CN103624698B - A kind of heat reactive resin grinding tool preparation method - Google Patents
A kind of heat reactive resin grinding tool preparation method Download PDFInfo
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- CN103624698B CN103624698B CN201310731220.7A CN201310731220A CN103624698B CN 103624698 B CN103624698 B CN 103624698B CN 201310731220 A CN201310731220 A CN 201310731220A CN 103624698 B CN103624698 B CN 103624698B
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Abstract
The invention discloses a kind of processing method of heat reactive resin grinding tool, the method is by mix, moulding and first heat cure, and rear finishing, second heat solidifies, inspection, packaging, operation for subsequent use composition. Because when first heat cure, solidifying KShi temperature is only final 80% to 95% of the KShi temperature of solidifying, although grinding tool also has certain mechanical strength after first heat cure, but mechanical strength is not high, be easy to rear finishing, after be trimmed to regulation and require after, again carry out after heat cure KShi temperature is the regelate of final KShi temperature, heat reactive resin reaches and finally requires performance. Adopted method processing heat reactive resin grinding tool of the present invention, although operation becomes twice from one-step solidification, operation is loaded down with trivial details, and during because of rear finishing, heat reactive resin grinding tool mechanical strength is not high, and dressing efficiency is high, dressing tool consumption is little, has improved on the contrary production efficiency.
Description
Technical field
The present invention relates to grinding tool manufacturing technology field, especially a kind of heat reactive resin grinding tool preparation method.
Background technology
Thermosetting resin grinding tool is taking resin as bonding agent, adds the materials such as abrasive material, packing material, additive, by mixingProcesses such as batching, moulding heat cure and rear finishing and making. Heat reactive resin grinding tool has grinding efficiency high, grinding tool self-sharpeningGood, be difficult for stopping up, be difficult for the advantages such as the processed object surface of burn, polishing performance are good, be widely used in photoelectric cell, magnetic materialThe grinding of material, metal. For processing the higher resin abrasive tools of required precision such as overall ball sheet for lenslet, after heat cureGenerally all to open the rear trim process process such as chip area, the finishing of face shape. For undersized strip grinding tool, generally first makeMake large-sized resin abrasive tools, trim process after passing through again after solidifying, is cut into undersized rectangle or triangle resinGrinding tool. While carrying out rear finishing, because thoroughly heat cure of resin abrasive tools, resin abrasive tools hardness and dressing tool are close, even thanIt is hard that dressing tool is also wanted, therefore dressing tool consumption is very fast and dressing efficiency is low.
Summary of the invention
The object of the invention is to, when solving existing heat reactive resin grinding tool and carrying out rear finishing, dressing tool consumption is very fast,The problem that dressing efficiency is low, provides a kind of dressing tool to consume the preparation method of the heat reactive resin grinding tool little, production efficiency is high.
Heat reactive resin grinding tool preparation method disclosed by the invention is as follows:
(1), taking resin as bonding agent, add abrasive material, packing material, additive, mix;
(2) the first heat cure of moulding, heat cure KShi temperature is finally to solidify 80% to 95% of KShi temperature;
(3) finishing after;
(4) second heat solidifies, and heat cure KShi temperature is the final KShi temperature of solidifying;
(5) inspection, packaging, for subsequent use.
Detailed description of the invention
Below in conjunction with specific embodiment, further set forth the present invention. Be interpreted as, these embodiment are only for illustrating thisBright and be not used in and limit the scope of the invention. In addition be interpreted as, after having read the content of the present invention's instruction, this area skillVarious changes or amendment that art personnel can make the present invention, these equivalent form of values still belong to the appended right of the present patent application and wantThe scope of asking book to limit.
Embodiment 1
It is the chip area heat reactive resin finishing method that 7mm, width are 1mm that Φ 15mm × 10mm opens a degree of depthAs follows:
(1) the artificial metal and stone powder taking 1 gram particle degree as W14 is as abrasive material, and 10 grams contain 2123 of hexamethylenetetramine curing agentPhenol-formaldehyde resin powder is resinoid bond, and 30 gram of 300 order copper powder, 60 gram of 300 order silicon powder are packing material, 10 gram of 300 order oxidationIron powder is additive, mix;
(2) batching is pressed into the grinding tool green compact of Φ 15mm × 10mm, puts into baking oven and be heated to 428.15K (155DEG C) heat cure 2 hours, each 200 grinding tool green compact of heat cure;
(3) the grinding tool surface of the Φ 15mm × 10mm after first heat cure being opened to the degree of depth along diametric(al) with saw blade isThe chip area that 7mm, width are 1mm, every is consuming time 2 minutes; ;
(4) put into baking oven and be heated to final solidification temperature 463.15K (190 DEG C) heat cure 2 hours, each heat cure200 grinding tool green compact;
(5) inspection, packaging, for subsequent use.
It is the chip area heat reactive resin grinding tool that 7mm, width are 1mm that processing Φ 15mm × 10mm opens a degree of depthComparative example 1 processing method is as follows:
(1) the artificial metal and stone powder taking 1 gram particle degree as W14 is as abrasive material, and 10 grams contain 2123 of hexamethylenetetramine curing agentPhenol-formaldehyde resin powder is resinoid bond, and 30 gram of 300 order copper powder, 60 gram of 300 order silicon powder are packing material, 10 gram of 300 order oxidationIron powder is additive, mix;
(2) batching is pressed into the grinding tool green compact of Φ 15mm × 10mm, puts into baking oven and be heated to final solidification temperature463.15K (190 DEG C) heat cure 2 hours, each 200 grinding tool green compact of heat cure;
(3) by the grinding tool surface of the Φ 15mm × 10mm after heat cure along diametric(al) with saw blade open the degree of depth be 7mm,Width is a chip area of 1mm, and every consuming time 10 minutes;
(4) inspection, packaging, for subsequent use.
The method of employing embodiment 1 and Φ 15mm × 10mm that comparative example 1 is processed drive a groove heat reactive resin mill and makeUse performance no significant difference. But process 200 Φ 15mm × 10mm and drive a groove heat reactive resin grinding tool, adopt embodiment 1Method, average production hour is 4.5 minutes, comparative example 1 is 11.9 minutes; Adopt the method for embodiment 1,700 of every productionsIt is that 7mm, width are that 1mm chip area heat reactive resin grinding tool consumes 1 saw blade that Φ 15mm × 10mm opens a degree of depth, and adoptsComparative example 1, it is that 7mm, width are 1mm chip area heat reactive resin grinding tool that 80 Φ 15mm × 10mm of every production open a degree of depthConsume 1 saw blade.
Embodiment 2
Φ 30 × 10mm opens three degree of depth be 7mm, the width chip area heat reactive resin finishing method that is 1mm asUnder:
(1) the artificial metal and stone powder taking 1 gram particle degree as W14 is as abrasive material, and 8 grams of TY002 polyimide resin powder are resin-bondedAgent, 30 gram of 300 order copper powder, 60 gram of 300 order silicon powder are packing material, and 10 gram of 300 order brown iron oxide is additive, and mixing is joinedMaterial;
(2) batching is joined in Φ 30mm × 10mm mould, heat compressingly, heating-up temperature is473.15K (200 DEG C) temperature retention time is 1 hour
(3) by the grinding tool surface of the Φ 30mm × 10mm after first heat cure along diametric(al) with saw blade open three darkThe chip area that degree is 1mm for 7mm, width, every is consuming time 5 minutes; ;
(4) put into baking oven and be heated to final solidification temperature 513.15K (240 DEG C) heat cure 2 hours;
(5) inspection, packaging, for subsequent use.
It is three chip area heat reactive resin grinding tools that 7mm, width are 1mm that processing Φ 30mm × 10mm opens three degree of depthComparative example 2 is as follows:
(1) the artificial metal and stone powder taking 1 gram particle degree as W14 is as abrasive material, and 8 grams containing TY002 polyimide resin powder resin-oatmeal areResinoid bond, 30 gram of 300 order copper powder, 60 gram of 300 order silicon powder are packing material, 10 gram of 300 order brown iron oxide is additive,Mix;
(2) batching is joined in Φ 30mm × 10mm mould, heat compressingly, heating-up temperature is513.15KK (240 DEG C) temperature retention time is 1 hour;
(3) by the grinding tool surface of the Φ 30mm × 10mm after heat cure along diametric(al) with saw blade open the degree of depth be 7mm,Width is three chip areas of 1mm, and every consuming time 25 minutes;
(4) inspection, packaging, for subsequent use.
Adopt the method for embodiment 2 and Φ 30mm × 10mm that comparative example 2 is processed to drive three groove heat reactive resin grinding toolsServiceability no significant difference. But process 200 Φ 30mm × 10mm and drive three groove heat reactive resin grinding tools, adopted embodiment2 method, average production hour is 65.9 minutes, comparative example implementation method 2 is 85.3 minutes; Adopt the method for embodiment 2, everyProduce 200 Φ 30mm × 10mm open three degree of depth be 7mm, width be 1mm chip area heat reactive resin grinding tool consume 1 sawBar is that 7mm, width are 1mm row and adopt comparative example implementation method 2,30 Φ 30mm × 10mm of every production to open three degree of depthBits groove heat reactive resin grinding tool consumes 1 saw blade.
Embodiment 3
10mm × 5mm × 5mm heat reactive resin finishing method is as follows:
(1) the artificial metal and stone powder taking 1 gram particle degree as W10 is as abrasive material, 10 grams of PF-that contain hexamethylenetetramine curing agent4169 phenol-formaldehyde resin powders are resinoid bond, and 50 gram of 300 order copper powder, 30 gram of 300 order silicon powder are packing material, 10 gram of 300 orderBrown iron oxide is additive, mix;
(2) batching is pressed into the grinding tool green compact of 100mm × 5mm × 5mm, puts into baking oven and be heated to 428.15K (155DEG C) heat cure 2 hours, each 20 grinding tool green compact of heat cure;
(3) grinding tool of the 100mm × 5mm × 5mm after first heat cure is cut into 10mm × 5mm × 5mm's with saw bladeFirst heat reactive resin grinding tool, every is consuming time 1 minute;
(4) put into baking oven and be heated to final solidification temperature 463.15K (190 DEG C) heat cure 2 hours, each heat cure200 first heat reactive resin grinding tools;
(5) inspection, packaging, for subsequent use.
Processing 10mm × 5mm × 5mm heat reactive resin grinding tool contrast implementation method 3 is as follows:
(1) the artificial metal and stone powder taking 1 gram particle degree as W10 is as abrasive material, 10 grams of PF-that contain hexamethylenetetramine curing agent4169 phenol-formaldehyde resin powders are resinoid bond, and 50 gram of 300 order copper powder, 30 gram of 300 order silicon powder are packing material, 10 gram of 300 orderBrown iron oxide is additive, mix;
(2) batching is pressed into the grinding tool green compact of 100mm × 5mm × 5mm, puts into baking oven and be heated to the final temperature of solidifyingDegree 463.15K (190 DEG C) heat cure 2 hours, each 20 grinding tool green compact of heat cure;
(3) grinding tool of the 100mm × 5mm × 5mm after heat cure is cut into the thermosetting of 10mm × 5mm × 5mm with saw bladeChange resin abrasive tools, every consuming time 4 minutes;
(4) inspection, packaging, for subsequent use.
Adopt the method for embodiment 3 and the heat reactive resin grinding tool usability of 10mm × 5mm × 5mm that comparative example 3 is processedCan no significant difference. But the heat reactive resin grinding tool of 200 10mm × 5mm × 5mm of processing, the method for employing embodiment 3, averageProduction hour is 1.8 minutes, and contrast implementation method 3 is 4.2 minutes; Adopt the method for embodiment 3,900 10mm of every production ×5mm × 5mm heat reactive resin grinding tool consumes 1 saw blade, and adopts contrast implementation method 3 to produce 70 10mm × 5mm × 5mm heatCured resin grinding tool consumes 1 saw blade.
Claims (1)
1. a heat reactive resin grinding tool preparation method, is characterized in that:
(1), taking resin as bonding agent, add abrasive material, packing material, additive, mix;
(2) moulding and first heat cure, heat cure KShi temperature is finally to solidify 80% to 95% of KShi temperature;
(3) finishing after;
(4) second heat solidifies, and heat cure KShi temperature is the final KShi temperature of solidifying;
(5) inspection, packaging, for subsequent use.
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| CN201310731220.7A CN103624698B (en) | 2013-12-27 | 2013-12-27 | A kind of heat reactive resin grinding tool preparation method |
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| CN103624698B true CN103624698B (en) | 2016-05-11 |
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| EP1129824B1 (en) * | 2000-03-02 | 2005-09-14 | Noritake Co., Limited | Resinoid grinding wheel having core portion made of metallic material |
| CN1752049A (en) * | 2005-08-08 | 2006-03-29 | 河南莱盟特磨料磨具有限公司 | Cubic boron nitride ceramic binder parallel abrasion wheel and its production method |
| CN101602191A (en) * | 2009-06-29 | 2009-12-16 | 云南光电辅料有限公司 | A kind of method of utilizing CNT to improve performances of resin abrasive tools |
| CN102225529A (en) * | 2011-05-27 | 2011-10-26 | 云南光电辅料有限公司 | Cubic boron nitride honing tool and production method thereof |
| CN102513918A (en) * | 2011-12-12 | 2012-06-27 | 江苏智邦精工科技有限公司 | Silicon nitride ceramic ball grinding method based on flexible grinding material fixing grinding tool |
| CN102513944A (en) * | 2011-12-29 | 2012-06-27 | 云南光电辅料有限公司 | Resin-bonded grinding tool for processing sapphire crystals and preparation method for resin-bonded grinding tool |
| CN102794714A (en) * | 2011-05-22 | 2012-11-28 | 韦波 | Process for manufacturing ceramic sand strip |
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2013
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| CN1249219A (en) * | 1999-09-27 | 2000-04-05 | 谢德明 | Method for manufacturing pattern |
| EP1129824B1 (en) * | 2000-03-02 | 2005-09-14 | Noritake Co., Limited | Resinoid grinding wheel having core portion made of metallic material |
| CN1752049A (en) * | 2005-08-08 | 2006-03-29 | 河南莱盟特磨料磨具有限公司 | Cubic boron nitride ceramic binder parallel abrasion wheel and its production method |
| CN101602191A (en) * | 2009-06-29 | 2009-12-16 | 云南光电辅料有限公司 | A kind of method of utilizing CNT to improve performances of resin abrasive tools |
| CN102794714A (en) * | 2011-05-22 | 2012-11-28 | 韦波 | Process for manufacturing ceramic sand strip |
| CN102225529A (en) * | 2011-05-27 | 2011-10-26 | 云南光电辅料有限公司 | Cubic boron nitride honing tool and production method thereof |
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Inventor after: Yang Junhong Inventor after: Hu Zhong Inventor after: Ju Hongbing Inventor after: Ma Zhongyun Inventor after: Hong Jie Inventor after: Ma Jie Inventor before: Yang Junhong Inventor before: Ma Zhongyun Inventor before: Ju Hongbing Inventor before: Hong Jie Inventor before: Ma Jie |
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