CN204649634U - A kind of infrared imaging pick-up unit for surface-mounted devices - Google Patents
A kind of infrared imaging pick-up unit for surface-mounted devices Download PDFInfo
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- CN204649634U CN204649634U CN201520185110.XU CN201520185110U CN204649634U CN 204649634 U CN204649634 U CN 204649634U CN 201520185110 U CN201520185110 U CN 201520185110U CN 204649634 U CN204649634 U CN 204649634U
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Abstract
The utility model discloses a kind of infrared imaging pick-up unit for surface-mounted devices, improves the image capture module be used in precise electronic surface-mounted devices.Precise electronic assembling is the important manufacture field promoting the particularly portable electronic information such as notebook, the mobile phone production development of whole electronics and information industry always, surface mounting technology SMT equipment is the precision manufactureing equipment various chip components and parts being mounted printing board PCB or is attached to by nude film on base plate for packaging, achieve the high density of electronic product assembling, highly reliable, low cost and the production automation, drive the development of the multinomial electronic technology such as computing machine, medical electronics.The utility model uses the method for infrared lens and the collaborative work of ordinary optical camera lens, gather the infrared image of components and parts, utilize the material temperature difference of components and parts diverse location, obtain the chip image that contrast is high, be easy to identification, improve the degree of accuracy of components and parts defects detection, reach accurate detection, the effect of attachment at a high speed.
Description
Technical field
The utility model relates to the technical field of infrared imaging, particularly a kind of infrared imaging pick-up unit for surface-mounted devices.
Background technology
Because electron trade is to the pursuit of miniaturization of electronic products, multifunction, various high-density packages element is widely used in electronic product assembling.Current surface patch Resistor-Capacitor Unit size has reached 01005 encapsulation standard, IC packaging pin fine-pitch, the packing forms upgraded, as SOC (system level chip), Flip Chip (flip-chip) and various high-end special-shaped device, is had higher requirement to placement accuracy and packaging and testing technique especially 3D Inner Defect Testing.
At present, the test mode that encapsulation and assembling process adopt has multiple, wherein widely used is automatic optics inspection AOI (Automatic Optical Inspection), and other test mode also has the modes such as artificial visual detection, flying needle formula on-line checkingi and needle bed-type on-line checkingi.But because the integrated level of Electronic Assemblies is more and more higher, above-mentioned detection method has been difficult to the requirement meeting high density circuit board measuring accuracy.
In order to the requirement of the Inner Defect Testing precision that the processes such as 2D and 3D encapsulation occur can be met, improve the work efficiency of whole Electronic Packaging production line, infrared lens can be utilized in conjunction with the detection method of common lens, the infrared image that acquisition for contrast is high is used as analyzing and processing, take less storage space, meet the requirement in detection system precision and speed simultaneously.
Utility model content
The purpose of this utility model is that the shortcoming overcoming prior art is with not enough, provides a kind of infrared imaging pick-up unit for surface-mounted devices.Under mainly utilizing infrared image to carry out the prerequisite detecting judgement, add the detection combination of ordinary optical camera lens and visible LED light source, improve the degree of accuracy of components and parts defects detection.
The purpose of this utility model is achieved through the following technical solutions:
A kind of infrared imaging pick-up unit for surface-mounted devices, described device comprises: image acquisition units, sensor unit and computer processing unit, wherein, described image acquisition units for gathering the surface reflection light signal of target element device, and transfers to coupled sensor unit; The target element device surface reflected light signal of collection is converted to electric signal image by described sensor unit, and transfers to coupled computer processing unit; Described computer processing unit controls the image acquisition units that is attached thereto and the electric signal image of receiving target components and parts, by corresponding image processing algorithm and after mating with the components and parts template of standard, can judge the defect situation of target element device.
Preferably, described image acquisition units comprises: lighting module, lens group module and objective table, and wherein, described objective table is used for drop target components and parts; Described lens group module comprises infrared lens and ordinary optical camera lens, is all positioned at the top of objective table; Described lighting module comprises infrared light supply and visible LED light source, and wherein, infrared light supply is placed on below objective table, and visible LED light source is placed on above objective table or oblique upper.
Preferably, described infrared light supply adopts and throws light on dorsad, and visible LED light source adopts front illumination.
Preferably, described infrared light supply adopts multiple heat radiation infrared light supply luminophor, and described visible LED light source adopts the LED illuminator that the exposure intensity of multiple different colours is high.
Preferably, multiple infrared light supply luminophors of described infrared light supply are integrated in same plane or are integrated into being conducive in the cambered surface of optically focused of band radian.
Preferably, multiple LED illuminator of described visible LED light source are integrated in same plane or are integrated into being conducive in the cambered surface of optically focused of band radian.
Preferably, described lens group module is that one or more infrared lens and the combination of one or more ordinary optical camera lenses are formed, and the arrangement mode of above-mentioned infrared lens and ordinary optical camera lens can form surface that is straight, curved or that have inclination angle, and be gapless arrangement or the arrangement with gap between each camera lens.
Preferably, described infrared light supply and visible LED light source are all one or more combinations.
Preferably, described computer processing unit comprises ON-OFF control circuit, and this computer processing unit is connected with light source module with the lens group module in described image acquisition units by ON-OFF control circuit.
Preferably, described ON-OFF control circuit is for controlling described infrared light supply and visible LED light source, and the gauge tap of described infrared light supply all remains closed within the non-generic optical lens working time, the gauge tap of described visible LED light source is controlled the shutter collaborative work of response command and described ordinary optical camera lens according to described computer processing unit by described ON-OFF control circuit.
The utility model has following advantage and effect relative to prior art:
1) in surface-assembled is produced, infrared imaging pick-up unit disclosed in the utility model is used, by the combination of infrared imaging and ordinary optical imaging acquisition system, the image that shooting infrared image is different with visible images two kinds, the defects detection of high-accuracy high-resolution can be carried out to microsize chip, multi-pipe pin chip, flip-chip etc., the storage space of minimizing system, improves speed of production.
2) utilize infrared image and visual image fusion technology, the components and parts image that sharpness is higher can be obtained, improve the accuracy detected.
Accompanying drawing explanation
Fig. 1 is the structural representation of the utility model for the infrared imaging pick-up unit of surface-mounted devices;
Fig. 2 is the structural representation of the utility model for image acquisition units in the infrared imaging pick-up unit of surface-mounted devices;
Fig. 3 is the infrared light supply structural representation of image acquisition units in the utility model;
Fig. 4 is the structural representation of the visible LED light source of image acquisition units in the utility model;
Fig. 5 is the lens arrangement schematic diagram of the lens group module of image acquisition units in the utility model;
Fig. 6 is the workflow diagram of the utility model for the infrared imaging pick-up unit of surface-mounted devices;
1-lens group module, 2-visible LED light source, 3-chip to be measured, 4-objective table, 5-infrared light supply, 6-infrared lens, 7-ordinary optical camera lens.
Embodiment
For making the purpose of this utility model, technical scheme and advantage clearly, clearly, referring to the accompanying drawing embodiment that develops simultaneously, the utility model is described in further detail.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Embodiment
Present embodiment discloses a kind of infrared imaging pick-up unit for surface-mounted devices, concrete structure is as formed shown in schematic diagram for the structure of the infrared imaging pick-up unit of surface-mounted devices in Fig. 1, as can be seen from Figure 1, this device comprises: image acquisition units, sensor unit and computer processing unit, wherein image acquisition units is for gathering the surface reflection light signal of target element device, and transfers to coupled sensor unit; The target element device surface reflected light signal of collection is converted to electric signal image by sensor unit, and transfers to coupled computer processing unit; Described computer processing unit controls the image acquisition units that is attached thereto and the electric signal image of receiving target components and parts, by corresponding image processing algorithm and after mating with the components and parts template of standard, can judge the defect situation of chip.
Image acquisition units, comprises lighting module, lens group module and objective table, and wherein target element device (chip 3 to be measured) is positioned over the image-acquisition area on objective table 4; Lens group module 1 comprises infrared lens 6 and ordinary optical camera lens 7, is positioned at the top of objective table, in the present embodiment they cooperatively interact, collaborative work.Infrared lens can collect the high components and parts infrared image of contrast in insufficient light space, judges the defect situation of chip fast; Ordinary optical camera lens is for coordinating the work of visible LED light source synchronous, and once glisten acquisition image.This device can detect separately through the infrared image of infrared lens photographic subjects components and parts, also can be merged by the visible images of the infrared image of infrared lens and ordinary optical lens shooting, detects the image after merging.
Lighting module comprises infrared light supply 5 and visible LED light source 2, and they used in the time period of different acquisition target element device image.
Infrared light supply is poor for the temperature difference and radiation strengthening components and parts diverse location, outstanding image object feature.Light filling when visible LED light source is for coordinating ordinary optical camera lens to take pictures.
Infrared light supply is placed on below objective table, and visible LED light source is placed on above objective table or oblique upper, can be one or more combinations, and infrared light supply adopts and throws light on dorsad, and visible LED light source adopts front illumination.
Infrared light supply can choice for use heat radiation infrared light supply; Visible LED light source can choice for use white or the higher light source of other exposure intensities (such as red, blue etc.).Its mid-infrared light source needs first to carry out preheating before this infrared image pick-up unit formally carries out testing, and testing environment is remained in uniform temperature.
The above-mentioned different camera mentioned and light source can be used as integrated equipment collaborative work, gather two kinds of different images of single target.
As shown in Figure 4, multiple LED illuminator of visible LED light source according to queue latticed form ordered arrangement together, forming the assorted LED light source luminophor of a plane, can be integrated in luminophor in same plane, also can be integrated into the luminophor being conducive to optically focused of band radian.
As shown in Figure 3, multiple infrared illuminants of infrared light supply can be integrated in luminophor in same plane, also can be integrated into the luminophor being conducive to optically focused of band radian.
The arrangement mode of infrared lens and first two camera lens of ordinary optical mirror does not limit and forms straight surface, this camera lens face can be to include numerous forms, as can be curved or there is inclination angle according to this camera lens face of actual conditions, and also can have certain gap by close-packed arrays between camera lens.It is exactly a kind of lens arrangement schematic diagram of the lens group module of image acquisition units in the present embodiment shown in Fig. 5.Under actual conditions, lens group module can be that multiple infrared lens and the combination of multiple ordinary optical camera lens are formed.
The different image of target element device two kinds can be obtained by two kinds of different camera lenses.Alone infrared image can reduce required storage space as examination criteria, accelerates the travelling speed of system.Carry out image co-registration in conjunction with visible images and can obtain the higher image of sharpness, improve the precision of chip internal defects detection.
Computer processing unit, for obtaining the analyzing and processing of image, controls the duty of sensor unit, lens group module and light source light source by exporting response command.Because computer processing unit is the duty regulating sensor and/or camera lens according to the control signal of external unit input, so this device always works in comparatively ideal state, ensure that the Dynamic Signal gathering and export is accurate.
Wherein, computer processing unit comprises an ON-OFF control circuit, and computer processing unit is connected with light source module with the lens group module in image acquisition units by ON-OFF control circuit.Wherein, ON-OFF control circuit must control visible LED light source and ordinary optical camera lens according to computing machine response command simultaneously.
The luminophor of infrared light supply luminophor and the visible LED light source array composition such as (red, white) is controlled by an ON-OFF control circuit respectively, and the control circuit of infrared light supply all remains closed within the non-generic optical lens working time.The switch of visible LED light source controls response command and the collaborative work of ordinary optical front shutter by ON-OFF control circuit according to computing machine, now disconnects infrared light supply control circuit, obtains components and parts visible images.Then take the infrared image that obtains and visible images by sensor by the image uploading that obtains to rgb signal collector, finally view data is submitted to computer processing unit and carries out data and image processing.
Be the workflow diagram of the utility model for the infrared imaging pick-up unit of surface-mounted devices shown in Fig. 6, the job step knowing this pick-up unit can be known from Fig. 6, specific as follows:
S1, the shutter frequency of temporal frequency setting infrared lens as requested and the switching requirements to visible LED array of source and infrared light supply array, infrared light supply is in open mode always.
S2, when target object enters image acquisition link, infrared lens is taken, and obtains components and parts infrared image, is sent in signal picker by sensor unit.
S3, the image in signal picker is sent in computer processing unit carry out processing, template matches, existing defects is judged whether by Computer Image Processing algorithm, if zero defect, complete judgement and enter the detection of next components and parts, otherwise send control command by computing machine, close infrared light supply array, open visible LED array of source.
S4, while opening LED light source array, ordinary optical camera lens obtains visible images, send into computing machine through corresponding sensor and rgb signal collector to process, infrared image and corresponding visible images are merged, more clear, that contrast is higher target image can be obtained, reach higher accuracy of detection.
The utility model is irradiated target element device by infrared light supply, the temperature contrast that ultrared heat radiation can cause chip and pin thereof to produce because material is different.The infrared radiation ability of different temperatures is different, therefore can obtain clear, that contrast is high target element device infrared image.Storage space needed for infrared image is little, effectively can improve the travelling speed of system and detect the production efficiency of assembling.
The utility model, under mainly utilizing infrared image to carry out the prerequisite detecting judgement, adds the detection combination of ordinary optical camera lens and visible LED light source.Under infrared image cannot accurately judge chip defect situation by extraneous factor interference, the visible images of width components and parts can be obtained more, infrared image and visible images are merged, generate a width information more comprehensively, accurate and stable new images, contain the complementary information of two kinds of images simultaneously.To solve in traditional surface-mounting equipment, single image carries out the deficiency of image recognition.
Above-described embodiment is the utility model preferably embodiment; but embodiment of the present utility model is not restricted to the described embodiments; change, the modification done under other any does not deviate from Spirit Essence of the present utility model and principle, substitute, combine, simplify; all should be the substitute mode of equivalence, be included within protection domain of the present utility model.
Claims (10)
1. for an infrared imaging pick-up unit for surface-mounted devices, it is characterized in that, described device comprises: image acquisition units, sensor unit and computer processing unit, wherein,
Described image acquisition units for gathering the surface reflection light signal of target element device, and transfers to coupled sensor unit;
The target element device surface reflected light signal of collection is converted to electric signal image by described sensor unit, and transfers to coupled computer processing unit;
Described computer processing unit controls the image acquisition units that is attached thereto and the electric signal image of receiving target components and parts.
2. a kind of infrared imaging pick-up unit for surface-mounted devices according to claim 1, it is characterized in that, described image acquisition units comprises: lighting module, lens group module and objective table, wherein,
Described objective table is used for drop target components and parts;
Described lens group module comprises infrared lens and ordinary optical camera lens, is all positioned at the top of objective table;
Described lighting module comprises infrared light supply and visible LED light source, and wherein, infrared light supply is placed on below objective table, and visible LED light source is placed on above objective table or oblique upper.
3. a kind of infrared imaging pick-up unit for surface-mounted devices according to claim 2, is characterized in that, described infrared light supply adopts and throws light on dorsad, and visible LED light source adopts front illumination.
4. a kind of infrared imaging pick-up unit for surface-mounted devices according to claim 2, it is characterized in that, described infrared light supply adopts multiple heat radiation infrared light supply luminophor, and described visible LED light source adopts the LED illuminator that the exposure intensity of multiple different colours is high.
5. a kind of infrared imaging pick-up unit for surface-mounted devices according to claim 4, is characterized in that, multiple infrared light supply luminophors of described infrared light supply are integrated in same plane or are integrated into being conducive in the cambered surface of optically focused of band radian.
6. a kind of infrared imaging pick-up unit for surface-mounted devices according to claim 4, is characterized in that, multiple LED illuminator of described visible LED light source are integrated in same plane or are integrated into being conducive in the cambered surface of optically focused of band radian.
7. a kind of infrared imaging pick-up unit for surface-mounted devices according to claim 2, it is characterized in that, described lens group module is that one or more infrared lens and the combination of one or more ordinary optical camera lenses are formed, and the arrangement mode of above-mentioned infrared lens and ordinary optical camera lens can form surface that is straight, curved or that have inclination angle, and be gapless arrangement or the arrangement with gap between each camera lens.
8., according to the arbitrary described a kind of infrared imaging pick-up unit for surface-mounted devices of claim 2 to 7, it is characterized in that, described infrared light supply and visible LED light source are all one or more combinations.
9. a kind of infrared imaging pick-up unit for surface-mounted devices according to claim 8, it is characterized in that, described computer processing unit comprises ON-OFF control circuit, and this computer processing unit is connected with light source module with the lens group module in described image acquisition units by ON-OFF control circuit.
10. a kind of infrared imaging pick-up unit for surface-mounted devices according to claim 9, it is characterized in that, described ON-OFF control circuit is for controlling described infrared light supply and visible LED light source, and the gauge tap of described infrared light supply all remains closed within the non-generic optical lens working time, the gauge tap of described visible LED light source is controlled the shutter collaborative work of response command and described ordinary optical camera lens according to described computer processing unit by described ON-OFF control circuit.
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| CN201520185110.XU CN204649634U (en) | 2015-03-30 | 2015-03-30 | A kind of infrared imaging pick-up unit for surface-mounted devices |
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| CN201520185110.XU CN204649634U (en) | 2015-03-30 | 2015-03-30 | A kind of infrared imaging pick-up unit for surface-mounted devices |
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| CN105445649A (en) * | 2015-12-30 | 2016-03-30 | 深圳市创科自动化控制技术有限公司 | Equipment and method for detecting circuit board and device on circuit board |
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| CN107741425A (en) * | 2017-10-31 | 2018-02-27 | 华南理工大学 | A kind of surface defect real-time detection apparatus for increasing material manufacturing |
| CN108693462A (en) * | 2018-06-13 | 2018-10-23 | 奇酷互联网络科技（深圳）有限公司 | Circuit board detecting method, system, readable storage medium storing program for executing, equipment and circuit board |
| CN108732507A (en) * | 2018-05-21 | 2018-11-02 | 中国科学技术大学 | A kind of lithium battery defect detecting device based on battery temperature field and visible images |
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| CN110487803A (en) * | 2019-08-20 | 2019-11-22 | Oppo（重庆）智能科技有限公司 | The defect inspection method and device of infrared light-emitting component |
| CN110596141A (en) * | 2019-09-25 | 2019-12-20 | 无锡乐东微电子有限公司 | Defect detection device and method for semiconductor chip |
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| CN105445649A (en) * | 2015-12-30 | 2016-03-30 | 深圳市创科自动化控制技术有限公司 | Equipment and method for detecting circuit board and device on circuit board |
| CN105445649B (en) * | 2015-12-30 | 2019-07-16 | 深圳市创科自动化控制技术有限公司 | A kind of detection method based on the equipment of device in detection circuit board and its plate |
| CN105678793B (en) * | 2016-02-26 | 2019-01-15 | 浙江大学 | A kind of method of early diagnosis and device of the Prospect on Kiwifruit Bacterial Canker based on image co-registration |
| CN105678793A (en) * | 2016-02-26 | 2016-06-15 | 浙江大学 | Image-fusion-based early diagnosis method and apparatus for kiwifruit canker |
| CN107741425A (en) * | 2017-10-31 | 2018-02-27 | 华南理工大学 | A kind of surface defect real-time detection apparatus for increasing material manufacturing |
| CN108732507A (en) * | 2018-05-21 | 2018-11-02 | 中国科学技术大学 | A kind of lithium battery defect detecting device based on battery temperature field and visible images |
| CN108693462A (en) * | 2018-06-13 | 2018-10-23 | 奇酷互联网络科技（深圳）有限公司 | Circuit board detecting method, system, readable storage medium storing program for executing, equipment and circuit board |
| CN109100364A (en) * | 2018-06-29 | 2018-12-28 | 杭州国翌科技有限公司 | A kind of tunnel defect monitoring system and monitoring method based on spectrum analysis |
| CN110487803A (en) * | 2019-08-20 | 2019-11-22 | Oppo（重庆）智能科技有限公司 | The defect inspection method and device of infrared light-emitting component |
| CN110596141A (en) * | 2019-09-25 | 2019-12-20 | 无锡乐东微电子有限公司 | Defect detection device and method for semiconductor chip |
| CN112558244A (en) * | 2020-12-28 | 2021-03-26 | 武汉光迅科技股份有限公司 | Method and device for flip coupling of optical chip |
| CN112558244B (en) * | 2020-12-28 | 2022-06-17 | 武汉光迅科技股份有限公司 | Method and device for flip coupling of optical chip |
| CN113218341A (en) * | 2021-05-21 | 2021-08-06 | 哈尔滨理工大学 | Cable turning type infrared eccentricity detection device and detection method |
| CN113218340A (en) * | 2021-05-21 | 2021-08-06 | 哈尔滨理工大学 | Light-variable type eccentricity detection device and detection method for small-diameter cable |
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