta et al. | Electrical simulation and characterization of shunts in solar cells | |
| CN203523138U (en) | Electroplating capability test module for HDI plate | |
| CN105786218B (en) | Time writer, time writer resonant frequency adjust system and method | |
| CN215067113U (en) | Testing arrangement of short position in quick location PCB board | |
| TWI538237B (en) | Method and apparatus for increasing conductivity of solar cell, and solar cell | |
| CN103353578B (en) | A kind of fault detection method of circuit board device | |
| CN203875442U (en) | Intelligent wave solder | |
| CN104237752A (en) | Test method, test fixture and test device for thin core board layer short risks | |
| CN105228369A (en) | The deposited copper welding procedure of lightning-protected product | |
| CN204925318U (en) | Power equipment detector | |
| CN203745573U (en) | ICT test needle bed | |
| TWI627424B (en) | Electrostatic discharge detection devices and methods thereof | |
| CN209344034U (en) | A kind of detection system of photovoltaic module bypass diode | |
| CN206347974U (en) | A kind of offset detecting device of PCB multilayer board | |
| CN202679785U (en) | Multilayer PCB plate possessing quality inspection ring | |
| CN104502439A (en) | Device for detecting defects of insulating tool for hot-line work | |
| CN207057842U (en) | A kind of laser-beam welding machine with detection means | |
| CN104539947A (en) | Wide voltage testing device and testing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20140326 |