CN105445649B - A kind of detection method based on the equipment of device in detection circuit board and its plate - Google Patents
A kind of detection method based on the equipment of device in detection circuit board and its plate Download PDFInfo
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- CN105445649B CN105445649B CN201511026596.3A CN201511026596A CN105445649B CN 105445649 B CN105445649 B CN 105445649B CN 201511026596 A CN201511026596 A CN 201511026596A CN 105445649 B CN105445649 B CN 105445649B
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- 238000001514 detection method Methods 0.000 title claims abstract description 38
- 230000005611 electricity Effects 0.000 claims abstract description 7
- 230000000007 visual effect Effects 0.000 claims abstract description 7
- 230000002159 abnormal effect Effects 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 abstract description 2
- 230000000875 corresponding Effects 0.000 description 4
- 230000000630 rising Effects 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 230000004397 blinking Effects 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 238000000280 densification Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- 230000001360 synchronised Effects 0.000 description 1
Abstract
The invention discloses a kind of device and method thereof of device in detection circuit board and its plate, equipment includes: adjustable rack, the objective table for being used to place detected circuit plate on adjustable rack, infrared camera, the infrared lens being installed on infrared camera, and the main control computer platform with visual analysis function, main control computer platform courses objective table is mobile, and the infrared image for obtaining infrared camera carries out intelligent recognition and analysis.The device and method thereof of device in detection circuit board and its plate of the invention, utilize the infra-red radiation after circuit board strip electricity operation, by infrared camera in the length of testing speech of setting between continue acquisition Dynamic infrared image, the inspection software with machine vision function can track the temperature variations of each device on circuit board and plate.By comparing with master sample value, judges the quality and stability of device on plate, to provide support information for the buying of component or the heat dissipation design of circuit board, improve the quality of electronic product.
Description
Technical field
The present invention relates to a kind of inspections of the equipment of device in technical field of circuit board detection more particularly to circuit board and its plate
Survey method.
Background technique
In each electronic product, the quality of circuit board is the basic guarantee factor of Quality of electronic products.Electronic product
Structure densification increasingly now, for example, largely using the micro components such as 01005,0201 in circuit board of mobile phone.Higher and higher collection
More stringent requirements are proposed for detection of the Cheng Du to product.Currently, being laid particular emphasis in the detection of electronic product and its printed circuit board
The welding of circuit board detects, and such as manually visualizes the methods of detection, automatic optics inspection AOI, automatic X-ray detection AXI.Above-mentioned side
After method is commonly used in printed circuit board processing, there is preferable discovery to instant unfavorable condition explicit in Product jointing processing.But
It is unstable to the bad or performance exposed after many implicit bad and long-time burning machines of the electronic component on circuit board itself
Condition of pledging love lacks interpretation ability.
The Chinese invention patent of Publication No. CN102183545B discloses a kind of the red of detection circuit board welding spot reliability
Exterior measuring temperature detection method.This method issues the pad to be detected that a branch of infrared laser gathers circuit board using infrared laser
On, after continuing 0.1~1s time, the temperature dynamic image of the test point is obtained using thermal infrared imager and the test point draws
Temperature dynamic image at foot, to obtain the temperature rising curve of the test point and the temperature rising song at the test point pin
Line.If this two temperature rising curve distribution trends are identical, maximum temperature point is synchronous, then the pad is qualified.It should
Method uses active infrared laser irradiation, and focuses on the analysis of single solder joint, and circuit board is not at working condition.
The Chinese utility model patent of Publication No. CN204649634U discloses a kind of for the red of surface-mounted devices
Outer imaging detection device.The device is furnished with infrared light supply and infrared lens other than visible detection camera lens.Detection printing
When circuit board, while visible images and infrared image are acquired, infrared image is to sophisticated image details.By infrared image and
The fusion of visible images obtains the higher image of clarity.This method also uses active infrared light source, focuses on that solder joint is examined
It surveys, circuit board is not at working condition.
Both the above method all lays particular emphasis on the welding defect of detection circuit board, for electronic product and its circuit board long-time
The implicit bad and quality defect shown after operation cannot make effective assessment.
Summary of the invention
The purpose of the present invention is to provide a kind of detection method based on the equipment of device in detection circuit board and its plate,
Solve existing circuit board detecting cannot effectively detection circuit board use when generate recessive trait defect the technical issues of.
In order to achieve the above objectives, technical solution proposed by the invention are as follows:
A kind of equipment of the device in detection circuit board and its plate comprising: an adjustable rack is set to described adjustable
The objective table for being used to place detected circuit plate in section rack, an infrared camera are installed on infrared on the infrared camera
Camera lens, and the main control computer platform with visual analysis function, the main control computer platform courses objective table is mobile, and obtains
The infrared image of the infrared camera carries out intelligent recognition and analysis.
A kind of detection method of the equipment using the device as described above in detection circuit board and its plate comprising with
Lower step:
The first step adjusts adjustable rack, and the detected circuit plate being located on objective table is made to be placed in the infrared of detection device
In the visual field of camera lens；
Second step, allows electricity operation on detected circuit plate, at interval of the dynamic red of certain time acquisition detected circuit plate
Outer image；
Third step sets several temperature than the region that circuit board ambient temperature is significantly higher by according to Dynamic infrared image
For region-of-interest；
4th step, the modified-image of region-of-interest described in continuous collecting according to reference value and allow disparity range to determine, if
Beyond disparity range is allowed, then warning note is abnormal.
Wherein, the region-of-interest in the third step includes overlapping region, and the overlapping region is no more than three layers.
Wherein, the feature that the image of the Dynamic infrared image of region-of-interest is acquired in the third step includes that temperature becomes
Change, area change and region offset.
Wherein, the second step to the 4th step need to repeat at least three times.
Wherein, further include the steps that generating quality report according to testing result after the 4th step.
Detection method based on the equipment of device in detection circuit board and its plate of the invention, utilizes circuit board strip electricity operation
Infra-red radiation afterwards, by infrared camera in the length of testing speech of setting between continue acquisition Dynamic infrared image, have machine vision
The inspection software of function can track the temperature variations of each device on circuit board and plate.Pass through the data with master sample value
After being compared, the quality and stability of device on plate can determine whether, thus for the batch buying or the heat dissipation of circuit board of component
Design, which provides, supports information, improves the quality of electronic product.
Detailed description of the invention
Fig. 1 is the functional block diagram of present invention equipment of device in detection circuit board and its plate.
Fig. 2 is the flow chart of the method for device in detection circuit board and its plate of the invention.
Fig. 3 is the temperature change system of the method wherein region-of-interest of the device in detection circuit board and its plate of the invention
Count schematic diagram.
Specific embodiment
Below with reference to attached drawing, the present invention is further described in detail.
Attached drawing 1 is please referred to, in embodiment, the equipment of this kind device in detection circuit board and its plate comprising: one
Adjustable rack 3, the objective table 4 for being used to place detected circuit plate on adjustable rack 3, an infrared camera 2, installation
Infrared lens 1 on the infrared camera 2, and the main control computer platform 5 with visual analysis function, the main control computer
Platform 5 controls the movement of objective table 4, and the infrared image for obtaining the infrared camera 2 carries out intelligent recognition and analysis.More specifically
, detected circuit board is placed on objective table 4 first, then controlling adjustable rack 3 by main control computer platform 5 makes to carry
Detected circuit plate on object platform is automatically positioned in the vision area of infrared lens 1, then, to electricity operation on detected circuit plate, so
Acquire the infrared image of running detected circuit plate at interval of certain time by infrared camera 2 afterwards.Wherein, main control computer is flat
The software of infrared machine vision and intellectual analysis function is installed on platform 5, automatically tracks and monitor the spies such as the temperature of region-of-interest
Sign variation after continuing to monitor certain time, generates quality report.
Attached drawing 2 is please referred to, it is a kind of using the detection for being used for the equipment of device on detection circuit board and its plate as described above
Method, detection method includes the following steps for this:
First step S1 adjusts adjustable rack, and the detected circuit plate being located on objective table is made to be placed in the red of detection device
In the visual field of outer camera lens；The automatic adjustment is the automatic control and adjustment based on main control computer platform 5.
Second step S2, allows electricity operation on detected circuit plate, at interval of the dynamic of certain time acquisition detected circuit plate
Infrared image.According to actually detected needs, certain time interval are set, then acquire the dynamic of the operation of the circuit board in being currently running
Then image is returned to main control computer platform by state infrared image.
Third step S3 sets several temperature than the region that circuit board ambient temperature is significantly higher by according to Dynamic infrared image
It is set to region-of-interest.For the image that second step S2 is returned, the inspection software of main control computer platform is calculated using infrared machine vision
Method determines several region-of-interests, which is temperature than the region that circuit board ambient temperature is significantly higher by.One concern area
In domain, may include or the higher closure zonule of several temperature that partly overlap.It can the nested or small height that partly overlaps in i.e. big region
Temperature area, it is usually nested to be no more than 3 layers.Physically, the corresponding device of a usual region-of-interest or certain combination of devices.
For each region-of-interest, inspection software is based on experience value or the reference value of similar master sample provides reference temperature
With the disparity range allowed.It can also manual intervention input reference temperature and acceptable disparity range.
For each region-of-interest, variation of the inspection software continual analysis region in some time in past piece, including temperature
The variation of degree, variation, offset of regional location of region area etc..
4th step S4, the modified-image of region-of-interest described in continuous collecting according to reference value and allow disparity range to determine,
Warning note is abnormal if beyond disparity range is allowed.Inspection software updates the dynamic statistics report of each region-of-interest simultaneously, more
The numerical value of new each regional temperature, and compared with the reference value of master sample and the disparity range allowed after, show that each region is corresponding
Device quality estimating.It is as exceeded the difference section allowed, then undesirable for the corresponding device quality in the region.Exceed
The variation of tolerance means the possibility operation irregularity of circuit board, comprising: area accelerates to become larger suddenly, and temperature quickly increases
Deng.Inspection software meeting blinking region profile, provides warning.
Specifically, for unusual high temperature, it may be possible to short circuit occur, warning need to be provided immediately or cutting circuit board supplies
Electricity.
Wherein, the second step S2 to the 4th step S4 need to be repeated at least three times.
Wherein, further include the steps that generating quality report according to testing result after the 4th step S4.
Attached drawing 3 is please referred to, is the temperature time curve figure made in the present embodiment for one of region-of-interest,
In, dotted line A and dotted line D are the upper limit curve and lower limit curve of the permissions difference of region-of-interest, wherein B works as region-of-interest
Preceding value, C curve are the reference value in the region, that is, changing for its temperature value of one of region-of-interest is transported according to circuit board
Market condition and change, therefore its with reference to limit value be also gradual change.Reference value curve C can be according to the workability of different components
Situations such as power in matter and certain circuit module regions, is determined.
Above content, only presently preferred embodiments of the present invention, are not intended to limit embodiment of the present invention, and this field is general
Logical technical staff's central scope according to the present invention and spirit can very easily carry out corresponding flexible or modification, therefore originally
The protection scope of invention should be subject to protection scope required by claims.
Claims (1)
1. a kind of detection method based on the equipment of device in detection circuit board and its plate, equipment include: an adjustable rack, if
In, for placing the objective table of detected circuit plate, an infrared camera is installed on the infrared phase on the adjustable rack
Infrared lens on machine, and the main control computer platform with visual analysis function, the main control computer platform courses are adjustable
Machine frame movement, and the infrared image for obtaining the infrared camera carries out intelligent recognition and analysis, which is characterized in that detection method
The following steps are included:
The first step adjusts adjustable rack, and the detected circuit plate being located on objective table is made to be placed in the infrared lens of detection device
Visual field in；
Second step, allows electricity operation on detected circuit plate, at interval of the Dynamic IR figure of certain time acquisition detected circuit plate
Picture；
Several temperature are set as closing by third step according to Dynamic infrared image than the region that circuit board ambient temperature is significantly higher by
Infuse region；
4th step, the modified-image of region-of-interest described in continuous collecting according to reference value and allow disparity range to determine, if exceeding
Allowing disparity range, then warning note is abnormal；
Wherein, the region-of-interest in the third step includes overlapping region, and the overlapping region is no more than three layers, and described the
The feature that the image of the Dynamic infrared image of region-of-interest is acquired in three steps includes temperature change, and area change and region deviate,
The second step to the 4th step need to repeat at least three times, further include generating quality according to testing result after the 4th step
The step of report.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026596.3A CN105445649B (en) | 2015-12-30 | A kind of detection method based on the equipment of device in detection circuit board and its plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201511026596.3A CN105445649B (en) | 2015-12-30 | A kind of detection method based on the equipment of device in detection circuit board and its plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105445649A CN105445649A (en) | 2016-03-30 |
| CN105445649B true CN105445649B (en) | 2019-07-16 |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101832950A (en) * | 2010-04-28 | 2010-09-15 | 深圳创维－Rgb电子有限公司 | PCB quality detection method, system and device |
| CN102183545A (en) * | 2011-01-31 | 2011-09-14 | 哈尔滨工业大学 | Infrared temperature measurement detection method for detecting solder joint reliability of circuit board |
| CN102183542A (en) * | 2011-01-31 | 2011-09-14 | 哈尔滨工业大学 | System for detecting solder joint reliability of circuit board by using infrared multipoint temperature measuring heat resistance method |
| CN103675595A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Short circuit detecting method for inner-layer circuit and outer-layer circuit of circuit board |
| CN204649634U (en) * | 2015-03-30 | 2015-09-16 | 华南理工大学 | A kind of infrared imaging pick-up unit for surface-mounted devices |
| CN103399248B (en) * | 2013-07-18 | 2015-09-23 | 江苏物联网研究发展中心 | PCB defect batch inspection system and method |
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101832950A (en) * | 2010-04-28 | 2010-09-15 | 深圳创维－Rgb电子有限公司 | PCB quality detection method, system and device |
| CN102183545A (en) * | 2011-01-31 | 2011-09-14 | 哈尔滨工业大学 | Infrared temperature measurement detection method for detecting solder joint reliability of circuit board |
| CN102183542A (en) * | 2011-01-31 | 2011-09-14 | 哈尔滨工业大学 | System for detecting solder joint reliability of circuit board by using infrared multipoint temperature measuring heat resistance method |
| CN103399248B (en) * | 2013-07-18 | 2015-09-23 | 江苏物联网研究发展中心 | PCB defect batch inspection system and method |
| CN103675595A (en) * | 2013-12-11 | 2014-03-26 | 广州兴森快捷电路科技有限公司 | Short circuit detecting method for inner-layer circuit and outer-layer circuit of circuit board |
| CN204649634U (en) * | 2015-03-30 | 2015-09-16 | 华南理工大学 | A kind of infrared imaging pick-up unit for surface-mounted devices |
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