CN103646935A - Secondary plating-prior-to-etching metal frame subtraction imbedded chip flip bump structure and process method - Google Patents
Secondary plating-prior-to-etching metal frame subtraction imbedded chip flip bump structure and process method Download PDFInfo
- Publication number
- CN103646935A CN103646935A CN201310645356.6A CN201310645356A CN103646935A CN 103646935 A CN103646935 A CN 103646935A CN 201310645356 A CN201310645356 A CN 201310645356A CN 103646935 A CN103646935 A CN 103646935A
- Authority
- CN
- China
- Prior art keywords
- metal substrate
- photoresistance film
- back side
- metal
- pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 140
- 239000002184 metal Substances 0.000 title claims abstract description 140
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000005530 etching Methods 0.000 title claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 97
- 239000004033 plastic Substances 0.000 claims abstract description 26
- 239000005022 packaging material Substances 0.000 claims abstract description 16
- 230000003064 anti-oxidating effect Effects 0.000 claims abstract description 4
- 239000003963 antioxidant agent Substances 0.000 claims description 24
- 230000003078 antioxidant effect Effects 0.000 claims description 24
- 235000006708 antioxidants Nutrition 0.000 claims description 24
- 238000003384 imaging method Methods 0.000 claims description 18
- 238000004806 packaging method and process Methods 0.000 claims description 14
- 230000003628 erosive effect Effects 0.000 claims description 13
- 238000003486 chemical etching Methods 0.000 claims description 11
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000003822 epoxy resin Substances 0.000 claims description 10
- 229920000647 polyepoxide Polymers 0.000 claims description 10
- 238000007747 plating Methods 0.000 claims description 9
- 238000009713 electroplating Methods 0.000 claims description 6
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 239000003292 glue Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 14
- 238000001465 metallisation Methods 0.000 description 11
- 239000000463 material Substances 0.000 description 6
- 238000005538 encapsulation Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000013043 chemical agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310645356.6A CN103646935B (en) | 2013-12-05 | 2013-12-05 | First plate for two times and lose metal frame subtraction afterwards and bury flip-chip bump structure and processing method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201310645356.6A CN103646935B (en) | 2013-12-05 | 2013-12-05 | First plate for two times and lose metal frame subtraction afterwards and bury flip-chip bump structure and processing method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN103646935A true CN103646935A (en) | 2014-03-19 |
CN103646935B CN103646935B (en) | 2016-06-01 |
Family
ID=50252133
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201310645356.6A Active CN103646935B (en) | 2013-12-05 | 2013-12-05 | First plate for two times and lose metal frame subtraction afterwards and bury flip-chip bump structure and processing method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN103646935B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1862800A (en) * | 2006-04-12 | 2006-11-15 | 江苏长电科技股份有限公司 | Electronic component plane button ultra-thin packed substrate and making method thereof |
CN102456677A (en) * | 2010-10-27 | 2012-05-16 | 三星半导体(中国)研究开发有限公司 | Packaging structure for ball grid array and manufacturing method for same |
CN102723293A (en) * | 2012-06-09 | 2012-10-10 | 江苏长电科技股份有限公司 | Etching-first and packaging-later manufacturing method for chip inversion single-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit |
CN103400767A (en) * | 2013-08-06 | 2013-11-20 | 江苏长电科技股份有限公司 | Packaging-prior-to-etching chip-flipped bump type three-dimensional system-level metal circuit board and process method thereof |
-
2013
- 2013-12-05 CN CN201310645356.6A patent/CN103646935B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1862800A (en) * | 2006-04-12 | 2006-11-15 | 江苏长电科技股份有限公司 | Electronic component plane button ultra-thin packed substrate and making method thereof |
CN102456677A (en) * | 2010-10-27 | 2012-05-16 | 三星半导体(中国)研究开发有限公司 | Packaging structure for ball grid array and manufacturing method for same |
CN102723293A (en) * | 2012-06-09 | 2012-10-10 | 江苏长电科技股份有限公司 | Etching-first and packaging-later manufacturing method for chip inversion single-surface three-dimensional circuit and packaging structure of chip formal double-surface three-dimensional circuit |
CN103400767A (en) * | 2013-08-06 | 2013-11-20 | 江苏长电科技股份有限公司 | Packaging-prior-to-etching chip-flipped bump type three-dimensional system-level metal circuit board and process method thereof |
Also Published As
Publication number | Publication date |
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CN103646935B (en) | 2016-06-01 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20170323 Address after: The 200127 Tianjin Tianjin FTA test area (Dongjiang Bonded Port) No. 6865 North Road, 1-1-1802-7 financial and trade center of Asia Patentee after: Xin Xin finance leasing (Tianjin) Co., Ltd. Address before: 214434 Jiangyin, Jiangsu Province, the development of mountain road, No. 78, No. Patentee before: Jiangsu Changjiang Electronics Technology Co., Ltd. |
|
TR01 | Transfer of patent right | ||
EE01 | Entry into force of recordation of patent licensing contract | ||
EE01 | Entry into force of recordation of patent licensing contract |
Application publication date: 20140319 Assignee: Jiangsu Changjiang Electronics Technology Co., Ltd. Assignor: Xin Xin finance leasing (Tianjin) Co., Ltd. Contract record no.: 2017320010028 Denomination of invention: Secondary plating-prior-to-etching metal frame subtraction imbedded chip flip bump structure and process method Granted publication date: 20160601 License type: Exclusive License Record date: 20170508 |
|
EC01 | Cancellation of recordation of patent licensing contract | ||
EC01 | Cancellation of recordation of patent licensing contract |
Assignee: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY Co.,Ltd. Assignor: Xin Xin finance leasing (Tianjin) Co., Ltd. Contract record no.: 2017320010028 Date of cancellation: 20200515 |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200604 Address after: 214434, No. 78, mayor road, Chengjiang, Jiangsu, Jiangyin, Wuxi Patentee after: JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY Co.,Ltd. Address before: 1-1-1802-7, North Zone, financial and Trade Center, No. 6865, Asia Road, Tianjin pilot free trade zone (Dongjiang Free Trade Port Area), Tianjin Patentee before: Xin Xin finance leasing (Tianjin) Co.,Ltd. |