CN103619538A - Polishing head and polishing apparatus - Google Patents
Polishing head and polishing apparatus Download PDFInfo
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- CN103619538A CN103619538A CN201280031139.1A CN201280031139A CN103619538A CN 103619538 A CN103619538 A CN 103619538A CN 201280031139 A CN201280031139 A CN 201280031139A CN 103619538 A CN103619538 A CN 103619538A
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- 238000005498 polishing Methods 0.000 title abstract 10
- 239000012530 fluid Substances 0.000 claims abstract description 80
- 229920001971 elastomer Polymers 0.000 claims abstract description 75
- 239000005060 rubber Substances 0.000 claims abstract description 75
- 239000004744 fabric Substances 0.000 claims abstract description 25
- 238000000227 grinding Methods 0.000 claims description 140
- 239000012528 membrane Substances 0.000 claims description 59
- 229910001651 emery Inorganic materials 0.000 claims description 24
- 239000003795 chemical substances by application Substances 0.000 claims description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 12
- 230000007246 mechanism Effects 0.000 claims description 11
- 239000000463 material Substances 0.000 claims description 10
- 229920002379 silicone rubber Polymers 0.000 claims description 7
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 6
- 229920000181 Ethylene propylene rubber Polymers 0.000 claims description 3
- 229920000459 Nitrile rubber Polymers 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 239000002174 Styrene-butadiene Substances 0.000 claims description 3
- 239000007864 aqueous solution Substances 0.000 claims description 3
- 239000013536 elastomeric material Substances 0.000 claims description 3
- -1 fluorubber Polymers 0.000 claims description 3
- 239000004615 ingredient Substances 0.000 claims description 3
- 229920003049 isoprene rubber Polymers 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 3
- 229920001084 poly(chloroprene) Polymers 0.000 claims description 3
- 229920002492 poly(sulfone) Polymers 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920003225 polyurethane elastomer Polymers 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 239000011347 resin Substances 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 47
- 230000002093 peripheral effect Effects 0.000 description 38
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 210000002445 nipple Anatomy 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
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- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000007767 bonding agent Substances 0.000 description 1
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present invention is a polishing head which is provided with at least: an annular rigid ring; a rubber film that is bonded to the rigid ring at a uniform tension; a back plate that is joined to the rigid ring so as to form a space together with the rubber film and the rigid ring; and an annular template that is arranged concentrically with the rigid ring in the periphery of the lower surface portion of the rubber film and holds an edge portion of a workpiece. The polishing head polishes the front surface of the workpiece by holding the back surface of the workpiece in the lower surface portion of the rubber film and bringing the front surface of the workpiece in slide contact with a polishing cloth that is bonded to a polishing plate. The polishing head is characterized by additionally comprising a non-compressible fluid that is sealed in the above-described space. Consequently, final polishing of a workpiece can be performed and the entire of the workpiece can be uniformly polished regardless of the thickness of a template by a polishing head that holds the back surface of the workpiece at a rubber film, while holding the edge portion of the workpiece with the template. The present invention also provides a polishing apparatus.
Description
Technical field
The grinding head of holding workpiece and the lapping device that has possessed this grinding head while the present invention relates to for grinding work-piece surperficial, the lapping device that relates in particular to the grinding head of holding workpiece on rubber membrane and possessed this grinding head.
Background technology
Be accompanied by the highly integrated of semiconductor devices in recent years, more and more stricter for its requirement of flatness.And, in order to improve the yield rate of semiconductor chip, even require near the flatness in the region edge of wafer.
Semiconductor die plate shape is determined by final mirror ultrafinish processing.Especially, the silicon chip that is 300mm at diameter carries out the once grinding in twin grinding in order to meet the specification standards of strict flatness, then in order to improve surperficial flaw or surface roughness, carries out grinding in surface second and the completion of one side.
At the surface second of one side, grind and completion requires to maintain or improves the two-sided flatness of making in once grinding in grinding and requires face side to make the complete minute surface of the defect such as indefectible.
For example, as shown in figure 10, common single-sided grinding device consists of the institutes such as platform 103, grinding agent feed mechanism 104 and grinding head 101 that are pasted with emery cloth 102.In such lapping device 110, with grinding head 101 holding workpiece W and supply with grinding agent 105 from grinding agent feed mechanism 104 to emery cloth 102, and by platform 103 and grinding head 101 are rotated respectively, the surface of workpiece W and emery cloth 102 sliding-contacts are ground.
As the method in grinding head holding workpiece, there is bonding agents such as utilizing wax to paste the methods such as workpiece in smooth workpiece holding tray.In addition, as shown in figure 11, have and will in the elastic membrane being referred to as backing film 113a, paste that the template assembly 113 of market sale is pasted on workpiece holding tray 112 for preventing the template 113b that workpiece ejects and the grinding head 121 without wax mode of holding workpiece W etc.
As shown in figure 12, as other grinding head without wax mode, also can use the template that substitutes market sale to paste backing film 113a on the surface of workpiece holding tray 112, and in workpiece holding tray side, be provided with for preventing the grinding head 131 etc. of the circular lead ring 113b that workpiece ejects.
Workpiece holding tray 112 is used high smooth ceramic wafer conventionally, but irregular etc. due to the thickness of backing film 113a, produces small pressure distribution, and the surface of the work after processing produces and rise and fall, thereby has the problem of the flatness variation that makes workpiece.
So, also propose to have the grinding head of so-called rubber chuck mode, this grinding head substitutes workpiece holding tray and rubber membrane is used as to workpiece maintaining part, make the pressure fluids such as air flow into the back side of this rubber membrane, and rubber membrane is heaved and on emery cloth, pressed workpiece (reference example is as patent documentation 1) with uniform pressure.
One example of the formation of the grinding head of rubber chuck mode is shown schematically in Figure 13.The major part of this grinding head 141 by the stiffening ring 144 of ring stainless steel (SUS) goods etc., be pasted on the rubber membrane 143 on stiffening ring 144 and form with the backboard 145 of stiffening ring 144 combinations.By stiffening ring 144, rubber membrane 143 and backboard 145, formed the spatial portion 146 of sealing.In addition, in the lower surface portion of rubber membrane 143, be pasted with backing film 148, and possess with one heart annular template 147 with stiffening ring 144.In addition, the central supplying that utilizes pressure adjustmenting mechanism 150 toward back plate 145 is to pressure fluid etc., and regulates the pressure of spatial portion 146.In addition, the grinding head top 149 linking with backboard 145 has the not shown unit of pressing from backboard 145 to emery cloth direction that press.
Prior art document
Patent documentation
Patent documentation 1: TOHKEMY 2008-110407 communique
Summary of the invention
Invent problem to be solved
Owing to using the grinding head of this rubber chuck mode, just can not produce and result from the irregular small pressure distribution of thickness of backing film, thereby not produce fluctuating on the surface of the work after processing.Yet, because the internal diameter of template is greater than the external diameter of workpiece, thereby between template and workpiece, produce a little gap, in the situation that utilize as described above pressure adjustmenting mechanism to carry out pressure adjustment to the internal feed pressure fluid of spatial portion, heaving of the rubber membrane of the gap portion between template and workpiece becomes large, the pressure of workpiece peripheral part raises, and the over-lapping of workpiece peripheral part, causes easily producing periphery sagging thus.
By adjusting the thickness of template, can regulate to a certain extent the pressure of workpiece peripheral part, but because the thickness deviation of this template causes that the grind of workpiece peripheral part changes, and there is the problem that cannot obtain stable flatness.
In addition, in the completion of workpiece is ground, when making template contact completion emery cloth, because foreign matter causes producing the defects such as flaw on the surface of workpiece from template disengaging etc., therefore, wish to stop template contact emery cloth.
Yet, in the situation that make the thickness of Thickness Ratio workpiece of template also thin to stop template contact emery cloth, the pressure of workpiece peripheral part raises, because of the over-lapping of workpiece peripheral part, to produce periphery sagging, the flatness variation that causes workpiece, therefore, also there is the problem of the completion grinding that cannot be applicable to workpiece.
The present invention completes in view of problem as above, its object is to provide a kind of grinding head and lapping device, the back side of above-mentioned grinding head holding workpiece on rubber membrane, and utilize the edge part of template holding workpiece, even if can not to produce the blemish such as flaw and make the thickness of Thickness Ratio workpiece of template also thin to stop template contact emery cloth at surface of the work in order to grind, also can be ground to equably workpiece peripheral part,, the completion that not only can carry out workpiece is ground, and whole workpiece can be ground to form evenly and not and can be limit by the thickness of template.
Solve the scheme of problem
For achieving the above object, according to the invention provides a kind of grinding head, this grinding head at least possesses: annular stiffening ring; With uniform tension force, be pasted on the rubber membrane on this stiffening ring; Be combined with above-mentioned stiffening ring, and form the backboard of spatial portion with above-mentioned rubber membrane together with above-mentioned stiffening ring; And be arranged at one heart the periphery of the lower surface portion of above-mentioned rubber membrane with above-mentioned stiffening ring, and the annular template of the edge part of holding workpiece, the back side that keeps above-mentioned workpiece in the lower surface portion of above-mentioned rubber membrane, and the surface of this workpiece is ground with being pasted on the emery cloth sliding-contact on platform, above-mentioned grinding head, it is characterized in that further thering is the Incoercibility fluid being filled with in above-mentioned spatial portion.
If this grinding head, can suitably be adjusted the surface configuration of the rubber membrane of holding workpiece by be filled with Incoercibility fluid, in addition, in grinding work-piece process, can suppress the local deformation of its surface configuration.Its result, can grind to form whole workpiece evenly and not and can be limit by the thickness of template.In addition, even if make the thickness of Thickness Ratio workpiece of template also thin, also whole workpiece can be ground to form evenly, therefore, the completion that also can be applicable to workpiece is ground.
Now, can make above-mentioned Incoercibility fluid is water, or take the Incoercibility fluid that water is principal component.
If this Incoercibility fluid, can form grinding head with low cost, even if for example Incoercibility fluid spills from spatial portion, there is not the danger of the inside of polluting workpiece or lapping device yet.
In addition now, can make above-mentioned Incoercibility fluid is the grinding agent using when grinding above-mentioned workpiece, or has the aqueous solution of at least one above composition of ingredient in this grinding agent.
If this Incoercibility fluid, even if for example Incoercibility fluid spills from spatial portion, also can suppress Incoercibility fluid for the impact of the abrasive characteristic of workpiece.
In addition now, poor according to the thickness of above-mentioned template and above-mentioned workpiece preferably, adjust above-mentioned rubber membrane lower surface portion heave shape.
So, can adjust the grind of workpiece peripheral part, and can more reliably whole workpiece be ground to form evenly.
In addition now, above-mentioned Incoercibility fluid is preferably charged with the pressure of the grinding pressure when grinding above-mentioned workpiece.
So, can suppress increases for the pressure of workpiece peripheral part, and can apply more uniform grinding load and grinding work-piece for workpiece.
In addition now, above-mentioned rubber membrane is preferably pasted on above-mentioned stiffening ring with the state that tension force was stretched by more than 30N.
So, can in grinding work-piece process, can maintain reliably the surface configuration that is filled with the rubber membrane after Incoercibility fluid, and can more reliably whole workpiece be ground to form evenly.
In addition now, above-mentioned rubber membrane preferably the arbitrary material in isoprene rubber, SBR styrene butadiene rubbers, chloroprene rubber, NBR rubber, polyurethane rubber, fluorubber, silicon rubber, ethylene propylene rubber, polyester elastomeric material, polysulfone resin and polyamide form.
Like this, if even if use tough and be also difficult for high-tension stretching the material breaking, just energy long term maintenance is filled with the surface configuration of the rubber membrane after Incoercibility fluid, can more reliably whole workpiece be ground to form evenly, and can reduce costs.
In addition, according to the invention provides a kind of lapping device, this lapping device uses when grinding work-piece surface, and above-mentioned lapping device, is characterized in that, at least possesses: be pasted on the emery cloth on platform; For supply with the grinding agent feed mechanism of grinding agent on this emery cloth; And conduct is for keeping the grinding head of the present invention of the grinding head of above-mentioned workpiece.
If this lapping device, by the Incoercibility fluid being filled with of grinding head of the present invention, can suitably adjust the surface configuration for the rubber membrane of holding workpiece, in addition, can in grinding work-piece process, suppress the local deformation of surface configuration, its result, can grind to form whole workpiece evenly and not and can be limit by the thickness of template.In addition, even if make the thickness of Thickness Ratio workpiece of template also thin, also whole workpiece can be ground to form evenly, therefore, the completion that also can be applicable to workpiece is ground.
Invention effect
In the present invention, grinding head has the Incoercibility fluid that is filled with spatial portion, therefore, can suitably be adjusted the surface configuration of the rubber membrane of holding workpiece by be filled with Incoercibility fluid, in addition, in grinding work-piece process, can suppress the local deformation of its surface configuration.Its result, can grind to form whole workpiece evenly and not and can be limit by the thickness of template.In addition, even if make the thickness of Thickness Ratio workpiece of template also thin, also whole workpiece can be ground to form evenly, therefore, the completion that also can be applicable to workpiece is ground.
Accompanying drawing explanation
Fig. 1 means the skeleton diagram of an example of grinding head of the present invention.
Fig. 2 is the key diagram of the filling method of explanation Incoercibility fluid.Wherein, (A) represent the template thickness occasion thinner than thickness of workpiece, (B) represent the template thickness occasion thicker than thickness of workpiece.
Fig. 3 means another routine skeleton diagram of grinding head of the present invention.
Fig. 4 means the skeleton diagram of an example of lapping device of the present invention.
Fig. 5 means the figure of the result of embodiment 1～embodiment 3.
Fig. 6 means the figure of the result of comparative example 1～comparative example 3.
Fig. 7 means the figure of the result of embodiment 4～embodiment 7.Wherein, (A) represent that the grind of workpiece distributes, (B) represent that the grind of the scope that is 120mm～148mm apart from workpiece centre distributes.
The figure of the result of relation when Fig. 8 has meaned and pasted rubber membrane in embodiment 4～embodiment 7 between tension force and peripheral part grind deviation.
Fig. 9 means the figure of the result of embodiment 8, embodiment 9.
Figure 10 means the skeleton diagram of an example of existing lapping device.
Figure 11 means the skeleton diagram of an example of the existing grinding head that has used backing film.
Figure 12 means another routine skeleton diagram of the existing grinding head that has used backing film.
Figure 13 means the skeleton diagram of an example of the grinding head of existing rubber chuck mode.
The specific embodiment
About the present invention, embodiment is described below, but the present invention is not limited thereto.
All the time, exist the grind of workpiece peripheral part to be changed by the thickness of template, cause obtaining the problem of stable flatness and so on.Have again, identical with workpiece or thicker than workpiece in order to suppress the sagging thickness of template that need to make of periphery, but in this case,, in process of lapping, template contacts with emery cloth and produces foreign matter etc., and has the problem that causes producing on the surface of workpiece defects such as flaw and so on.
So the inventor has repeated wholwe-hearted research in order to address this is that.Its result, found out by rubber membrane is pasted on annular stiffening ring with uniform tension force, and on top, backboard be set and in the seal cavity portion that forms, be filled with in advance Incoercibility fluid and form the rubber chuck portion of holding workpiece, the scheme that can grind to form smooth workpiece and can not limit by the thickness of template, and completed the present invention.
Fig. 1 has meaned the figure of an example of grinding head of the present invention.
As shown in Figure 1, grinding head 1 possesses: by such as SUS(stainless steel) etc. the annular stiffening ring 4 that forms of rigid material; With uniform tension force, be pasted on the rubber membrane 3 of the lower face side of stiffening ring 4; And the backboard 5 that is arranged at the upper surface of stiffening ring 4.
By this stiffening ring 4, rubber membrane 3 and backboard 5, formed the spatial portion 6 of sealing.
Here, material, the shape of backboard 5 are not particularly limited, as long as can form spatial portion 6 together with stiffening ring 4, rubber membrane 3.
In addition, periphery and the stiffening ring 4 in the lower surface portion of rubber membrane 3 is provided with the annular template 7 that internal diameter is a bit larger tham the external diameter of workpiece W with one heart.This template 7 is for the edge part of holding workpiece W, and is configured to along the peripheral part of the lower surface portion of rubber membrane 3 outstanding downwards.
Here, template 7 can be made its external diameter and at least be greater than the internal diameter of stiffening ring 4 and the internal diameter that its internal diameter is less than stiffening ring 4.The pressing force that so, can be applied on whole of workpiece is more even.
In addition here, with regard to the material of template 7, in order not pollute workpiece W and in order not cause flaw and impression etc., even if it is desirable to more more soft than workpiece W and contact the higher material of wearability that is also difficult to wearing and tearing with the emery cloth of lapping device in process of lapping.
In the example of the grinding head shown in Fig. 1, the thin thickness of the Thickness Ratio workpiece W of template 7, but be not particularly limited to this, as shown in Figure 3, the thickness of template 7 also can be also thicker than the thickness of workpiece W.
In addition, can paste backing film 8 is set in the part of at least holding workpiece W of the lower surface portion of rubber membrane 3.Make backing film 8 moisture and adhere to workpiece W, and on the workpiece maintenance face of rubber membrane 3 holding workpiece W.Here, backing film 8 can be made by for example polyurethane.By this backing film 8 being set and making it moisture, the surface tension of the water being contained by backing film 8 is holding workpiece W reliably.
In addition here, can also use and on the surface of backing film, paste template and as the template assembly of template assembly market sale.
In this rubber chuck portion being formed by rubber membrane 3, stiffening ring 4 and backboard 5 etc., before grinding work-piece W, in advance Incoercibility fluid 2 is filled with in spatial portion 6.When being filled with this Incoercibility fluid 2, the surface configuration adjustment of the workpiece retaining part of the rubber membrane of holding workpiece W 3 is formed to best shape.Thereafter, the upper surface tool for mounting of backboard 5 standby the grinding head top 9 of not shown presser unit.Here, in the present invention, said Incoercibility fluid refers to a kind of fluid, once this fluid is not pressurized will compression as gas, and the fluid that volume is significantly dwindled.
In addition, as shown in Figure 3, for fluid 2 is filled with in spatial portion 6, can be configured to through hole 11a, 11b and connector 10a, 10b are set on backboard 5, and can on this connector 10a, 10b, connect following fluid charging device.
If use this grinding head of the present invention, almost constant owing to being filled with the volume of the Incoercibility fluid 2 in spatial portion 6 in grinding work-piece process, therefore, can suppress the above-mentioned surface configuration distortion that has formed the rubber membrane 3 of best shape, especially can suppress the part of the rubber membrane 3 of the gap portion between workpiece W and template 7 and heave, can apply uniform load and grinding work-piece W to whole workpiece.Its result, can grind to form whole workpiece evenly and not and can be limit by the thickness of template 7.In addition, even if can not produce the blemish such as flaw on the surface of workpiece W in order grinding, and to make the thickness of Thickness Ratio workpiece W of template 7 also thin to stop the emery cloth of template 7 contact lapping devices, also can be ground to equably workpiece W peripheral part, therefore the completion that, can be used in workpiece W is ground.
Now, can make Incoercibility fluid is the Incoercibility fluid that water or the water of take are principal component.
If this Incoercibility fluid, can form grinding head with low cost.In addition, the in the situation that of rubber membrane occurs in such as process of lapping breaking etc., even if Incoercibility fluid for example spills from spatial portion, there is not the danger of the inside of polluting workpiece or lapping device yet.
In addition, especially, in the situation that workpiece is semi-conducting material, for preventing the objects such as metallic pollution, the pure water of metal ion etc. is not suitable as Incoercibility fluid.
In addition now, the grinding agent using in the time of can also making Incoercibility fluid be grinding work-piece, or for thering is the aqueous solution of at least one above composition of ingredient in this grinding agent.
For example, if this Incoercibility fluid,, even if Incoercibility fluid spills from spatial portion, also can be suppressed at the impact of the abrasive characteristic for workpiece in Min..
Here, illustrate to the method that is filled with Incoercibility fluid in spatial portion.
Fig. 2 (A) means and uses than the thickness of the workpiece figure of an example of the filling method of fluid during thin template also.
As shown in Fig. 2 (A), in this grinding head 21, for Incoercibility fluid 2 being imported in spatial portions 6 and from the interior discharge Incoercibility of spatial portion 6 fluid 2, at the upper surface of backboard 5, be provided with two through hole 11a, 11b, for still to keep the pressure of Incoercibility fluid 2 (following, sometimes also referred to as charged pressure) state in spatial portion 6, be filled with Incoercibility fluid 2, and at through hole 11a, 11b separately, connector 10a, 10b are installed.And, before grinding work-piece, when being filled with Incoercibility fluid 2 in spatial portion 6, first, for example, in mode as follows, fluid charging device is connected with grinding head.
As shown in Fig. 2 (A), fluid charging device 30, have the loop that is connected with pressure gauge 33 and valve 32a, and the end in this loop is connected with nipple 31a in order to import Incoercibility fluid 2.This nipple 31a is connected with the connector 10a being arranged on backboard 5.Have again, fluid charging device 30, in order to discharge Incoercibility fluid 2, its end is connected with discharging tube, and is connected with valve 32b in centre.At loop front end, be connected with nipple 31b, this nipple 31b is connected with the connector 10b being arranged on backboard 5.
Then, on smooth pedestal 35, put the adjustment plate 36 that workpiece W or thickness are identical with workpiece W, and place at the lower surface of template 7 pad 34 for adjustment of difference that thickness equals the thickness of this workpiece W and template 7.Have again, with workpiece W or the mode of adjusting in the hole that plate 36 is contained in template 7 on pedestal 35, put the grinding head parts that formed by backing film 8, template 7, rubber membrane 3, stiffening ring 4 and backboard 5.Have again, utilize fastening clips 37 fixed pedestals 35 with backboard 5 in case the height change of backboard 5 while being filled with Incoercibility fluid 2.
Then, open valve 32a and 32b, to the interior importing Incoercibility of spatial portion 6 fluid 2, the gas of implementing in spatial portion 6 is discharged.As this gas, discharge, for example, can and open valve 32b by shut off valve 32a, and connect pressure reducing circuit and implement in discharging tube side.
Then, shut off valve 32a and 32b, utilize the mode that the pressure adjustmenting mechanism of not shown Incoercibility fluid 2 becomes the pressure of regulation with pressure gauge 33 to adjust, and then opens valve 32a and to the interior importing Incoercibility of spatial portion 6 fluid 2.After confirming that pressure gauge 33 becomes the pressure of regulation, shut off valve 32a is filled with Incoercibility fluid 2 in spatial portion 6.After being filled with, from being installed on connector 10a and the 10b on the top of backboard 5, pull down nipple 31a and 31b.
Now, if used thickness than the difference of the thickness of workpiece and template also thin adjustment with pad 34, be filled with fluid 2, the mode that surface configuration of rubber membrane 3 diminishes with heaving of central portion forms.If use the grinding head of adjusting through so, the pressure that is applied to workpiece peripheral part in process of lapping uprises, and it is large that the grind of peripheral part becomes.If in contrast to this used thickness than the difference of the thickness of workpiece and template also thick adjustment with pad 34, be filled with fluid 2, the surface configuration of rubber membrane 3 becomes large mode with heaving of central portion and forms.If use the grinding head of adjusting through so, the pressure that is applied to workpiece peripheral part in process of lapping diminishes, and the grind of peripheral part diminishes.So, the thickness of pad 34 for the adjustment of using while being filled with fluid by adjustment, the grind of going back capable of regulating workpiece peripheral part.
Fig. 2 (B) means and uses than the thickness of the workpiece figure of an example of the filling method of fluid during thick template also.Now, as shown in Fig. 2 (B), can insert and adjust with pad 34 at the lower surface of workpiece W, and with the above-mentioned Incoercibility fluid 2 that is similarly filled with.Now also can be by adjustment be adjusted to the grind of workpiece peripheral part with the thickness adjustment of pad 34.
In addition, in the situation that the thickness of workpiece is identical with the thickness of template, does not use adjustment to be just filled with Incoercibility fluid 2 with pad and also can.
As mentioned above, preferably, according to the shape of heaving of the lower surface portion of the difference adjustment rubber membrane of the thickness of template and workpiece, so, just can adjust the grind of workpiece peripheral part, and can more reliably whole workpiece be ground to form evenly.
In addition, Incoercibility fluid preferably the pressure of the grinding pressure when higher than grinding work-piece be charged.The adjustment of this charged pressure, for example, can be used the pressure adjustmenting mechanism of fluid charging device as above to adjust.
So, can suppress increases for the pressure of workpiece peripheral part, and can be with more uniform grinding load grinding work-piece for workpiece.
In addition, the rubber membrane being pasted on stiffening ring maintains by being filled with Incoercibility fluid the surface configuration as above forming, and therefore, it is desirable to be stretched by higher tension force, especially ideal, rubber membrane is pasted on stiffening ring with the state that tension force was stretched by more than 30N.
So, in grinding work-piece process, can maintain reliably the surface configuration that is filled with the rubber membrane after Incoercibility fluid, and can more reliably whole workpiece be ground to form evenly.
In addition, as the material of rubber membrane, even if preferably tough and be also difficult for breaking with higher tension force stretching, and the surface configuration of the rubber membrane as above forming by being filled with Incoercibility fluid due to long term maintenance, therefore, the less material of the deformation of creep preferably.
Therefore, rubber membrane preferably the arbitrary material in isoprene rubber, SBR styrene butadiene rubbers, chloroprene rubber, NBR rubber, polyurethane rubber, fluorubber, silicon rubber, ethylene propylene rubber, polyester elastomeric material, polysulfone resin and polyamide form.
So, can more reliably whole workpiece be ground to form evenly, and can extend the service life of rubber membrane and reduce costs.
Then, lapping device of the present invention is described.
Fig. 4 has meaned the skeleton diagram of an example of lapping device of the present invention.
As shown in Figure 4, lapping device 20 of the present invention has: be pasted on the emery cloth 22 on platform 23; For supply with the grinding agent feed mechanism 24 of grinding agent 25 on this emery cloth 22; And as the above-mentioned grinding head of the present invention 21 that is used for the grinding head of holding workpiece W.This grinding head 21 is made the structure that workpiece W can be pressed the emery cloth 22 being pasted on platform 23 by not shown pressing mechanism.
And, by grinding agent feed mechanism 24 to emery cloth 22 on supply with grinding agent 25 on one side, on one side by the spinning motion of grinding head 21 and rotatablely moving of platform 23 with rotating shaft link, make the surface sliding contact of workpiece W and grind.
If this lapping device, can in grinding work-piece process, suppress the distortion of the surface configuration of rubber membrane, especially, can suppress the part of the rubber membrane in the gap portion between workpiece and template and heave, and can apply uniform load and grinding work-piece to whole workpiece.Its result, can grind to form whole workpiece evenly and not and can be limit by the thickness of the template of grinding head.In addition, even if owing to making the thickness of Thickness Ratio workpiece of template also thin, also whole workpiece can be ground to form evenly, therefore, the completion that also can be applicable to workpiece is ground.
Embodiment
Below, embodiments of the invention and comparative example are shown and the present invention is more specifically described, but the present invention is not limited to these embodiment.
(embodiment 1～embodiment 3)
The lapping device of the present invention that use possesses grinding head of the present invention has as shown in Figure 3 carried out the grinding of workpiece, and the deviation of the grind in the workpiece face after grinding is evaluated.As workpiece W used diameter for 300mm, thickness be the silicon single crystal wafer of 775 μ m.Here, use flatness analyzer to guarantee district and measure the wafer thickness before and after grinding as flatness for the region except outermost perimembranous 2mm width, and carry out calculus of differences for the thickness before and after the grinding in the diametric(al) cross section at wafer, and calculated grind.The flatness analyzer (Wafer Sight) that has used KLA-Tencor company to manufacture as flatness analyzer.
First, prepared following grinding head.As stiffening ring, used external diameter for the stiffening ring of 360mm, the internal diameter SUS system that is 320mm, and be that 1mm and rubber hardness are that the silicon rubber of 90 degree is pasted on the lower surface of stiffening ring with the tension force of 7.5N as rubber membrane using thickness.On the surface of rubber membrane, pasted the template assembly of market sale, this template assembly is pasted with external diameter on backing film surface be the template that 355mm and internal diameter are 302mm, and the thickness of this template is 700 μ m, at embodiment 2, is 780 μ m and is 800 μ m at embodiment 3 at embodiment 1.
And, as shown in Fig. 2 (A), use fluid charging device to be filled with Incoercibility fluid.Now, the adjustment of 75 μ m is inserted into the lower surface of template when the thickness of template is 700 μ m with pad, when being 780 μ m, do not use the thickness of template adjustment pad, the adjustment of 25 μ m is inserted into the lower surface of wafer when the thickness of template is 800 μ m with pad, and be filled with respectively fluid, and pure water is used as to Incoercibility fluid, and is filled with in spatial portion with 20kPa pressure.
The grinding head that this is prepared is loaded on lapping device of the present invention as shown in Figure 4 and has ground wafer.In addition, the wafer using, in advance its two sides is implemented once to grind, and grinding has also been implemented in opposite side edge.In addition, platform has been used the platform that diameter is 800mm, and emery cloth has been used normally used emery cloth.
In addition, during grinding, as grinding agent, used the aqueous slkali that contains colloidal silica, and grinding head and platform are rotated with 30rpm respectively.The pressure that while the grinding load (pressing force) of wafer being made as to the face pressure that is converted into wafer surface by not shown presser unit is 20kPa has ground wafer.In addition, milling time is adjusted to and makes the average grind of wafer become 1 μ m.
The grind distribution table of the wafer grinding in embodiment 1～embodiment 3 is shown in Fig. 5.As shown in Figure 5, the grind of known wafer distributes different from following comparative example 1～comparative example 3, is subject to hardly the restriction of the thickness of template, can access roughly grind uniformly and distribute.The scope of the grind in cross section is 0.042 μ m in embodiment 1, in embodiment 2, be 0.027 μ m, in embodiment 3, be 0.048 μ m, these are compared with following comparative example 1～comparative example 3, have had improvement.
Like this, can confirm grinding head and the lapping device of the application of the invention, just whole wafer grinding can be become evenly and not can be limit by the thickness of template.
(comparative example 1～comparative example 3)
Use lapping device as shown in figure 10, and ground silicon single crystal wafer with the condition identical with embodiment 1～embodiment 3, wherein, above-mentioned lapping device has loaded the existing grinding head without Incoercibility fluid of the present invention as shown in figure 13.Here, used stiffening ring and the template of the grinding head identical with embodiment 1～embodiment 3, and by rubber hardness be the silicon rubber of 70 degree as rubber membrane, and with the tension force of 5N, stick on the lower surface of stiffening ring.
Thickness for used template is the occasion of 700 μ m (comparative example 1), 780 μ m (comparative example 2) and 800 μ m (comparative example 3), has evaluated respectively the deviation of the grind in the wafer face after grinding.
The grind distribution table of the wafer grinding in comparative example 1～comparative example 3 is shown in Fig. 6.As shown in Figure 6, the grind of known wafer distributes closely related with the thickness of template, in the situation that the thickness of the Thickness Ratio wafer of template also thin (comparative example 1), the over-lapping of wafer peripheral part, in contrast, in the situation that the thickness of the Thickness Ratio wafer of template also thick (comparative example 3), the grind of wafer peripheral part reduces.The scope of the grind in cross section is 0.181 μ m in comparative example 1, in comparative example 2, be 0.061 μ m and in comparative example 3, be 0.104 μ m, compares variation with embodiment 1～embodiment 3.
(embodiment 4～embodiment 7)
The tension force of take has been pasted silicon rubber as the condition of 5N (embodiment 4), 20N (embodiment 5), 35N (embodiment 6) and 48N (embodiment 7), in addition, with the condition identical with embodiment 1, grind silicon single crystal wafer, and evaluated similarly to Example 1 the deviation of the grind in the wafer face after grinding.
The grind distribution table of the wafer grinding in embodiment 4～embodiment 7 is shown in Fig. 7 (A).Have again, as the grind of the peripheral part of wafer, distribute, the grind distribution table of the scope that is 120mm～148mm apart from center wafer is shown in Fig. 7 (B).As shown in Fig. 7 (A), Fig. 7 (B), known in arbitrary situation of embodiment 4～embodiment 7, also can both be ground to equably wafer peripheral part.
In addition, the index distributing as the grind that represents wafer peripheral part, the maximum of the grind that to obtain apart from center wafer be 135mm～148mm and minimum of a value poor, and the peripheral part grind deviation using the difference of this maximum and minimum of a value as wafer.The peripheral part grind deviation of wafer is 0.043 μ m in embodiment 4, in embodiment 5, be 0.027 μ m, in embodiment 6, be 0.016 μ m, in embodiment 7, be 0.011 μ m.
The relation that represents the tension force of silicon rubber and the peripheral part grind deviation of wafer in Fig. 8.As shown in Figure 8, the peripheral part grind deviation of the larger wafer of the tension force of known rubber is just less.In addition, at tension force, be 30N above in the situation that, the peripheral part grind deviation of wafer becomes below 0.020 μ m, the peripheral part of known grinding wafers more equably.
(embodiment 8, embodiment 9)
In order to investigate the impact of the charged pressure of Incoercibility fluid, used the condition that the pressure setting when being filled with is 10kPa (embodiment 8), 40kPa (embodiment 9) to be filled with the grinding head of pure water, in addition, with the condition identical with embodiment 7, grind silicon single crystal wafer, and evaluated similarly to Example 7 the deviation to the grind in the wafer face after grinding.
The grind that is illustrated in the peripheral part of the wafer grinding in embodiment 8, embodiment 9 in Fig. 9 distributes.As mentioned above, the grind deviation of the wafer peripheral part of embodiment 7 is 0.011 μ m, with respect to this, in the situation that charged pressure for than the pure water charged pressure 20kPa of embodiment 7 also the occasion of low 10kPa be embodiment 8, the grind deviation of wafer peripheral part increases to 0.033 μ m, and in the situation that pure water charged pressure for than embodiment 7 also the occasion of high 40kPa be embodiment 9, the grind deviation of wafer peripheral part is varied down to 0.005 μ m.
From this result, the grind deviation of wafer peripheral part is set for compared with high and is diminished because of the charged pressure of Incoercibility fluid.By setting for higher than the grinding of wafer and load to the charged pressure of major general's Incoercibility fluid, can the peripheral part of wafer be ground to form more even.
In addition, the present invention is not limited to above-mentioned embodiment.Above-mentioned embodiment is illustration, so long as have the formation identical in fact with the technological thought of recording in claims of the present invention and bring the technology of identical action effect to include in any case at technical scope of the present invention.
For example, relate to grinding head of the present invention and be not limited to the form shown in Fig. 1, Fig. 3, for example, for the suitably designs such as shape of the body outside the important document of recording in claims.Have, the formation of lapping device is also not limited to the formation shown in Fig. 4 again, for example, also can make and possess a plurality of lapping devices that relate to grinding head of the present invention.
Claims (8)
1. a grinding head, at least possesses: annular stiffening ring; With uniform tension force, be pasted on the rubber membrane on this stiffening ring; Be combined with above-mentioned stiffening ring, and form the backboard of spatial portion with above-mentioned rubber membrane together with above-mentioned stiffening ring; And be arranged at one heart the periphery of the lower surface portion of above-mentioned rubber membrane with above-mentioned stiffening ring, and the annular template of the edge part of holding workpiece, the back side that keeps above-mentioned workpiece in the lower surface portion of above-mentioned rubber membrane, and the surface of this workpiece is ground with being pasted on the emery cloth sliding-contact on platform, above-mentioned grinding head, it is characterized in that
Further there is the Incoercibility fluid being filled with in above-mentioned spatial portion.
2. grinding head according to claim 1, is characterized in that,
Above-mentioned Incoercibility fluid is water, or take the Incoercibility fluid that water is principal component.
3. grinding head according to claim 1, is characterized in that,
Above-mentioned Incoercibility fluid is the grinding agent using when grinding above-mentioned workpiece, or has the aqueous solution of at least one above composition of ingredient in this grinding agent.
4. according to the grinding head described in any one in claims 1 to 3, it is characterized in that,
Poor according to the thickness of above-mentioned template and above-mentioned workpiece, adjust above-mentioned rubber membrane lower surface portion heave shape.
5. according to the grinding head described in any one in claim 1 to 4, it is characterized in that,
Above-mentioned Incoercibility fluid is charged with the pressure of the grinding pressure when grinding above-mentioned workpiece.
6. according to the grinding head described in any one in claim 1 to 5, it is characterized in that,
Above-mentioned rubber membrane is pasted on above-mentioned stiffening ring with the state that tension force was stretched by more than 30N.
7. according to the grinding head described in any one in claim 1 to 6, it is characterized in that,
The arbitrary material of above-mentioned rubber membrane in isoprene rubber, SBR styrene butadiene rubbers, chloroprene rubber, NBR rubber, polyurethane rubber, fluorubber, silicon rubber, ethylene propylene rubber, polyester elastomeric material, polysulfone resin and polyamide forms.
8. a lapping device uses when grinding work-piece surface, and above-mentioned lapping device, is characterized in that,
At least possess: be pasted on the emery cloth on platform; For supply with the grinding agent feed mechanism of grinding agent on this emery cloth; And as for keeping the grinding head described in claim 1 to 7 any one of grinding head of above-mentioned workpiece.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011-143927 | 2011-06-29 | ||
| JP2011143927 | 2011-06-29 | ||
| PCT/JP2012/003598 WO2013001719A1 (en) | 2011-06-29 | 2012-05-31 | Polishing head and polishing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN103619538A true CN103619538A (en) | 2014-03-05 |
Family
ID=47423651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201280031139.1A Pending CN103619538A (en) | 2011-06-29 | 2012-05-31 | Polishing head and polishing apparatus |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20140113531A1 (en) |
| JP (1) | JPWO2013001719A1 (en) |
| KR (1) | KR20140048894A (en) |
| CN (1) | CN103619538A (en) |
| DE (1) | DE112012002493T8 (en) |
| TW (1) | TW201318767A (en) |
| WO (1) | WO2013001719A1 (en) |
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| JP6508123B2 (en) * | 2016-05-13 | 2019-05-08 | 信越半導体株式会社 | Method of sorting template assembly, method of polishing workpiece and template assembly |
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Also Published As
| Publication number | Publication date |
|---|---|
| DE112012002493T5 (en) | 2014-03-27 |
| TW201318767A (en) | 2013-05-16 |
| DE112012002493T8 (en) | 2014-06-12 |
| WO2013001719A1 (en) | 2013-01-03 |
| KR20140048894A (en) | 2014-04-24 |
| JPWO2013001719A1 (en) | 2015-02-23 |
| US20140113531A1 (en) | 2014-04-24 |
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Application publication date: 20140305 |