CN101136346A - Chip welding spot on-line detecting, defect identification device and chip packaging device - Google Patents
Chip welding spot on-line detecting, defect identification device and chip packaging device Download PDFInfo
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- CN101136346A CN101136346A CNA2007100300006A CN200710030000A CN101136346A CN 101136346 A CN101136346 A CN 101136346A CN A2007100300006 A CNA2007100300006 A CN A2007100300006A CN 200710030000 A CN200710030000 A CN 200710030000A CN 101136346 A CN101136346 A CN 101136346A
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Abstract
This invention provides an on-line test for chip solder joints and a package device including a test platform, an image collecting device, an image processing device and a front interface, in which, said platform for processing chips and testing samples is connected with the chip package device via the front interface and is capable of heating the sample, said image collecting device is set above the platform and set with an infrared thermal imaging system to pick up thermal images of the sample, said image process system includes a central processor for processing the thermal images of the sample picked up by the collecting image to judge solder joints of the sample.
Description
Technical field
The present invention relates to the detection of chip welding spot, and the encapsulation technology of chip.
Technical background
Integrated circuit (as the IC element), electronics (as the HEMT element) and photoelectron (as the LED element) components and parts all need Chip Packaging on shell, this encapsulation or adopt the elargol isocolloid directly to be bonded on the shell, or adopt eutectic weldering, flip chip bonding scolders such as (face of weld or solder bumps) directly to be welded on the shell.Adhesive surface had both played the effect of fixed chip, and again as chip and outside electrical interconnection passage and heat transfer path, so the quality of adhesive surface will have a strong impact on the performance of packaging.Owing to reasons such as actual process or operations, adhesive surface tends to occur defectives such as cavity, bubble, layering, for guaranteeing electronic product quality stability and reliability, the adhesive surface of the electronic product chip after encapsulating detected is very important.Can reject the chip of imperfect bonding according to testing result, also can improve original technology according to the bonding situation.
And adhesive surface is often covered below chip, is difficult to observation.Adhesive surface quality detection method commonly used has two kinds of nondestructive, destructive detections.Nondestructive testing method mainly contains the X-ray detection and ultrasonic wave (C-SAM) detects two kinds.It is to utilize the penetrable material of X ray and have the characteristic of decay to find defective in material that X-ray detects, and mainly detects the solder joint internal flaw, as BGA, CSP and FC solder joint etc.The X-ray ray detection is as a lot of company's production lines and breadboard automated solder point checkout equipment, but the X-ray ray detector is too expensive, and harmful, also needs the operator to have stronger experience simultaneously.Ultrasound examination is to utilize ultrasonic beam can penetrate the depths of metal material, when entering another cross section by a cross section, detects the defective of solder joint in the characteristics of interface edge generation reflection.Ultrasonic wave from the solder joint surface enters metal inside, when running into defective and solder joint bottom reflex will take place, and reflected beam is collected formed impulse waveform on the phosphor screen, judges position, size and the character of defective according to the characteristics of waveform.Advantages such as though ultrasound examination is highly sensitive, easy to operate, check speed is fast, cost is low, harmless, but defective is carried out qualitative and quantitative judgement to be remained in difficulty, chip need be placed when detecting simultaneously and reach the location under water, and need successively scan and select correct ultrasonic signal, be unfavorable for the system integration.The destructive detection be that solder joint is carried out mechanical destruction, checks defective from its intensity and the plane of disruption.Evaluation index commonly used has hot strength, peel strength and shear strength.Because it is impossible that all products are detected, so can only carry out an amount of sampling observation.
Thermal imaging detects when element is worked, and is subjected to thermal excitation, and heat portion within it transmits, when there is defective in element internal, will change the thermal conduction characteristic on surface, the change of thermal conduction characteristic will cause heat distribution to change, thereby makes the temperature generation difference of body surface.Detect this temperature contrast of body surface with thermal infrared imager, form heat picture, can judge in view of the above whether detected element exists the situation of defective and defective.Yet existing this method often is used in the thermal performance test in flip chip bonding, the BGA encapsulation and reprocesses in the technology, and the technology controlling and process in reprocessing in order to raising also reduces and reprocesses cost, and it is unfavorable for that large-scale chip detects and the system integration in real time.
Summary of the invention
The objective of the invention is to the problem that exists in traditional detection technique, proposed a kind of based on the online detection of realization solder joint of thermal imaging detection principle and the method and apparatus of defect identification, this method is simple, can be used as the rear end detection part of large automatic sealed in unit, be suitable for large-scale industrial production.
Another object of the present invention is to provide a kind of chip encapsulating device that can online detection.
In order to realize goal of the invention one, the technical scheme of employing is as follows:
Online detection of a kind of chip welding spot and defect identification device comprise detection platform, image collecting device, image processing system, front end interface; Described detection platform is as the platform of process chip test sample, and it is connected with chip encapsulating device by front end interface, and can make the test sample heating; Described image collector is arranged in the detection platform top, and it is provided with thermal infrared imager, with the heat picture of picked-up sample; Described image processing system is provided with central processing unit, by central processing unit the sample heat picture that image collecting device absorbed is handled to differentiate the solder joint of sample.
Surface temperature image when the present invention adopts the chip component work of infrared heat image instrument measuring encapsulation back, by to potted element owing to reasons such as welding point defect cause the variation of surface temperature field, by image processing, thereby obtain the defect situation of chip.
Front end interface as with the bridge that is connected of front end package assembling, each solder joint detection platform parts is integrated by front end interface and front end package assembling, and the front end package assembling has multiple packing forms: comprise various chips consolidation styles such as bondings such as eutectic welding, elargol heat-conducting glue, flip chip bonding solder joint are fixed.
And described detection platform comprises electric power driving module, chip classifying module, temperature control modules.Detection platform is responsible for handling the chip sample that sends from front end, and electric power driving module is the drive source as specimen, and this drive source is carried on the testing element by cantilever probe.The chip classifying module is because temperature reaches stable state and needs certain hour, in order to adapt to front end envelope capacity at a high speed, and batch measuring technique that on test platform, adopts.Temperature control modules is to control the residing platform of each potted element on identical temperature, and this temperature control modules can be in test platform identical temperature value.
Image processing system mainly is to handle by the hygrogram that thermal infrared imager is taken, and all temps criterion according to the user sets has flawless judgement as chip.Described image processing system comprises three kinds of tupes:
Pattern 1 is for to judge fast that by the temperature value of chip key position chip has zero defect;
Pattern 2 is for carrying out criterion in the temperature field of chip surface, and the defective of the variation butt welding point adhesive surface by the chip surface temperature field is carried out analyzing and positioning;
Mode 3 is by determining the emissivity of each material of chip, by image processing, and the Temperature Distribution when obtaining this chip operation.
Pattern 1 is for to judge fast that by the temperature value of chip key position chip has flawless judgement, the defective of chip attach face can cause the temperature rise of chip surface, by temperature criterion to the same key position of chip in the visual field, this temperature criterion is set the acceptable temperature range, temperature exceeds this interval, and it is unusual to think that just chip attach exists.In addition, also can on chip, select a plurality of key positions to set criterion.There is unusual chip in mark, can select to enter feedback fraction, or defect analysis and defect location are carried out in the position that enters 2 pairs of defective chips of pattern.Pattern 2 is to carry out criterion in the temperature field of chip surface, variation by the chip surface temperature field is carried out analyzing and positioning to the defective of adhesive surface, the position of (being hotspot) but of mark defective chip maximum temperature, the Two dimensional Distribution of defective chip surface temperature field and good chip surface temperature field difference can be determined the welding point defect position, this position is that temperature maximum or temperature gradient change maximum position, in addition also can be the mean temperature of chip surface as the defective criterion, binding pattern 1 analysis chip defective.Mode 3 is the higher level operation pattern, adopts this pattern can obtain the actual temperature value of chip, can obtain the parameter of the thermal properties such as thermal resistance of this chip to the analysis of chip actual temperature.This pattern can pass through to determine the emissivity of each material of chip, by image processing, and the Temperature Distribution when obtaining this chip operation.
Described image collecting device also is provided with the ccd image pickup apparatus.
So far, image collecting device comprises ccd image collection and IR Camera infra-red thermal imaging instrument system, and the ccd image acquisition system is carried out chip location and automatic measurement, and IR Camera thermal infrared imager is the interior chip sample surface temperature of acquisition field of view then.
The operation principle of image collecting device is: CCD and IR Camera adjust focal length automatically, pattern in the CCD acquisition field of view, the user determines chip position according to gathering pattern, can be by the user directly selected or image discern automatically, simultaneously behind the IR Camera setup parameter, record heat picture at this moment, the chip locating information and the heat picture of ccd image store in the computer, change image processing operations over to.As on detection platform, introducing some locating information, determine the position of heat picture chips can not need to adopt CCD to carry out the parts of chip location by feature locations.In addition, IR Camera selects the high camera lens of spatial resolution for use, and the visual field can diminish, and in order to measure the temperature pattern in the whole visual field, IR Camera can move in the focal length plane, merges the thermal map sample of position, just can obtain the temperature pattern in the whole visual field.
Online detection of chip welding spot of the present invention and defect identification device, also include feedback device, described feedback device is judged the chip that has defective to image processing system, and the particular location of the determined defective chip of image collecting device, adopts mechanical transmission component to reject defective chip.
In order to realize goal of the invention two, the technical scheme of employing is as follows:
A kind of chip packaging device comprises sealed in unit and checkout equipment, and described checkout equipment comprises detection platform, image collecting device, image processing system, front end interface, and checkout equipment is connected with sealed in unit by front end interface.
In the chip packaging device of the present invention, sealed in unit can adopt existing mature equipment, and is connected with checkout equipment by front end interface, realizes that online detection and the defective in the encapsulation process judges that checkout equipment adopts the technical scheme of goal of the invention one.
Solder joint online detection instrument of the present invention, simple, safe and reliable, be applicable to the adhesive surface quality testing of most of Chip Packaging; It is integrated into the front end package assembling easily simultaneously, is applicable to large-scale industrial production, and cheap.Online detection instrument is by causing surface temperature field difference owing to the chip attach defective to detected element in encapsulation process, the heat picture that utilizes thermal imager to form carries out the detected element bonding defect and detects and defect analysis.It comprises measuring component, thermal infrared imager and image processing and reponse system simultaneously, can be integrated into the rear end detection part of large-scale sealed in unit.This equipment adopts noncontact Dynamic Non-Destruction Measurement, automaticity height.
Description of drawings
Fig. 1 is online detection of infrared thermal imaging solder joint and defect identification device structure schematic diagram;
Fig. 2 is an image capturing system operation principle schematic diagram;
Fig. 3 is an image processing system operation principle schematic diagram.
Embodiment
The present invention is described further below in conjunction with accompanying drawing.
Online detection of the present invention and defect identification device structure schematic diagram as shown in Figure 1, by front end interface, detection platform, image collecting device, the several parts of image processing system and feedback device are formed; Front end interface as with the bridge that is connected of front end package assembling, each solder joint detection platform parts is integrated by front end interface and front end package assembling; Detection platform is responsible for handling the chip sample that sends from front end; Image collecting device comprises ccd image collection and IR Camera infra-red thermal imaging instrument system, and the ccd image acquisition system is carried out chip location and automatic measurement, and IR Camera thermal infrared imager is the interior chip sample surface temperature of acquisition field of view then; Image processing section mainly is to handle by the hygrogram that IR Camera is taken, and all temps criterion according to the user sets has flawless judgement as chip; The chip that has defective in the marking image treatment system enters feedback fraction then, adopts mechanical transmission component to reject defective chip.
In the critical component image capturing system and image processing system involved in the present invention, the operation principle of image capturing system as shown in Figure 2.CCD and IR Camera adjust focal length automatically, pattern in the CCD acquisition field of view, the user determines chip position according to gathering pattern, can be by the user directly selected or image discern automatically, simultaneously behind the IR Camera setup parameter, record heat picture at this moment, the chip locating information and the heat picture of ccd image store in the computer, change image processing operations over to.As on detection platform, introducing some locating information, determine the position of heat picture chips can not need to adopt CCD to carry out the parts of chip location by feature locations.In addition, IR Camera selects the high camera lens of spatial resolution for use, and the visual field can diminish, and in order to measure the temperature pattern in the whole visual field, IR Camera can move in the focal length plane, merges the thermal map sample of position, just can obtain the temperature pattern in the whole visual field.
The operation principle of image processing system of the present invention as shown in Figure 3.After reading the locating information and hygrogram of chip, the selection operation pattern, pattern 1 is for to judge fast that by the temperature value of chip key position chip has flawless judgement, the defective of chip attach face can cause the temperature rise of chip surface, by temperature criterion to the same key position of chip in the visual field, this temperature criterion is set the acceptable temperature range, and temperature exceeds this interval, and it is unusual to think that just chip attach exists.In addition, also can on chip, select a plurality of key positions to set criterion.There is unusual chip in mark, can select to enter feedback fraction, or defect analysis and defect location are carried out in the position that enters 2 pairs of defective chips of pattern.Pattern 2 is to carry out criterion in the temperature field of chip surface, variation by the chip surface temperature field is carried out analyzing and positioning to the defective of adhesive surface, the position of (being hot spot) but of mark defective chip maximum temperature, the Two dimensional Distribution of defective chip surface temperature field and good chip surface temperature field difference can be determined the welding point defect position, this position is that temperature maximum or temperature gradient change maximum position, in addition also can be the mean temperature of chip surface as the defective criterion, binding pattern 1 analysis chip defective.Mode 3 is the higher level operation pattern, adopts this pattern can obtain the actual temperature value of chip, can obtain the parameter of the thermal properties such as thermal resistance of this chip to the analysis of chip actual temperature.This pattern can pass through to determine the emissivity of each material of chip, by image processing, and the Temperature Distribution when obtaining this chip operation.
The led chip of 1mm * 1mm size of utilizing the present invention to detect salient point flip chip bonding mode to encapsulate, the detection platform bottom temp is set at 50 ℃, the injection operating current is 350mA, the surface temperature of IR Camera record chip, in the temperature pattern of sample 1, the surface maximum temperature is 69.3 ℃, and sample 1 solder side is intact; In the temperature pattern of sample 2, surperficial maximum temperature is 103.2 ℃, and the surface temperature field display surface exists remarkable temperature rise and thermal region (hot spot); In the temperature pattern of sample 3, surperficial maximum temperature is 111.6 ℃, and the surface temperature field display surface exists remarkable temperature rise and thermal region (hot spot); Use traditional solder joint detection mode ultrasonic wave (C-SAM) to come the chip defect position is positioned then, C-SAM figure by three sample chip, the quantity of welding point defect is many more, and the temperature rise of surface temperature field is big more, and the maximum temperature position of surface temperature field appears at the position of welding point defect.This explanation utilizes chip surface variations in temperature (as temperature rise, thermal region) to predict that the adhesive surface defective is feasible.For the flip-chip of other salient point mode (as slicker solder salient point, golden tin salient point etc.) encapsulation, bga chip etc., all can adopt this method to judge.
Utilize the present invention to detect the high-power LED chip that the eutectic solder mode encapsulates, the detection platform bottom temp is set at 50 ℃, the injection operating current is 350mA, the surface temperature of IR Camera record chip, this chip surface is with metal electrode, and metal electrode presents different temperatures because emissivity is different on thermography, in the temperature pattern of sample 1, the surface maximum temperature is 53 ℃, and sample 1 solder side is intact; In the temperature pattern of sample 2, surperficial maximum temperature is 60 ℃, and there is big temperature rise in the surface temperature field display surface; Choose pattern 1, the center as the temperature criterion, is judged that by the temperature range of this position it is feasible that chip has zero defect.For the chip of other scolder or colloid mode (as terne metal, gold-tin alloy, elargol, heat-conducting glue etc.) encapsulation etc., all can adopt this method to judge.
Claims (6)
1. online detection of chip welding spot and defect identification device is characterized in that comprising detection platform, image collecting device, image processing system, front end interface;
Described detection platform is as the platform of process chip sample, and it is connected with chip encapsulating device by front end interface, and can make the test sample heating;
Described image collector is arranged in the detection platform top, and it is provided with thermal infrared imager, with the heat picture of picked-up sample;
Described image processing system is provided with central processing unit, by central processing unit the sample heat picture that image collecting device absorbed is handled to differentiate the solder joint of sample.
2. online detection of chip welding spot according to claim 1 and defect identification device is characterized in that described detection platform comprises electric power driving module, chip classifying module, temperature control modules.
3. online detection of chip welding spot according to claim 1 and 2 and defect identification device is characterized in that described image processing system comprises three kinds of tupes:
Pattern 1 is for to judge fast that by the temperature value of chip key position chip has zero defect;
Pattern 2 is for carrying out criterion in the temperature field of chip surface, and the defective of the variation butt welding point adhesive surface by the chip surface temperature field is carried out analyzing and positioning;
Mode 3 is by determining the emissivity of each material of chip, by image processing, and the Temperature Distribution when obtaining this chip operation.
4. online detection of chip welding spot according to claim 3 and defect identification device is characterized in that described image collecting device also is provided with the ccd image pickup apparatus.
5. online detection of chip welding spot according to claim 4 and defect identification device is characterized in that also including feedback device, and described feedback device is provided with mechanical transmission component, and by this mechanical transmission component defective chip are rejected.
6. a chip packaging device is characterized in that comprising sealed in unit and checkout equipment, and described checkout equipment comprises detection platform, image collecting device, image processing system, front end interface, and checkout equipment is connected with sealed in unit by front end interface.
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| CNA2007100300006A CN101136346A (en) | 2007-08-31 | 2007-08-31 | Chip welding spot on-line detecting, defect identification device and chip packaging device |
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| CN101813638A (en) * | 2010-04-30 | 2010-08-25 | 华中科技大学 | Method and device for detecting welding point defect of chip on line |
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| CN102183542A (en) * | 2011-01-31 | 2011-09-14 | 哈尔滨工业大学 | System for detecting solder joint reliability of circuit board by using infrared multipoint temperature measuring heat resistance method |
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